MAZD091

Zener Diodes www.DataSheet4U.com MAZDxxx Series Silicon planar type Unit: mm For constant voltage, constant current, waveform clipper and surge absorption circuit ■ Features • Low noise type 0.60±0.05 1 0.20±0.05 0.12+0.05 –0.02 1.00±0.05 1.40±0.05 2 ■ Absolute Maximum Ratings Ta = 25°C Parameter Repetitive peak forward current Total power dissipation Junction temperature Storage temperature * 0.27+0.05 –0.02 Symbol IFRM PT Tj Tstg Rating 200 120 150 −55 to +150 Unit mA mW °C °C 5° 0.15 max. 0.52±0.03 0 to 0.01 Note) *: Ptot = 100 mW achieved with a printed circuit board Marking Symbol Refer to the list of the electrical characteristics within part numbers (Example) MAZD062: DF ■ Common Electrical Characteristics Ta = 25°C ± 3°C *1 Parameter Forward voltage Zener voltage *2 Zener operating resistance Reverse current Symbol VF VZ RZ IR IF = 10 mA IZ IZ VR Specified value Specified value Specified value Conditions Min Typ 0.9 Refer to the list of the electrical characteristics within part numbers Max 1.0 Unit V V Ω µA Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes. 2. Absolute frequency of input and output is 5 MHz. 3. *1: The temperature must be controlled 25°C for VZ mesurement. VZ value measured at other temperature must be adjusted to VZ (25°C) *2: VZ guaranteed 20 ms after current flow. 5° 1: Anode 2: Cathode SSSMini2-F2 Package 0.20±0.05 Publication date: September 2004 SKE00020AED 1 MAZDxxx Series www.DataSheet4U.com ■ Electrical Characteristics within Part Numbers Ta = 25°C ± 3°C Zener voltage Part number Min MAZD024 MAZD027 MAZD030 MAZD033 MAZD036 MAZD039 MAZD043 MAZD047 MAZD051 MAZD056 MAZD062 MAZD068 MAZD075 MAZD082 MAZD091 MAZD100 MAZD110 MAZD120 MAZD130 MAZD150 MAZD160 MAZD180 MAZD200 MAZD220 MAZD240 MAZD270 MAZD300 MAZD330 MAZD360 MAZD390 2.28 2.50 2.80 3.10 3.40 3.70 4.00 4.40 4.80 5.30 5.80 6.40 7.00 7.70 8.50 9.40 10.40 11.40 12.40 13.90 15.30 16.90 18.80 20.80 22.80 25.10 28.00 31.00 34.00 37.00 VZ (V) Nom 2.40 2.70 3.00 3.30 3.60 3.90 4.30 4.70 5.10 5.60 6.20 6.80 7.50 8.20 9.10 10.00 11.00 12.00 13.00 15.00 16.00 18.00 20.00 22.00 24.00 27.00 30.00 33.00 36.00 39.00 Max 2.60 2.90 3.20 3.50 3.80 4.10 4.60 5.00 5.40 6.00 6.60 7.20 7.90 8.70 9.60 10.60 11.60 12.70 14.10 15.60 17.10 19.10 21.20 23.30 25.60 28.90 32.00 35.00 38.00 41.00 IZ (mA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 Reverse current IR (µA) VR (V) Max 120 120 50 20 10 10 10 2.0 1.0 0.5 0.2 0.1 0.1 0.1 0.1 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 0.05 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.5 4.0 4.0 5.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 15.0 17.0 19.0 21.0 23.0 25.0 27.0 30.0 Zener operating resistance RZ (Ω) IZ (mA) Max 100 110 120 130 130 130 130 80 60 40 30 20 20 20 20 30 30 30 35 40 50 60 80 80 100 120 160 200 250 300 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 2 2 2 2 2 Marking symbol 1F 2F 3F 4F 5F 6F AF H BF CF DF W T EF FF GF JF KF LF MF NF PF RF SF UF VF XF YF ZF 7F 2 SKE00020AED www.DataSheet4U.com PT  Ta 200 Glass epoxy board MAZDxxx Series I Z  VZ 103 Ta = 25°C 2.4 V 2.7 V 3.0 V 3.3 V 3.6 V 3.9 V 4.3 V 103 I Z  VZ Ta = 25°C Total power dissipation PT (mW) 102 102 Zener current IZ (mA) Zener current IZ (mA) 150 10 10 100 1 1 10−1 10−1 50 10−2 10−2 0 0 40 80 120 160 10−3 10−3 0 2 4 6 0 4 8 8.2 V 9.1 V 10 V 12 Ambient temperature Ta (°C) Zener voltage VZ (V) Zener voltage VZ (V) IZ  V Z 103 Ta = 25°C 103 I Z  VZ Ta = 25°C 22 V 24 V 27 V 30 V 33 V 36 V 39 V 102 11 V 12 V 13 V 14 V 15 V 16 V 18 V 20 V 102 Zener current IZ (mA) 10 Zener current IZ (mA) 10 1 1 10−1 10−1 10−2 10−2 10−3 0 10 20 30 10−3 0 20 40 60 Zener voltage VZ (V) Zener voltage VZ (V) 4.7 V 5.1 V 5.6 V 6.2 V 6.8 V 7.5 V SKE00020AED 3 www.DataSheet4U.com Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2003 SEP