BD63621MUV-E2

Datasheet 36V Stepping Motor Driver BD63621MUV General Description BD63621MUV is a bipolar low-consumption driver that driven by PWM current. Rated power supply voltage of the device is 36 V, and rated output current is 2.0 A. CLK-IN driving mode is adopted for input interface, and excitation mode is corresponding to FULL STEP mode , HALF STEP mode ( 2 kinds), QUARTER STEP mode via a built-in DAC. In terms of current decay, the FAST DECAY/SLOW DECAY ratio may be set without any limitation, and all available modes may be controlled in the most appropriate way. In addition, the power supply may be driven by one single system, which simplifies the design. Key Specifications ■ ■ ■ ■ ■ Range of power supply voltage Rated output current (continuous) Rated output current (peak value) Range of operating temperature Output ON resistance (total of upper and lower resistors) Package 8 to 28 V 2.0 A 2.5 A -25 to +85 °C 0.49 Ω (Typ) W(Typ) x D(Typ)x H(Max) 5.00mm x 5.00mm x 1.00mm VQFN028V5050 Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Rated output current（DC）2.0A Low ON resistance DMOS output CLK-IN drive mode PWM constant current (other oscillation) Built-in spike noise cancel function (external noise filter is unnecessary) Full -, half (2 kinds)-, quarter step functionality Freely timing excitation mode switch Current decay mode switch （linearly variable FAST/SLOW DECAY ratio） Normal rotation & reverse rotation switching function Power save function Built-in logic input pull-down resistor Power-on reset function Thermal shutdown circuit (TSD) Over-current protection circuit（OCP） Under voltage lock out circuit (UVLO) Over voltage lock out circuit (OVLO) Ghost Supply Prevention (protects against malfunction when power supply is disconnected) Adjacent pins short protection Microminiature, ultra-thin and high heat-radiation (exposed metal type) package VQFN028V5050 Typical Application Circuit GND GND GND 1 25 GND 2 6 CLK 5 MODE1 7 MODE0 8 CW_CCW 9 ENABLE 10 TEST 11 ■ ■ ■ ■ PPC, multi-function printer, laser beam printer, and ink-jet printer Monitoring camera and WEB camera Sewing machine Photo printer, FAX, scanner and mini printer Toy and robot 24 VCC1 23 VREF 28 19 20 Application ■ 3 PS 21 12 CR 26 13 17 SELECT 4 16 MTH 27 15 18 OUT1A OUT1B RNF1 RNF1S VCC2 OUT2A OUT2B RNF2 RNF2S GND Figure 1. Application circuit diagram ○ Product structure：silicon monolithic integrated circuit ○It is not the radiation-proof design for this product. www.rohm.com TSZ02201-0P2P0B701290-1-2 © 2017 ROHM Co., Ltd. All rights reserved. 1/24 21.Dec.2020 Rev.002 TSZ22111・14・001 BD63621MUV Pin Configuration [TOP VIEW] Block Diagram RNF2S 18 17 16 15 N.C. 22 14 N.C. OUT1A 23 13 OUT2A VCC1 24 12 VCC2 GND 25 11 TEST CR 26 10 ENABLE CLK 5 MODE1 7 MODE0 8 CW_CCW 9 ENABLE 10 TEST 11 VREF 28 3 4 5 6 7 MODE1 2 GND 1 CLK MODE0 PS 8 SELECT VREF 28 GND CW_CCW GND 9 OVLO UVLO 25 GND 3 PS DAC 24 VCC1 23 ＋ RNF1S MTH 27 OCP RESET Translator ＋ － TSD － 20 RNF1 ＋ RNF2S － Blank time PWM control CR 26 OUT1A 19 OUT1B 21 RNF1S Predriver RNF2 19 GND 2 GND 6 Control logic OUT2B 20 OUT1B RNF1 21 GND RNF1S GND 1 12 VCC2 13 OUT2A OSC 17 OUT2B SELECT 4 1 1 MTH 27 16 RNF2 Mix decay control 15 RNF2S Regulator 18 GND Figure 2. Pin Configuration Diagram Figure 3. Block Diagram Pin Description Pin No. Pin name Function Pin No. Pin name Function Input terminal of current limit comparator Connection terminal of resistor for output current detection 1 GND Ground terminal 15 RNF2S 2 GND Ground terminal 16 RNF2 3 PS Power save terminal 17 OUT2B 4 SELECT Decay mode setting terminal 18 GND 5 CLK Clock input terminal for advancing the electrical angle 19 OUT1B 6 GND Ground terminal 20 RNF1 7 MODE1 Motor excitation mode setting terminal 21 RNF1S 8 MODE0 Motor excitation mode setting terminal 22 N.C. 9 CW_CCW Motor rotating direction setting terminal 23 OUT1A 10 ENABLE Output enable terminal 24 VCC1 Power supply terminal 11 TEST Terminal for testing (Used by connecting with GND) 25 GND Ground terminal 12 VCC2 Power supply terminal 26 CR Connection terminal of CR for setting chopping frequency 13 OUT2A H bridge output terminal 27 MTH Current decay mode setting terminal 14 N.C. No Connection 28 VREF Output current value setting terminal www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/24 H bridge output terminal Ground terminal H bridge output terminal Connection terminal of resistor for output current detection Input terminal of current limit comparator No Connection H bridge output terminal TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Description of operation ○ SELECT／Input Mode Switching Terminal This is the terminal to set the input mode. SELECT DECAY Mode L H DECAY Mode 1 DECAY Mode 2 ○CLK／Clock input terminal for advancing the electrical angle CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input. Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that there is no noise plunging ○MODE0,MODE1／Motor Excitation Mode Setting Terminal Set the motor excitation mode MODE0 MODE1 Excitation Mode L H L H L L H H FULL STEP HALF STEP A HALF STEP B QUARTER STEP Please refer to the P.13-14 for the timing chart & motor torque vector of various excitation modes. Unrelated to CLK, change in setting is forcibly reflected (refer to P.16). ○CW_CCW／Motor rotating direction setting Set the motor’s rotating direction. Change in setting is reflected at the CLK rising edge immediately after the change in setting (refer to P.15) CW_CCW Rotating direction L H Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current) Counter Clockwise (CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current) ○ENABLE／Output enable terminal Turn off forcibly all the output transistors (motor output is open). When ENABLE=L, input to CLK is blocked, and phase advance operation of internal translator circuit is stopped. However, during excitation modes (MODE0,MODE1) switch within the interval of ENABLE=L, as ENABLE=L→H is reset, the new mode upon switch will be applied for excitation (refer to P.16). ENABLE Motor Output L H OPEN (electrical angle maintained) ACTIVE ○PS／Power save terminal PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized) and electrical angle is initialized. Please be careful because there is a delay of 40µs(Max) before it is returned from standby state to normal state and the motor output becomes ACTIVE (refer to P.12). PS Status L H Standby state(RESET) ACTIVE The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows (refer to P.13-14). Excitation Mode Initial Electrical Angle FULL STEP HALF STEP A HALF STEP B QUARTER STEP www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 45° 45° 45° 45° 3/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV ○VCC1,VCC2／Power supply terminal Motor’s drive current is flowing in it, so please wire in such a way that the wire is thick & short and has low impedance. Voltage VCC may have great fluctuation, so please arrange the bypass capacitor of about 100µ to 470µF as close to the terminal as possible and adjust in such a way that the voltage VCC is stable. Please increase the capacity if needed especially when a large current is used or those motors that have great back electromotive force are used. In addition, for the purpose of reducing of power supply’s impedance in wide frequency bandwidth, parallel connection of multi-layered ceramic capacitor of 0.01µ to 0.1µF etc is recommended. Extreme care must be used to make sure that the voltage VCC does not exceed the rating even for a moment. VCC1 & VCC2 are shorted inside IC, so please be sure to short externally VCC1 & VCC2 when using. If used without shorting, malfunction or destruction may occur because of concentration of current routes etc., so please make sure that they are shorted when in use. Still more, in the power supply terminal, there is built-in clamp component for preventing of electrostatic destruction. If steep pulse or voltage of surge more that maximum absolute rating is applied, this clamp component operates, as a result there is the danger of destruction, so please be sure that the maximum absolute rating must not be exceeded. It is effective to mount a Zener diode of about the maximum absolute rating. Moreover, the diode for preventing of electrostatic destruction is inserted between VCC terminal and GND terminal, as a result there is the danger of IC destruction if reverse voltage is applied between VCC terminal and GND terminal, so please be careful. ○GND／Ground terminal In order to reduce the noise caused by switching current and to stabilize the internal reference voltage of IC, please wire in such a way that the wiring impedance from this terminal is made as low as possible to achieve the lowest electrical potential no matter what operating state it may be. ○OUT1A,OUT1B,OUT2A,OUT2B／H Bridge output terminal Motor’s drive current is flowing in it, so please wire in such a way that the wire is thick & short and has low impedance. It is also effective to add a Schottky diode if output has positive or negative great fluctuation when large current is used etc, for example, if counter electromotive voltage etc. is great. Moreover, in the output terminal, there is built-in clamp component for preventing of electrostatic destruction. If steep pulse or voltage of surge more than maximum absolute rating is applied, this clamp component operates, as a result there is the danger of even destruction, so please be sure that the maximum absolute rating must not be exceeded. ○RNF1,RNF2／Connection terminal of resistor for detecting of output current Please connect the resistor of 0.1Ω to 0.3Ω for current detection between this terminal and GND. In view of the power consumption of the current-detecting resistor, please determine the resistor in such a way that W= IOUT2･R[W] does not exceed the power dissipation of the resistor. In addition, please wire in such a way that it has a low impedance and does not have a impedance in common with other GND patterns because motor’s drive current flows in the pattern through RNF terminal to current-detecting resistor to GND. Please do not exceed the rating because there is the possibility of circuits’ malfunction etc. if RNF voltage has exceeded the maximum rating (0.7V). Moreover, please be careful because if RNF terminal is shorted to GND, large current flows without normal PWM constant current control, then there is the danger that OCP or TSD will operate. If RNF terminal is open, then there is the possibility of such malfunction as output current does not flow either, so please do not let it open. ○RNF1S,RNF2S／Input terminal of current limit comparator In this series, RNFS terminal, which is the input terminal of current limit comparator, is independently arranged in order to decrease the lowering of current-detecting accuracy caused by the wire impedance inside the IC of RNF terminal. Therefore, please be sure to connect RNF terminal and RNFS terminal together when using in the case of PWM constant current control. In addition, because the wires from RNFS terminal is connected near the current-detecting resistor in the case of interconnection, the lowering of current-detecting accuracy, which is caused by the impedance of board pattern between RNF terminal and the current-detecting resistor, can be decreased. Moreover, please design the pattern in such a way that there is no noise plunging. In addition, please be careful because if terminals of RNF1S & RNF2S are shorted to GND, large current flows without normal PWM constant current control and, then there is the danger that OCP or TSD will operate. ○VREF／Output current value setting terminal This is the terminal to set the output current value. The output current value can be set by VREF voltage and current-detecting resistor (RNF resistor). Output current IOUT [A] = {VREF [V] / 5(division ratio inside IC)} / RNF [Ω] Please avoid using it with VREF terminal open because if VREF terminal is open, the input is unsettled, and the VREF voltage increases, and then there is the possibility of such malfunctions as the setting current increases and a large current flows etc. Please keep to the input voltage range because if the voltage of over 3V is applied on VREF terminal, then there is also the danger that a large current flows in the output and so OCP or TSD will operate. Besides, please take into consideration the outflow current (Max2µA) if inputted by resistance division when selecting the resistance value. The minimum current, which can be controlled by VREF voltage, is determined by motor coil’s L & R values and minimum ON time because there is a minimum ON time in PWM drive. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV ○CR／Connection terminal of CR for setting chopping frequency This is the terminal to set the chopping frequency of output. Please connect the external C(470p to 3300pF) and R(10k to 200kΩ) between this terminal and GND. Please refer to P.7. Please interconnect from external components to GND in such a way that the interconnection does not have impedance in common with other GND patterns. In addition, please carry out the pattern design in such ways as keeps such steep pulses as square wave etc. away and that there is no noise plunging. Please mount the two components of C and R if being used by PWM constant current control because normal PWM constant current control becomes impossible if CR terminal is open or it is biased externally. ○MTH／Current decay mode-setting terminal This is the terminal to set the current decay mode. Current decay mode can be optionally set according to input voltage. MTH terminal input voltage[V] Current decay mode 0 to 0.3 0.4 to 1.0 SLOW DECAY MIX DECAY 1.5 to 3.5 FAST DECAY Please connect to GND if using at SLOW DECAY mode. Please avoid using with MTH terminal open because if MTH terminal is open, the input is unsettled, and then there is the danger that PWM operation becomes unstable. Besides, please take into consideration the outflow current (Max2µA) if inputted by resistance division when selecting the resistance value. ○TEST／Terminal for inspection This terminal is used for delivery inspection on IC, and shall be grounded before use. In addition, malfunctions may be caused by application without grounding. ○NC terminal This terminal is unconnected electrically with IC internal circuit. ○IC back metal For VQFN028V5050 package, the heat-radiating metal is mounted on IC’s back side, and on the metal the heat-radiating treatment is performed when in use, which becomes the precondition to use, so please secure sufficiently the heat-radiating area by surely connecting by solder with the GND plane on the board and getting as wide GND pattern as possible. Moreover, the back side metal is shorted with IC chip’s back side and becomes the GND potential, so there is the danger of malfunction and destruction if shorted with potentials other than GND, therefore please absolutely do not design patterns other than GND through the IC’s back side. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Protection circuits ○Thermal Shutdown (TSD) This IC has a built-in thermal shutdown circuit for thermal protection. When the IC’s chip temperature rises above 175°C(Typ) the motor output becomes OPEN. Also, when the temperature returns to under 150°C(Typ), it automatically returns to normal operation. However, even when TSD is in operation, if heat is continued to be added externally, heat overdrive can lead to destruction. ○Over Current Protection (OCP) This IC has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or VCC-motor output or motor output-GND is shorted. This circuit latches the motor output to OPEN condition when the regulated threshold current flows for 4µs (Typ). It returns with power reactivation or a reset of the PS terminal. The over current protection circuit’s only aim is to prevent the destruction of the IC from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. Therefore, sets should not be designed to take into account this circuit’s functions. After OCP operating, if irregular situations continues and the return by power reactivation or a reset of the PS terminal is carried out repeatedly, then OCP operates repeatedly and the IC may generate heat or otherwise deteriorate. When the L value of the wiring is great due to the wiring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. Also, when current which is over the output current rating and under the OCP detection current flows, the IC can heat up to over Tjmax=150°C and can deteriorate, so current which exceeds the output rating should not be applied. ○Under Voltage Lock Out (UVLO) This IC has a built-in under voltage lock out function to prevent false operation such as IC output during power supply under voltage. When the applied voltage to the VCC terminal goes under 5V (Typ), the motor output is set to OPEN. This switching voltage has a 1V (Typ) hysteresis to prevent false operation by noise etc. Please be aware that this circuit does not operate during power save mode. Also, the electrical angle is reset when the UVLO circuit operates during CLK-IN drive mode. ○Over Voltage Lock Out (OVLO) This IC has a built-in over voltage lock out function to protect the IC output and the motor during power supply over voltage. When the applied voltage to the VCC terminal goes over 32V (Typ), the motor output is set to OPEN. This switching voltage has a 1V (Typ) hysteresis and a 4µs (Typ) mask time to prevent false operation by noise etc. Although this over voltage locked out circuit is built-in, there is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the absolute maximum value should not be exceeded. Please be aware that this circuit does not operate during power save mode. ○Ghost Supply Prevention (protects against malfunction when power supply is disconnected) If a signal (logic input, MTH, VREF) is input when there is no power supplied to this IC, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from these input terminals to the VCC to this IC or to another IC’s power supply. Therefore, there is no malfunction of the circuit even when voltage is supplied to these input terminals while there is no power supply. ○Operation Under Strong Electromagnetic Field The IC is not designed for using in the presence of strong electromagnetic field. Be sure to confirm that no malfunction is found when using the IC in a strong electromagnetic field. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 6/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV 　α[V] ○PWM Constant current control 1) Current control operation When the output transistor is turned on, the output current increases, raising the voltage over the current sense resistor. When the voltage on the RNF pin reaches the voltage value set by the internal 2-bit/4-bit DAC and the VREF input voltage, the current limit comparator engages and enters current decay mode. The output is then held off for a period of time determined by the RC time constant connected to the CR pin. The process repeats itself constantly for PWM operation. 2) Noise-masking function In order to avoid misdetection of output current due to RNF spikes that may occur when the output turns ON, the IC employs an automatic current detection-masking period during charging of CR (tONMIN 0.7µs Typ) and during change in internal PHASE (tONMIN2 1.5µs Typ: fixed in internal circuit), during which current detection is disabled immediately after the output transistor is turned on. This allows for constant-current drive without the need for an external filter. This noise-masking period defines the minimum ON-time for the motor output transistor. 3) CR Timer The CR filter connected to the CR pin is repeatedly charged and discharged between the VCRH and VCRL levels. The output of the internal comparator is masked while charging from VCRL to VCRH in order to cancel noise. (As mentioned above, this period defines the minimum ON-time of the motor output transistor.) The CR terminal begins discharging once the voltage reaches VCRH. When the output current reaches the current limit during this period (i.e. RNF voltage reaches the decay trigger voltage), then the IC enters decay mode. The CR continues to discharge during this period until it reaches VCRL, at which point the IC output is switched back ON. The current output and CR pin begin charging simultaneously. The CR charge time (tONMIN) and discharge time (tdischarge) are set by external components, according to the following formulas. The total of tONMIN and tdischarge yield the chopping period, tchop. tONMIN[s]≒C･R'･R / (R'+R)･ln[(VCR-0.4)/(VCR-1.0)] 0.30 VCR=V･R/(R'+R) 0.25 V: internal regulator voltage 5V(Typ) 0.20 R': CR terminal internal impedance 5kΩ(Typ) 0.15 tdischarge[s]≒C･R･ln[(1+α)/0.4] 0.10 α:See the right graph. tCHOP[s]≒tONMIN + tdischarge 0.05 0.00 0 500 1000 C　[pF] 1500 2000 Spike noise Current limit Value Output current 0mA Current limit Value RNF Voltage GND VCRH(1.0V Typ) CR Voltage VCRL(0.4V Typ) Discharge time tdischarge GND Minimum ON Time Chopping Period tCHOP tONMIN Figure 4 Timing chart of CR voltage, RNF voltage and output current Attach a resistor of at least 10 kΩ to the CR terminal (10 kΩ to 200 kΩ recommended) as lower values may keep the RC from reaching the VCRH voltage level. A capacitor in the range of 470 pF – 3300 pF is also recommended. As the capacitance value is increased, however, the noise-masking period (tonmin) also increases, and there is a risk that the output current may exceed the current limit threshold due to the internal L and R components of the output motor coil. Also, ensure that the chopping period (tchop) is not set longer than necessary, as doing so will increase the output ripple, thereby decreasing the average output current and yielding lower output rotation efficiency. The optimal value should reduce the motor drive noise while keeping distortion of the output current waveform to a minimum. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 7/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV ○Current decay mode The IC allows for a mixed decay mode in which the ratio of fast and slow decay can be optionally set. The following diagrams show the operating state of each transistor and the regenerative current path during attenuation for each decay mode: Input DECAY Mode 1（SELECT＝L） SLOW DECAY FAST DECAY OFF ON→OFF M OFF→ON OFF→OFF ON→OFF M ON→OFF OFF→ON ON→ON Output ON Time Current Decay Time Figure 5. Route of Regenerated Current during Current Decay(DECAY Mode 1) Input DECAY Mode 2（SELECT＝H） SLOW DECAY FAST DECAY OFF→ON ON→OFF M M ON→OFF OFF OFF→ON ON→ON OFF→OFF ON→OFF Output ON Time Current Decay Time Figure 6. Route of Regenerated Current during Current Decay(DECAY Mode 2) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV The merits of each decay mode are as follows: ○SLOW DECAY During current attenuation, the voltage between motor coils is small and the regeneration current decreases slowly, decreasing the output current ripple. This is favorable for keeping motor torque high. However, due to fall-off of current control characteristics in the low-current region, or due to reverse EMF of the output motors exhibited when using high-pulse-rate half-step or quarter-step modes, the output current increases, distorting the output current waveform and increasing motor vibration. Thus, this decay mode is most suited to full-step modes, or low-pulse-rate half-step or quarter-step modes. ○FAST DECAY Fast decay decreases the regeneration current much more quickly than slow decay, greatly reducing distortion of the output current waveform. However, fast decay yields a much larger output current ripple, which decreases the overall average current running through the motor. This causes two problems: first, the motor torque decreases (increasing the current limit value can help eliminate this problem, but the rated output current must be taken into consideration); and second, the power loss within the motor increases and thereby radiates more heat. If neither of these problems is of concern, then fast decay can be used for high-pulse rate half- or quarter-step drive. Additionally, this IC allows for a mixed decay mode that can help improve upon problems that arise from using fast or slow decay alone. In this mode, the IC switches automatically between slow and fast decay, improving the current control characteristics without increasing the output current ripple. The ratio of fast to slow decay is set externally via the voltage input to the MTH pin; therefore, the optimal mix of slow and fast decay can be achieved for each application. Mixed decay mode operates by splitting the decay period into two sections, the first X%(t1-t2) of which operates the IC in slow decay mode, and the remainder(t2-t3) of which operates in fast decay mode. However, if the output current (i.e., the voltage on the RNF pin) does not reach the set current limit during the first X% (t1-t2) decay period, the IC operates in fast decay mode only. MTH voltage [V] Current decay mode 0 to 0.3 0.4 to 1.0 1.5 to 3.5 SLOW DECAY MIX DECAY FAST DECAY t1 t2 t3 1.0V CR Voltage MTH Voltage 0.4V GND Chopping Period tchop Current limit value Output Current FAST SLOW DECAY DECAY 0A Figure 7. Relation between CR terminal voltage, MTH voltage, and output current during mixed decay www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Absolute Maximum Ratings (Ta=25°C) Item Symbol Rated Value Unit VCC1,2 -0.2 to +36.0 V VIN -0.2 to +5.5 V RNF maximum voltage VRNF 0.7 V Maximum output current (DC) IOUT 2.0※1 A/Phase IOUTPEAK 2.5※1 A/Phase Operating temperature range Topr -25 to +85 °C Storage temperature range Tstg -55 to +150 °C Maximum Junction temperature Tjmax +150 °C Supply voltage Input voltage for control pin Maximum output current (Peak) ※2 ※1 Do not, however exceed Tjmax=150°C. ※2 Pulse width tw≤1ms, duty 20%. Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Recommended Operating Conditions (Ta= -25 to +85°C) Item Supply voltage Maximum Output current (DC) Symbol Rated Value Unit VCC1,2 8 to 28 V IOUT 1.7※3 A/ Phase ※3 Not exceeding Tj=150°C. Thermal Resistance※4 Parameter Symbol Thermal Resistance (Typ) Unit 1s※6 2s2p※7 θJA 128.5 31.5 °C/W ΨJT 12 9 °C/W VQFN028V5050 Junction to Ambient Junction to Top Characterization Parameter ※5 ※4 Based on JESD51-2A(Still-Air) ※5 The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. ※6 Using a PCB board based on JESD51-3 Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70µm ※7 Using a PCB board based on JESD51-7. Layer Number of Measurement Board 4 Layers Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70µm 74.2mm x 74.2mm 35µm 74.2mm x 74.2mm 70µm www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC1,2=24V) Item Limit Symbol Unit Condition Min Typ Max ICCST - - 10 µA PS=L ICC - 2.5 5.0 mA PS=H, VREF=3V H-level input voltage VINH 2.0 - - V L-level input voltage VINL - - 0.8 V H-level input current IINH 35 50 100 µA VIN=5V L-level input current IINL -10 0 - µA VIN=0V [Whole] Circuit current at standby Circuit current [Control input] [Output (OUT1A, OUT1B, OUT2A, OUT2B)] IOUT =±1.5A Output ON resistance RON - 0.49 0.75 Ω Output leak current ILEAK - - 10 µA RNFxS input current IRNFS -2.0 -0.1 - µA RNFxS=0V RNFx input current IRNF -80 -40 - µA RNFx=0V VREF input current IVREF -2.0 -0.1 - µA VREF=0V VREF input voltage range VVREF 0 - 3.0 V MTH input current IMTH -2.0 -0.1 - µA MTH input voltage range VMTH 0 - 3.5 V Minimum ON time (Blank time) tONMIN 0.3 0.7 1.5 µs C=1000pF, R=39kΩ Comparator threshold VCTH 0.57 0.60 0.63 V VREF=3V (total of upper and lower resistors) [Current control] www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/24 MTH=0V TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Timing Chart Translator circuit This series builds in translator circuit and can drive stepping motor in CLK-IN mode. The operation of the translator circuit in CLK-IN drive mode is described as below. ○Reset operation The translator circuit is initialized by power ON Reset function and PS terminal. ・Initializing operation when power supply is turned on ①If power supply is turned on at PS=L (Please use this sequence as a general rule) When power supply is turned on, the power ON reset function operates in IC and initialized, but as long as it is PS=L, the motor output is the OPEN state. After power supply is turned on, because of the changing of PS=L⇒H, the motor output becomes the ACTIVE state, and the excitation is started at the initial electrical angle. But at the time of PS=L⇒H, it returns from the standby state to the normal state and there is a delay of 40µs(Max) until the motor output has become the ACTIVE state. ACTIVE Reset is released ① Delay ② PS CLK OUT1A OUT1B Motor output OPEN Motor output ON ②If power supply is turned on at PS=H When power supply is turned on, the power ON function in IC operates, and initialized before the motor output becomes the ACTIVE state, and the excitation is started at the initial electrical angle. ・Initializing operation during motor operating Please input the reset signal to PS terminal when the translator circuit is initialized during motor operating. (Refer to P.19) But at the time of PS=L⇒H, it returns from the standby state to the normal state and there is a delay of 40µs (Max) until the motor output has become the ACTIVE state, so please be careful. ○Control input timing Please input as shown below because the translator circuit operates at the rising edge of CLK signal. If you disobey this timing and input, then there is the possibility that the translator circuit does not operate as expected. In addition, at the time of PS=L⇒H, it returns from the standby state to the normal state and there is a delay of 40µs (Max) until the motor output has become the ACTIVE state, so within this delay interval there is no phase advance operation even if CLK is inputted. A PS B C CLK D MODE0 MODE1 CW_CCW ENABLE F G E F G A:PS minimum input pulse width･･････20µs B:PS rising edge to CLK rising edge input possible maximum delay time･･････40µs C:CLK minimum period･･････4µs D:CLK minimum input H pulse width･･････2µs E:CLK minimum input L pulse width･･････2µs F:MODE0,MODE1,CW_CCW,ENABLE set-up time･･････1µs G:MODE0,MODE1,CW_CCW,ENABLE hold time･･････1µs www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV ・FULL STEP (MODE0=L, MODE1=L, CW_CCW=L, ENABLE=H) ① ② ③ ④ ① OUT1A 100% PS CLK 67% OUT1A 33% 1 4 OUT2A OUT2B OUT1B OUT2A 3 2 OUT2B 100% 67% 33% IOUT(CH1) OUT1B 4CLK = Electrical angle 360° -33% -67% -100% 100% 67% 33% IOUT(CH2) -33% -67% -100% ・HALF STEP A (MODE0=H, MODE1=L, CW_CCW=L, ENABLE=H) ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ① ② OUT1A PS 100% CLK 67% 8 33% OUT1A OUT2B OUT1B OUT2A 1 7 6 2 5 OUT2A 3 4 OUT2B 100% 67% 33% IOUT(CH1) 8CLK = Electrical angle 360° -33% -67% -100% 100% 67% 33% IOUT(CH2) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 OUT1B -33% -67% -100% 13/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV ・HALF STEP B(MODE0=L, MODE1=H, MODE2=L, CW_CCW=L, ENABLE=H) ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ① ② OUT1A PS 100% CLK 67% OUT1A 8 33% OUT1B OUT2B 1 7 2 6 OUT2A 5 OUT2A 3 4 OUT2B 100% 67% 33% IOUT(CH1) -33% -67% -100% OUT1B 8CLK = Electrical angle 360° 100% 67% 33% IOUT(CH2) -33% -67% -100% ・QUARTER STEP (MODE0=H, MODE1=H, CW_CCW=L, ENABLE=H) ①②③④⑤⑥⑦⑧⑨⑩⑪⑫⑬⑭⑮⑯①②③④ OUT1A PS 100% CLK 67% OUT1A 14 OUT2B OUT2A 2 16 13 33% OUT1B 15 1 12 2 11 1 10 3 4 9 100% 67% 33% IOUT(CH1) -33% -67% -100% 7 6 OUT1B 16CLK = Electrical angle 360° 100% 67% 33% IOUT(CH2) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 5 8 OUT2B OUT2A -33% -67% -100% 14/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV ・Reset timing chart (QUARTER STEP, MODE0=H, MODE1=H, CW_CCW=L , ENABLE=H) If the terminal PS is input to L, the reset operation is done with regardless of other input signals when reset the translator circuit while motor is working. At this time, IC internal circuit enters the standby mode, and makes the motor output OPEN. RESET ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ PS CLK OUT1A OUT1B OUT2A OUT2B 100% 67% 33% -33% -67% -100% IOUT(CH1) 100% 67% 33% -33% -67% -100% IOUT(CH2) ・CW_CCW Switch timing chart (FULL STEP, MODE0=L, MODE1=L, ENABLE=H) The switch of CW_CCW is reflected by the rising edge of CLK that comes immediately after the changes of the CW_CCW signal. However, depending on the state of operation of the motor at the switch the motor cannot follow even if the control on driver IC side is correspondent and there are possibilities of step-out and mistake step in motor, so please evaluate the sequence of the switch enough. CW ① CCW ② ③ ② ① PS CW_CCW CLK OUT1A OUT1B OUT2A OUT2B 100% IOUT(CH1) -100% 100% IOUT(CH2) www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 -100% 15/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV ・ENABLE Switch timing chart (FULL STEP, MODE0=L, MODE1=L) The switch of the ENABLE signal is reflected by the change in the ENABLE signal with regardless of other input signals. In the section of ENABLE=L, the motor output becomes OPEN and the electrical angle doesn't advance. Because the translator circuit stop and CLK input is canceled. Therefore, the progress of ENABLE=L→H is completed before the input of ENABLE=L. Excitation mode (MODE0, MODE1) also switches within ENABLE=L interval. Where excitation mode switched within ENABLE=L interval, restoring of ENABLE=L→H was done in the excitation mode after switch. Output off & Translator stop ① ② ② ③ PS ENABLE CLK OUT1A OUT1B OUT2A OUT2B 100% IOUT(CH1) -100% 100% IOUT(CH2) -100% Restoring in the state prior to input of ENABLE=L ・About the switch of the motor excitation mode The switch of the excitation mode can be done with regardless of the CLK signal at the same time as changing of the signal MODE0, MODE1. The following built-in function can prevent motor out-of-step caused by discrepancies of torque vector of transitional excitations during switch between excitation modes. However, due to operation state of motor during switch, motor may not act following control on IC side of controller, and thereby lead to out-of-step or miss step. Therefore, switch sequence shall be evaluated sufficiently before any decision. ・Cautions of bidirectional switch of CW_CCW and excitation modes (MODE0, MODE1) As shown in the figure below, the area between the end of reset discharge (PS=L→H) and beginning of the first CLK signal input is defined as interval A, while the area post the end of the first CLK signal input is defined as interval B. Interval A => For CW_CCW, no limitation is applied on switch of excitation mode. Interval B => In CLK1 period, or within ENABLE=L interval, CW_CCW and excitation mode can’t be switched together. Violation of this restriction may lead to false step (with one extra leading phase) or out-of-step. Therefore, in case that CW_CCW and excitation modes are switched simultaneously, PS terminal must be input with reset signal. Then start to operate in interval A before carrying out such bidirectional switch. Interval 区間AA Interval 区間B B PS CLK www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 16/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Application Example GND Logic input terminal Refer to P.3,5 for detail. GND GND 1 Power save terminal Refer to P.3 for detail. 2 6 CLK 5 MODE1 7 MODE0 8 Translator ＋ － OCP OVLO UVLO RESET CW_CCW 9 ENABLE 10 TEST 11 VREF 28 TSD 3 PS Bypass capacitor. Setting range is 100uF to 470uF(electrolytic) 0.01uF to 0.1uF(multilayer ceramic etc.) Refer to P.4 for detail. Be sure to short VCC1 & VCC2. DAC Set the output current. Input by resistor division. Refer to P.4 for detail. 24 VCC1 23 ＋ RNF1S Set the chopping frequency. Setting range is C:470pF to 3300pF R:10kΩ to 200kΩ Refer to P.5,7 for detail. － 19 20 － Blank time PWM control Predriver RNF2S Control logic ＋ CR 26 39kΩ 25 GND 21 12 13 OSC 17 1000pF SELECT 4 MTH 27 16 Mix decay control DECAY Mode input terminal Refer to P.3,8 for detail. 15 Regulator 18 OUT1A OUT1B RNF1 0.2Ω 0.1µF 100µF RNF1S VCC2 OUT2A OUT2B RNF2 0.2Ω Resistor for current detection Setting range is 0.1Ω to 0.3Ω. Refer to P.4 for detail. RNF2S GND Resistor for current detection Setting range is 0.1Ω to 0.3Ω. Refer to P.4 for detail. Set the current decay mode. ①SLOW DECAY ⇒Connect to GND. ②MIX DECAY ⇒Input by resistor division. Refer to P.5,9 for detail. Figure 8. Block diagram and applied circuit diagram www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Power dissipation Please confirm that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W), Thermal Resistance(°C/W) and ambient temperature (Ta). When Tj=150°C is exceeded the functions as a semiconductor do not operate and problems such as parasitism and leaks occur. Constant use under these circumstances leads to deterioration and eventually destruction of the IC. Tjmax=150°C must be strictly obeyed under all circumstances. Thermal Calculation The IC’s consumed power can be estimated roughly with the power supply voltage (VCC), circuit current (ICC), output ON resistance (RONH,RONL) and motor output current value (IOUT). The calculation method during FULL STEP drive, SLOW DECAY mode is shown here: Consumed power of the Vcc [W] = VCC [V]･ICC [A] ･･･････① Consumed power of the output DMOS [W] = (RONH[Ω] + RONL[Ω])･IOUT [A]2･2[ch]･on_duty During output ON + (2･RONL[Ω])･IOUT [A]2･2[ch]･(1 - on_duty) ･･･････② During current decay However, on duty: PWM on duty = ton / (tchop) ton varies depending on the L and R values of the motor coil and the current set value. Please confirm by actual measurement, or make an approximate calculation. tchop is the chopping period, which depends on the external CR. See P.8 for details. IC number BD63621MUV Upper PchDMOS ON Resistance RONH[Ω] (Typ) Lower NchDMOS ON Resistance RONL[Ω] (Typ) 0.32 0.17 Consumed power of total IC W_total [W] = ① + ② Junction temperature Tj = Ta[°C] + θja[°C/W]･W_total [W] However, the thermal resistance valueθja °C/W differs greatly depending on circuit board conditions. Refer to the thermal resistance on P.10. Also, we are taking measurements of thermal resistance valueθja of boards actually in use. Please feel free to contact our salesman. The calculated values above are only theoretical. For actual thermal design, please perform sufficient thermal evaluation for the application board used, and create the thermal design with enough margin to not exceed Tjmax=150°C.Although unnecessary with normal use, if the IC is to be used under especially strict heat conditions, please consider externally attaching a Schottky diode between the motor output terminal and GND to abate heat from the IC. ○Temperature Monitoring In respect of BD63621MUV, there is a way to directly measure the approximate chip temperature by using the TEST or MODEx terminal with a protection diode for prevention from electrostatic discharge. However, temperature monitor using this TEST terminal is only for evaluation and experimenting, and must not be used in actual usage conditions. (1) Measure the terminal voltage when a current of Idiode=50µA flows from the TEST or MODEx terminal to the GND, without supplying VCC to the IC. This measurement is of the Vf voltage inside the diode. (2) Measure the temperature characteristics of this terminal voltage. (Vf has a linear negative temperature factor against the temperature.) With the results of these temperature characteristics, chip temperature may be calibrated from the TEST terminal voltage. (3) Supply VCC, confirm the TEST terminal voltage while running the motor, and the chip temperature can be approximated from the results of (2). -Vf[mV] Monitor terminal Internal circuit Idiode Vf 25 150 Chip temperature Tj[°C] Figure 9. Model diagram for measuring chip temperature www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 18/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV I/O equivalent circuit CLK MODE1 MODE0 CW_CCW ENABLE PS VREF MTH 10kΩ 5kΩ 10kΩ 100kΩ VREG (internal regulator) RNF1S RNF2S 5kΩ 5kΩ CR 5kΩ 5kΩ VCC OUT1A OUT2A OUT1B OUT2B RNF1, RNF2 circuitry Figure 10. I/O equivalent circuit www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 19/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 20/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 11. Example of monolithic IC structure 13. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 14. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 21/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Ordering Information B D 6 3 6 2 M 1 U V - Package type MUV: VQFN028V5050 Part Number E2 Packing, Forming specification E2: Reel-wound embossed taping Marking Diagrams VQFN028V5050 (TOP VIEW) Part Number Marking D 6 3 6 2 1 LOT Number 1PIN MARK www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 22/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN028V5050 23/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Revision History Date Revision 15.Jun.2017 21.Dec.2020 001 002 Changes New Release Updated packages and part numbers, page 24-2 and 24-3 www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Ordering Information B D 6 3 6 2 M 1 U V Package type MUV: VQFN028V5050A Part Number - Z E2 Production site Z: added Packing, Forming specification E2: Reel-wound embossed taping Marking Diagrams VQFN028V5050A (TOP VIEW) Part Number Marking D 6 3 6 2 1 LOT Number 1PIN MARK www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 24-2/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 BD63621MUV Physical Dimension, Tape and Reel Information Package Name www.rohm.com © 2017 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VQFN28V5050A 24-3/24 TSZ02201-0P2P0B701290-1-2 21.Dec.2020 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.004 Datasheet General Precaution 1. Before you use our Products, you are requested to carefully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this document is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001