BD4941

Voltage Detector IC Series Standard CMOS Voltage Detector IC BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series No.09006EAT04  Description ROHM’s BD48□□G/FVE and BD49□□G/FVE series are highly accurate, low current consumption reset IC series. The lineup was established with tow output types (Nch open drain and CMOS output) and detection voltages range from 2.3V to 6.0V in increments of 0.1V, so that the series may be selected according the application at hand.  Features 1) Detection voltage: 2.3V to 6.0V (Typ.), 0.1V steps 2) High accuracy detection voltage: ±1.0% 3) Ultra-low current consumption: 0.8μA (Typ.) 4) Nch open drain output (BD48□□G/FVE), CMOS output (BD49□□G/FVE) 5) Compact packages VSOF5: BD48□□FVE, BD49□□FVE SSOP5: BD48□□G, BD49□□G  Applications All electronic devices that use microcontrollers and logic circuits  Selection Guide No. 1 Specifications Output Circuit Format Detection Voltage Package Description 8:Open Drain Output, 9:CMOS Output Example: Displays VS over a 2.3V to 6.0V range in 0.1V increments. (2.9V is marked as “29”) Part Number : BD4 1 2 3 2 3 G:SSOP5 / FVE:VSOF5  Lineup Marking EW EV EU ET ES ER EQ EP EN EM EL EK EJ EH EG EF EE ED EC Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V Part Number BD4860 BD4859 BD4858 BD4857 BD4856 BD4855 BD4854 BD4853 BD4852 BD4851 BD4850 BD4849 BD4848 BD4847 BD4846 BD4845 BD4844 BD4843 BD4842 Marking EB EA DV DU DT DS DR DQ DP DN DM DL DK DJ DH DG DF DE DD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Number BD4841 BD4840 BD4839 BD4838 BD4837 BD4836 BD4835 BD4834 BD4833 BD4832 BD4831 BD4830 BD4829 BD4828 BD4827 BD4826 BD4825 BD4824 BD4823 Marking GW GV GU GT GS GR GQ GP GN GM GL GK GJ GH GG GF GE GD GC Detection Voltage 6.0V 5.9V 5.8V 5.7V 5.6V 5.5V 5.4V 5.3V 5.2V 5.1V 5.0V 4.9V 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V Part Number BD4960 BD4959 BD4958 BD4957 BD4956 BD4955 BD4954 BD4953 BD4952 BD4951 BD4950 BD4949 BD4948 BD4947 BD4946 BD4945 BD4944 BD4943 BD4942 Marking GB GA FV FU FT FS FR FQ FP FN FM FL FK FJ FH FG FF FE FD Detection Voltage 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V Part Number BD4941 BD4940 BD4939 BD4998 BD4937 BD4936 BD4935 BD4934 BD4933 BD4932 BD4931 BD4930 BD4929 BD4928 BD4927 BD4926 BD4925 BD4924 BD4923 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series  Absolute maximum ratings (Ta=25°C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*3 SSOP5 Power *2*3 Dissipation VSOF5 Operating Temperature Ambient Storage Temperature Technical Note Symbol VDD-GND VOUT Pd Topr Tstg Limits -0.3 ~ +10 GND-0.3 ~ +10 GND-0.3 ~ VDD+0.3 540 210 -40 ~ +105 -55 ~ +125 Unit V V mW °C °C *1 Use above Ta=25°C results in a 5.4mW loss per degree. *2 Use above Ta=25°C results in a 2.1mW loss per degree. *3 When a ROHM standard circuit board (70mm×70mm×1.6mm glass epoxy board) is mounted.  Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) Parameter Detection Voltage Output Delay Time “LH” Symbol VS tPLH Condition RL=470kΩ, VDD=HL CL=100pF RＬ=100kΩ Vout=GND50% VS=2.3-3.1V VS=3.2-4.2V VDD=VS-0.2V *1 VS=4.3-5.2V VS=5.3-6.0V VS=2.3-3.1V VS=3.2-4.2V VDD=VS+2.0V *1 VS=4.3-5.2V VS=5.3-6.0V VOL≤0.4V, Ta=25~105°C, RL=470kΩ VOL≤0.4V, Ta=-40~25°C, RL=470kΩ VDS=0.5V, VDD=1.5V, VS=2.3-6.0V VDS=0.5V, VDD=2.4V, VS=2.7-6.0V VDS=0.5V, VDD=4.8V, VS=2.3-4.2V VDS=0.5V, VDD=6.0V, VS=4.3-5.2V VDS=0.5V, VDD=8.0V, VS=5.3-6.0V VDD=VDS=10V Ta=-40°C to 105°C (Designed Guarantee) VDD=LHL *1 *2 Min. VS(T) ×0.99 0.95 1.20 0.4 2.0 0.7 0.9 1.1 Limit Typ. VS(T) 0.51 0.56 0.60 0.66 0.75 0.80 0.85 0.90 1.0 4.0 1.4 1.8 2.2 ±100 Max. VS(T) ×1.01 100 1.53 1.68 1.80 1.98 2.25 2.40 2.55 2.70 0.1 ±360 Unit V µs Circuit Current when ON ICC1 µA Circuit Current when OFF ICC2 µA Minimum Operating Voltage ‘Low’Output Current (Nch) ‘High’Output Current (Pch) (BD49□□G/FVE) Leak Current when OFF (BD48□□G/FVE) Detection Voltage Temperature coefficient Hysteresis Voltage VOPL IOL V mA IOH mA Ileak VS/∆T *1 - µA ppm/°C V ∆ VS VS(T) : Standard Detection Voltage(2.3V to 6.0V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. CL: Capacitor to be connected between VOUT and GND. Designed Guarantee. (Outgoing inspection is not done on all products.) *1 Guarantee is Ta=25°C. *2 tPLH:VDD=(Vs typ.-0.5V)(Vs typ.+0.5V) VS×0.03 VS×0.05 VS×0.08 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series  Block Diagrams BD48□□G/FVE VDD Technical Note BD49□□G/FVE VDD VOUT VOUT Vref Vref GND GND Fig.1 TOP VIEW Fig.2 TOP VIEW SSOP5 PIN No. 1 2 3 4 5 Symbol VOUT VDD GND N.C. N.C. Function Reset Output Power Supply Voltage GND Unconnected Terminal Unconnected Terminal PIN No. 1 2 3 4 5 Symbol VOUT SUB N.C. GND VDD VSOF5 Function Reset Output Substrate* Unconnected Terminal GND Power Supply Voltage *Connect the substrate to GND. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 3/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series  Reference Data (Unless specified otherwise, Ta=25°C) Technical Note CIRCUIT CURRENT ： IDD [μA] 【BD4842G/FVE】 1.5 【BD4842G/FVE】 15 "HIGH" OUTPUT CURRENT ： IOH [mA] "LOW" OUTPUT CURRENT ： IOL [mA] 2.0 20 45 40 35 30 25 20 15 10 5 0 0 1 2 3 4 5 6 DRAIN-SOURCE VOLTAGE ： VDS[V] VDD =6.0V VDD =4.8V VDD =8.0V 【BD4942G/FVE】 1.0 10 VDD =2.4V 0.5 5 VDD =1.2V 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 0 1 2 3 4 5 6 7 8 9 10 VDD SUPPLY VOLTAGE ：VDD [V] DRAIN-SOURCE VOLTAGE ： VDS[V] Fig.3 Circuit Current Fig.4 “Low” Output Current Fig.5 “High” Output Current 9 1.0 OUTPUT VOLTAGE ： VOUT[V] 【BD4842G/FVE】 OUTPUT VOLTAGE： VOUT [V] 7 6 5 4 3 2 1 0 Ta=25℃ 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 0.8 DETECTION VOLTAGE ： VS[V] 8 【BD4842G/FVE】 5.4 5.0 【BD4842G/FVE】 Low to High（VS+ΔVS） 0.6 4.6 4.2 3.8 3.4 3.0 ～ ～ -40 0 40 80 High to Low（VS） 0.4 Ta=25℃ 0.2 0.0 0 0.5 1 1.5 2 2.5 SUPPLY VOLTAGE ： [V] VDD SUPPLY VOLTAGE ：VDD [V] TEMPERATURE ： Ta[℃] Fig.6 I/O Characteristics Fig.7 Operating Limit Voltage Fig.8 Detection Voltage Release Voltage CIRCUIT CURRENT WHEN ON ： IDD1[μA] CIRCUIT CURRENT WHEN OFF ： I DD2[μA] 1.5 【BD4842G/FVE】 1.5 【BD4842G/FVE】 MINIMUM OPERATION VOLTAGE ： VOPL[V] 1.5 【BD4842G/FVE】 1.0 1.0 1.0 0.5 0.5 0.5 0.0 -40 -20 0 20 40 60 80 100 0.0 -40 -20 0 20 40 60 80 100 0.0 -40 -20 0 20 40 60 80 100 TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] TEMPERATURE ： Ta[℃] Fig.9 Circuit Current when ON Fig.10 Circuit Current when OFF Fig.11 Operating Limit Voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 4/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series Technical Note  Reference Data Examples of Leading (TPLH) and Falling (TPHL) Output Part Number TPLH (μs) TPHL (μs) BD4845G/FVE 39.5 87.8 BD4945G/FVE 32.4 52.4 VDD=4.3V5.1V VDD=5.1V4.3V *This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use.  Explanation of Operation For both the open drain type (Fig.12) and the CMOS output type (Fig.13), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal voltage switches from either “High” to “Low” or from “Low” to “High”. Because the BD48□□G/FVE series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD R1 Vref VOUT R2 Q1 RL Vref R1 Q2 VOUT Q1 R2 R3 GND R3 GND Fig.12 (BD48□□ Type Internal Block Diagram) Fig.13 (BD49□□ Type Internal Block Diagram)  Timing Waveform Example: the following shows the relationship between the input voltages VDD and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (the circuits are those in Fig.12 and 13). When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until TPHL. There fore it is possible that the reset signal is not outputted when the rise time of VDD is faster than TPHL. 2 When VDD is greater than VOPL but less than the reset release voltage (VS + ∆VS), the output voltages will switch to Low. 3 If VDD exceeds the reset release voltage (VS + ∆VS), then VOUT switches from L to H. 4 If VDD drops below the detection voltage (VS) when the power supply is powered down or when there is a power supply fluctuation, VOUT switches to L (with a delay of TPHL). 5 The potential difference between the detection voltage and the release voltage is known as the hysteresis width (∆VS). The system is designed such that the output does not flip-flop with power supply fluctuations within this hysteresis width, preventing malfunctions due to noise. 1 VDD VDET+ΔVDET VDET VOPL 0V ⑤ VOUT VOH TPHL VOL TPLH TPHL TPLH ① ② Fig.14 ③ ④ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series  Circuit Applications 1) Examples of a common power supply detection reset circuit. VDD1 RL BD48□□□ Microcontroller VDD2 Technical Note Application examples of BD48□□G/FVE series (Open Drain output type) and BD49□□G/FVE series (CMOS output type) are shown below. CASE1: the power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the open drain output type (BD48□□G/FVE) attached a load resistance (RL) between the output and VDD2. (As shown Fig.15) CASE2: the power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BD49□□G/FVE) or open drain output type (BD48□□G/FVE) attached a load resistance (RL) between the output and Vdd1. (As shown Fig.16) CL （Noise-filtering Capacitor） GND Fig.15 Open Collector Output Type VDD1 BD49□□□ Microcontroller CL (Noise-filtering Capacitor） When a capacitance CL for noise filtering is connected to the VOUT pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (VOUT). GND Fig.16 CMOS Output Type 2) The following is an example of a circuit application in which an OR connection between two types of detection voltages resets the microcontroller. VDD1 VDD2 VDD3 RL Microcontroller RST BD48□□□ BD48□□□ GND Fig.17 When there are many power supplies of the system, power supplies VDD1 and VDD2 are being monitored separately, and it is necessary to reset the microcomputer, it is possible to use an OR connection on the open drain output type BD48□□G/FVE series to pull-up to the desired voltage (VDD3) as shown in Fig.17 and make the output “High” voltage matches the power supply voltage VDD3 of the microcontroller. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series Technical Note Examples of the power supply with resistor dividers In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output oscillatory state). (Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level switches from “High” to “Low” or vice versa.) V1 R2 I1 VDD R1 CIN BD48□□□ BD49□□□ CL GND VOUT Fig.18 A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage to descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the detection voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through output “Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation. IDD Through Current 0 VDD VDET Fig.19 Current Consumption vs. Power Supply Voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series Technical Note  Operation Notes 1 . Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins, which are over ground even if, include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the capacitor of 1μF or more between VDD pin and GND, and the capacitor of about 1000pF between VOUT pin and GND, to reject noise. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board, please be unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7. 8. 9. The VDD line inpedance might cause oscillation because of the detection current. A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. 10. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If the leakage is assumed between the VOUT terminal and the GND terminal, the pull-up resistor should be less than 1/10 of the assumed leak resistance. 11. External parameters The recommended parameter range for RL is 10kΩ~1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 12. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. 13. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 14. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/9 2009.04 - Rev.A BD48□□G, BD48□□FVE, BD49□□G, BD49□□FVE series  Part Number Selection Technical Note B D 4 8 2 3 G － T R Standard CMOS Reset IC BD48: Open Drain Type BD49: CMOS Output Type Reset Voltage Value 23: 2.3V to (0.1V step) 60: 6.0V Package G: SSOP5 FVE: VSOF5 Taping Specifications Embossed Taping SSOP5 (Unit：mm) +6° 4° −4° SSOP5 Tape Embossed carrier tape 3000pcs TR (The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand) 2.9±0.2 5 4 Quantity Direction of feed 2.8±0.2 1.6 −0.1 +0.2 1 2 3 0.13 1.25Max. 1.1±0.05 0.05±0.05 0.42 +0.05 −0.04 0.95 0.1 0.2Min. +0.05 −0.03 XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX 1Pin Reel Direction of feed * W hen you order, please order in times the amount of package quantity. VSOF5 (Unit：mm) VSOF5 Tape Quantity 1.0±0.05 1.6±0.05 54 Embossed carrier tape 3000pcs TR (The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand) 1.6±0.05 1.2±0.05 123 0.13±0.05 0.6Max. 0.5 0.22±0.05 0.08 M 0.2Max. Direction of feed XXX XXX XXX XXX XXX XXX XXX XXX XXX XXX 1Pin Reel Direction of feed *When you order, please order in times the amount of package quantity. www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/9 2009.04 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. 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