Datasheet
Sound Processors for Home Theater Systems
7.1ch Sound Processor
with Built-in Micro-step Volume
BD34701KS2
General description
Key Specifications
The BD34701KS2 is an 8ch independent volume system.
The system is designed in such a way, that it can be
used as a 7.1ch surround system. Micro-step volume
can reduce the switching shock noise when volume
changes, so it can achieve a high-quality set.
8ch dual input selector for zone 2 and multi channel
input enable the connection of a number of sources.
Total harmonic distortion:
Maximum output voltage:
Output noise voltage:
Residual output noise voltage:
Cross-talk between channels:
Cross-talk between selectors:
Package
0.0004%(Typ.)
4.2Vrms(Typ.)
1.5uVrms(Typ.)
1.0uVrms(Typ.)
-105dB(Typ.)
-105dB(Typ.)
W(Typ.) x D(Typ.) x H(Max.)
12.00mm x 12.00mm x 1.50mm
SQFP-T52
Features
8ch input selectors
Micro-step volume can reduce the switching shock
noise when volume changes.
Zone 2 can support.
2-wire serial bus control, corresponding to 3.3/5V.
Applications
Most suitable for the AV receiver, home theater
system
SQFP-T52
Typical Application Circuit
GND
INR1
INL1
INR2
INL2
INR3
INL3
INR4
INL4
INR5
INL5
INR6
39
38
37
36
35
34
33
32
31
30
29
28
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
INL6
27
GSM
Main
Sub
STEREO
INPUT
MULTI
INPUT
SBLIN
40
SBRIN
41
INL11
SLIN
42
INR11
SRIN
43
INL10
CIN
44
INR10
SWIN
45
INL9
FLIN
46
INR9
FRIN
47
GND
48
26
GND
GSM
INL12
INR12
INR7
24
INL7
23
INR8
22
INL8
GSM
GSM
25
Mode
selector
Mode
selector
GSM
GSM
Mode
selector
GSM
GSM
Mode
selector
GSM
GSM
21
GND
GSM
GSM
20
GND
19
RECR
18
RECL
17
GND
Rec
GSM
ADC
FL
Volume
FR
Volume
SW
Volume
C
Volume
SR
Volume
SBR
Volume
SL
Volume
SBL
Volume
ADCR
49
ADCL
50
16
GND
GND
51
15
SUBR
CHP
52
14
SUBL
Logic
1
47 µ
2
3
4
DGND
DA
CL
5
47µ
0.1µ
VCC
0.1 µ
VEE
6
7
OUTFR OUTFL
8
9
10
OUTSW
OUTC
OUTSR
11
12
13
OUTSL OUTSBR OUTSBL
Figure 1. Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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Datasheet
BD34701KS2
27 INL6
28 INR6
29 INL5
30 INR5
31 INL4
32 INR4
33 INL3
34 INR3
35 INL2
36 INR2
37 INL1
38 INR1
39 GND
Pin Configuration
SBLIN 40
26 GND
SBRIN 41
25 INR7
SLIN 42
24 INL7
SRIN 43
23 INR8
CIN 44
22 INL8
SWIN 45
21 GND
FLIN 46
20 GND
FRIN 47
19 RECR
GND 48
18 RECL
OUTSBL 13
OUTSBR 12
OUTSL 11
OUTSR 10
OUTC 9
OUTSW 8
14 SUBL
OUTFL 7
CHIP 52
OUTFR 6
15 SUBR
VEE 5
GND 51
CL 4
16 GND
DA 3
ADCL 50
DGND 2
17 GND
VCC 1
ADCR 49
Figure 2. Pin Configuration
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Datasheet
BD34701KS2
Description of terminal
Terminal
Number
Symbol
Terminal
Number
Symbol
1
VCC
Positive power supply
terminal
27
INL6
Lch input terminal 6
2
DGND
Digital ground terminal
28
INR6
Rch input terminal 6
3
DA
Data and latch input terminal
29
INL5
Lch input terminal 5
4
CL
Clock input terminal
30
INR5
Rch input terminal 5
5
VEE
Negative power supply
terminal
31
INL4
Lch input terminal 4
6
OUTFR
FRch Output terminal
32
INR4
Rch input terminal 4
7
OUTFL
FLch Output terminal
33
INL3
Lch input terminal 3
8
OUTSW
SWch Output terminal
34
INR3
Rch input terminal 3
9
OUTC
Cch Output terminal
35
INL2
Lch input terminal 2
10
OUTSR
SRch Output terminal
36
INR2
Rch input terminal 2
11
OUTSL
SLch Output terminal
37
INL1
Lch input terminal 1
12
OUTSBR
SBRch Output terminal
38
INR1
Rch input terminal 1
13
OUTSBL
SBLch Output terminal
39
GND
Analog ground terminal
14
SUBL
Lch SUB output terminal
40
SBLIN
SBLch input terminal for DSP
15
SUBR
Rch SUB output terminal
41
SBRIN
SBRch input terminal for DSP
16
GND
Analog ground terminal
42
SLIN
SLch input terminal for DSP
17
GND
Analog ground terminal
43
SRIN
SRch input terminal for DSP
18
RECL
Lch REC output terminal
44
CIN
19
RECR
Rch REC output terminal
45
SWIN
SWch input terminal for DSP
20
GND
Analog ground terminal
46
FLIN
FLch input terminal for DSP
21
GND
Analog ground terminal
47
FRIN
FRch input terminal for DSP
22
INL8
Lch input terminal 8
48
GND
Analog ground terminal
23
INR8
Rch input terminal 8
49
ADCR
Rch output terminal to ADC
24
INL7
Lch input terminal 7
50
ADCL
Lch output terminal to ADC
25
INR7
Rch input terminal 7
51
GND
Analog ground terminal
26
GND
Analog ground terminal
52
CHIP
Chip select
Function
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Function
Cch input terminal for DSP
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Datasheet
BD34701KS2
Block Diagram
39
38
GSM
37
GSM
36
GSM
35
GSM
34
GSM
33
GSM
32
GSM
31
GSM
30
GSM
29
GSM
28
GSM
27
GSM
Main
Sub
40
26
GSM
41
25
GSM
GSM
42
24
Mode
selector
Mode
selector
23
GSM
GSM
Mode
selector
GSM
GSM
Mode
selector
43
44
22
GSM
GSM
45
21
GSM
46
20
GSM
Rec
47
19
GSM
48
18
ADC
49
FL
Volume
FR
Volume
SW
Volume
C
Volume
SR
Volume
SBR
Volume
SL
Volume
SBL
Volume
17
50
16
51
15
52
14
Logic
1
2
3
4
5
6
7
8
9
10
11
12
13
Figure 3. Block Diagram
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Datasheet
BD34701KS2
Absolute Maximum Ratings
Item
Symbol
Rating
Unit
Positive power supply
Vcc
+7.75
(Note1)
V
Negative power supply
Vee
-7.75
(Note1)
V
Power dissipation
Pd
1.30
(Note2)
W
Input voltage
Vin
Operating temperature
Topr
Storage temperature
Tastg
Vee-0.2 to Vcc+0.2
-40 to +85
(Note3)
-55 to +125
V
°C
°C
(Note1)
The maximum voltage that can be applied based on GND.
(Note2)
This value decreases 13.0mW/°C for Ta=25°C or more. A standard board, 70×70×1.6 mm, shall be mounted.
(Note3)
If it within operation voltage range, circuit functions operation is guaranteed within operation temp.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between
pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as
adding a fuse, in case the IC is operated over the absolute maximum ratings.
Operating Condition
Item
Symbol
Rating
Positive power supply
Vcc
+6.5 to +7.5
Negative power supply
Vee
-6.5 to -7.5
(Note4)
(Note5)
Unit
(Note4,5)
(Note4,5)
V
V
Applying a voltage based on GND.
Within operation temp range, basic circuit function Operation is guaranteed within operation voltage range.
But please confirm set up of constant and element, voltage set up and temp set up on use.
Please watch out except condition stipulated by electrical characteristics within the range, It cannot guarantee
standard value of electrical characteristics. But it retains original function.
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Datasheet
BD34701KS2
Electrical characteristic
Unless specified particularly, Ta=25°C, Vcc=7V, Vee=-7V, f=1kHz, Vin=1Vrms, RL=10kΩ,
Stereo input selector(MAIN, SUB)=IN1, Mode selector(FL, FRch)=MAIN, Mode selector(SW, C, SL, SRch)=MULTI,
Mode selector(SBL, SBRch)=MULTI, Input Att=0dB, Input gain=0dB, Volume=0dB.
Limit
Item
Symbol
Unit
Conditions
Min.
Typ.
Max.
TOTAL
Positive circuit current
Iqp
-
22
44
mA
No signal
Negative circuit current
Iqn
-44
-22
-
mA
No signal
Output voltage gain
Gv
-1.5
0
1.5
dB
6 to 13pin output
Channel balance
CB
-0.5
0
0.5
Total harmonic distortion
THD
-
0.0004
0.02
Maximum output voltage
Vom
3.8
4.2
-
Output noise voltage
Vno
-
1.5
10
Residual output noise
voltage
Vnor
-
1
8
CT
-
-105
-80
CS
-
-105
-80
dB
Rin
32
47
62
kΩ
ATTmax
-
-115
-100
dB
Volume=Mute, BW=IHF-A
THDR
-
0.0005
0.02
%
BW=400 to 30kHz,
RL=6.8kΩ
14,15,18,19pin output
Cross-talk between
channels
Cross-talk between
selectors
Input impedance
VOLUME
REC
OUT
Maximum attenuation
Total harmonic distortion
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C Channel reference,
6 to 13pin output
BW=400 to 30kHz
%
6 to 13pin output
THD=1%,
Vrms VOLUME=+10dB
6 to 13pin output
Rg=0Ω, BW=IHF-A
µVrms
6 to 13pin output
Volume=Mute,
µVrms Rg=0Ω, BW=IHF-A
6 to 13pin output
Rg=0Ω, BW=IHF-A
dB
6, 7pin output
dB
Rg=0Ω, BW=IHF-A
6, 7pin output
22 to 25, 27 to 38
40 to 47pin input
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Datasheet
BD34701KS2
Typical Performance Curve(s)
30
25
20
15
Volume Gain[dB]
Current[mA]
10
5
0
Operational
range
-5
-10
-15
-20
-25
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
-2
-30
0
1
2
3
4
5
6
7
10
8
100
VCC(+)/VEE(-)[V]
Volume Gain[dB]
Volume Gain[dB]
1000
10000
100000
Frequency[Hz]
-30
-32
-34
-36
-38
-40
-42
-44
-46
-48
-50
-52
-54
-56
-58
-60
-62
-64
-66
10
100
1000
10000
100000
Frequency[Hz]
Figure 6. Volume Gain vs. Input Frequency
(0dB to -32 dB setting)
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100000
Figure 5. Volume Gain vs. Input Frequency
(32dB to 0 dB setting)
2
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
-26
-28
-30
-32
-34
100
10000
Frequenc y[Hz]
Figure 4. Circuit Currents vs. Circuit Voltage
10
1000
Figure 7. Volume Gain vs. Input Frequency
(-32dB to -64 dB setting)
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Datasheet
1.0000
-60
-62
-64
-66
-68
-70
-72
-74
-76
-78
-80
-82
-84
-86
-88
-90
-92
-94
-96
-98
0.1000
10kHz
100Hz
THD+N[%]
Volume Gain[dB]
BD34701KS2
1 kHz
0.0100
0.0010
0.0001
10
100
1000
10000
100000
0.001
Frequency[Hz]
0.100
1.000
10.000
Input Voltage [Vrms]
Figure 8. Volume Gain vs. Input Frequency
(-64dB to -95 dB setting)
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0.010
Figure 9. THD + N vs. Input Voltage
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Datasheet
BD34701KS2
Specifications for Control Signal
(1) Timing of control signal
Data is read at a rising edge of clock.
Latch is read at a falling edge of clock. And Data on the latest 16bit are taken in the inside of this IC.
Be sure to set DA and CL to LOW after latching.
1byte=16bit
CL
（ CLOCK）
tsu
90％
90％
twc
10％
thd
DA
DATA
LATCH
90％
twd
ts
90％
DATA
th
90％
10％
10％
tsd
thd
tsl
90％
twh
10％
90％
twc
90％
twl
DATA
10％
thl
10％
90％
LATCH
Figure 10. The timing definition of the control signal.
Item
Symbol
Clock width
Data width
Latch width
Low hold width
Data setup time (DATA→CLK)
Data hold time (CLK→DATA)
Latch setup time (CLK→LATCH)
Latch hold time
Latch Low setup time
Latch Low hold time
twc
twd
twl
twh
tsd
thd
tsl
thl
ts
th
Limit
Typ.
-
Min.
1.0
1.0
1.0
1.0
0.5
0.5
0.5
0.5
0.5
0.5
Max.
-
Unit
µsec
µsec
µsec
µsec
µsec
µsec
µsec
µsec
µsec
µsec
(2) Voltage of control signal (CL, DA, CHIP)
Limit
Item
High input voltage
Low input voltage
(3) Basic Structure of Control Data
←Input Direction
D15 D14 D13 D12 D11
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Conditions
Vcc=+6.5 to +7.5V
Vee=-6.5 to -7.5V
D10
D9
Data
D8
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D7
Min.
Typ.
Max.
(B switching time] [B->A switching time]
Prossing Time
Figure 11. About [A→B switching-time] [B→A switching-time]
Base clock is able to change Internal Oscillator Frequency. For example, when Base clock select ×1/2,
A->B and B->A switching time is to be two times. (ex. 11msec->22msec)
○Caution on send data
When send the same channel data among the switching process, internal operation is as below.
Inv alid data
①
②
③
④
CLK
DATA
Processing
IC
processing
Output
A->B switching time
Initial
time
per
1
Processing
B->A switching t ime
Initial → ① →
time
A->B switching time
②
per
1
B->A switching time
② → ④
Figure 12. The switching process with send data
②data is sent during A -> B switching time, it is valid.
③data and ④data are sent during B -> A switching time, it is valid at the next processing time.
But ③data is replaced by ④data.
○About pop noise in gain changing
The level of the pop noise sometimes varies in the difference in output DC offset of the inside condition A and B.
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Datasheet
BD34701KS2
Application Circuit Diagram
GND
INR1
INL1
INR2
INL2
INR3
INL3
INR4
INL4
INR5
INL5
INR6
INL6
39
38
37
36
35
34
33
32
31
30
29
28
27
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
GSM
Main
Sub
MULTI
INPUT
INL12
SBLIN
40
INR12
SBRIN
41
INL11
SLIN
42
INR11
SRIN
43
INL10
CIN
44
INR10
SWIN
45
INL9
FLIN
46
26
GND
GSM
STEREO
INPUT
INR7
24
INL7
23
INR8
22
INL8
GSM
GSM
25
Mode
selector
Mode
selector
GSM
GSM
Mode
selector
GSM
GSM
Mode
selector
GSM
GSM
GND
20
GND
19
RECR
18
RECL
17
GND
GSM
21
GSM
INR9
47
GND
48
GSM
FRIN
Rec
ADC
FR
Volume
FL
Volume
SW
Volume
C
Volume
SR
Volume
SBR
Volume
SL
Volume
SBL
Volume
ADCR
49
ADCL
50
16
GND
GND
51
15
SUBR
CHP
52
14
SUBL
Logic
1
47 µ
2
3
4
DGND
DA
CL
0.1µ
VCC
5
47µ
0.1 µ
VEE
6
7
OUTFR OUTFL
8
9
10
OUTSW
OUTC
OUTSR
11
12
13
OUTSL OUTSBR OUTSBL
Figure 13. Application Circuit Diagram
Notes on wiring
① GND shall be wired from reference point and thicken.
② Wiring pattern of CL and DA shall be away from that of analog unit and cross-talk shall not be acceptable.
③ Lines of CL and DA of shall not be parallel if possible. The lines shall be shielded, if they are adjacent to each other.
④ Please pay attention the wiring pattern of the input terminal of the input selector to the cross talk. Recommend that
wiring period is shielded.
⑤ Please connect the decoupling capacitor of a power supply in the shortest distance as much as possible to VCC and
GND, VEE.
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Datasheet
BD34701KS2
Power Dissipation
About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation.
Reference data
SQFP-T52
Measurement condition: ROHM Standard board
board Size：70×70×1.6(㎣)
material：A FR4 grass epoxy board
(3% or less of copper foil area)
Power Dissipation Pd(W)
2.0
1.30W
θja = 76.9°C/W
1.0
0.0
0
25
50
75
85
100
125
150
Ambient Temperature Ta(°C)
Figure 14. Temperature Derating Curve
Note) Value are actual measurements and are not guaranteed.
Power dissipation values vary according to the board on which the IC is mounted.
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Datasheet
BD34701KS2
I/O equivalence circuit(s)
Terminal
Number
16
17
20
21
39
48
51
Terminal
Name
Terminal
Voltage (V)
Equivalent Circuit
Analog ground terminals.
Vcc
AGND
Description of terminal
0
Vee
Positive power supply terminal and
1
5
VCC
VEE
+7
-7
Digital ground terminal.
Vcc
2
DGND
0
Vee
Vcc
3
DA
4
CL
52
CHP
Input terminals for a clock and data.
Vee
6
7
8
9
10
11
12
13
49
50
OUTFR
OUTFL
OUTSW
OUTC
OUTSR
OUTSL
OUTSBR
OUTSBL
ADCR
ADCL
Output terminal s for analog sound signal.
Vcc
0
Vee
Output terminal s for analog sound signal.
(SUB/REC)
Vcc
14
15
18
19
SUBL
SUBR
RECL
RECR
0
47 k
Vee
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Datasheet
BD34701KS2
Terminal
Number
Terminal
Name
22
23
24
25
27
28
29
30
31
32
33
34
35
36
37
38
INL8
INR8
INL7
INR7
INL6
INR6
INL5
INR5
INL4
INR4
INL3
INR3
INL2
INR2
INL1
INR1
Terminal
Voltage (V)
Equivalent Circuit
Input terminals for stereo sound signal.
Input impedance is 47kΩ(Typ.).
Vcc
0
47k
Vee
Input terminals for an analog multi sound
signal.
Input impedance is 47kΩ(Typ.).
Vcc
40
41
42
43
44
45
46
47
SBLIN
SBRIN
SLIN
SRIN
CIN
SWIN
FLIN
FRIN
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Description of terminal
47k
0
Vee
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Datasheet
BD34701KS2
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Vee Voltage
Ensure that no pins are at a voltage below that of the VEE pin at any time, even during transient condition.
4.
Ground Wiring Pattern
GND pins which are digital ground(2pin) and analog ground(16,17,20,21,26,39,48,51pin) are not connected inside
LSI. These ground pins traces should be routed separately but connected to a single ground at the reference point of
the application board. Also ensure that the ground traces of external components do not cause variations on the
ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to IC pin may subject the IC to stress.
Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned
off completely before connecting or removing it from the test setup during the inspection process. To prevent damage
from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals
Because the input impedance of the terminal becomes 47kΩ when the signal input terminal makes a terminal open,
the plunge noise from outside sometimes becomes a problem. Please connect the no using input pin to GND. And
please open the no using output pin.
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BD34701KS2
Operational Notes – continued 1
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When Vee > Pin A and Vee > Pin B, the P-N junction operates as a parasitic diode.
When Vee > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the Vee voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin B
Pin A
C
E
Pin A
P
+
N
P
+
N
N
P
+
N
Pin B
B
Parasitic
Elements
N
P
N P
B
+
N
P
N
C
E
Parasitic
Elements
P Substrate
P Substrate
Vee
Vee
Vee
Vee
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 15. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. About power ON/OFF
1. At power ON/OFF, a shock sound will be generated and, therefore, use MUTE on the set.
2. When turning on power supplies, Vee and Vcc should be powered on simultaneously or Vee first; then followed
by Vcc. If the Vcc side is started up first, an excessive current may pass Vcc through Vee.
15. About function switching
When switching Input Selector, Mode selector or Input Gain, use MUTE on Volume.
16. Volume gain switching
In case of the boost of the volume when changing to the high gain which exceeds +20dB especially, the switching
shock noise sometimes becomes big. In this case, we recommend changing every 1 dB step without changing a gain
at once. Also, the shock noise sometimes can reduce by making micro-step volume switching time long, too.
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BD34701KS2
Operational Notes – continued 2
17. Output load characteristic
The usages of load for output are below (reference). Please use the load more than 10 kΩ(TYP).
Output terminal
Terminal
Terminal
No.
Name
6
OUTFR
7
OUTFL
8
OUTSW
9
OUTC
Terminal
No.
10
11
12
13
Terminal
Name
OUTSR
OUTSL
OUTSBR
OUTSBL
Terminal
No.
14
15
18
19
Terminal
Name
SUBL
SUBR
RECL
RECR
Terminal
No.
49
50
-
Terminal
Name
ADCR
ADCL
-
5
4.5
4
V O,max Vrms
3.5
3
2.5
2
Vcc=+7V
Vee=-7V
THD+n=1%
BW=400～30kHz
1.5
1
0.5
0
100
1000
10000
100000
Load Resistance Ω
Figure 16. Output load characteristic at Vcc=+7V, Vee=-7V(Reference)
Ordering Information
B
D
3
4
7
Part Number
0
1
K
S
2
Package
KS2: SQFP-T52
Packaging and forming specification
none: Tray
E2: Embossed tape and reel
Marking Diagram(TOP VIEW)
SQFP-T52 (TOP VIEW)
Part Number Marking
BD34701KS2
LOT Number
1PIN MARK
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Datasheet
BD34701KS2
Physical Dimension, Tape and Reel Information
Package Name
SQFP-T52
Container
Tray (with dry pack)
Quantity
1000pcs
Direction of feed Direction of product is fixed in a tray
1pin
∗ Order quantity needs to be multiple of the minimum quantity.
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Datasheet
BD34701KS2
Revision History
Date
Revision
02.Sep.2013
17.Sep.2003
001
002
Changes
New Release
P27. Delete “M” of “SQFP-T52M” in Marking Diagram.
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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Rev.001
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