DATASHEET
ISL8487E, ISL81487L, ISL81487E
FN6051
Rev.8.00
Sep 20, 2018
±15kV ESD Protected, 1/8 Unit Load, 5V, Low Power, High Speed or Slew Rate
Limited RS-485/RS-422 Transceivers
The ISL8487E, ISL81487L, and ISL81487E RS-485/RS-422
devices are ESD protected, fractional unit load (UL),
BiCMOS, 5V powered, single transceivers that meet both
the RS-485 and RS-422 standards for balanced
communication. Each driver output/receiver input is
protected against ±15kV ESD strikes without latch-up. Unlike
competitive devices, this device family is specified for 10%
tolerance supplies (4.5V to 5.5V).
Features
All devices present a 1/8 unit load to the RS-485 bus, which
allows up to 256 transceivers on the network for large node
count systems (for example, process automation and remote
meter reading systems). In a remote utility meter reading
system, individual utility meter readings (in apartments, for
example) are routed to a concentrator with an RS-485
network, so the high allowed node count minimizes the
number of repeaters required to network all the meters. Data
for all meters is then read out from the concentrator from a
single access port or a wireless link.
• Slew rate limited versions for error free data
transmission (ISL8487E, ISL81487L) . . . . .up to 250kbps
• RS-485 I/O pin ESD protection . . . . . . . . . . . ±15kV HBM
- Class 3 ESD level on all other pins . . . . . . . >7kV HBM
• Fractional unit load allows up to 256 devices on the bus
• Specified for 10% tolerance supplies
• High data rate version (ISL81487E) . . . . . . . up to 5Mbps
• Low current shutdown mode (except ISL81487E) . . . 0.5µA
• Low quiescent supply current:
- ISL8487E, ISL81487L . . . . . . . . . . . 145µA (maximum)
- ISL81487E . . . . . . . . . . . . . . . . . . . . 420µA (maximum)
• -7V to +12V common mode input voltage range
• Three state Rx and Tx outputs
• 30ns propagation delays, 5ns skew (ISL81487E)
Slew rate limited drivers on the ISL8487E and ISL81487L
reduce EMI and minimize reflections from improperly
terminated transmission lines or unterminated stubs in
multidrop and multipoint applications. Data rates up to
250kbps are achievable with these devices.
• Half duplex pinouts
• Operate from a single +5V supply (10% tolerance)
• Current limiting and thermal shutdown for driver overload
protection
Data rates up to 5Mbps are achievable by using the
ISL81487E, which features higher slew rates.
• Pin compatible replacements for: MAX487E, (ISL8487E);
LTC1487, ADM1487 (ISL81487L); MAX1487E, ST485ER
(ISL81487E)
The receiver (Rx) inputs feature a “fail-safe if open” design,
which ensures a logic high Rx output if Rx inputs are floating.
• Pb-free plus anneal available (RoHS compliant)
The driver (Tx) outputs are short-circuit protected, even for
voltages exceeding the power supply voltage. Additionally,
on-chip thermal shutdown circuitry disables the Tx outputs to
prevent damage if power dissipation becomes excessive.
Applications
• High node count networks
• Automated utility meter reading systems
The half duplex devices multiplex the Rx inputs and Tx
outputs to allow transceivers with Rx and Tx disable
functions in 8 lead packages.
• Factory automation
• Security networks
• Building environmental control systems
Related Literature
• Industrial/process control networks
For a full list of related documents, visit our website:
• ISL8487E, ISL81487L, and ISL81487E product pages
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
HALF/FULL
DUPLEX
ISL8487E
Half
256
0.25
Yes
Yes
120
Yes
8
ISL81487L
Half
256
0.25
Yes
Yes
120
Yes
8
ISL81487E
Half
256
5
No
Yes
350
No
8
FN6051 Rev.8.00
Sep 20, 2018
NO. OF DEVICES
DATA RATE
ALLOWED ON BUS
(Mbps)
SLEW RATE
LIMITED?
RECEIVER/
QUIESCENT LOW POWER
PIN
DRIVER ENABLE?
ICC (A)
SHUTDOWN? COUNT
Page 1 of 16
ISL8487E, ISL81487L, ISL81487E
Typical Operating Circuits
9
9&&
538
52
9
Q)
Q)
5%
$<
5(
'(
9&&
$<
57
%=
9)6
57
538
52
5(
'(
%=
',
',
5%
*1'
*1'
To calculate the resistor values, refer to TB509.
Ordering Information
PART NUMBER ()
PART MARKING
TEMP. RANGE (°C)
TAPE AND REEL
(UNITS) (Note 1)
PACKAGE
PKG. DWG. #
ISL8487EIBZ
8487EIBZ
-40 to +85
-
8 Ld SOIC
(Pb-free)
M8.15
ISL8487EIBZ-T
8487EIBZ
-40 to +85
2.5k
8 Ld SOIC
(Pb-free)
M8.15
8487EIPZ
ISL8487EIPZ (not
recommended for new designs,
recommended replacement
ISL81487LIPZ)
-40 to +85
-
8 Ld PDIP
E8.3
(Pb-free, Note 4)
ISL81487LIBZ
81487LIBZ
-40 to +85
-
8 Ld SOIC
(Pb-free)
M8.15
ISL81487LIBZ-T
81487LIBZ
-40 to +85
2.5k
8 Ld SOIC
(Pb-free)
M8.15
ISL81487LIPZ
81487LIPZ
-40 to +85
-
E8.3
8 Ld PDIP
(Pb-free, Note 4)
ISL81487EIBZ
81487EIBZ
-40 to +85
-
8 Ld SOIC
(Pb-free)
M8.15
ISL81487EIBZ-T
81487EIBZ
-40 to +85
2.5k
8 Ld SOIC
(Pb-free)
M8.15
ISL81487EIPZ
ISL81487EIPZ
-40 to +85
-
8 Ld PDIP
E8.3
(Pb-free, Note 4)
NOTES:
1. Refer to TB347 for details about reel specifications.
2. Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020
3. For Moisture Sensitivity Level (MSL), see the ISL8487E, ISL81487L, and ISL81487E product information pages. For more information about
MSL, see TB363.
4. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
FN6051 Rev.8.00
Sep 20, 2018
Page 2 of 16
ISL8487E, ISL81487L, ISL81487E
Pinout
PDIP, SOIC
TOP VIEW
RO 1
8
VCC
RE 2
7
B/Z
DE 3
6
A/Y
5
GND
DI 4
R
D
Pin Descriptions
PIN
FUNCTION
RO
Receiver output. RO is high if A > B by at least 0.2V; RO is low if A < B by 0.2V or more; RO is high if A and B are unconnected (floating).
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs Y and Z are enabled by bringing DE high. They are high impedance when DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection.
A/Y
15kV HBM ESD protected, RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0;
pin is an output (Y) if DE = 1.
B/Z
15kV HBM ESD protected, RS-485/422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is
an output (Z) if DE = 1.
VCC
System power supply input (4.5V to 5.5V).
Truth Tables
TRANSMITTING
RECEIVING
INPUTS
OUTPUTS
INPUTS
OUTPUT
RE
DE
DI
Z
Y
RE
DE
A-B
RO
X
1
1
0
1
0
X
≥ +0.2V
1
X
1
0
1
0
0
X
≤ -0.2V
0
0
0
X
High-Z
High-Z
0
X
Inputs Open
1
1
0
X
High-Z
(Note 12)
High-Z
(Note 12)
1
X
X
High-Z
(Note 12)
1
0
X
High-Z
FN6051 Rev.8.00
Sep 20, 2018
Page 3 of 16
ISL8487E, ISL81487L, ISL81487E
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Input/Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short-Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . See “Electrical Specifications”
Thermal Resistance (Typical, Note 5)
JA (°C/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
170
140
8 Ld PDIP Package (Note 6) . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
Operating Conditions
Temperature Range
ISL8XXXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” can permanently damage the device. This is a stress only rating and operation of the device at
these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
5. JA is measured with the component mounted on a low-effective thermal conductivity test board in free air. See TB379 for details.
6. Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
(
Electrical Specifications
PARAMETER
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C,
Note 7
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
TYP
MAX
UNIT
Full
-
-
VCC
V
DC CHARACTERISTICS
Driver Differential VOUT (No Load)
VOD1
Driver Differential VOUT (with Load)
VOD2
R = 50Ω (RS-422), (Figure 1)
Full
2
3
-
V
R = 27Ω (RS-485), (Figure 1)
Full
1.5
2.3
5
V
VOD
R = 27Ω or 50Ω, (Figure 1)
Full
-
0.01
0.2
V
VOC
R = 27Ω or 50Ω, (Figure 1)
Full
-
-
3
V
VOC
R = 27Ω or 50Ω, (Figure 1)
Full
-
0.01
0.2
V
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
Logic Input Current
IIN1
DE, DI, RE
Input Current (A/Y, B/Z), (Note 15)
IIN2
DE = 0V, VCC = 4.5 to
5.5V
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
Logic Input High Voltage
IIN2
Receiver Differential Threshold
Voltage
VTH
Full
-2
-
2
µA
VIN = 12V
Full
-
-
140
µA
VIN = -7V
Full
-
-
-120
µA
VIN = 12V
Full
-
-
180
µA
VIN = -7V
Full
-
-
-100
µA
-7V VCM 12V
Full
-0.2
-
0.2
V
-
mV
DE = 0V, VCC = 0V
Receiver Input Hysteresis
VTH
VCM = 0V
25
-
70
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
3.5
-
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
-
0.4
V
Three-State (High Impedance)
Receiver Output Current
IOZR
0.4V VO 2.4V
Full
-
-
1
µA
Receiver Input Resistance
RIN
-7V VCM 12V
Full
96
-
-
kΩ
FN6051 Rev.8.00
Sep 20, 2018
Page 4 of 16
ISL8487E, ISL81487L, ISL81487E
Electrical Specifications
PARAMETER
No-Load Supply Current, (Note 8)
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C,
Note 7 (Continued)
SYMBOL
ICC
TEST CONDITIONS
ISL81487E, DI, RE = 0V DE = VCC
or VCC
DE = 0V
ISL8487E, ISL81487L,
DI, RE = 0V or VCC
TEMP
(°C)
MIN
TYP
MAX
UNIT
Full
-
400
500
µA
Full
-
350
420
µA
DE = VCC
Full
-
160
200
µA
DE = 0V
Full
-
120
145
µA
Shutdown Supply Current
ISHDN
(Note 12), DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.5
8
µA
Driver Short-Circuit Current,
VO = High or Low
IOSD1
DE = VCC, -7V VY or VZ 12V, (Note 9)
Full
35
-
250
mA
Receiver Short-Circuit Current
IOSR
0V VO VCC
Full
7
-
85
mA
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
15
24
50
ns
tSKEW
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
-
3
10
ns
tR, tF
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
3
12
25
ns
tZH
CL = 100pF, SW = GND, (Figure 2)
Full
-
14
70
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC, (Figure 2)
Full
-
14
70
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND, (Figure 2)
Full
-
44
70
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, (Figure 2)
Full
-
21
70
ns
Receiver Input to Output Delay
tPLH, tPHL
(Figure 4)
Full
30
90
150
ns
tSKD
SWITCHING CHARACTERISTICS (ISL81487E)
Driver Input to Output Delay
Driver Output Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
Receiver Skew | tPLH - tPHL |
(Figure 4)
25
-
5
-
ns
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND, (Figure 5)
Full
-
9
50
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC, (Figure 5)
Full
-
9
50
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND, (Figure 5)
Full
-
9
50
ns
Receiver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, (Figure 5)
Full
-
9
50
ns
Full
5
-
-
Mbps
Maximum Data Rate
fMAX
SWITCHING CHARACTERISTICS (ISL8487E)
Driver Input to Output Delay
Driver Output Skew
Driver Differential Rise or Fall Time
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
250
650
2000
ns
tSKEW
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
-
160
800
ns
tR, tF
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
250
900
2000
ns
Driver Enable to Output High
tZH
CL = 100pF, SW = GND, (Figure 3, Note 10)
Full
250
1000
2000
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC, (Figure 3, Note 10)
Full
250
860
2000
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND, (Figure 3)
Full
300
660
3000
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, (Figure 3)
Full
300
640
3000
ns
Receiver Input to Output Delay
tPLH, tPHL
(Figure 4)
Full
250
500
2000
ns
tSKD
(Figure 4)
25
-
60
-
ns
Receiver Skew | tPLH - tPHL |
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND, (Figure 5, Note 11)
Full
-
10
50
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC, (Figure 5, Note 11)
Full
-
10
50
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND, (Figure 5)
Full
-
10
50
ns
tLZ
CL = 15pF, SW = VCC, (Figure 5)
Full
-
10
50
ns
Full
250
-
-
kbps
(Note 12)
Full
50
120
600
ns
Receiver Disable from Output Low
Maximum Data Rate
Time to Shutdown
fMAX
tSHDN
Driver Enable from Shutdown to
Output High
tZH(SHDN)
CL = 100pF, SW = GND, (Figure 3, Notes 12 and
13)
Full
-
1000
2000
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
CL = 100pF, SW = VCC, (Figure 3, Notes 12 and
13)
Full
-
1000
2000
ns
FN6051 Rev.8.00
Sep 20, 2018
Page 5 of 16
ISL8487E, ISL81487L, ISL81487E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = +25°C,
Note 7 (Continued)
TEMP
(°C)
MIN
TYP
MAX
UNIT
CL = 15pF, SW = GND, (Figure 5, Notes 12 and
14)
Full
-
800
2500
ns
CL = 15pF, SW = VCC, (Figure 5, Notes 12 and
14)
Full
-
800
2500
ns
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
150
650
1200
ns
tSKEW
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
-
160
600
ns
tR, tF
RDIFF = 54Ω, CL = 100pF, (Figure 2)
Full
250
900
1200
ns
PARAMETER
SYMBOL
TEST CONDITIONS
Receiver Enable from Shutdown to
Output High
tZH(SHDN)
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
SWITCHING CHARACTERISTICS (ISL81487L)
Driver Input to Output Delay
Driver Output Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
tZH
CL = 100pF, SW = GND, (Figure 3, Note 10)
Full
100
1000
1500
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC, (Figure 3, Note 10)
Full
100
1000
1500
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND, (Figure 3)
Full
150
750
1500
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, (Figure 3)
Full
150
750
1500
ns
Receiver Input to Output Delay
tPLH, tPHL
(Figure 4)
Full
30
175
250
ns
tSKD
Receiver Skew | tPLH - tPHL |
(Figure 4)
25
-
13
-
ns
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND, (Figure 5, Note 11)
Full
-
10
50
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC, (Figure 5, Note 11)
Full
-
10
50
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND, (Figure 5)
Full
-
10
50
ns
Receiver Disable from Output Low
tLZ
CL = 15pF, SW = VCC, (Figure 5)
Full
-
10
50
ns
Full
250
-
-
kbps
Maximum Data Rate
Time to Shutdown
fMAX
tSHDN
(Note 12)
Full
50
140
600
ns
Driver Enable from Shutdown to
Output High
tZH(SHDN)
CL = 100pF, SW = GND, (Figure 3, Notes 12 and
13)
Full
-
1100
2000
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
CL = 100pF, SW = VCC, (Figure 3, Notes 12 and
13)
Full
-
1000
2000
ns
Receiver Enable from Shutdown to
Output High
tZH(SHDN)
CL = 15pF, SW = GND, (Figure 3, Notes 12 and
14)
Full
-
900
2000
ns
Receiver Enable from Shutdown to
Output Low
tZL(SHDN)
CL = 15pF, SW = VCC, (Figure 3, Notes 12 and
14)
Full
-
900
2000
ns
Human Body Model
25
-
15
-
kV
25
-
>7
-
kV
ESD PERFORMANCE
RS-485 Pins (A/Y, B/Z)
All Other Pins
NOTES:
7. Currents into device pins are positive; currents out of device pins are negative. Voltages are referenced to ground unless otherwise specified.
8. Supply current specification is valid for loaded drivers when DE = 0V.
9. Applies to peak current. See “Typical Performance Curves” for more information.
10. When testing the ISL8487E and ISL81487L, keep RE = 0 to prevent the device from entering shutdown (SHDN).
11. When testing the ISL8487E and ISL81487L, the RE signal high time must be short enough (typically 600ns to ensure that the device enters SHDN.
14. Set the RE signal high time >600ns to ensure that the device enters SHDN.
15. Devices meeting these limits are denoted as 1/8 unit load (1/8 UL) transceivers. The RS-485 standard allows up to 32 UL on the bus, so there
can be 256 1/8 UL devices on a bus.
FN6051 Rev.8.00
Sep 20, 2018
Page 6 of 16
ISL8487E, ISL81487L, ISL81487E
Test Circuits and Waveforms
VCC
R
DE
DI
Z
VOD
D
Y
R
VOC
FIGURE 1. DRIVER VOD AND VOC
3V
DI
1.5V
1.5V
0V
tPHL
tPLH
VOH
50%
OUT (Y)
50%
VOL
tPHL
tPLH
VOH
VCC
CL = 100pF
DE
OUT (Z)
50%
50%
VOL
Z
DI
RDIFF
D
Y
SIGNAL
GENERATOR
CL = 100pF
90%
DIFF OUT (Y - Z)
10%
tR
+VOD
90%
10%
-VOD
tF
SKEW = |tPLH (Y or Z) - tPHL (Z or Y)|
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
FN6051 Rev.8.00
Sep 20, 2018
Page 7 of 16
ISL8487E, ISL81487L, ISL81487E
Test Circuits and Waveforms (Continued)
DE
Z
DI
500
VCC
D
SIGNAL
GENERATOR
GND
SW
Y
CL
3V
(SHDN) for ISL8487E and ISL81487L only.
PARAMETER OUTPUT
tHZ
RE
DI
SW
CL (pF)
X
1/0
GND
15
Y/Z
tLZ
Y/Z
tZH
Y/Z
0
(Note 10)
tZL
Y/Z
tZH(SHDN)
Y/Z
tZLSHDN)
X
Y/Z
0/1
VCC
15
1/0
GND
100
0
(Note 10)
0/1
VCC
100
1
(Note 12)
1/0
GND
100
1
(Note 12)
0/1
DE
1.5V
NOTE 7
1.5V
0V
tZH, tZH(SHDN)
VOH - 0.5V
OUT (Y, Z)
100
VCC
tHZ
OUTPUT HIGH
NOTE 7
VOH
2.3V
0V
tZL, tZL(SHDN)
tLZ
NOTE 7
VCC
OUT (Y, Z)
2.3V
VOL + 0.5V V
OL
OUTPUT LOW
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3A. TEST CIRCUIT
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
RE
+1.5V
3V
15pF
B
R
A
A
RO
1.5V
1.5V
0V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
50%
RO
50%
0V
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. RECEIVER PROPAGATION DELAY
RE
B
R
SIGNAL
GENERATOR
1k
RO
VCC
SW
A
NOTE 7
3V
GND
15pF
RE
1.5V
1.5V
0V
tZH, tZH(SHDN)
(SHDN) for ISL8487E and ISL81487L only.
PARAMETER
DE
A
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH (Note 11)
0
+1.5V
GND
tZL (Note 11)
0
-1.5V
VCC
tZH(SHDN) (Note 12)
0
+1.5V
GND
tZL(SHDN) (Note 12)
0
-1.5V
VCC
FIGURE 5A. TEST CIRCUIT
OUTPUT HIGH
NOTE 7
tHZ
VOH - 0.5V
RO
VOH
1.5V
0V
tZL, tZL(SHDN)
tLZ
NOTE 7
VCC
RO
1.5V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER ENABLE AND DISABLE TIMES
FN6051 Rev.8.00
Sep 20, 2018
Page 8 of 16
ISL8487E, ISL81487L, ISL81487E
Application Information
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard that allows only one
driver and up to 10 receivers on each bus (assuming one
unit load devices). RS-485 is a true multipoint standard that
allows up to 32 one unit load devices (any combination of
drivers and receivers) on each bus. To allow for multipoint
operation, the RS-485 specification requires that drivers
handle bus contention without sustaining any damage.
An important advantage of RS-485 is the extended
Common-Mode Range (CMR), which specifies that the
driver outputs and receiver inputs withstand signals ranging
from +12V to -7V. RS-422 and RS-485 are intended for runs
as long as 4000ft, so the wide CMR is necessary to handle
ground potential differences and voltages induced in the
cable by external fields.
Receiver Features
These devices use a differential input receiver for maximum
noise immunity and common-mode rejection. Input sensitivity
is 200mV, as required by the RS-422 and RS-485
specifications.
The receiver input resistance of 96kΩ surpasses the RS-422
specification of 4kΩ and is eight times the RS-485 Unit Load
(UL) requirement of 12kΩ minimum. Thus, these products
are known as one-eighth UL transceivers. A network can
host up to 256 of these devices still complying with the
RS-485 loading specification.
maximum data rate on these slew rate limited versions is
250kbps. The ISL81487E drivers are not limited, so faster
output transition times allow data rates of at least 5Mbps.
Data Rate, Cables, and Terminations
RS-485/422 are intended for network lengths up to 4000ft,
but the maximum system data rate decreases as the
transmission length increases. Devices operating at 5Mbps
are limited to lengths less than a few hundred feet, while the
250kbps versions can operate at full data rates with lengths
in excess of 1000ft.
Twisted pair cable is the cable of choice for RS-485/422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as
common-mode signals that are effectively rejected by the
differential receivers in these ICs.
Proper termination is imperative to minimize reflections
when using the 5Mbps device. Short networks using the
250kbps versions do not need to be terminated, but
terminations are recommended unless power dissipation is
an overriding concern.
In point-to-point or point-to-multipoint (single driver on bus)
networks, terminate the main cable in its characteristic
impedance (typically 120Ω) at the end farthest from the
driver. In multi-receiver applications, keep stubs connecting
receivers to the main cable as short as possible. In
multipoint (multi-driver) systems, terminate the main cable in
its characteristic impedance at both ends. Keep stubs
connecting a transceiver to the main cable as short as
possible.
Built-In Driver Overload Protection
The receiver inputs function with common-mode voltages as
great as 7V outside the power supplies (that is, +12V and
-7V), making them ideal for long networks in which induced
voltages are a realistic concern.
The RS-485 specification requires that drivers survive worst
case bus contentions undamaged. These devices meet this
requirement with driver output short-circuit current limits and
on-chip thermal shutdown circuitry.
All the receivers include a “fail-safe if open” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating).
The driver output stages incorporate short-circuit current
limiting circuitry that ensures the output current never
exceeds the RS-485 specification, even at the
common-mode voltage range extremes. These devices also
use a foldback circuit that reduces the short-circuit current
and as a result, the power dissipation when the contending
voltage exceeds either supply.
Receivers easily meet the data rates supported by the
corresponding driver. The receiver outputs are three-statable
using the active low RE input.
Driver Features
The RS-485/422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485) and at
least 2V across a 100Ω load (RS-422). The drivers feature
low propagation delay skew to maximize bit width and to
minimize EMI.
Driver outputs are three-statable using the active high DE
input.
In the event of a major short-circuit condition, the thermal
shutdown feature disables the drivers when the die
temperature becomes excessive. This eliminates the power
dissipation, allowing the die to cool. The drivers
automatically re-enable after the die temperature drops
about 15°C. If the condition persists, the thermal
shutdown/re-enable cycle repeats until the fault is cleared.
Receivers stay operational during thermal shutdown.
The ISL8487E and ISL81487L driver outputs are slew rate
limited to minimize EMI and to minimize reflections in
unterminated or improperly terminated networks. The
FN6051 Rev.8.00
Sep 20, 2018
Page 9 of 16
ISL8487E, ISL81487L, ISL81487E
Low Power Shutdown Mode (Excluding ISL81487E)
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but the ISL8487E and
ISL81487L include a shutdown feature that reduces the
already low quiescent ICC to a 500nA trickle. They enter
shutdown whenever the receiver and driver are
simultaneously disabled (RE = VCC and DE = GND) for a
period of at least 600ns. Disabling both the driver and the
receiver for less than 50ns guarantees that shutdown is not
entered.
Note that receiver and driver enable times increase when
enabling from shutdown. Refer to Note 10 through 14 at the
end of the “Electrical Specifications” table for more information.
ESD Protection
All pins on the interface devices include Class 3 Human Body
Model (HBM) ESD protection structures, but the RS-485 pins
(driver outputs and receiver inputs) incorporate advanced
structures allowing them to survive ESD events in excess of
15kV HBM. The RS-485 pins are particularly vulnerable to
Human Body Model Testing
This test method emulates the ESD event delivered to an IC
during human handling. The tester delivers the charge stored
on a 100pF capacitor through a 1.5k current limiting resistor
into the pin under test. The HBM method determines an IC’s
ability to withstand the ESD events typically present during
handling and manufacturing. The RS-485 pin survivability on
this high ESD family has been characterized to be in excess of
15kV for discharges to GND.
VCC = 5V, TA = +25°C, ISL8487E, ISL81487L, and ISL81487E; unless otherwise specified
90
3.6
80
3.4
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
Typical Performance Curves
ESD damage because they typically connect to an exposed
port on the exterior of the finished product. Touching the port
pins or connecting a cable can cause an ESD event that
destroys unprotected ICs. The ESD structures protect the
device whether or not it is powered up, protect without
allowing any latchup mechanism to activate, and without
degrading the RS-485 common-mode range of -7V to +12V.
This built-in ESD protection eliminates the need for board
level protection structures (for example, transient
suppression diodes), and the associated undesirable
capacitive load they present.
70
60
50
40
30
20
10
0
0
1
2
3
4
DIFFERENTIAL OUTPUT VOLTAGE (V)
FIGURE 6. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FN6051 Rev.8.00
Sep 20, 2018
5
3.2
RDIFF = 100Ω
3
2.8
2.6
2.4
RDIFF = 54Ω
2.2
2
-40
-25
0
50
25
75
TEMPERATURE (°C)
FIGURE 7. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
Page 10 of 16
85
ISL8487E, ISL81487L, ISL81487E
Typical Performance Curves
VCC = 5V, TA = +25°C, ISL8487E, ISL81487L, and ISL81487E; unless otherwise specified
400
160
ISL81487E, DE = VCC, RE = X
140
ISL81487E
120
ISL81487E, DE = GND, RE = X
80
ISL8487E, ISL81487L
300
60
40
ICC (µA)
OUTPUT CURRENT (mA)
350
Y OR Z = LOW
100
20
0
-20
200
Y OR Z = HIGH
-40
250
ISL8487E, ISL81487L, DE = VCC, RE = X
-60
ISL81487E
-80 ISL8487E, ISL81487L
-100
150
-120
100
-40
-7 -6
-4
-2
ISL8487E, ISL81487L, DE = GND, RE = GND
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
12
FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT-CIRCUIT
VOLTAGE
0
25
TEMPERATURE (°C)
50
75
FIGURE 9. SUPPLY CURRENT vs TEMPERATURE
250
750
700
200
tPLHY
tPLHZ
650
|tPLHY - tPHLZ|
150
600
SKEW (ns)
PROPAGATION DELAY (ns)
-25
tPHLY
550
tPHLZ
50
500
450
-40
|tPHLY - tPLHZ|
100
|CROSS PT. OF Y & Z - CROSS PT. OF Y & Z|
-25
0
25
TEMPERATURE (°C)
50
75
0
-40
85
-25
0
25
TEMPERATURE (°C)
50
75
85
FIGURE 11. DRIVER SKEW vs TEMPERATURE
(ISL8487E and ISL81487L)
FIGURE 10. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL8487E and ISL81487L)
30
5
4
|tPHLY - tPLHZ|
26
3
24
22
20
SKEW (ns)
PROPAGATION DELAY (ns)
28
tPLHY
tPHLZ
tPLHZ
|tPLHY - tPHLZ|
2
1
18
|CROSSING PT. OF Y & Z - CROSSING PT. OF Y & Z|
tPHLY
16
-40
-25
0
25
50
TEMPERATURE (°C)
FIGURE 12. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL81487E)
FN6051 Rev.8.00
Sep 20, 2018
75
85
0
-40
-25
0
50
25
75
TEMPERATURE (°C)
FIGURE 13. DRIVER SKEW vs TEMPERATURE
(ISL81487E)
Page 11 of 16
85
ISL8487E, ISL81487L, ISL81487E
RO
0
ISL81487L
5
RO
0
ISL8487E
4
3
2
B/Z
A/Y
1
0
5
RO
0
5
RO
0
3
2
DRIVER OUTPUT (V)
4
RECEIVER OUTPUT (V)
5
DRIVER INPUT (V)
RECEIVER OUTPUT (V)
DRIVER OUTPUT (V)
RO
0
B/Z
A/Y
1
0
TIME (20ns/DIV)
FIGURE 16. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL81487E)
ISL8487E
3
2
A/Y
B/Z
1
0
TIME (400ns/DIV)
0
5
ISL81487L
FIGURE 15. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL8487E and ISL81487L)
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL8487E and ISL81487L)
DI
RDIFF = 54Ω, CL = 100pF
DI
5
0
5
RO
0
4
3
2
A/Y
B/Z
1
0
TIME (20ns/DIV)
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL81487E)
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
518
PROCESS:
Si Gate CMOS
FN6051 Rev.8.00
Sep 20, 2018
0
4
TIME (400ns/DIV)
RDIFF = 54Ω, CL = 100pF
5
DRIVER INPUT (V)
5
0
RDIFF = 54Ω, CL = 100pF
DI
Page 12 of 16
DRIVER INPUT (V)
RDIFF = 54Ω, CL = 100pF
DRIVER INPUT (V)
5
DI
RECEIVER OUTPUT (V)
VCC = 5V, TA = +25°C, ISL8487E, ISL81487L, and ISL81487E; unless otherwise specified
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
ISL8487E, ISL81487L, ISL81487E
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision.
DATE
REVISION
CHANGE
Sep 20, 2018
FN6051.8
Applied Renesas Header/Footer.
Added Related Literature section.
Updated Ordering Information table by removing retired parts ISL8487EIB, ISL81487LIB,
ISL81487LIP, and ISL81487EIP, adding Notes 1 and 3, and adding tape and reel parts and column.
Updated the Typical Operating Circuit diagram on page 2.
Added Revision History section.
Updated POD M8.15 to the latest revision. Changes are as follows:
-Revision 1: Initial revision
-Revision 1 to revision 2: Updated to new package outline drawing format by removing table, moving
dimensions onto drawing, and adding land pattern
-Revision 2 to revision 3: Changed the following values in Typical Recommended Landing Pattern:
2.41(0.095) to 2.20 (0.087)
0.76(0.030) to 0.60(0.023)
0.200 to 5.20(0.205)
-Revision 3 to revision 4: Changed text in Note 1 from “1982” to “1994”
FN6051 Rev.8.00
Sep 20, 2018
Page 13 of 16
ISL8487E, ISL81487L, ISL81487E
Package Outline Drawings
E8.3 (JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N
INCHES
E1
INDEX
AREA
1 2 3
N/2
-B-
-AD
E
BASE
PLANE
-C-
SEATING
PLANE
A2
e
B1
D1
B
0.010 (0.25) M
A1
eC
C A B S
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
L
C
0.008
0.014
0.204
eA
D
0.355
0.400
9.01
A
L
D1
MILLIMETERS
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
0.355
10.16
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
eB
-
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
L
0.115
N
8
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
8
6
10.92
7
3.81
4
9
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
For the most recent package outline drawing, see E8.3.
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
FN6051 Rev.8.00
Sep 20, 2018
Page 14 of 16
ISL8487E, ISL81487L, ISL81487E
M8.15
For the most recent package outline drawing, see M8.15.
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
INDEX
6.20 (0.244)
5.80 (0.228)
AREA
0.50 (0.20)
x 45°
0.25 (0.01)
4.00 (0.157)
3.80 (0.150)
1
2
8°
0°
3
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
TOP VIEW
2.20 (0.087)
SEATING PLANE
5.00 (0.197)
4.80 (0.189)
1.75 (0.069)
1.35 (0.053)
1
8
2
7
0.60 (0.023)
1.27 (0.050)
3
6
4
5
-C-
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
0.25(0.010)
0.10(0.004)
5.20(0.205)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.
FN6051 Rev.8.00
Sep 20, 2018
Page 15 of 16
Notice
1.
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the incorporation or any other use of the circuits, software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by
you or third parties arising from the use of these circuits, software, or information.
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(Note 2)
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Tel: +44-1628-651-700
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709 Quantum Plaza, No.27 ZhichunLu, Haidian District, Beijing, 100191 P. R. China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, 200333 P. R. China
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HAL 2nd Stage, Indiranagar, Bangalore 560 038, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
17F, KAMCO Yangjae Tower, 262, Gangnam-daero, Gangnam-gu, Seoul, 06265 Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5338
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