RP114x SERIES
300mA LDO REGULATOR
NO. EA-236-160824
OUTLINE
The RP114x Series are CMOS-based voltage regulator ICs with high output voltage accuracy, low supply
current, low dropout, and high ripple rejection. Each of these voltage regulator ICs consists of a voltage reference
unit, an error amplifier, resistors for setting output voltage, a short current limit circuit, a chip enable circuit, and
so on.
RP114x features a minimum input voltage from 1.4V and the output voltage, which can be set from 0.8V to
3.6V (in 0.1V step). The output voltage of these ICs is internally fixed.
These ICs perform with low dropout voltage due to built-in transistor with low ON resistance. Low supply
current and a chip enable function prolong the battery life of each system. The ripple rejection, line transient
response and load transient response of the RP114x Series are excellent, thus these ICs are very suitable for
the power supply for hand-held communication equipment.
Since the packages for these ICs are DFN(PLP)1010-4, SC-88A, SOT-23-5, therefore high density mounting
of the ICs on boards is possible.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
Supply Current ............................................................. Typ. 50µA
Standby Current ........................................................... Typ. 0.1µA
Input Voltage Range ..................................................... 1.4V to 5.25V
Output Voltage Range .................................................. 0.8V to 3.6V (0.1V steps)
(For other voltages, please refer to Mark Specification Table).
Output Voltage Accuracy .............................................. ±1.0% (VSET>2.0V, Topt=25°C)
Temperature-Drift Coefficient of Output Voltage .......... Typ. ±80ppm/°C
Dropout Voltage............................................................ Typ. 0.25V (IOUT=300mA, VSET=2.8V)
Ripple Rejection ........................................................... Typ. 75dB (f=1kHz)
Line Regulation ............................................................ Typ. 0.02%/V
Packages .................................................................... DFN(PLP)1010-4, SC-88A, SOT-23-5
Built-in Fold Back Protection Circuit ............................. Typ. 60mA (Current at short mode)
Ceramic capacitors are recommended to be used with this IC .... 1.0µF or more
APPLICATIONS
• Power source for portable communication equipment.
• Power source for electrical appliances such as cameras, VCRs and camcorders.
• Power source for battery-powered equipment.
1
RP114x
NO. EA-236-160824
BLOCK DIAGRAMS
RP114xxxxB
RP114xxxxD
VDD
VOUT
VDD
Vref
VOUT
Vref
Current Limit
Current Limit
CE
GND
CE
GND
SELECTION GUIDE
The set output voltage, the auto discharge function, and the package type for the ICs are user-selectable
options.
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
DFN(PLP)1010-4
10,000 pcs
Yes
Yes
RP114Qxx2∗(y)-TR-FE
SC-88A
3,000 pcs
Yes
Yes
RP114Nxx1∗(y)-TR-FE
SOT-23-5
3,000 pcs
Yes
Yes
RP114Kxx1∗(y)-TR
xx : Specify the set output voltage within the range of 0.8 V (08) to 3.6 V (36) in 0.1 V step.
(y): If the output voltage includes the 3rd digit, indicate the digit of 0.01V.
(1.05 V, 1.15 V, 1.25 V, 1.35 V, 1.75 V, 1.85 V, 2.85 V, 3.45 V)
Ex. If the output voltage is 1.25V, RP114K121∗5-TR
If the output voltage is 1.85V, RP114K181∗5-TR
∗: Specify a combination of the CE pin polarity and the auto-discharge function.
(B) “H” Active, without Auto-Discharge function
(D) “H” Active, with Auto-Discharge function
Auto-Discharge function quickly lowers the output voltage to 0V by releasing the electrical charge in the external capacitor
when the chip enable signal is switched from the active mode to the standby mode.
2
RP114x
NO. EA-236-160824
PIN DESCRIPTIONS
• DFN(PLP)1010-4
Bottom View
Top View
4
• SC-88A
3
3
4
5
∗
1
•
2
2
4
• SOT-23-5
5
(mark side)
1
1
2
3
4
(mark side)
1
2
3
DFN(PLP)1010-4
Pin No
Symbol
Pin Description
1
VOUT
Output Pin
2
GND
Ground Pin
3
CE
Chip Enable Pin ("H" Active)
4
VDD
Input Pin
∗) Tab is GND level. (They are connected to the reverse side of this IC.)
The tab is better to be connected to the GND, but leaving it open is also acceptable.
•
•
SC-88A
Pin No
Symbol
Pin Description
1
CE
Chip Enable Pin ("H" Active)
2
NC
No Connection
3
GND
Ground Pin
4
VOUT
Output Pin
5
VDD
Input Pin
SOT-23-5
Pin No
Symbol
Pin Description
1
VDD
2
GND
3
CE
Chip Enable Pin ("H" Active)
4
NC
No Connection
5
VOUT
Output Pin
Input Pin
Ground Pin
3
RP114x
NO. EA-236-160824
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Unit
VIN
Input Voltage
6.0
V
VCE
Input Voltage (CE Pin)
6.0
V
VOUT
Output Voltage
−0.3 to VIN+0.3
V
IOUT
Output Current
400
mA
Power Dissipation (DFN(PLP)1010-4)
∗
400
Power Dissipation (SC-88A)∗
380
Power Dissipation (SOT-23-5)∗
420
Topt
Operating Temperature Range
−40 to 85
°C
Tstg
Storage Temperature Range
−55 to 125
°C
PD
Rating
mW
∗) For Power Dissipation, please refer to PACKAGE INFORMATION.
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages
and may degrade the life time and safety for both device and system using the device in the field. The functional
operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
4
RP114x
NO. EA-236-160824
ELECTRICAL CHARACTERISTICS
•
RP114x
VIN=VSET+1.0V (VSET > 1.5V), VIN=2.5V (VSET ≤ 1.5V), IOUT=1mA, CIN=COUT=1.0µF, unless otherwise noted.
VSET is Set Output Voltage.
The specifications in
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
RP114xxxxB/D
Symbol
(Ta=25°C)
Item
Conditions
Ta=25°C
VOUT
Output Voltage
-40°C ≤ Ta ≤ 85°C
IOUT
Load Regulation
VDIF
Dropout Voltage
ISS
Supply Current
Typ.
Max.
Unit
VSET > 2.0V
×0.99
×1.01
V
VSET ≤ 2.0V
-20
+20
mV
VSET > 2.0V
×0.97
×1.03
V
VSET ≤ 2.0V
-60
+60
mV
Output Current
∆VOUT
/∆IOUT
Min.
mA
300
1mA ≤ IOUT ≤ 300mA
15
mV
40
Please refer to Dropout Voltage shown on the next page.
IOUT = 0mA
50
75
μA
VCE= 0V
0.1
1.0
μA
Line Regulation
VSET+0.5V ≤ VIN ≤ 5.25V
(VIN ≥ 1.4V)
0.02
0.10
%/V
RR
Ripple Rejection
f=1kHz
Ripple 0.2Vp-p
VIN=VSET +1V
IOUT=30mA
(When VSET ≤ 2.0V, VIN=3.0V)
VIN
Input Voltage*2
Istandby Standby Current
∆VOUT
/∆VIN
75
1.4
dB
5.25
V
Output Voltage
-40°C ≤ Ta ≤ 85°C
Temperature Coefficient
±80
ppm
/°C
ISC
Short Current Limit
60
mA
IPD
CE Pull-down Current
VCEH
CE Input Voltage “H”
VCEL
CE Input Voltage “L”
∆VOUT
/∆Ta
en
RLOW
VOUT=0V
0.3
0.6
μA
V
1.0
0.4
V
Output Noise
BW=10Hz to 100kHz
IOUT=30mA
75
μVrms
LOW Output Nch On
Resistance
(D version only)
VIN=4.0V
VCE=0V
50
Ω
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj≈Ta=25ºC) except for Output
Noise, Ripple Rejection, and Output Voltage Temperature Coefficient.
*2
The maximum input voltage listed under Electrical Characteristics is 5.25V. If, for any reason the input voltage exceeds
5.25V, it has to be no more than 5.5V with 500hrs of the total operating time.
5
RP114x
NO. EA-236-160824
The specifications in
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
(Ta=25°C)
Dropout Voltage by Set Output Voltage
Set Output Voltage
VSET (V)
Typ.
Max.
VSET=0.8
0.560
0.720
VSET=0.9
0.510
0.650
1.0 ≤ VSET < 1.2
0.460
0.590
1.2 ≤ VSET < 1.4
0.390
0.500
0.350
0.440
1.7 ≤ VSET < 2.1
0.300
0.390
2.1 ≤ VSET < 2.5
0.260
0.340
2.5 ≤ VSET < 3.0
0.250
0.300
3.0 ≤ VSET ≤ 3.6
0.220
0.290
1.4 ≤ VSET < 1.7
6
Dropout Voltage VDIF (V)
Condition
IOUT=300mA
RP114x
NO. EA-236-160824
TYPICAL APPLICATIONS
VDD
C1
CE Control
(External Components)
C2 Ceramic 1.0µF
RP114x
Series
CE
VOUT
VOUT
C2
GND
MURATA: GRM155B31A105KE15
TECHNICAL NOTES
When using these ICs, consider the following points:
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor C2 with 1.0µF or more and good ESR (Equivalent Series Resistance).
(Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for
phase compensation, the operation might be unstable. Because of this, test these ICs with as same external
components as ones to be used on the PCB.)
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor C1 with a capacitance value as much as 1.0µF or more between VDD and GND pin, and as
close as possible to the pins.
Set external components, especially the output capacitor C2, as close as possible to the ICs, and make wiring
as short as possible.
7
RP114x
NO. EA-236-160824
PACKAGE INFORMATION
Power Dissipation (DFN(PLP)1010-4)
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
Measurement Conditions below.
Measurement Conditions
Standard Land Pattern
Environment
Board Material
Mounting on Board (Wind Velocity=0m/s)
Glass Cloth Epoxy Plastic (Double-sided)
Board Dimensions
40mm x 40mm x 1.6mm
Copper Ratio
Top-side: Approx. 50%, Back-side: Approx. 50%
Through-hole
φ 0.54mm x 24pcs
Measurement Result
(Ta=25°C)
Standard Land Pattern
400mW (Tjmax=125°C)
500mW (Tjmax=150°C)
θja=(125-25°C)/0.4W=250 °C/W
Power Dissipation
Thermal Resistance
θjc=67 °C/W
40
40
Measurement Board Pattern
IC Mount Area (Unit: mm)
Note: The above graph shows the power dissipation of the package based on Tjmax=125ºC and
Tjmax=150ºC. Operating the IC within the shaded area in the graph might have an influence on its
lifetime.
Operating time must be within the time limit described in the table below.
8
Operating Time
Estimated Years
(Operating 4 hrs/ day)
13,000 hours
9 Years
RP114x
NO. EA-236-160824
X4
3
*
4
45°
1.00
0.25±0.05
0.05
0.6MAX.
INDEX
0.05MIN.
0.48
±0.05
0.65
3-C0.18
2
0.25±0.05
B
1 0.48
±0.05
0.25±0.05
0.32±0.05
A
1.00
0.07±0.05
Package Dimensions (DFN(PLP)1010-4)
0.05 M S AB
Bottom View
S
0.05 S
(Unit : mm)
* The tab is substrate level (GND).
The tab is better to be connected to the GND,
but leaving it open is also acceptable.
Mark Specification (DFN(PLP)1010-4)
: Product Code ········· Please refer to RP114K Mark Specification Table.
: Lot Number ············ Alphanumeric Serial Number
①②
③④
9
RP114x
NO. EA-236-160824
Mark Specification Table (DFN(PLP)1010-4)
RP114Kxx1B
Product Name
RP114K081B
RP114K091B
RP114K101B
RP114K111B
RP114K121B
RP114K131B
RP114K141B
RP114K151B
RP114K161B
RP114K171B
RP114K181B
RP114K191B
RP114K201B
RP114K211B
RP114K221B
RP114K231B
RP114K241B
RP114K251B
RP114K261B
RP114K271B
RP114K281B
RP114K291B
RP114K301B
RP114K311B
RP114K321B
RP114K331B
RP114K341B
RP114K351B
RP114K361B
RP114K121B5
RP114K181B5
RP114K281B5
RP114K341B5
RP114K101B5
RP114K171B5
RP114K111B5
RP114K131B5
10
RP114Kxx1D
L0
L1
L2
L3
L4
L5
L6
L7
L8
L9
M0
M1
M2
M3
M4
M5
M6
M7
M8
M9
N0
N1
N2
N3
N4
N5
N6
N7
N8
N9
P0
P1
P2
P3
P4
P5
P6
VSET
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
1.75V
1.15V
1.35V
Product Name
RP114K081D
RP114K091D
RP114K101D
RP114K111D
RP114K121D
RP114K131D
RP114K141D
RP114K151D
RP114K161D
RP114K171D
RP114K181D
RP114K191D
RP114K201D
RP114K211D
RP114K221D
RP114K231D
RP114K241D
RP114K251D
RP114K261D
RP114K271D
RP114K281D
RP114K291D
RP114K301D
RP114K311D
RP114K321D
RP114K331D
RP114K341D
RP114K351D
RP114K361D
RP114K121D5
RP114K181D5
RP114K281D5
RP114K341D5
RP114K101D5
RP114K171D5
RP114K111D5
RP114K131D5
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
R0
R1
R2
R3
R4
R5
R6
R7
R8
R9
S0
S1
S2
S3
S4
S5
S6
S7
S8
S9
T0
T1
T2
T3
T4
T5
T6
VSET
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
1.75V
1.15V
1.35V
RP114x
NO. EA-236-160824
Power Dissipation (SC-88A)
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
Measurement Conditions below.
Measurement Conditions
Standard Land Pattern
Environment
Mounting on Board (Wind Velocity=0m/s)
Board Material
Glass Cloth Epoxy Plastic (Double-sided)
Board Dimensions
40mm × 40mm × 1.6mm
Copper Ratio
Top-side: Approx. 50%, Back-side: Approx. 50%
Through-hole
φ0.5mm × 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
(Ta=25°C, Tjmax=125°C)
Standard Land Pattern
Free Air
380mW
150mW
θja＝(125-25°C)/0.38W＝263°C/W
θja＝(125-25°C)/0.15W＝667°C/W
θjc＝75°C/W
-
Power Dissipation
Note: The above graph shows the power dissipation of the package based on Tjmax=125ºC and Tjmax=150ºC.
Operating the IC within the shaded area in the graph might have an influence on its lifetime.
Operating time must be within the time limit described in the table below.
Operating Time
Estimated Years
(Operating 4 hrs/ day)
13,000 hours
9 Years
11
RP114x
NO. EA-236-160824
2.0±0.2
A
0.15±0.07
B
1.3±0.2
0.36±0.1
Package Dimensions (SC-88A)
4
0.15
2.1±0.3
+0.2
1.25 -0.1
5
0～14°
2
3
+0.1
0.65
+0.1
S
0.10 S
0.10 S AB
Unit : mm
0～0.1
0.9 -0.2
0.2 -0.05
1.1Max.
1
Mark Specification (SC-88A)
: Product Code ·· Please refer to RP114Q Mark Specification Table.
: Lot Number ···· Alphanumeric Serial Number
5
4
①②③
④⑤⑥
1
12
2
3
RP114x
NO. EA-236-160824
Mark Specification Table (SC-88A)
RP114Qxx2B
Product Name
RP114Q082B
RP114Q092B
RP114Q102B
RP114Q112B
RP114Q122B
RP114Q132B
RP114Q142B
RP114Q152B
RP114Q162B
RP114Q172B
RP114Q182B
RP114Q192B
RP114Q202B
RP114Q212B
RP114Q222B
RP114Q232B
RP114Q242B
RP114Q252B
RP114Q262B
RP114Q272B
RP114Q282B
RP114Q292B
RP114Q302B
RP114Q312B
RP114Q322B
RP114Q332B
RP114Q342B
RP114Q352B
RP114Q362B
RP114Q122B5
RP114Q182B5
RP114Q282B5
RP114Q342B5
RP114Q102B5
RP114Qxx2D
AG08
AG09
AG10
AG11
AG12
AG13
AG14
AG15
AG16
AG17
AG18
AG19
AG20
AG21
AG22
AG23
AG24
AG25
AG26
AG27
AG28
AG29
AG30
AG31
AG32
AG33
AG34
AG35
AG36
AG37
AG38
AG39
AG40
AG41
VSET
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
Product Name
RP114Q082D
RP114Q092D
RP114Q102D
RP114Q112D
RP114Q122D
RP114Q132D
RP114Q142D
RP114Q152D
RP114Q162D
RP114Q172D
RP114Q182D
RP114Q192D
RP114Q202D
RP114Q212D
RP114Q222D
RP114Q232D
RP114Q242D
RP114Q252D
RP114Q262D
RP114Q272D
RP114Q282D
RP114Q292D
RP114Q302D
RP114Q312D
RP114Q322D
RP114Q332D
RP114Q342D
RP114Q352D
RP114Q362D
RP114Q122D5
RP114Q182D5
RP114Q282D5
RP114Q342D5
RP114Q102D5
AH08
AH09
AH10
AH11
AH12
AH13
AH14
AH15
AH16
AH17
AH18
AH19
AH20
AH21
AH22
AH23
AH24
AH25
AH26
AH27
AH28
AH29
AH30
AH31
AH32
AH33
AH34
AH35
AH36
AH37
AH38
AH39
AH40
AH41
VSET
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
13
RP114x
NO. EA-236-160824
Power Dissipation (SOT-23-5)
Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the
Measurement Conditions below. (Power Dissipation (SOT-23-5) is substitution of SOT-23-6.)
Measurement Conditions
Standard Land Pattern
Environment
Mounting on Board (Wind Velocity=0m/s)
Board Material
Glass Cloth Epoxy Plastic (Double-sided)
Board Dimensions
40mm x 40mm x 1.6mm
Copper Ratio
Top-side: Approx. 50%, Back-side: Approx. 50%
Through-holes
φ 0.5mm x 44pcs
Measurement Result
Power Dissipation
Thermal Resistance
(Ta=25°C)
Standard Land Pattern
420mW (Tjmax=125°C)
525mW (Tjmax=150°C)
θja=(125-25°C)/0.42W=238°C/W
Free Air
250mW (Tjmax=125°C)
400°C/W
Measurement Board Pattern
IC Mount Area (Unit: mm)
Note: The above graph shows the power dissipation of the package based on Tjmax=125ºC and Tjmax=150ºC.
Operating the IC within the shaded area in the graph might have an influence on its lifetime.
Operating time must be within the time limit described in the table below.
14
Operating Time
Estimated Years
(Operating 4 hrs/ day)
13,000 hours
9 Years
RP114x
NO. EA-236-160824
Package Dimensions (SOT-23-5)
2.9±0.2
1.1±0.1
1.9±0.2
0.8±0.1
(0.95)
4
1
2
0～0.1
0.2min.
+0.2
1.6-0.1
5
2.8±0.3
(0.95)
3
+0.1
0.15-0.05
0.4±0.1
Unit : mm
Mark Specification (SOT-23-5)
: Product Code ······ Please refer to RP114N Mark Specification Table.
: Lot Number ········· Alphanumeric Serial Number
5
4
1
2
3
15
RP114x
NO. EA-236-160824
Mark Specification Table (SOT-23-5)
RP114Nxx1B
Product Name
RP114N081B
RP114N091B
RP114N101B
RP114N111B
RP114N121B
RP114N131B
RP114N141B
RP114N151B
RP114N161B
RP114N171B
RP114N181B
RP114N191B
RP114N201B
RP114N211B
RP114N221B
RP114N231B
RP114N241B
RP114N251B
RP114N261B
RP114N271B
RP114N281B
RP114N291B
RP114N301B
RP114N311B
RP114N321B
RP114N331B
RP114N341B
RP114N351B
RP114N361B
RP114N121B5
RP114N181B5
RP114N281B5
RP114N341B5
RP114N101B5
16
RP114Nxx1D
QAA
QAB
QAC
QAD
QAE
QAF
QAG
QAH
QAJ
QAK
QAL
QAM
QAN
QAP
QAQ
QAR
QAS
QAT
QAU
QAV
QAW
QAX
QAY
QAZ
RAA
RAB
RAC
RAD
RAE
RAF
RAG
RAH
RAJ
RAK
VSET
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
Product Name
RP114N081D
RP114N091D
RP114N101D
RP114N111D
RP114N121D
RP114N131D
RP114N141D
RP114N151D
RP114N161D
RP114N171D
RP114N181D
RP114N191D
RP114N201D
RP114N211D
RP114N221D
RP114N231D
RP114N241D
RP114N251D
RP114N261D
RP114N271D
RP114N281D
RP114N291D
RP114N301D
RP114N311D
RP114N321D
RP114N331D
RP114N341D
RP114N351D
RP114N361D
RP114N121D5
RP114N181D5
RP114N281D5
RP114N341D5
RP114N101D5
QBA
QBB
QBC
QBD
QBE
QBF
QBG
QBH
QBJ
QBK
QBL
QBM
QBN
QBP
QBQ
QBR
QBS
QBT
QBU
QBV
QBW
QBX
QBY
QBZ
RBA
RBB
RBC
RBD
RBE
RBF
RBG
RBH
RBJ
RBK
VSET
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
RP114x
NO. EA-236-160824
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (C1=1.0µF, C2=1.0µF, Topt=25°C)
RP114x08xx
0.9
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.8
0.7
VIN=1.8V
VIN=2.8V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.25V
0.6
0.5
0.4
RP114x25xx
3.0
0.3
0.2
0.1
2.5
2.0
VIN=3.5V
1.5
VIN=5.0V
VIN=5.25V
VIN=4.2V
1.0
0.5
0
0
0
0
100 200 300 400 500 600 700
Output Current IOUT (mA)
100 200 300 400 500 600 700
Output Current IOUT (mA)
RP114x36xx
4.0
Output Voltage VOUT (V)
3.5
3.0
VIN=4.6V
2.5
VIN=5.0V
2.0
VIN=5.25V
1.5
1.0
0.5
0
0
100 200 300 400 500 600 700
Output Current IOUT (mA)
2) Output Voltage vs. Input Voltage (C1=1.0µF, C2=1.0µF, Topt=25°C)
RP114x08xx
RP114x25xx
3.0
0.8
0.7
0.6
0.5
0.4
IOUT=1mA
0.3
IOUT=30mA
0.2
IOUT=50mA
0.1
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.9
2.5
2.0
1.5
IOUT=1mA
IOUT=30mA
1.0
IOUT=50mA
0.5
0
0
0
1
2
3
4
Input Voltage VIN (V)
5
0
1
2
3
4
Input Voltage VIN (V)
5
17
RP114x
NO. EA-236-160824
RP114x36xx
Output Voltage VOUT (V)
4.0
3.5
3.0
2.5
2.0
1.5
IOUT=1mA
1.0
IOUT=30mA
IOUT=50mA
0.5
0
0
1
2
3
4
5
Input Voltage VIN (V)
3) Supply Current vs. Input Voltage (C1=1.0µF, C2=1.0µF, Topt=25°C)
RP114x25xx
70
70
60
60
Supply Current ISS (µA)
Supply Current ISS (µA)
RP114x08xx
50
40
30
20
10
0
1
2
3
4
Input Voltage VIN (V)
5
RP114x36xx
70
Supply Current ISS (µA)
40
30
20
10
0
0
60
50
40
30
20
10
0
0
18
50
1
2
3
4
Input Voltage VIN (V)
5
0
1
2
3
4
Input Voltage VIN (V)
5
RP114x
NO. EA-236-160824
4) Output Voltage vs. Temperature (C1=1.0µF, C2=1.0µF, IOUT=1mA)
RP114x08xx
RP114x25xx
VIN=1.8V
0.83
0.82
2.55
2.54
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.85
0.84
0.81
0.80
0.79
0.78
0.77
0.76
VIN=3.5V
2.53
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
0.75
-50
-25
0
25
50
75
Temperature Topt (°C)
RP114x36xx
3.65
-50
100
-25
0
25
50
75
Temperature Topt (°C)
100
VIN=4.6V
Output Voltage VOUT (V)
3.64
3.63
3.62
3.61
3.60
3.59
3.58
3.57
3.56
3.55
-50
-25
0
25
50
75
Temperature Topt (°C)
100
5) Supply Current vs. Temperature (C1=1.0µF, C2=1.0µF, IOUT=0mA)
RP114x08xx
60
50
40
30
20
10
0
-50
-25
0
25
50
75
Temperature Topt (°C)
100
VIN=3.5V
70
Supply Current ISS (μA)
Supply Current ISS (μA)
70
RP114x25xx
VIN=1.8V
60
50
40
30
20
10
0
-50
-25
0
25
50
75
Temperature Topt (°C)
100
19
RP114x
NO. EA-236-160824
RP114x36xx
VIN=4.6V
Supply Current ISS (μA)
70
60
50
40
30
20
10
0
-50
-25
0
25
50
75
100
Temperature Topt (°C)
6) Dropout Voltage vs. Output Current (C1=1.0µF, C2=1.0µF)
RP114x08xx
RP114x25xx
300
Dropout Voltage VDIF (mV)
Dropout Voltage VDIF (mV)
700
600
500
400
300
-40°C
25°C
85°C
200
100
0
50
100
150
200
250
300
Output Current IOUT (mA)
150
100
-40°C
25°C
85°C
50
250
200
150
100
-40°C
25°C
85°C
50
0
0
50
100
150
200
250
Output Current IOUT (mA)
0
50
100
150
200
250
Output Current IOUT (mA)
RP114x36xx
Dropout Voltage VDIF (mV)
200
0
0
20
250
300
300
RP114x
NO. EA-236-160824
7) Dropout Voltage vs. Set Output Voltage (C1=1.0µF, C2=1.0µF, Topt=25°C)
Dropout Voltage VDIF (mV)
600
IOUT=30mA
500
IOUT=100mA
400
IOUT=300mA
300
200
100
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Set Output Voltage VREG (V)
8) Dropout Voltage vs. Temperature (C1=none, C2=1.0µF)
RP114x08xx
RP114x25xx
300
600
Dropout Voltage VDIF (mV)
Dropout Voltage VDIF (mV)
700
50mA
150mA
300mA
500
400
300
200
100
250
50mA
150mA
300mA
200
150
100
50
0
0
-50
-25
0
25
50
75
Temperature Topt (°C)
100
-50
-25
0
25
50
75
100
Temperature Topt (°C)
RP114x36xx
Dropout Voltage VDIF (mV)
250
200
50mA
150mA
300mA
150
100
50
0
-50
-25
0
25
50
75
100
Temperature Topt (°C)
21
RP114x
NO. EA-236-160824
9) Ripple Rejection vs. Input Voltage (C1=none, C2=1.0µF, Ripple=0.2Vp-p, Topt=25°C)
Ripple Rejection RR (dB)
100
90
IOUT=1mA
80
70
60
50
40
30
20
1kHz
10kHz
100kHz
10
0
2.5
3.0
3.5
4.0
4.5
5.0
Input Voltage VIN (V)
RP114x25xx
100
90
80
70
60
50
40
30
20
10
0
Ripple Rejection RR (dB)
RP114x25xx
1kHz
10kHz
100kHz
2.5
5.5
IOUT=30mA
3.0
3.5
4.0
4.5
5.0
Input Voltage VIN (V)
5.5
10) Ripple Rejection vs. Frequency (C1=none, C2=1.0µF, Topt=25°C)
RP114x08xx
1mA
30mA
150mA
0.1
1
10
100
Frequency f (kHz)
RP114x36xx
Ripple Rejection RR (dB)
100
90
80
70
60
50
40
30
20
10
0
VIN=4.6V
30mA
150mA
1
10
100
Frequency f (kHz)
22
1000
1mA
0.1
RP114x25xx
100
90
80
70
60
50
40
30
20
10
0
Ripple Rejection RR (dB)
Ripple Rejection RR (dB)
100
90
80
70
60
50
40
30
20
10
0
VIN=3.0V
1000
VIN=3.5V
1mA
30mA
150mA
0.1
1
10
100
Frequency f (kHz)
1000
RP114x
NO. EA-236-160824
11) Input Transient Response (IOUT=30mA, tr=tf=5µs, Topt=25°C)
0.815
0.810
0.805
0.800
Output Voltage
0.795
0.790
0
20
40
60
80
Input Voltage
3.5V4.5V
2.505
2.500
2.495
2.490
2.485
2.480
100
5.0
4.5
4.0
3.5
3.0
Output Voltage
0
20
Time t (µs)
40
60
80
Input Voltage VIN (V)
1.5
1.0
Input Voltage
1.8V2.8V
Output Voltage VOUT (V)
RP114x25xx
3.0
2.5
2.0
Input Voltage VIN (V)
Output Voltage VOUT (V)
RP114x08xx
100
Time t (µs)
6.0
5.5
5.0
4.5
4.0
Input Voltage
4.6V5.6V
3.610
3.605
3.600
3.595
3.590
Output Voltage
0
20
40
60
80
Input Voltage VIN (V)
Output Voltage VOUT (V)
RP114x36xx
100
Time t (µs)
RP114x25xx
200
150
100
50
0
Output Current
50mA100mA
0.84
0.82
0.80
Output Voltage
0.78
0.76
0.74
0
100
200
300
Time t (µs)
400
500
Output Voltage VOUT (V)
VIN=1.8V
Output Current IOUT (mA)
Output Voltage VOUT (V)
RP114x08xx
VIN=3.5V
Output Current
50mA100mA
2.54
2.52
2.50
2.48
2.46
2.44
200
150
100
50
0
Output Voltage
0
100
200
300
Time t (µs)
400
Output Current IOUT (mA)
12) Load Transient Response (C1=1.0µF, C2=1.0µF, tr=tf=0.5µs, Topt=25°C)
500
23
RP114x
NO. EA-236-160824
VIN=4.6V
200
150
100
50
Output Current
50mA100mA
0
3.62
3.60
3.58
3.56
Output Voltage
Output Current IOUT (mA)
Output Voltage VOUT (V)
RP114x36xx
3.54
1.0
0.9
0.8
450
300
150
0
Output Voltage
0.7
0.6
0.5
100
200
300
Time t (µs)
RP114x36xx
Output Voltage VOUT (V)
RP114x25xx
VIN=1.8V
Output Current
1mA300mA
0
400
3.8
3.7
3.6
3.5
3.4
3.3
450
300
150
0
Output Voltage
100
200
300
Time t (µs)
400
500
VIN=3.5V
Output Current
1mA300mA
2.7
2.6
2.5
2.4
2.3
2.2
450
300
150
0
Output Voltage
0
500
VIN=4.6V
Output Current
1mA300mA
0
24
500
100
200
300
Time t (µs)
400
500
Output Current IOUT (mA)
Output Voltage VOUT (V)
RP114x08xx
400
Output Voltage VOUT (V)
200
300
Time t (µs)
Output Current IOUT (mA)
100
Output Current IOUT (mA)
0
RP114x
NO. EA-236-160824
13) Turn On Speed with CE pin (C1=1.0µF, C2=1.0µF, Topt=25°C)
0.8
Output Voltage
0.4
IOUT=0mA
IOUT=30mA
IOUT=300mA
0.2
0
40
80
Time t (µs)
120
RP114x36xx
CE Input Voltage
2
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
3
2
0
Output Voltage
1
0
160
VIN=4.6V
40
80
Time t (µs)
120
160
6
4
2
IOUT=0mA
IOUT=30mA
IOUT=300mA
0
3
Output Voltage
2
4
0
CE Input Voltage
4
6
CE Input Voltage VCE (V)
0
Output Voltgage VOUT (V)
1
CE Input Voltage VCE (V)
CE Input Voltage
0.6
VIN=3.5V
3
2
0.0
Output Voltgage VOUT (V)
RP114x25xx
VIN=1.8V
1
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xx
0
0
40
80
Time t (µs)
120
160
14) Turn Off Speed with CE pin (B version) (C1=1.0µF, C2=1.0µF, Topt=25°C)
2
CE Input Voltage
1
0
0.8
IOUT=0mA
0.6
0.4
Output Voltage
0.2
VIN=3.5V
3
6
4
2
CE Input Voltage
0
4
IOUT=0mA
3
2
Output Voltage
1
CE Input Voltage VCE (V)
RP114x25xB
Output Voltgage VOUT (V)
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xB
0
0.0
0
2
4
6 8 10 12 14 16 18
Time t (ms)
0
2
4
6 8 10 12 14 16 18
Time t (ms)
25
RP114x
NO. EA-236-160824
RP114x36xB
6
4
CE Input Voltage
2
0
4
IOUT=0mA
3
2
Output Voltage
1
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
VIN=4.6V
0
0
2
4
6 8 10 12 14 16 18
Time t (ms)
15) Turn Off Speed with CE pin (D version) (C1=1.0µF, C2=1.0µF, Topt=25°C)
2
CE Input Voltage
1
0
0.8
IOUT=0mA
IOUT=30mA
IOUT=300mA
0.6
0.4
0.2
Output Voltage
VIN=4.6V
6
4
CE Input Voltage
IOUT=0mA
IOUT=30mA
2
0
IOUT=300mA
2
Output Voltage
0
0 100 200 300 400 500 600 700 800
Time t (µs)
26
4
CE Input Voltage
2
0
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
3
2
1
Output Voltage
Time t (µs)
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x36xD
1
6
0 100 200 300 400 500 600 700 800
0 100 200 300 400 500 600 700 800
Time t (µs)
3
VIN=3.5V
0
0.0
4
Output Voltgage VOUT (V)
3
CE Input Voltage VCE (V)
RP114x25xD
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xD
RP114x
NO. EA-236-160824
ESR vs. Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below.
The conditions when the white noise level is under 40µV (Avg.) are marked as the hatched area in the graph.
Measurement conditions
Frequency Band: 10Hz to 2MHz
Temperature
: −40°C to 85°C
C1, C2
: 1.0µF
RP114x08xx
RP114x25xx
VIN=1.4V to 5.25V
100
Topt=85°C
Topt=85°C
10
ESR (Ω)
ESR (Ω)
10
Topt=-40°C
1
Topt=-40°C
1
0.1
0.1
0.01
0.01
0
50
100 150 200 250
Output Current IOUT (mA)
VIN=2.5V to 5.25V
100
300
0
50
100
150
200
250
300
Output Current IOUT (mA)
RP114x36xx
VIN=3.6V to 5.25V
100
Topt=85°C
ESR (Ω)
10
Topt=-40°C
1
0.1
0.01
0
50
100 150 200 250
Output Current IOUT (mA)
300
27
1. The products and the product specifications described in this document are subject to change or discontinuation of
production without notice for reasons such as improvement. Therefore, before deciding to use the products, please
refer to Ricoh sales representatives for the latest information thereon.
2. The materials in this document may not be copied or otherwise reproduced in whole or in part without prior written
consent of Ricoh.
3. Please be sure to take any necessary formalities under relevant laws or regulations before exporting or otherwise
taking out of your country the products or the technical information described herein.
4. The technical information described in this document shows typical characteristics of and example application circuits
for the products. The release of such information is not to be construed as a warranty of or a grant of license under
Ricoh's or any third party's intellectual property rights or any other rights.
5. The products listed in this document are intended and designed for use as general electronic components in standard
applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products,
amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality
and reliability, for example, in a highly specific application where the failure or misoperation of the product could result
in human injury or death (aircraft, spacevehicle, nuclear reactor control system, traffic control system, automotive and
transportation equipment, combustion equipment, safety devices, life support system etc.) should first contact us.
6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products
are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from
such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy
feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or
damage arising from misuse or inappropriate use of the products.
7. Anti-radiation design is not implemented in the products described in this document.
8. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and
characteristics in the evaluation stage.
9. WLCSP products should be used in light shielded environments. The light exposure can influence functions and
characteristics of the products under operation or storage.
10. There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the
case of recognizing the marking characteristic with AOI, please contact Ricoh sales or our distributor before attempting
to use AOI.
11. Please contact Ricoh sales representatives should you have any questions or comments concerning the products or
the technical information.
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Ricoh is committed to reducing the environmental loading materials in electrical devices
with a view to contributing to the protection of human health and the environment.
Ricoh has been providing RoHS compliant products since April 1, 2006 and Halogen-free products since
April 1, 2012.
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Phone: +31-20-5474-309
Ricoh International B.V. - German Branch
Semiconductor Sales and Support Centre
Oberrather Strasse 6, 40472 Düsseldorf, Germany
Phone: +49-211-6546-0
Ricoh Electronic Devices Korea Co., Ltd.
3F, Haesung Bldg, 504, Teheran-ro, Gangnam-gu, Seoul, 135-725, Korea
Phone: +82-2-2135-5700 Fax: +82-2-2051-5713
Ricoh Electronic Devices Shanghai Co., Ltd.
Room 403, No.2 Building, No.690 Bibo Road, Pu Dong New District, Shanghai 201203,
People's Republic of China
Phone: +86-21-5027-3200 Fax: +86-21-5027-3299
Ricoh Electronic Devices Shanghai Co., Ltd.
Shenzhen Branch
1205, Block D(Jinlong Building), Kingkey 100, Hongbao Road, Luohu District,
Shenzhen, China
Phone: +86-755-8348-7600 Ext 225
Ricoh Electronic Devices Co., Ltd.
Taipei office
Room 109, 10F-1, No.51, Hengyang Rd., Taipei City, Taiwan (R.O.C.)
Phone: +886-2-2313-1621/1622 Fax: +886-2-2313-1623
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