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BT1308-600D

BT1308-600D

  • 厂商:

    PHILIPS

  • 封装:

  • 描述:

    BT1308-600D - Logic level triac - NXP Semiconductors

  • 数据手册
  • 价格&库存
BT1308-600D 数据手册
BT1308-400D/600D Logic level triac Rev. 01 — 19 February 2004 M3D186 Product data 1. Product profile 1.1 Description Logic level sensitive gate triac intended to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. 1.2 Features s Sensitive gate in all four quadrants s Low cost package. 1.3 Applications s General purpose bidirectional switching s Solid state relays s Phase control applications s Low power AC fan speed controllers. 1.4 Quick reference data s VDRM ≤ 600 V (BT1308-600D) s ITSM ≤ 9 A s VDRM ≤ 400 V (BT1308-400D) s IT(RMS) ≤ 0.8 A. 2. Pinning information Table 1: Pin 1 2 3 Pinning - SOT54 (TO-92), simplified outline and symbol Description main terminal 2 gate main terminal 1 1 1 2 3 2 MSB033 Simplified outline Symbol 3 MBL305 SOT54 (TO-92) Philips Semiconductors BT1308-400D/600D Logic level triac 3. Ordering information Table 2: Ordering information Package Name BT1308-600D BT1308-400D TO-92 TO-92 Description Plastic single-ended leaded (through hole) package; 3 leads Plastic single-ended leaded (through hole) package; 3 leads Version SOT54 SOT54 Type number 4. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM repetitive peak off-state voltage BT1308-600D BT1308-400D IT(RMS) ITSM on-state current (RMS value) full sine wave; Tlead ≤ 55 °C; Figure 1 and 2 non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to surge; Figure 3 and 4 t = 20 ms t = 16.7 ms I2t dIT/dt I2t for fusing repetitive rate of rise of on-state current after triggering t = 10 ms ITM = 1 A; IG = 0.2 A; dIG/dt = 0.2 A/µs T2+ G+ T2+ G− T2− G− T2− G+ IGM VGM PGM PG(AV) Tstg Tj gate current (peak value) gate voltage (peak value) gate power (peak value) average gate power storage temperature junction temperature t = 2 µs max; Tcase ≤ 80 °C t = 2 µs max −40 −40 50 50 50 10 1 5 5 0.1 +150 +125 A/µs A/µs A/µs A/µs A V W W °C °C 9 10 0.32 A A A2s 25 °C ≤ Tj ≤ 125 °C 600 400 0.8 V V A Conditions Min Max Unit 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 2 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 1 IT(RMS) (A) 0.75 003aaa616 3 IT(RMS) (A) 003aaa617 2 0.5 1 0.25 0 0 50 100 Tlead (°C) 150 0 10-3 10-2 1 tsurge (s) 10 f = 50 Hz Tlead ≤ 65 °C Fig 1. Maximum permissible on-state current (RMS value) as a function of lead temperature. Fig 2. Maximum permissible repetitive on-state current (RMS value) as a function of surge duration for sinusoidal currents. 103 I ITSM (A) 102 T 003aaa614 12 ITSM (A) 003aaa615 I TSM tp time 8 dIT/dt limit T2- G+ quadrant 10 4 1 0 10-5 10-4 10-3 10-2 tp (s) 10-1 1 10 102 n 103 tp ≤ 20 ms initial Tj ≤ 25 °C n = number of cycles f = 50 Hz initial Tj ≤ 25 °C Fig 3. Maximum permissible non-repetitive peak on-state current as a function of pulse width for sinusoidal currents. Fig 4. Maximum permissible non-repetitive peak on-state current as a function of number of cycles for sinusoidal currents. 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 3 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 5. Thermal characteristics Table 4: Symbol Rth(j-lead) Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to lead thermal resistance from junction to ambient Conditions full cycle half cycle mounted on a printed-circuit board; lead length = 4 mm; Figure 5 150 Min Typ Max 60 80 K/W Unit K/W 5.1 Transient thermal impedance 103 Zth(j-a) (K/W) 003aaa029 102 10 P tp t 1 10-5 10-4 10-3 10-2 10-1 1 tp (s) 10 Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values. 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 4 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 6. Characteristics Table 5: Characteristics Tj = 25 °C unless otherwise specified. Symbol IGT Parameter gate trigger current Conditions VD = 12 V; IT = 0.1 A; Figure 8 T2+ G+ T2+ G− T2− G− T2− G+ IL latching current VD = 12 V; IT = 0.1 A; Figure 9 T2+ G+ T2+ G− T2− G− T2− G+ IH VT VGT ID dVD/dt holding current on-state voltage gate trigger voltage off-state leakage current critical rate of rise of off-state voltage VD = 12 V; IGT = 0.1 A; Figure 10 IT = 0.85 A; Figure 11 VD = 12 V; IT = 0.1 A; Figure 7 VD = VDRM; IT = 0.1 A; Tj = 110 °C VD = VDRM(max); Tj = 110 °C VD = 67% of VDM(max); Tcase = 110 °C; exponential waveform; gate open circuit; Figure 12 Dynamic characteristics 30 45 V/µs 0.1 1 5 1 2 1 1.35 0.9 0.7 3 10 10 10 10 10 1.6 2 100 mA mA mA mA mA V V V µA 1 2 2 4 5 5 5 7 mA mA mA mA Min Typ Max Unit Static characteristics dVcom/dt tgt critical rate of rise of commutation VD = rated VDM; Tcase = 50 °C; ITM = 0.84 A; voltage commutating dI/dt = 0.3 A/ms gate controlled turn-on time ITM = 1.0 A; VD = VDRM(max); IG = 25 mA; dIG/dt = 5 A/µs - 5 2 - V/µs µs 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 5 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 1.2 α 1 003aaa613 α = 180° 120° 90° 60° 30° a 1.6 003aaa039 Ptot (W) 0.8 α 1.2 0.8 0.4 0.4 0 0 0.2 0.4 0.6 1 0.8 IT(RMS) (A) 0 -60 -10 40 90 T (°C) 140 j α = conduction angle V GT ( T ) j a = -----------------------V GT (25 ° C ) Fig 7. Normalized gate trigger voltage as a function of junction temperature; typical values. Fig 6. On-state dissipation as a function of on-state current (RMS value); maximum values. 3 T2+ G+ a T2− G+ T2− G− T2+ G− 2 003aaa030 3 a 003aaa031 2 1 1 0 -60 0 -10 40 90 Tj (°C) 140 -60 -10 40 90 Tj (°C) 140 I GT ( T ) j a = ----------------------I GT (25 ° C ) Fig 8. Normalized gate trigger current as a function of junction temperature; typical values. I L(T ) j a = ------------------I L (25 ° C ) Fig 9. Normalized latching current as a function of junction temperature; typical values. 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 6 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 2 a 1.5 003aaa032 1.6 IT (A) 1.2 003aaa612 Tj = 125 °C Tj = 25 °C 1 0.8 0.5 0.4 0 -60 0 -10 40 90 Tj (°C) 140 0 0.8 1.6 VT (V) 2.4 I H (T ) j a = -------------------I H (25 ° C ) Fig 10. Normalized holding current as a function of junction temperature; typical values Fig 11. On-state current as a function of on-state voltage; typical and maximum values. 103 003aaa034 dVD/dt (V/µs) 102 10 1 0 25 50 75 100 Tj (°C) 125 Fig 12. Critical rate of rise of off-state voltage as a function of junction temperature; typical values. 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 7 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 7. Package outline Plastic single-ended leaded (through hole) package; 3 leads SOT54 c E d A L b 1 D 2 e1 e 3 b1 L1 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A 5.2 5.0 b 0.48 0.40 b1 0.66 0.56 c 0.45 0.40 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 e 2.54 e1 1.27 L 14.5 12.7 L1(1) 2.5 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 REFERENCES IEC JEDEC TO-92 EIAJ SC-43 EUROPEAN PROJECTION ISSUE DATE 97-02-28 Fig 13. SOT54 (TO-92). 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 8 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 8. Revision history Table 6: Rev Date 01 20040219 Revision history CPCN Description Product data (9397 750 12594) 9397 750 12594 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 9 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac 9. Data sheet status Level I II Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). III Product data Production [1] [2] [3] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 10. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 11. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. 9397 9397 750 12594 Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data Rev. 01 — 19 February 2004 10 of 11 Philips Semiconductors BT1308-400D/600D Logic level triac Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 5.1 6 7 8 9 10 11 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Transient thermal impedance . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 © Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 19 February 2004 Document order number: 9397 750 12594
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