Datasheet
AC/DC Drivers
Quasi-Resonant Control type
DC/DC Converter IC
BM1Q00XFJ Series
●General Description
The quasi-resonant controller typed AC/DC converter IC
(BM1Q00XFJ series) provides an optimum system for all
products that include an electrical outlet.
Quasi-resonant operation enables soft switching and helps
to keep EMI low.
With MOSFET for switching and current detection resistors
as external devices, a higher degree of design freedom is
achieved.
As BM1Q00XFJ series built in HV starter circuit, it
contributes to low consumption power and high speed
start.
Because the built-in burst mode is reduced switching loss
and IC consumption current is low, Stand-by power is very
low.
Because BM1Q00XFJ series built-in soft-start, burst mode,
over current limiter which is cycle-by-cycle, over load
protection, over voltage protection, CS open protection and
so on, BM1Q00XFJ series are highly safety.
●Features
◼ Quasi-resonant method
◼ Built-in 650V tolerate start circuit
◼ Low power when load is light ( Burst operation)
◼ Maximum frequency control (120kHz)
◼ Frequency reduction function
◼ AC voltage correction function
◼ VCC pin : under voltage protection
◼ VCC pin : overvoltage protection
◼ Over-current protection (cycle-by-cycle)
◼ OUT pin : H voltage 12V clamp
◼ Soft start
◼ ZT trigger mask function
◼ ZT Over voltage protection
◼ FB Over Load protection [Auto-restart]
◼ CS pin open protection [Auto-restart]
●Package
SOP-J8
●Key Specifications
◼ Operating Power Supply Voltage Range:
:
VCC：8.9V to 26.0V
VH：
to 600V
◼ Operating Current:
Normal：0.60mA (Typ.)
Burst ： 0.35mA(Typ.)
◼ Max frequency:
120kHz(Typ.)
◼ Operate temperature range:
-40℃ to +105℃
●Typical Application Circuit
+
AC
VOUT
VS
FUSE
Diode
Bridge
Filter
85-265
Vac
VP
-
7
VH
6
5
VCC
OUT
●Applications
AC adapters and household appliances (printer, TV,
vacuum cleaners, air cleaners, air conditioners, IH
cooking heaters etc.)
●Line Up
CM
VD
8
4.90mm × 6.00mm × 1.65mm
(Typ.)
(Typ.)
(Max.)
IC
IC
VCC OVP
ZT OVP
BM1Q001FJ
Auto restart
None
BM1Q002FJ
Latch
Latch
ERROR
AMP
Rzt1
ZT
FB
CS
GND
１
2
3
4
Rzt2
RS
PC
Fig 1. Application Circuit
○Product structure：Silicon monolithic integrated circuit
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○This product is not designed protection against radioactive rays
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BM1Q00XFJ Series
●Absolute Maximum Ratings（Ta=25C）
Item
Symbol
Rating
Unit
Condition
Input voltage range 1
Vmax1
-0.3 ~ 30
V
VCC
Input voltage range 2
Vmax2
-0.3 ~ 6.5
V
CS, FB
Input voltage range 3
Vmax3
-0.3 ~ 7.0
V
ZT
Input voltage range 4
Vmax4
-0.3 ~ 15
V
OUT
Input voltage range 5
Vmax5
-0.3 ~ 650
V
VH
OUT pin out peak current1
IOH
-0.5
A
OUT pin out peak current2
IOL
1.0
A
ZT pin current1
ISZT1
-3.0
mA
ZT pin current2
ISZT2
3.0
mA
Allowable dissipation
Pd
0.67 (Note1)
W
oC
-40 ～ +105
Operating temperature
Topr
oC
Max junction temperature
Tjmax
150
oC
Storage temperature range
Tstr
-55 ～ +150
(Note1) When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
Reduce to 5.4 mW/C when Ta = 25C or above.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit
between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection
measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
●Operating Conditions（Ta=25C）
Parameter
Power supply voltage range 1
Power supply voltage range 2
Symbol
VCC
VH
Rating
8.9～26.0
80～600
Unit
V
V
●Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
Symbol
MIN
TYP
MAX
Conditions
VCC
VH
Unit
Conditions
［Circuit current］
FB=2.0V
(Switching operation)
FB=0.5V
(Switching OFF)
VCC=12V , VH:open
VCC UVLO = disable
Circuit current (ON)1
ION1
-
600
1000
uA
Circuit current (ON)2
ION2
-
350
450
uA
Circuit current(OFF)
IOFF
-
-
25
uA
VH Start current1
VH Start current2
ISTART1
ISTART2
0.400
1.00
0.700
3.00
1.000
6.00
mA
mA
VH OFF current
ISTART3
-
10
20
uA
VSC
0.400
0.800
1.400
V
VCC pin
VUVLO1
VUVLO2
VUVLO3
VCHG1
VCHG2
VOVP1
VOVP2
VOVP3
12.50
7.50
7.70
12.00
26.00
-
13.50
8.20
5.30
8.70
13.00
27.50
23.50
4.00
14.50
8.90
9.70
14.00
29.00
-
V
V
V
V
V
V
V
V
VCC rise
VCC fall
VUVLO3= VUVLO1-VUVLO2
Starter circuit
Stop voltage from VCHG1
VCC rise
VCC fall [BM1Q001]
[BM1Q001]
VOUTH
VOUTL
RPDOUT
10.5
75
12.5
100
14.5
0.30
125
V
V
kΩ
IO=-20mA, VCC=15V
IO=+20mA
［VH pin starter］
VH start current switched
voltage
VCC= 0V
VCC=10V
Released VCCUVLO
VH pin current
［VCC pin protection］
VCC UVLO voltage1
VCC UVLO voltage2
VCC UVLO hysteresis
VCC charge start voltage
VCC charge end voltage
VCC OVP voltage1
VCC OVP voltage2
VCC OVP hysteresis
［OUT pin］
OUT pin H voltage
OUT pin L voltage
OUT pin Pull-down resistor
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BM1Q00XFJ Series
●IC control unit Electrical Characteristics (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Specifications
Parameter
Symbol
Unit
MIN
TYP
MAX
Conditions
[ DC/DC converter unit （Turn-off）]
RFB
Vlim1A
Vlim1B
Vlim2A
Vlim2B
22.5
0.475
0.310
0.100
0.062
30.0
0.500
0.350
0.125
0.088
37.5
0.525
0.390
0.150
0.113
kΩ
V
V
V
V
FB=2.2V (ACSNS＝L)
FB=2.2V (ACSNS＝H)
FB=0.5V (ACSNS＝L)
FB=0.5V (ACSNS＝H)
AVCS1
3.40
4.00
4.60
V/V
ACSNS＝L
AVCS2
4.86
5.71
6.57
V/V
ACSNS＝H
IZT1
IZT2
0.93
0.82
1.00
0.90
1.07
0.98
mA
mA
IZTHYS
-
0.10
-
mA
TLEB
-
0.250
-
us
Turn-off time
TOFF
-
0.150
-
us
Minimum ON width
Maximum ON width
Tmin
Tmax
30.0
0.400
39.0
50.7
us
us
IZT1
IZT2
IZT3
FSW1
FSW2
4
6
8
108
21
14
16
18
120
30
24
26
28
132
39
uA
uA
uA
kHz
kHz
VFBSW1
1.10
1.25
1.40
V
VFBSW2
VZT1
VZT2
0.42
60
120
0.50
100
200
0.58
140
280
V
mV
mV
Pull-up resistor of FB pin
CS over current voltage 1A
CS over current voltage 1B
CS over current voltage 2A
CS over current voltage 2B
Voltage gain1
（ΔVFB/ΔVCS）
Voltage gain 2
（ΔVFB/ΔVCS）
ZT current switched CS 1
ZT current switched CS 2
ZT current hysteresis
switched CS voltage
CS Leading Edge Blanking
At applying PULSE to the
CS pin
TLEB＋TOFF
[ DC/DC converter unit （Turn-on）]
ZT input current 1
ZT input current 2
ZT input current 3
Max frequency 1
Max frequency 2
Frequency reduction start
voltage
Frequency reduction end voltage
ZT comparator voltage1
ZT comparator voltage2
ZT trigger mask time
TZTMASK
-
0.6
-
us
ZT trigger Timeout1
ZT trigger Timeout2
TZTOUT1
TZTOUT2
10.5
3.5
15.0
5.0
19.5
6.5
us
us
TSS1
TSS2
TSS3
TSS4
VBURST
VFOLP1A
VFOLP1B
TFOLP
TOLPST
0.35
0.70
1.40
2.80
0.42
2.6
44.8
358
0.50
1.00
2.00
4.00
0.50
2.8
2.6
64
512
0.65
1.30
2.60
5.20
0.58
3.0
83.2
666
ms
ms
ms
ms
V
V
V
ms
ms
VLATCH
-
-
V
TLATCH
VZTL
50
4.65
200
5.35
us
V
OUT=L, ZT=4.65V
OUT=L, ZT=5.00V
OUT=L, ZT=5.35V
FB=2.0V
FB=0.5V
ZT fall
ZT rise
In OUT H ->L,
prevent noise
No bottom detection
From final ZT trigger
[DC/DC protection ]
Soft start time1
Soft start time 2
Soft start time 3
Soft start time 4
FB Burst voltage
FB OLP voltage a
FB OLP voltage b
FB OLP delay timer
FBOLP stop timer
Latch released voltage
（VCC pin voltage）
Latch mask time
ZT OVP voltage
VUVLO2 –
0.50
100
5.00
Burst ON
FBOLP detect（FB rise）
FBOLP detect（FB fall）
[BM1Q002FJ]
* Definition of ACSNS (L : ZT current＜IZT1 、H : ZT current > IZT1)
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BM1Q00XFJ Series
●Pin Configuration
Table 1 Input-Output PIN Function
NO.
Pin Name
I/O
1
2
3
4
5
6
7
8
ZT
FB
CS
GND
OUT
VCC
N.C.
VH
I
I
I
I/O
O
I/O
I
ESD Diode
Function
VCC
○
○
○
○
-
Zero current detect pin
Feedback signal input pin
Primary current sensing pin
GND pin
External MOS drive pin
Power supply pin
Non Connection
Starter circuit pin
GND
○
○
○
○
○
○
4.9±0.2
MAX 5.25 ( include BURR)
● External Dimensions
7
6
5
0.45MIN
1Q00X
3.9±0.2
6.0±0.3
8
Lot No.
4
11.27
.27
0.175
1.375±0.1
3
2
1
Fig-2
0.2±0.1
0.42±0.1
(Unit:mm)
External Dimensions
●I/O Equivalent Circuit Diagram
1
ZT
2
Internal
Reg
3
FB
VCC
CS
4
GND
Internal
Reg
VCC
GND
500kΩ
5
OUT
6
7
VCC
N.C.
8
VH
VCC
Non Connection
Internal
block
Fig-3
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I/O Equivalent Circuit Diagram
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BM1Q00XFJ Series
●Block Diagram
+
AC
Diode
Bridge
Filter
85265Vac
VOUT
VH
FUSE
CM
Va
Cvcc
8
6
VH
VCC
Starter
+
-
+
-
4.0V Regulator
13.5V/
8.2V
13.0V/
8.7V
NOUT
+
-
ZT ACSNS Comp.
-
ZT
1
+
ZT OVP Comp.
(LATCH)
VCC OVP
(LATCH)
ZT Blanking
OUT(H->L)
0.60us
ERROR
AMP
POUT
S Q
AND
30k
+
AND
FBOLP_OH
NOUT
OR
Burst
Comp.
PRE
Driver
5
OUT
NOUT
R
Max frequency
control
VREF(4V)
2
OSC
OR
Trigger
detect LOGIC
100mV
/200mV
FB
OSC
TimeOut
・ 15 us
・ 5 us
AND
7V
Rzt2
27.5V
1 shot
ZT
Comp.
-
Czt
Internal
Supply
+
+
-
Rzt1
12V Clamp
Circuit
VCC UVLO
BURST_OH
VREF(4V)
+
OSC
-
1MΩ
delay Timer FBOLP_OH Stop Timer
(512ms)
(64ms)
OSC
0.50V.
OLP1
Cfb
Soft Start
300kΩ
100kΩ
FB/4
0.50V
-
DCDC
Comp.
SS
0.5ms
SS
1ms
SS
2ms
SS
4ms
+
CURRENT SENSE (V-V Change)
Normal : ×1.0
Leading Edge
Blanking
3
CS
RS
4
GND
PC
Fig-4 Block Diagram
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BM1Q00XFJ Series
●Description of Blocks
( 1-1 ) Starter Circuit VH pin（8pin）
IC builds in starter circuit (tolerates 650V) to VH pin (8pin). It enables to be low standby power and high speed starting.
The operating current is shown in Fig-6.After starting IC, consumption power is decided by multiplied idling current ISTART3
（typ=10uA） with VH voltage. The loss by the idling current is below.
ex) power consumption of starter circuit only
Vac=100V Power＝100V*√2*10uA=1.41mW
Vac=240V Power＝240V*√2*10uA=3.38mW
Start time is decided by VH current and VCC pin capacitor.
The reference value of start time is shown in Fig7. For example, VCC capacitor is charged within 0.1s in CVCC=10uF
When VCC pin is shorted to GND, current of “ISTART1” flows. (Fig-6)
When VH pin is shorted to GND, large current flows from VH line to GND. To prevent it, need to insert
resistor (5kΩ~60kΩ) of “RVH” to limit current between VH line and VH pin.
When VH pin is shorted to GND, the power of VH2/RVH is applied. For that, please decide resistor size to confirm power
dissipation. When it does not satisfy power dissipation by one resistor, please use more than two resistors.
+
FUSE
AC
Input
Diode
Bridge
-
Rvh
8
VH
Starter
SW1
6
VCC
Cvcc
+
VCCUVLO
Fig-5 Starter Block Diagram
VCC cap – Start up time
Start upt time[ms]
Start Up Current [mA]
ISTART2
ISTART1
ISTART3
0 Vsc
10V
V UVLO1
VCC cap[uF]
VCC Voltage[V]
Fig-6 Start-up Current vs VCC Voltage
*The start up current is flown from VH pin(8Pin).
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Fig-7 Start-up Time（example）
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BM1Q00XFJ Series
It shows operation waveform of start-up in Fig-8.
VH
Voltage
ISTART2
VH input
current
ISTART1
ISTART3
VUVLO1
VCC
VCC(5pin)
Switchin
Switing
g
VSC
Set voltage
Secondary
output
A
B
C
D
Fig-8 Start-up Waveform
A: By inserting to outlet, VH voltage applies. From the time, charging to VCC pin starts from VH pin through starter circuit.
At the time, due to VCC < VSC (typ=0.8V), VH input current is limited to ISTART1 by VCC pin short protection.
B: Because of VCC voltage > VSC (typ=0.8V), VCC short protection is released, the current flows from VH pin.
C: Because of VCC voltage > VUVLO1 (typ=13.5V), the start-up stops, and VH input current is limited to ISTART3
(typ=10uA)
Furthermore, because switching operation starts, Secondary output rises. However, because Secondary output is low,
VCC pin voltage is decreased. The falling rate of VCC is determined by VCC pin capacitance, the consumption current
of IC and the load current that flows from the VCC pin. ( V/t = Cvcc/Icc )
D: Because secondary output has risen to specific voltage, VCC pin voltage is applied from the auxiliary winding and VCC
voltage is stabilized.
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BM1Q00XFJ Series
( 1-2 ) In Case of Useless VH pin (8pin)
This IC is also possible to start by connecting the start-up resistor to the VCC pin in the open the start-up circuit (650V
breakdown voltage) of the VH pin. The structure that do not use the recharge function is shown in Fig- 9.
At start-up (before VCC VULO releasing) , please be careful to set the start-up resistor shown in blue because the
consumption current IOFF（Max=25uA） flows from VCC pin(6pin). Also, in case of not to use recharge function, the same
circuit is used.
+
AC
Diode
Bridge
Filter
85-265
Vac
VOUT
VS
FUSE
VP
-
CM
VD
8
7
VH
6
5
VCC
OUT
IC
ERROR
AMP
Rzt1
ZT
FB
CS
GND
１
2
3
4
Rzt2
RS
PC
Fig-9 Application Circuit not to use VH Pin (8pin)
・How to set the start-up resistance
Start-up resistor Rstart shown in Fig-9 in blue, is necessary for the IC to start if you do not use the VH pin.
If you reduce Rstart value, standby power is increased, start-up time is shorter.
If you increase Rstart on the contrary, standby power is reduced, start-up time will be longer.
When the voltage VCC=12V, standby current IOFF is 25μA (max), VCC UVLO voltage VUVLO1 is 14.5V (max).
ex） The example of start-up resistor Rstart setting
Rstart = (Vmin- VUVLO1（max）) / IOFF（max）
In Vac=100V, if margin is -30% , VHmin=100×√2×0.7=99V
VUVLO1（max）=14.5V ,so
Rstart ＝(99-14.5) / 25μA＝3.38MΩ
For an example, with a sufficient margin to 3.38MΩ, and the Rstart is 2.0MΩ..
For AC100V, Power consumption in Rstart is below.
Pd (Rstart) = (VH-VCC)2/Rstart = (141V-14.5V) 2/2.0M = 8.00mW
Pd in using start-up resistor is more than in using VH pin,
However for VCC pin capacitance value and VCC start-up resistor, please confirm by performing the evaluation of the actual
application.
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BM1Q00XFJ Series
(2 ) Start Sequence (Soft start, Light load operation, Auto recovery in over load protection)
The start sequence of IC is shown in Fig-10. About each detail, explain in each section.
VH(8pin)
13.0V
13.5V
VCC(6pin)
VCC=8.7V
Internal REF
Pull Up
64msec
64msec
512msec
64msec
2.8V
FB(2pin)
Vout
Over Load
Normal Load
Light LOAD
Iout
Burst mode
Switing
Switching
Soft
Start
A
BC
D
E
F
GH I
J
K
Fig-10 Start Sequence Time Chart
A: Input voltage from AC line is supplied to VH pin(8Pin).
B : VCC pin（6pin） voltage is rise, when VCC＞VUVLO1（typ=13.5V）, IC starts operating.
In case of protection function is no active, IC starts to switching operation.
Then VCC pin voltage is dropped in cause of VCC (6pin) consumption current.
In case of VCC< VCHG1 （typ=8.7V）, starter circuit is operated, IC starts to charge VCC pin. After starting of charge, IC
continues to charge until VCC> VCHG2 （typ=13.0V）.
C: There is a soft start function which regulates the voltage level at the CS pin to prevent a rise in voltage and current.
D: When the switching operation starts, VOUT rises.
Once the output voltage starts-up, set to stable the output voltage to within the TFOLP (typ=64ms) period
E: When it is light load, burst operation is used to keep power consumption down.
F: When it is heavy load, FB pin voltage (2pin) is larger than VFOLP1A (typ=2.8V), because output voltage is down.
G: When the FB pin(2pin) voltage keeps VFOLP1A (typ=2.8V) at or above T FOLP (64ms typ), switching is stopped by the over load
protection for TOLPST(typ=512ms).
When the FB pin(2pin) voltage does not keep VFOLP1B (typ=2.6V) at T FOLP (64ms typ), the timer of TFOLP(typ=64ms) is reset.
H : When VCC voltage（6pin） is VCHG1 （typ=8.7V） or less, starter circuit starts to charge VCC pin(6pin) to operate starter
circuit.
I : When VCC voltage (6pin) is over than VCHG2 （typ =13.0V）,starter circuit stops to charge VCC pin(6pin).
J: The same as F.
K: The same as G.
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BM1Q00XFJ Series
(3) VCC pin(6pin) Protection Function
IC built in VCC UVLO（Under Voltage Lock Out） function and VCC OVP (Over Voltage Protection) function and VCC charge
function.
VCC UVLO function is the protection for VCC (pin) voltage is low. VCC OVP function is the protection for VCC (6pin) voltage is
high. They are for preventing MOSFET from destroying for switching in VCC voltage low or high.
VCC charge function is stable for output voltage in VCC pin voltage low, because starter circuit charge VCC pin from VH line.
(3-1) VCC UVLO / VCC OVP Function
VCCUVLO is an auto recovery type that has voltage hysteresis. VCCOVP is able to select an auto recovery type
(BM1Q001FJ) and VCCOVP is a latch type (BM1Q002FJ).
VCC< VLATCH（typ=7.7V） is condition of latch release (reset) after detection of latch operation by VCCOVP.
Refer to the operation figure-11.
VCCOVP built in mask time for TLATCH（typ=100us）. This function operates to successful detection at
VCC pin voltage > VOVP1 （typ=27.5V）. By this mask time, this IC masks surge etc.
In case of BM1Q001FJ (Auto recovery), When IC detects VCCOVP function, IC stops switching until VCC pin voltage is smaller
than VOVP2 (typ=23.5V).
VH(8pin)
Vovp
VCCuvlo1
VCCCHG2
VCCCHG1
VCCuvlo2
Vlatch
VCC(6pin)
Time
ON
ON
VCC UVLO
Function
OFF
OFF
ON
VCC OVP
Function
OFF
OFF
ON
VCC CHARGE
Function
ON
OFF
OFF
OFF
ON
ON
ON
OFF
OFF
OFF
ON
ON
OUT
Switing
OFF
OFF
Internal
Latch Signal
L : Normal
H : Latch
TLATCH
A
B
CD
E
F
G H
I
J K
A
Time
Fig-11 VCC UVLO / OVP Timing Chart(In case of BM1Q002FJ)
A: VH (8pin) voltage input, VCC (6pin) voltage starts rising.
B: VCC pin voltage >VUVLO1, releases the VCC UVLO function and DC/DC operation starts.
C: VCC pin voltage >VOVP1, VCCOVP detects the over-voltage.
D: When the VCC (6pin) voltage > VOVP1 continues TLATCH (typ =100us), switching is stopped by the VCCOVP function.
(LATCH mode)
E: VCC (6pin) voltage < VCHG1, VCC charge function operates and the VCC pin (6pin) voltage rises.
F: VCC (6pin) voltage > VCHG2, VCC charge function stops.
G: The same as E.
H: The same as F.
I: VH line voltage is down.
J: VCC < VUVLO2, VCC UVLO function starts to operate.
K: VCC < VLATCH, latch function is released.
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・For Capacitor Value of VCC pin
For stable operation of the IC, please set the 1uF or higher capacitor value of VCC pin. When the VCC capacitor
terminal is too large, response of the VCC pin to the Secondary output is slows down. Please be careful.
If the degree of the transformer coupling is low, since a large surge occurs to the VCC pin, the IC may be destroyed. In
this case, please attach a resistor which is from 10Ω to 100Ω to the path between the capacitor and diode at the back of
the auxiliary winding. Please set the resistance value in order that surge of VCC pin does not exceed the absolute
maximum rating of the VCC pin by performing the waveform evaluation of VCC pin.
・For settings VCC OVP voltage protection when Vout (Secondary output) is increased
VCC pin voltage is determined by the transformer ratio and Vout ( Secondary output ).Therefore, when the Secondary
output is large, it is possible to protect IC by VCCOVP. Setting VCCOVP protection is below.
Vout
Np
Ns
Nb
8
7
VH
ZT
1
6
5
VCC OUT
FB
CS
GND
2
3
4
Fig-12 How to Set VCCOVP
VCC voltage = Vout×Nb/Ns -VF (Vout:Secondary output, Nb:Number of auxiliary winding, Ns:Number of secondary
winding)
If you wish to apply protection when it becomes Secondary output × 1.3, please set the number of turns so that
1.3×(Vout×(Nb/Ns)-VF) > VOVP1
Because there is a blanking time of TLATCH (typ = 100us) to VCCOVP protection, VCCOVP protection is not detected to
momentary surge noise of the VCC pin, However, VCCOVP is detected when VCC voltage is higher than the VOVP1 at
the period of more than TTLATCH, due to low degree of transformer coupling or other influences
In addition, as a protection of Secondary output, ZTOVP is also available. ZTOVP is described in (6).
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（3-2）VCC Recharge Function
After VCC (6pin) voltage > VUVLO1, IC start to operate. After that, when VCC pin voltage < VCHG1, VCC charge function is active.
Then starter circuit operates charge VCC (6pin) from VH line. By these, it does not occur start problem. When the IC charge
the VCC pin (6pin) and the VCC pin voltage exceeds V CHG2, the charging function is finished.
The operation is shown to Figure-13.
VH
VUVLO1
VCHG2
VCC VCHG1
VUVLO2
Switching
VH charge
charge
charge charge charge
OUTPUT
voltage
A
B C D E
F G H
Fig-13 VCC pin Charge Operation
A :As VH pin voltage（8pin）is rising, VCC pin(6pin) is started to charge by VCC charge function.
B: VCC pin （6pin） voltage > VUVLO1、VCC UVLO function is released, VCC charge function is stopped, DC/DC operation start.
C: VCC pin (6pin) voltage is dropped for starting operation because OUTPUT voltage is low.
D: VCC pin （6pin） voltage < VCHG1 、VCC pin(6pin) voltage rises to operate charge function.
E: VCC pin （6pin） voltage > VCHG2 、VCC charge function stops.
F: VCC pin （6pin） voltage < VCHG1 、VCC pin (6pin) voltage rises to re-operate charge function.
G: VCC pin （6pin） voltage > VCHG2 、VCC charge function stops.
H: OUTPUT voltage is stable. Then, VCC pin (6pin) voltage is also stable for charging from the auxiliary winding to VCC
pin(6pin).
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( 4 ) DC/DC Driver
The IC operates PFM (Pulse Frequency Modulation) mode method.
By monitoring FB pin(2pin) and ZT pin (1pin), CS pin(3pin), the IC supply optimum system for DC/DC operation.
The IC controls ON width (Turn Off) of external MOSFET by FB pin (2pin) and CS pin (3pin). The IC controls OFF width (Turn
ON) of external MOSFET by ZT pin（1pin）. The detail is shown below.
(4-1) For QR-basic Operations
The QR basic block diagram and the basic operation are shown in Fig-14,15.
VOUT
VS
VH
CM
Va
Izt =(VH*Na)/(Np*Rzt1)
7
6
VCC
NOUT
+
-
12V Clamp
Circuit
ZT ACSNS Comp.
Ip
+
-
Rzt1
ZT
1
+
ZT OVP Comp.
(LATCH)
ZT
Comp.
TimeOut
15 usec
5 usec
AND
-
Czt
7V
Rzt2
1 shot
100mV
/200mV
ZT Blanking
OUT(H->L)
0.60us
OR
AND
SET
POUT
S Q
NOUT
FBOLP_OH
AND
AND
5 OUT
PRE
Driver
NOUT
30k
FB
OR
Max frequency
control
VREF(4V)
2
+
R
RESET
Burst
Comp.
VREF(4V)
OLP1
+
-
OLP2
+
Timer
(64ms)
1MΩ
FBOLP_OH
OSC
0.5V
Cfb
-
300kΩ
100kΩ
FB/4
0.50V
-
Soft Start
DCDC
Comp.
SS
0.5ms
SS SS
1ms 2ms
SS
4ms
+
CURRENT SENSE (V-V Change)
Normal : ×1.0
Leading Edge
Blanking
3
CS
RS
4
GND
Fig-14 DC/DC Operation Block
Tondelay
ZT
Bottom
Detect
SET
OUT
FB/4 or VCS
CS
RESET
Drain
Switching frequency
Ton
A
B C
D
E
Fig-15 QR Basic Operation
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For Fig-15
A: The internal oscillator outputs the SET signal, and turns ON the MOSFET.
At this time, the Drain - source capacitance of the MOSFET is discharged, so noise is generated to the CS pin.
This noise is called Leading Edge.
The filter for this noise is built in this IC. (It refer to (4-3))
Minimum pulse width of the IC is a 400ns (typ) by this filter and the delay time.
After that, current flows through the MOSFET, and Voltage Vcs = Rs * Ip is applied to the CS pin.
B: When CS pin voltage rises than FB pin voltage/Gain (typ = 4) or the overcurrent detection voltage Vcs,
RESET signal is output, OUT turns OFF
C: There is a delay time Tondelay from the point of B to turn OFF actually. Because of Tondelay the difference occurs in
the maximum power by the AC voltage. This IC has a built-in function to reduce this difference. (It refer to (4-4))
D: The energy stored in the transformer during Ton is discharged to the secondary side, and Free vibration of the Drain
voltage caused by the Cds (Drain - source capacitance) of MOSFET and Lp(transformer value) begins.
E: Since the switching frequency is determined by the IC.
SET signal is output from the internal oscillator and turn ON the MOSFET by process of certain time from A.
(4 -2) Determination of ON Width（Turn OFF）
ON width is controlled by FB (2pin), CS (3pin).
By comparison between FB pin voltage divided by AVcs (typ=4) and CS pin voltage, the IC decides ON width.
Besides, by comparison with Vlim1（typ =0.5V）voltage which is generated in IC, CS comparator level is changed lineally to be
shown in Fig-16(bottom). Maximum frequency also changes at this time.
CS (3pin) is shared with over current limiter circuit by pulse.
IC is changed over current limiter level and max frequency by FB (2pin) voltage.
・mode1 : Burst operation
・mode2 : Frequency reduction operation（reduce max frequency）
・mode3 : Max frequency operation (120kHz)
・mode4 : Over load operation（To detect over load state, IC is stopped switching）
Y
MAX Fsw[kHz]
mode1
mode2
mode3
mode4
120kHz
30kHz
0.0V
0.5V
1.25V
2.0V
2.8V
X
FB [V]
Y
CS Limiter[V]
mode1
mode2
mode3
mode4
Vlim1
Vlim2
0.0V
0.5V
1.25V
2.0V
2.8V
X
FB [V]
Fig-16 FB pin Voltage - Over Current Limiter, Max Frequency Characteristics
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The ON width of ”Ton” is decided by CS Limiter level “VCS”
.
Ton = (Lp*Vcs)/(Vin*RS)
Lp: primary inductance value、Vin :VH voltage in Fig-14,
RS: Sense resistor in Fig-14
To adjust over current limiter level, CS over current protection voltage is switched in soft-start, AC voltage.
Vlim1 and Vlim2 is changed below.
Table2 Over current protection voltage Detail
AC=100V
Soft start
AC=230V
Vlim1
Vlim2
Vlim1
Vlim2
start～0.5ms
0.063V ( 12%)
0.016V ( 3%)
0.044V (10%)
0.011V ( 2%)
0.5ms～1ms
0.125V ( 25%)
0.032V (6%)
0.088V (20%)
0.022V ( 4%)
1ms～2ms
0.250V ( 50%)
0.063V (12%)
0.175V (40%)
0.044V ( 9%)
2ms～4ms
0.375V ( 75%)
0.094V (19%)
0.263V (60%)
0.066V ( 13%)
4ms～
0.500V (100%)
0.125V (25%)
0.350V (70%)
0.087V (18%)
* ( percent) is shown comparative value with Vlim1（typ =0.5V）in normal operation.
The reason that distinguish between AC100V and AC230V is by CS over current protection voltage switch function which
is shown to（4-4）.
(4-3) LEB（Leading Edge Blanking） Function
When a MOSFET for switching is turned ON, surge current occurs in cause of capacitance or rush current.
Therefore, when CS (3pin) voltage rises temporarily, over current limiter circuit may miss detections.
To prevent miss detections, the IC build-in blanking function which mask for TLEB （typ=250ns） from switching OUT pin(5pin)
from L to H. This blanking function enables to reduce noise filter of CS pin(3pin).
However, when CS pin noise does not converge less than 250ns, need to attach RC filter to CS pin shown in Fig-17.
Then, delay time occurs to CS pin detection by RC filter.
Also, even if the filter in not attached, it is recommended that it is attached an Rcs resistor to CS pin as surge provision.
Rcs recommended resistor value is about 1kΩ.
VOUT
VS
VH
CM
12V Clamp
Circuit
1 shot
ZT
1
+
ZT
Comp.
TimeOut
15 usec
5 usec
AND
-
100mV
/200mV
ZT Blanking
OUT(H->L)
0.60us
OR
AND
SET
POUT
S Q
NOUT
FBOLP_OH
AND
AND
5 OUT
PRE
Driver
NOUT
30k
FB
OR
Max frequency
control
VREF(4V)
2
+
R
RESET
Burst
Comp.
VREF(4V)
OLP1
+
-
OLP2
+
Timer
(64ms)
1MΩ
FBOLP_OH
OSC
0.5V
Cfb
-
300kΩ
100kΩ
FB/4
0.50V
-
Soft Start
DCDC
Comp.
SS
0.5ms
SS SS
1ms 2ms
SS
4ms
+
CURRENT SENSE (V-V Change)
Normal : ×1.0
4
Leading Edge
Blanking
3
CS
Rcs
Ccs
GND
RS
Fig-17. CS pin surrounding circuit
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(4-4) CS Over Current Protection Switching Function
When input voltage（VH） is higher, ON time is short, and the operating frequency increases. As a result, maximum capable
power increases for constant over current limiter. For that, monitoring input voltage (VH), IC switches over current detection of
IC.
In case of high voltage（AC230V）, IC changes over current comparator level to ×0.7 multiple of normal level.
The detection method is that IC monitors ZT input current, then, IC switches it.
When MOSFET turns on, the voltage of “Va” has negative voltage to be affected input voltage (VH）.
Then, ZT (1pin) voltage is clamped near 0V by IC, ZT pin flows current to bias coil.
The calculation is below. And show block figure to Fig-18, show graph to Fig-19, Fig-20.
Izt ＝ （Va－Vzt）/Rzｔ1 ≒ Va/Rzｔ1 ＝ VH * Na/Np /Rzｔ1
Rzt1 ＝ Va/Izt
Please set ZT current” Izt” to select the resistor Rzt1. And set bottom detection timing to select Czt.
About ZT current, IC builds in ZT current hysteresis IZTHYS(typ=0.1mA) to prevent VH detection changing by input voltage.
VH
Va
Izt =(VH*Na)/(Np*Rzt1)
6
VCC
NOUT
+
-
12V Clamp
Circuit
ZT ACSNS Comp .
+
-
Rzt1
ZT
1
Czt
+
ZT OVP Comp .
( LATCH )
ZT
Comp.
-
TimeOut
15 usec
5 usec
AND
7V
Rzt 2
ZT Blanking
OUT (H-> L)
0. 60us
100mV
/200mV
1 shot
OR
POUT
AND
S Q
NOUT
FBOLP_ OH
AND
AND
5 OUT
PRE
Driver
NOUT
30k
FB
OR
Max frequency
control
VREF(4 V)
2
+
R
Burst
Comp.
VREF(4V)
0. 5V
Cfb
OLP1
+
-
OLP2
+
Timer
(64ms)
1MΩ
FBOLP_OH
C
S
O
-
300kΩ
100kΩ
FB/4 0. 50V -
Soft Start
DCDC
Comp.
SS
SS SS
0.5ms 1ms 2ms
SS
4ms
+
CURRENT SENSE (V -V Change)
Normal : ×1. 0
Leading Edge
Blanking
3
CS
RS
4
GND
Fig-18 CS Over Current Detection Switched ZT current block diagram
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Izt1.0mA
Vlim2
0.5V
Fig-19
2.0V
2.8V
X
FB [V]
FB pin Voltage vs CS pin Voltage Characteristics
0.9mA 1.0mA
X
Izt[mA]
Fig-20 Izt Current vs Switched CS Voltage Characteristics
ex) setting method （Switching between AC100V and AC220V ）
AC100V: 141V±28V（±20% margin）
AC220V: 308V±62V（±20% margin）
In above case, need to switch CS over current detection voltage from 169V to 246V.
For that, switching VH voltage from AC100V to AC220V may be selected in VH＝214V.
Setting Np=100, Na=15
Va=Vin*Na/Np = 214V*15/100 *(-1) = -32.1V
Rzc = Va/ IZT = -32.1V/-1mA = 32.1kΩ
Therefore, set to Rzt=32KΩ
(4-5) Determination of OFF Width（Turn on）
OFF width is controlled at the ZT pin. When OUT is Low, the power stored in the coil is supplied to the secondary-side output
capacitor. When this power supply ends, there is no more current flowing to the secondary side, so the drain voltage of
switching MOSFET drops. Consequently, the voltage on the auxiliary winding side also drops. A voltage that was
resistance-divided by Rzt1 and Rzt2 is applied to ZT pin. When this voltage level drops to V ZT1 (100 mV typ) or below, MOSFET
is turned ON by the ZT comparator. Since zero current status is detected at the ZT pin, time constants are generated using Czt,
Rzt1, and Rzt2.
However, since Rzt1 and Rzt2 setting is required in AC voltage compensation function and ZTOVP function, bottom time
adjustment is set in Czt capacitor.
OFF time is calculated below equation:
Toff1=Ls/(Vout+VF)*Is
(Toff1 : transformer discharge time、Ls : secondary inductance 、Vout : Secondary output、
VF：secondary diode forward voltage、Is：secondary peak current）
For that, switching frequency is calculated below:
switching frequency=1 / {transformer charge and discharge time(Ton+Toff1)+(bottom-1)×resonant time+(1/2×resonant time) }
resonant time
= 1 / (2×π×√(Lp×Cds))
＊Lp: primary inductance , MOSFET D-S capacitor : Cds
Because frequency reduction range in light load restricts shown Fig-16, bottom detection operates by the frequency which is
lower than max frequency function in Fig-16.
Additionally, a ZT trigger mask function (described in section 4-6) and a ZT timeout function (described in section 4-7) are built in
IC.
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(4-6) ZT Trigger Mask Function（Fig-22）
When switching is set from ON to OFF, superposition of noise may occur at the ZT pin.
Then, the ZT comparator and ZTOVP comparator are masked for the TZTMASK time to prevent ZT comparator operation errors.
ON
DC/DC
OFF
ON
OFF
ON
OUT
ZT
Tztmask
ZT mask
A
Tztmask
B C
Fig-21 ZT Trigger Mask Function
A: DC/DC OFF=>ON
B: DC/DC ON=>OFF then the surge noise occurs to ZT pin.
C: Since a noise occurs to ZT pin at B, IC masks ZT comparator and ZTOVP comparator detection for T ZTMASK time.
(4-7-1) ZT Timeout Function1 （Fig-23）
When ZT pin voltage is not higher than VZT2(typ=200mV) for TZTOUT1(typ=15us) such as start or low output voltage, ZT pin short,
IC turns on MOSFET by force.
(4-7-2) ZT Timeout Function2 （Fig-23）
After ZT comparator detects bottom, when IC does not detect next bottom within T ZTOUT2（typ =5us）, IC turns on MOSFET
by force. After ZT comparator detects bottom at once, the function operates. For that, it does not operate at start or at low output
voltage. When IC is not able to detect bottom by decreasing auxiliary winding voltage, the function operates.
ZT pin GND
short
VZT2
ZT VZT1
Bottom
detection
5us
5us
timeout
15us
timeout
5us
15us
15us
CS
OUT
A
B C
D
E
F
G
H
I
Fig-22 ZT Timeout Function
A:
B:
C:
D:
E:
F:
G:
H:
I:
When starting, IC starts to operate by ZT timeout function1 for ZT=0V.
MOSFET turns ON
MOSFET turns OFF
ZT voltage is lower than VZT2(typ=200mV) by ZT dump decreasing.
MOSFET turns ON by ZT timeout fucntion2 after TZT2(typ=5us) from D point.
ZT voltage is lower than VZT2(typ=200mV) by ZT dump decreasing.
MOSFET turns ON by ZT timeout fucntion2 after TZT2(typ=5us) from F point.
ZT pin is short to GND.
MOSFET turns ON by ZT timeout function1 after TZTOUT1(typ=15us)
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（5）Soft Start Sequence
Normally, when AC voltage is applied, a large current flows. Then secondary output voltage and current is occurred overshoot.
For preventing it, IC built in soft-start function.
When VCC pin(6pin) voltage is lower than VUVLO2 （typ =8.2V）, IC is reset. After that, when AC voltage is applied, IC operates
soft-start.
The soft start function is below: （ Please refer to (4-1) turn off item about CS limiter.）
・start ～ 0.5ms => Set CS limiter to 12.5% of normal operation.
・0.5ms～1ms
=> Set CS limiter to 25% of normal operation.
・1ms～2ms
=> Set CS limiter to 50% of normal operation.
・2ms～4ms
=> Set CS limiter to 75% of normal operation.
・4ms～
=> normal operation
（6）ZT pin (1pin) OVP (Over Voltage Protection)
IC build-in OVP function to ZT (1pin). It is latch type in BM1Q002, and none in BM1Q001.
ZTOVP operates by DC voltage detection and pulse detection for ZT pin.
[BM1Q002]
When ZT pin(1pin) voltage is over VZTL (typ=5.0V), IC starts to detect ZTOVP function.
For DC voltage detection, when the state which ZT voltage is larger than V ZTL (typ=5.0V) continues for 100us, IC carries out
latch stop.
To prevent ZT (1pin) OVP from miss-detecting by surge noise, IC builds in 3count and TLATCH（typ=100us） timer.
ZT (1pin) OVP function operates in all states (normal state and over load state and burst state).
For pulse detection, ZT (1pin) OVP operation starts detection after TZTMASK delay time from OUT:H→L.
When the pulse of ZT (1pin) voltage larger than V ZTL(typ=5.0V) is applied 3 count and for TLATCH（typ=100us）time, IC carries out
latch stop.
OUT
ZT
VZTL
ZT OVP
comparator
Tztmask
1
Tztmask
2
Tztmask
3
ZT OVP
detect
Tztmask
Tztmask
Tztmask
TLATCH(typ=100us)
Latch stop
A B
C
D
Fig-23 ZTOVP and Latch Blanking Function
A: When OUT (5pin) voltage is changed from H to L, ZT (1pin) voltage is up. Then, surge pulse occurs to ZT (1pin). For that,
because IC builds in Tztmask time (typ=0.6us), IC does not detect ZTOVP for Tztmask time.
B: After Tztmask time (typ=0.6us), ZT OVP detects over voltage.
C: When ZTOVP comparator counts 3 pulse, TLATCH timer (typ=100us) operates.
D: When it takes for 100us from C, IC detects ZT OVP and IC carries out latch stop.
It shows ZT OVP voltage setting method below. (auxiliary winding voltage : Va、ZT upper resistor : Rzt1、ZT lower resistor : Rzt2)
Secondary voltage : Vo、 transformer winding ratio(secondary / auxiliary) : Ns/Na、 ZT input current : IZT
The voltage which detects over voltage protection in secondary side : VOVP
VOVP = (Na/Ns)*Va = (Na/Ns) *{VZT*(Rzt1+Rzt2)/Rzt2+Rzt1*IZT}
When ZT voltage = 5.35V, ZT input current is calculated to IZT(max)=28uA、OVP maximum voltage is set below:
VOVP(max)=(Na/Ns)/｛5.35*(Rzt1+Rzt2)/Rzt2+Rzt2*28uA｝
Rzt1 setting is decided by AC voltage compensation function of (4-4).
Rzt2 setting is calculated below
Rzt2= Vztovp×Rzt1/{Vovp×(Na/Ns)-Izt×Rzt1-Vztovp}
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(7) CS (3pin) Open Protection
When CS （3pin） is OPEN, to prevent OUT pin from changing to H by noise, IC builds in CS(3pin) open protection.
When CS (3pin) is open, OUT (5pin) switching is stopped by the function. （This is auto-recovery）
VCCOVP
Timeout
Bottom det
OR
POUT
AND
S
Q
FBOLP_OH AND
5 OUT
PRE
Driver
NOUT
R
VREF(4V)
1MΩ
CURRENT SENSE
Leading
Edge
Blanking
(V-V Change)
Normal : ×1.0
3
CS
RS
Fig-24 CS Open Protection
(8) OUTPUT Over Load Protection（FB OLP comparator）
When secondary output is over load, IC detects it by FB (2pin), IC stops switching.
In OLP state, because secondary photo-coupler is not flown current, FB (2pin) voltage is up.
When the condition continues for TFOLP （typ =64ms）, IC judges over load state, OUT (5pin) is L fixed. After FB（2pin） voltage is
over VFOLP1A （typ =2.8V）, when FB (2pin) voltage is lower than VFOLP1B （typ =2.6V） within TFOLP （typ =64ms）, over load
protection timer is reset.
In starting, because FB (2pin) is pull-up by a resistor to internal voltage, FB (2pin) voltage starts to operate in the state which is
more than VFOLP1A （typ =2.8V）.
For that, please set stable time of secondary output voltage within T FOLP （typ =64ms）.
After detecting over load, IC is stopped for TOLPST （typ =512ms）,IC is auto-recovery operation.
In stopping switching, though VCC (6pin) voltage falls, but IC operates re-charge function by starter circuit, VCC (6pin) voltage
keeps VCC pin voltage > VUVLO2.
FB
VFOLP1A
VH charge
charge
charge
64ms
64ms
Switching
512ms
VUVLO1
VCHG2
VCC
512ms
VCHG1
VUVLO2
A
Fg-25
B
C D
E
F
G H
Over Load Protection : Auto-recovery
A: When FB voltage is over VFOLP1A(typ=2.8V), FBOLP comparator detects over load.
B: When the state A continues for TFOLP（typ=64ms）, IC stops switching by over load protection.
C: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC（6pin） voltage is lower than VCHG1,
VCC re-charge function operate, VCC (6pin) voltage is up.
D: When VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.
E: From B, it takes for TOLPST （typ =512ms）, IC starts switching with soft-start.
F: When over load state continues, FB (2pin) voltage is over VFOLP1A. When it takes for TFOLP（typ=64ms） from E, IC stops
switching.
G: During stopping switching by over load protection, VCC (6pin) voltage drops. When VCC（6pin） voltage is lower than VCHG1,
VCC re-charge function operate, VCC (6pin) voltage is up.
H: When VCC (6pin) voltage is higher than VCHG2 by re-charge function, VCC recharge function is stopped.
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BM1Q00XFJ Series
(9) OUT（5pin）Voltage Clamp Function
By the purpose which protects external MOSFET, H level of OUT （5pin） is clamped to VOUTH（typ=12.5V）
It prevents gate destruction of MOSFET by rising VCC （6pin） voltage. （It refers to Fig-23）
OUT （5pin） is pull-down RPDOUT(typ=100kΩ).
6
VCC
12V Clamp
Circuit
POUT
PRE
Driver
5
OUT
NOUT
3
CS
RS
Fig-26
OUT（5pin）Construction
●Operation Mode of Protection Circuit
Operation mode of protection functions are shown in table3.
Table3
Operation Mode of Protection Circuit
Protection Mode
項目
BM1Q001FJ
BM1Q002FJ
VCC Under Voltage Locked Out
Self-restart
Self-restart
VCC Over Voltage Protection
Self-restart (100us with timer)
Latch (100us with timer)
FB Over Load Protection
Self-restart(64ms delay, 512ms stop)
Self-restart(64ms delay, 512ms stop)
CS Open Protection
Self-restart
Self-restart
ZT Over Voltage Protection
None
Latch (100us with timer)
VCC Charge Protection
Self-restart
Self-restart
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● Power Dissipation
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 105℃ or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70 mm × 70 mm × 1.6 mm, mounted on glass epoxy substrate)
1
0.9
0.8
Pd[mW]
Pd
[W]
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
25
50
75
100
125
150
Ta [℃]
Fig-27
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SOP-J8 Thermal Abatement Characteristics
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Operational Notes – continued
11.
Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 40. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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●Ordering Information
B
M
1
Q
0
0
X
F
J
Package
SOP-J8
Product name
-
E2
Packaging and
forming specification
E2: Embossed tape and reel
●Marking Diagram
●Line Up
Product (BM1Q00XFJ)
BM1Q001FJ
BM1Q002FJ
1PIN MARK
1Q00X
LOT No.
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BM1Q00XFJ Series
●Physical Dimension Tape and Reel Information
Package Name
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SOP-J8
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BM1Q00XFJ Series
●Revision History
Date
Revision
2013.04.05
2014.03.07
2014.03.07
2014.03.07
2014.03.07
2015.06.17
001
002
002
002
002
003
2017.01.25
004
2020.12.28
005
Changes
New Release
Datasheet Format modified
P-17 calculation change：Resonant time = 1 / (2×π×(Lp×Cds) )
P-17 Delete Figure-27
Change Operational Notes
P-1,P-8,P-13 Modify transformer polarity in figure
P1 size of the package
P1 Operate temperature range
P2 Operate temperature range
P4 External Dimensions
P7 a value of Figure8
P13 a value of Figure14
P16 a value of Figure18
Updated packages and part numbers P27-2,P27-3
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●Ordering Information
B
M
1
Q
0
0
X
F
J
-
Package
SOP-J8A
Product name
ZE2
Packaging and
forming specification
Production site Z: Added
E2: Embossed tape and reel
●Marking Diagram
●Line Up
Product (BM1Q00XFJ)
BM1Q001FJ
BM1Q002FJ
1PIN MARK
1Q00X
LOT No.
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Physical Dimension and Packing Information
Package Name
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SOP-J8A
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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