Datasheet
AC/DC Converter IC
PWM Type DC/DC Converter IC
With Integrated Switching MOSFET
BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z
General Description
Key Specifications
The PWM Type DC/DC Converter for AC/DC provides an
optimal system for all products that include an electrical
outlet. This IC supports isolated power supply and
enables simpler designs of various low power
consumption electrical converters.
It realizes the high flexibility in power supply design
by incorporating a switching MOSFET and with external
current detection resistor.
This IC can make high efficiency power supply because it
has AC low voltage protection function and X capacitor
discharge function and operates frequency reduction,
minimum ON width adjustment and burst operation at
light load.
This IC has following various protection functions.
◼ Operating Power Supply Voltage Range
VCC Pin Voltage:
11 V to 60 V
VH Pin Voltage:
650 V (Max)
DRAIN Pin Voltage:
730 V (Max)
◼ Current at Switching Operation:
BM2P060MF-Z: 1400 μA (Typ)
BM2P061MF-Z: 1100 μA (Typ)
BM2P063MF-Z: 850 μA (Typ)
◼ Current at Burst Operation:
400 μA (Typ)
◼ Switching Frequency:
65 kHz (Typ)
◼ Operating Temperature Range:
-40 °C to +105 °C
MOSFET ON Resistor:
BM2P060MF-Z: 0.70 Ω (Typ)
BM2P061MF-Z: 1.00 Ω (Typ)
BM2P063MF-Z: 3.00 Ω (Typ)
Features
Package
AC Low Voltage Protection Function (AC UVLO)
X Capacitor Discharge Function
VCC Pin Low Voltage Protection (VCC UVLO)
PWM Type Current Mode Control
Frequency Reduction Function
Burst Operation at Light Load
Burst Voltage Setting Function
Minimum ON Width Adjustment at Light Load
Soft Start Function
FB Pin Overload Protection Function (FB OLP)
Over Current Protection Function by cycle
Over Current Detection Compensation Function by
AC Voltage Detection
◼ External Stop Function
◼ Dynamic Over Current Protection
◼ Leading Edge Blanking Function
SOP20A
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
◼
W (Typ) x D (Typ) x H (Max)
12.8 mm x 10.3 mm x 2.65 mm
Lineup
Product Name
BM2P060MF-Z
BM2P061MF-Z
BM2P063MF-Z
MOSFET ON
Resistor
0.70 Ω
1.00 Ω
3.00 Ω
Applications
AC Adapters, Each Household Applications and
Power Supplies for Motor
Typical Application Circuit
FUS E
FIL TER
SN UBB ER
DIO DE
BR IDG E
ER RO R
AM P
〇Product structure : Silicon integrated circuit
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〇This product has no designed protection against radioactive rays.
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Pin Configuration
(TOP VIEW)
20
19
18
17
16
15
14
13
12
11
VH
N.C.
GND
N.C.
SOURCE
N.C.
DRAIN
DRAIN
DRAIN
DRAIN
STOP
FB
BURST
OFF
VCC
N.C.
DRAIN
DRAIN
1
2
3
4
5
6
7
8
DRAIN
9
DRAIN
10
Pin Descriptions
ESD Diode
VCC
GND
No
Pin name
I/O
Function
1
STOP
I
External stop pin
-
○
2
FB
I/O
Feedback pin
-
○
3
BURST
I
Burst setting pin
-
○
4
OFF
I
MIN on setting pin
-
○
5
VCC
I/O
Power supply input pin
-
○
-
-
6
N.C.
7
DRAIN
8
DRAIN
9
DRAIN
10
DRAIN
11
DRAIN
12
DRAIN
13
DRAIN
14
DRAIN
15
16
-
No connection
(Note 1)
I/O
MOSFET
Drain pin
-
○
N.C.
-
No connection (Note 1)
-
-
SOURCE
I/O
MOSFET source pin
-
○
(Note 1)
-
-
○
-
-
-
-
○
17
N.C.
-
18
GND
I/O
19
N.C.
-
20
VH
I
No connection
GND pin
No connection
(Note 1)
AC voltage start-up pin
(Note 1) The N.C. pin must be open on the board. It means not to connect GND etc.
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Block Diagram
FUSE
AC
Input
Diode
Bridge
Filter
VH
VCC
DRAIN
Starter
X-Cap
Discharge
Internal
Reg
H voltage
clamp
+
AC voltage
Detection
Reg
VCC CHG
Reg
Internal Block
ROFF
Min ON
Setting
OFF
S
Q
Reg
DRIVER
R
FB
FBOLP
RFB
PWM Control
FBOLP
Timer
+
1/AVG
Dynamic
Over current
Protection
+
-
Pulse
counter
Min ON
Width
Reg
Current
Limiter
Burst
Comparator
Leading Edge
+
-
+
RBURST
Blanking
SOURCE
Burst
PWM
Comparator
Setting
BURST
Soft Start
-
AC detection
Compensation
+
Slope
Compensation
STOP
MAX
DUTY
OSC
Frequency
Reduction
Reg
RSTOP
+
Frequency
Hopping
GND
STOP
comparator
+
-
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Timer
STOP
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Description of Blocks
1
Start-up Circuit
This IC has a built-in start-up circuit. When the AC input voltage is applied, the VH pin is also applied the voltage.
Then the VCC pin voltage is charged by applied current to the VCC pin through the start-up circuit. This charge is
stopped after the VCC pin voltage rises and VCC UVLO is released.
2
AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function
AC UVLO:
At start-up, the voltage occurs at the VH pin when the AC input voltage is applied.
The VCC pin waits the detection of AC input voltage remaining applied voltage and IC switching
is stopped until the VH pin peak voltage becomes more than VINLVP while this IC charges the
VCC pin through the start-up circuit. IC does not work switching operate in AC UVLO operation.
When the VH pin peak voltage is more than VINLVP, AC UVLO function is released and IC works
switching operation.
After stopping AC input voltage supply, the VH pin peak voltage is VINLVP or less for tINLVP,
IC stops switching operation.
X Capacitor Discharge Function: When the status of the VH pin peak voltage is VINLVP or less continues for tINLVP and
the switching operation is stopped by AC UVLO function, X capacitor discharge
function starts to operate. Since the VH pin detects the voltage change, even if
the VH pin peak voltage is more than VINLVP, If the VH pin does not detect voltage
rising or falling for tINLVP, IC does not work switching operation.
FUSE
VH
VCC
IVCC
ISTART
Start-up
Circuit
UVLO
+
-
LOGIC
Recharge
+
-
Internal
BLOCK
MONITOR
+
-
Timer
tINLV P
LOGIC
X-capacitor
Discharge
Figure 1. Block Diagram of VH Pin and VCC Pin
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2
AC UVLO (Under Voltage Lockout), X Capacitor Discharge Function – continued
tINLVP
AC input voltage
VH pin voltage
VCC pin voltage
VUVLO1
VCHG2
VCHG1
VUVLO2
VCC pin current
ON
VCC UVLO
ON
Switching
ON
X capacitor
discharge function
ON
ON
ON
ON
VCC recharge
function
B
A
C
D E
F G
H
I
J
Figure 2. Timing Chart of X Capacitor Discharge Function
A:
B:
C:
D:
E:
F:
G:
H:
I:
J:
The AC input voltage is turned OFF.
After tINLVP from A, the switching operation stops. VCC capacitor is discharged because of the VCC pin voltage
more than VCHG1.
When the VCC pin voltage becomes less than VCHG1, the VCC recharge operation starts.
When the VCC pin voltage becomes more than VCHG2, the VCC recharge operation stops.
The Same as C.
The Same as D.
The Same as C.
The Same as D.
When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the
current supply to the VCC pin decreases and the VCC pin voltage continues to drop because of the low VH pin
voltage.
When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates.
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Description of Blocks – continued
VCC Pin Protection Function
This IC has VCC UVLO and VCC recharge function at the VCC pin.
3
3.1 VCC UVLO (Under Voltage Lockout)
This is an auto recovery comparator with a voltage hysteresis. When the VCC pin voltage becomes less than
VUVLO2, the IC stops the operation. And, when the VCC pin voltage becomes more than VUVLO1, the operation is
restarted.
3.2 VCC Recharge Function
If the VCC pin voltage drops to less than VCHG1 after once the VCC pin becomes more than VUVLO1 and the IC
starts to operate, the VCC recharge function operates. At this time, the VCC pin is recharged from the VH pin
through the start-up circuit. When the VCC pin voltage becomes more than VCHG2, this recharge is stopped.
VINLVP
VH pin voltage
AC UVLO
VUVLO1
VCHG2
VCC pin voltage
VCHG1
VUVLO2
VCC UVLO
VCC charge
VCC recharge
function
Switching
AB
C D
E
F
G
HI
J
Figure 3. Timing Chart of VCC UVLO and VCC Recharge Function
A:
B:
C:
D:
The VH pin is applied voltage and the VCC pin voltage rises.
When the VH pin voltage becomes more than VINLVP, AC UVLO is released.
When the VCC pin voltage becomes more than VUVLO1, the switching operation starts.
When the VCC pin voltage becomes less than VCHG1, the VCC pin is recharged from the VH pin by VCC recharge
function.
E: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function is stopped.
F: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates.
G: When the VCC pin voltage becomes more than VCHG2, the VCC recharge function stops. By the operation of F and
G, the VCC pin voltage is maintained constantly.
H: When the VCC pin voltage becomes less than VCHG1, the VCC recharge function operates. However, the current
supply to the VCC pin decreases and the VCC pin voltage continues to drop because the VH pin voltage dropped.
I: When the VCC pin voltage becomes less than VUVLO2, VCC UVLO operates.
J: The VH pin is applied voltage and the IC operation restarts.
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Description of Blocks – continued
4
DC/DC Driver Block
This IC performs a current mode PWM control and it has the following characteristics.
◼
◼
◼
◼
◼
◼
◼
The switching frequency operates in the range of fSW2 to fSW1 by an internal oscillator. It has a built-in frequency
hopping function and the fluctuation cycle is at random. It makes the EMI low by swaying the switching
frequency within ±6 %.
This IC controls the ON width by detecting the peak current using the SOURCE pin voltage correspond to the FB
pin voltage. The SOURCE pin voltage is restricted to 1/AVG of the FB pin voltage.
Maximum duty is fixed at DMAX.
In the current mode control, a sub-harmonic oscillation may occur when the duty cycle exceeds 50 %. As a
countermeasure, this IC has a built-in slope compensation circuit.
It has a built-in burst mode and frequency reduction circuit to achieve lower power consumption at light load.
The FB pin is pulled up to the internal power supply by R FB.
The FB pin voltage is changed by the secondary output power. This IC monitors this and changes a switching
operation status.
4.1 Transition of Switching Frequency by FB Pin Voltage
IC works burst operation which moves between mode a and mode b by repetition.
IC enables to set burst stop voltage at the BURST pin.
VBST* means VBST1 to VBST8 and it is able to select by the BURST pin.
Refer to the description of 4.6.3 about setting by AC voltage.
IC does not work switching operation when the FB pin voltage is less than burst stop voltage at light load.
After burst stop status, as the FB pin voltage is more than burst release voltage, IC rework switching operation.
IC switching frequency increases from fsw2 to fsw1 in proportion to the FB voltage at mode c.
mode a:
mode b:
mode c:
mode d:
Burst operation
(Operate intermittently)
Fix frequency operation
(Operate for fSW2)
Frequency modulated operation (Change switching frequency)
Fix frequency operation
(Operate for fSW1)
Switching Frequency
mode a
mode b
mode c
mode d
fSW1
fSW2
Switching
OFF
VBST*
VFBSW1
VFBSW2
FB pin
voltage
Figure 4. State Transition of Switching Frequency
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4
DC/DC Driver Block - continued
4.2 Transition of SOURCE Pin Voltage by FB Pin Voltage
This IC operates as shown below.
Over current detection protection voltage (VOCP) means from VOCP1 to VOCP8, the value is set by AC voltage.
The setting by AC voltage refers to 4.5.1.
VBST* means from VBST1 to VBST8, the value is set by the BURST pin voltage.
The setting by AC voltage refers to 4.6.3.
mode A:
mode B:
mode C:
Burst operation
Normal load operation
Overload operation
(The SOURCE pin voltage is changed by the FB pin voltage.)
(The SOURCE pin peak voltage is limited by VOCP.
When the status continues for tFBOLP1, IC is stopped by FB OLP.)
SOURCE Pin Voltage
mode A
mode B
mode C
VOCP
Switching
OFF
FB pin
voltage
VBST1/ VBST2
Figure 5. State Transition of SOURCE Pin Voltage by FB Pin Voltage
4.3 Soft Start Function
This function controls the over current protection voltage in order to prevent any excessive voltage or current
rising at start-up. This IC enables the soft start operation by changing the over current protection voltage with
time.
SOURCE pin voltage
SS1
SS2
VOCP
x 1.00
VOCP
x 0.60
VOCP
x 0.30
tSS2
tSS1
Time
[ms]
Figure 6. Soft Start Function
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4
DC/DC Driver Block - continued
4.4 FB Pin Overload Protection Function (FB OLP)
This IC is switched off when status that the FB pin voltage more than V FBOLP1 during tFBOLP1.
When the FB pin voltage is less than VFBOLP2 during tFBOLP1, the detection timer tFBOLP1 is released.
It restarts with soft start after fFBOLP2 when switching off.
Output Voltage
FB pin voltage
VFBOLP1
VFBOLP2
tFBOLP1
tFBOLP1
tFBOLP2
FB overload
detectecd
Switching
Figure 7. FB Overload Protection Function
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DC/DC Driver Block – continued
4
4.5 SOURCE Pin Protection Function
This IC has a built-in OCP for cycle and Dynamic OCP in the SOURCE pin.
Function
Table 1. Operation Status of SOURCE Pin Protection Functions
Load Status at Operation to Protect
Detection Voltage
Operation to Protect
OCP
Over the peak load
(Lowing the output voltage)
SOURCE pin peak voltage > VOCP
(VOCP: It is set from VOCP1
to VOCP8)
Turned off by pulse
Dynamic
OCP
SOURCE pin voltage is increased
for CCM operation
SOURCE pin peak voltage > VDOC
Operate at the time of the detection
in two continuations.
(VDOC: set by from VDOC1 to VDOC8)
Switching stop
for tDOC
4.5.1
Over Current Protection function (OCP)
This IC is built-in OCP function by switching cycle.
As the SOURCE pin peak voltage is more than VOCP1 to VOCP8, MOSFET is turned to OFF.
OCP is built-in AC voltage compensation function. IC detects the VH pin peak voltage, OCP voltage
is switched from VOCP1 to VOCP8 according to Table 2.
This function compensates the AC voltage dependency of overload protection power.
At this time, the maximum power has the characteristics shown in Figure 9.
Table 2. OCP voltage by AC voltage detection
VH peak Voltage[V]
OCP
Symbol
OCP[V]
(Typ)
to 85
VOCP1
0.680
85 to 127
VOCP2
0.670
127 to 170
VOCP3
0.640
170 to 212
VOCP4
0.615
212 to 255
VOCP5
0.600
255 to 297
VOCP6
0.590
297 to 339
VOCP7
0.580
339 to
VOCP8
0.570
0.680
150.0
145.0
Maximum Power [W]
0.660
OCP Voltage [V]
0.640
0.620
0.600
0.580
0.560
140.0
135.0
130.0
125.0
120.0
115.0
110.0
105.0
100.0
0
100
200
300
400
500
0
VH peak Voltage [V]
100
200
300
400
500
VH peak Voltage [V]
Figure 8. OCP Voltage vs VH peak Voltage
Figure 9.(Note 2) Example of Maximum Power
(Lp = 450 μH, Rs = 0.22 Ω)
(Note 2) Figure 9 is reference graph. It changes to depend on external condition.
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4.5 SOURCE pin protection function – continued
4.5.2
Dynamic over current protection function
This IC is built-in dynamic over current protection.
When the SOURCE pin voltage detects over VDOC voltage in continuous two pulses,
IC stops switching operation for tDOC.
2 counts
VDOC
1
2
SOURCE
tDOC
ON
ON
Switching
OFF
Figure 10. Dynamic OCP Timing Chart
4.5.3
Leading Edge Blanking
Normally, when the MOSFET for switching is turned to ON, surge current is generated at each
capacitor component and drive current and so on. At this time, detection errors may occur in the over
current protection function because the SOURCE pin voltage rises temporary. To prevent these
errors, Leading Edge Blanking function is built-in this IC. This function masks the SOURCE pin
voltage for tLEB from the switch of the Drain pin H to L.
4.6 Minimum ON width function
This IC is built-in minimum ON width function.
4.6.1
Minimum ON width switching function by FB pin pulse count of burst period
Normally, the minimum ON width of this IC is tMIN1. When the operation is burst operation at light load,
IC counts the number of switching from the start of switching after the burst stop is released to the
burst stop again. When switching number is 3 pulses or less IC operates low stand-by mode, and IC
switches minimum ON width. The switching of minimum ON width is decided from tMIN2 to tMIN4 to
correspond to the OFF pin resistor value. As minimum ON width is switched, the number of switching
is low. When it is low standby power mode, if the load is increased, the number of switching increases.
When the number of switching after the burst operation is stopped is 2 pulses or more, the low standby
power mode is switched to the normal mode. Then minimum ON width function is released, minimum
ON width is to tMIN1.
VCC
FB
VBST2
VBST1
DRAIN
State
NORMAL
A
B
NORMAL
Low Power
C
D
E F
G H
Figure 11. MIN ON Width Function
A:
B:
C:
D:
E:
F:
G:
H:
VCC voltage rises, and IC works switching operation.
When the FB pin voltage is less than VBST1, IC does not work switching operation by burst
function.
When the FB pin voltage is more than VBST2, IC works switching operation.
Because the number of switching is 3 times for one burst period, IC changes low standby mode.
And pulse width is increased after the next burst release.
Burst stop function is released, the minimum ON width increases.
Because the power of one switching increases, pulse number is reduced.
Because IC detects burst stop in the state of one switching number,
IC maintains low standby mode.
The burst stop is released, IC works switching operation.
Because IC detects second pulse in one burst period, IC changes from low standby mode
to normal mode.
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4.6
4.6.2
Minimum ON width function - continued
Minimum ON width switching function by OFF pin
Minimum ON width in burst operation is able to switch external resistor at the OFF pin.
IC detects the OFF pin resistor value at the timing of tSTSET2 from VCC UVLO released.
Then IC sets minimum ON width below.
When the OFF pin is connected to GND, MIN ON width is set to tMIN4, the number of switching pulse
increases by +1.
The function is reset when VCC UVLO is detected.
Table 3. MIN ON Setting Width
R1 (kΩ)
MIN ON width
OPEN
180
47
GND
tMIN2
tMIN3
tMIN4
tMIN4
Number of
Low Standby Mode
Switching Pulse
3
3
3
4
Number of
Normal Mode
Switching Pulse
1
1
1
2
Reg
ROFF
MIN ON width
Setting
R1
OFF
Figure 12. OFF Setting Circuit
4.6.3
BURST voltage switching function by BURST pin
Burst operation voltage is able to switch external resistor at the BURST pin.
IC sets the BURST voltage as follows by BURST pin voltage at the timing of tSTSET1 from VCC UVLO
released.
The function is reset when VCC UVLO is detected.
Table 4. BURST Voltage Setting
R2 (kΩ)
OPEN
180
47
GND
Burst Detection Voltage
Symbol
VBST1
VBST3
VBST5
VBST7
Burst Release Voltage
Symbol
VBST2
VBST4
VBST6
VBST8
Reg
RBURST
Burst voltage
Setting
R2
BURST
Figure 13. BURST Setting Circuit
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Description of Blocks – continued
5
External stop function by the STOP pin
This IC is switched off when status that the STOP pin voltage less than V STOP for tSTOP.
This IC incorporates a mask timer of tSTOP to prevent the false detection by the noise.
When the STOP pin voltage more than VSTOP, the switching is reopened.
The STOP pin is pulled up in the IC inside by RSTOP.
Example for use to the STOP pin
The STOP pin can perform outside stop.
Show a case stopping from the microcomputer of the secondary as an example in figure 14.
This is stopped by transmitting a signal from the microcomputer on the secondary side to the primary side with a
photocoupler.
RST OP
STOP
+
-
µ-CON
Figure 14. External Stop Circuit
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Operation Mode of Protection Functions
The operation modes of each protection function are shown in Table 5.
Table 5. Operation Modes of Protection Functions
AC UVLO
VCC UVLO
Dynamic OCP
Detection
Conditions
VH pin peak voltage ≤ VINLVP
VCC pin voltage < VUVLO2
(voltage drop)
SOURCE pin voltage
> VDOC
Release
Conditions
VH pin peak voltage > VINLVP
VCC pin voltage > VUVLO1
(voltage rise)
Release after past for tDOC
tINLVP
(VH pin peak voltage > VINLVP)
–
Detect continuous two pulses
Auto restart
Auto restart
STOP
FB OLP
TSD (Thermal Protection)
Detection
Conditions
STOP pin voltage < VSTOP
(Voltage drop)
FB pin voltage > VFBOLP1
(Voltage rise)
Tj > TTSD1
(Temperature rise)
Release
Conditions
STOP pin voltage > VSTOP
(Voltage rise)
Elapsed period by tFBOLP2
Tj < TTSD2
(Temperature drop)
tSTOP
(STOP pin voltage > VSTOP)
tFBOLP1
(FB pin voltage < VFBOLP2)
tTSD
(Tj < TTSD2)
Auto restart
Auto restart
Auto restart
Detection Timer
(Reset Conditions)
Auto restart
or
Latch
Detection Timer
(Reset Conditions)
Auto restart
or
Latch
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
-0.3 to +650
V
DRAIN
730
V
-0.3 to +6.5
V
DRAIN (tpulse < 10 μs) (Note 3)
SOURCE, FB, OFF, BURST,
STOP
VCC
Maximum Applied Voltage 1
VMAX1
Maximum Applied Voltage 2
VMAX2
Maximum Applied Voltage 3
VMAX3
-0.3 to +62.0
V
Maximum Applied Voltage 4
VMAX4
-0.3 to +650.0
V
Drain Current 1 (Pulse)
IDP1
21
A
Drain Current 2 (Pulse)
IDP2
12
A
Drain Current 3 (Pulse)
IDP3
4
A
Power Dissipation
Pd
2.30
W
Tjmax
150
°C
Tstg
-55 to +150
°C
Maximum Junction Temperature
Storage Temperature Range
Condition
VH
Pw = 10 µs, Duty cycle = 1 %
(BM2P060MF-Z)
Pw = 10 µs, Duty cycle = 1 %
(BM2P061MF-Z)
Pw = 10 µs, Duty cycle = 1 %
(BM2P063MF-Z)
(Note 4)
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with power dissipation taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 3) Duty is less than 1 %
(Note 4) When IC mounted singly. Derate by 18.3 mW / °C if the IC is used in the ambient temperature 25 °C or more.
Thermal Dissipation
Make the thermal design so that the IC operates in the following conditions.
(Because the following temperature is guarantee value, it is necessary to consider margin.)
1. The ambient temperature Ta must be 105 °C or less.
2. The IC’s loss must be the power dissipation Pd or less.
The thermal abatement characteristic is as follows.
(At mounting singly)
2.50
Pd [W]
2.00
1.50
1.00
0.50
0.00
0
25
50
75
100
125
150
Ta [℃ ]
Figure 15. SOP20A Thermal Dissipation Characteristic
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating VCC Pin Voltage Range
VCC
11
-
V
VH Pin Range at AC Voltage
VH
-
-
60
300
VCC Pin Capacitor
CVCC
4.7
-
-
µF
VH Pin Resistor
RVH
-
-
4.7
kΩ
Operating Temperature
Topr
-40
-
+105
°C
(Note 5)
V
(Note 5) The recommendation maximum operating voltage shows AC 300 V which is the input AC voltage in the application.
Apply the input AC voltage which is full-wave-rectified to the VH pin.
Electrical Characteristics in MOSFET Part (Unless otherwise specified Tj = 25 °C, VCC = 15 V)
Parameter
Symbol
Min
Typ
Max
Unit
650
-
-
V
730
-
-
V
Conditions
Drain Voltage
VDS
DRAIN Pin Leak Current
IDSS
-
-
100
μA
ID = 1 mA, VGS = 0 V
ID = 1 mA, VGS = 0 V
tpulse < 10 μs(Note 6)
VDS = 650 V, VGS = 0 V
ON Resistor 1
RDS(ON)1
-
0.70
0.86
Ω
BM2P060MF-Z
ON Resistor 2
RDS(ON)2
-
1.00
1.35
Ω
BM2P061MF-Z
ON Resistor 3
RDS(ON)3
-
3.00
4.00
Ω
BM2P063MF-Z
(Note 6) Duty is less than 1 %.
Electrical Characteristics in Start Up VH Part (Unless otherwise specified Tj = 25 °C, VCC = 15 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Start-up Current
ISTART1
8
15
25
mA
VH = 100 V, VCC = 10 V
VH Pin OFF Current
ISTART2
5
12
20
μA
VH = 100 V, VCC = 15 V
AC UVLO Detection Voltage
VINLVP
75
85
95
V
Discharge ON Delay Timer
tINLVP
105
150
195
ms
Electrical Characteristics in Control IC Part (Unless otherwise specified Tj = -40 °C to +105 °C, VCC = 15 V)
Parameter
Symbol
Min
Typ
Max
Unit
Current at Switching Operation 1A
ION1A
900
1400
2000
μA
Current at Switching Operation 1B
ION1B
500
1100
1700
μA
Current at Switching Operation 1C
ION1C
300
850
1450
μA
Current at Burst Operation
ION2
250
400
550
μA
BM2P060MF-Z,
FB = 3.0 V (Note 7)
BM2P061MF-Z,
FB = 3.0 V (Note 7)
BM2P063MF-Z,
FB = 3.0 V (Note 7)
FB = 0.2 V (Note 7)
Current at STOP
ISTOP
70
150
230
μA
Stop by the STOP pin (Note 7)
VCC UVLO Release Voltage
VUVLO1
13.0
14.0
15.0
V
VCC rising (Note 7)
VCC UVLO Detection Voltage
VUVLO2
8.2
9.0
9.8
V
VCC UVLO Hysteresis
VUVLO3
-
5.0
-
V
VCC falling (Note 7)
VUVLO3 = VUVLO1 - VUVLO2
VCC Recharge Start Voltage
VCHG1
9
10
11
V
(Note 7)
VCC Recharge Stop Voltage
VCHG2
11
12
13
V
(Note 7)
TSD Temperature 1
TTSD1
150
-
-
°C
TSD Temperature 2
TTSD2
-
TTSD1 -25
-
°C
tTSD
-
100
-
μs
TSD Timer
Conditions
(Note 7)
(Note 7) Tj = 25 °C guaranteed.
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Electrical Characteristics – continued (Unless otherwise specified, Tj = -40 °C to +105 °C, VCC = 15 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Switching Frequency 1
fSW1
60
65
70
kHz
Switching Frequency 2
fSW2
20
25
30
kHz
Frequency Hopping Width
fDEL
-
4
-
kHz
Voltage Gain (FB/SOURCE)
AVG
-
5
-
V/V
Maximum Duty
DMAX
67
75
83
%
(Note 7)
FB Pin Burst Voltage 1
VBST1
0.20
0.25
0.30
V
FB Falling
FB Pin Burst Voltage 2
VBST2
-
0.28
-
V
FB Rising
FB Pin Burst Voltage 3
VBST3
0.25
0.30
0.35
V
FB Falling
FB Pin Burst Voltage 4
VBST4
-
0.33
-
V
FB Rising
FB Pin Burst Voltage 5
VBST5
0.30
0.35
0.40
V
FB Falling
FB Pin Burst Voltage 6
VBST6
-
0.40
-
V
FB Rising
FB Pin Burst Voltage 7
VBST7
0.40
0.45
0.50
V
FB Falling
FB Pin Burst Voltage 8
Frequency Reduction Start FB Pin
Voltage
Frequency Reduction End FB Pin
Voltage
Leading Edge Blanking Time
VBST8
-
0.50
-
V
FB Rising
VFBSW1
0.75
0.90
1.05
V
(Note 7)
VFBSW2
1.15
1.30
1.45
V
(Note 7)
tLEB
-
0.25
-
µs
RSOCE
1.4
2.0
2.6
MΩ
FB Pin Pull up Resistor
RFB
24
30
36
kΩ
(Note 7)
Minimum ON Width 1
tMIN1
-
0.50
-
µs
Normal
Minimum ON Width 2
tMIN2
1.30
1.50
1.70
µs
OFF: OPEN (Note 7)
Minimum ON Width 3
tMIN3
1.55
1.70
1.85
µs
OFF: 180 kΩ (Note 7)
Minimum ON Width 4
tMIN4
1.70
1.90
2.10
µs
OFF: or less 47 kΩ (Note 7)
DC/DC Driver Block
SOURCE Pin Pull up Resistor
(Note 7)
FB = 3.0 V
During normal operation
(Note 7)
DC/DC Driver Block (SOURCE Pin Over Current Protection Function)
SOURCE Pin OCP Voltage 1
VOCP1
0.645
0.680
0.715
V
VH peak < 85 V
SOURCE Pin OCP Voltage 2
VOCP2
0.635
0.670
0.705
V
85 V < VH peak < 127 V
SOURCE Pin OCP Voltage 3
VOCP3
0.605
0.640
0.675
V
127 V < VH peak < 170 V
SOURCE Pin OCP Voltage 4
VOCP4
0.580
0.615
0.640
V
170 V < VH peak < 212 V
SOURCE Pin OCP Voltage 5
VOCP5
0.565
0.600
0.635
V
212 V < VH peak < 255 V
SOURCE Pin OCP Voltage 6
VOCP6
0.555
0.590
0.625
V
255 V < VH peak < 297 V
SOURCE Pin OCP Voltage 7
VOCP7
0.545
0.580
0.615
V
297 V < VH peak < 339 V
SOURCE Pin OCP Voltage 8
VOCP8
0.535
0.570
0.605
V
VH peak > 339 V
SOURCE Pin Dynamic OCP Voltage 1
VDOC1
0.934
1.005
1.076
V
VH peak < 85 V
SOURCE Pin Dynamic OCP Voltage 2
VDOC2
0.920
0.990
1.060
V
85 V < VH peak < 127 V
SOURCE Pin Dynamic OCP Voltage 3
VDOC3
0.886
0.953
1.020
V
127 V < VH peak < 170 V
SOURCE Pin Dynamic OCP Voltage 4
VDOC4
0.858
0.923
0.988
V
170 V < VH peak < 212 V
SOURCE Pin Dynamic OCP Voltage 5
VDOC5
0.837
0.900
0.963
V
212 V < VH peak < 255 V
SOURCE Pin Dynamic OCP Voltage 6
VDOC6
0.823
0.885
0.947
V
255 V < VH peak < 297 V
SOURCE Pin Dynamic OCP Voltage 7
VDOC7
0.809
0.870
0.931
V
297 V < VH peak < 339 V
SOURCE Pin Dynamic OCP Voltage 8
VDOC8
0.795
0.855
0.915
V
VH peak > 339 V
tDOC
100
160
220
µs
SOURCE Pin Dynamic OCP
Stop Timer
(Note 7)
(Note 7) Tj = 25 °C guaranteed.
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Electrical Characteristics – continued (Unless otherwise specified Tj = -40 °C to +105 °C, VCC = 15 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
DC/DC Driver Block (Soft Start Function)
Soft Start Timer 1
tSS1
1.79
2.56
3.33
ms
Soft Start Timer 2
tSS2
7.17
10.24
13.31
ms
DC/DC Driver Block (FB Pin Overload Protection Function)
FB OLP Detection Voltage
VFBOLP1
3.9
4.2
4.5
V
FB OLP Release Voltage
VFBOLP2
-
4.0
-
V
FB OLP Detection Timer
tFBOLP1
60
82
104
ms
(Note 7)
FB OLP STOP Timer
tFBOLP2
484
656
828
ms
(Note 7)
External Stop Function by the STOP Pin
STOP Pin by Stop Voltage
VSTOP
0.4
0.5
0.6
V
STOP Pin Pull up Resistor
RSTOP
19.4
25.9
32.3
kΩ
(Note 7)
STOP Detection Timer
tSTOP
75
150
250
µs
(Note 7)
RBURST
150
200
250
kΩ
(Note 7)
tSTSET1
160
320
480
µs
(Note 7)
ROFF
150
200
250
kΩ
(Note 7)
tSTSET2
160
320
480
µs
(Note 7)
BURST Pin Setting Block
BURST Pin Pull up Resistor
BURST Pin External Resistor Detection
Timer in Start-up
OFF Pin Setting Block
OFF Pin Pull up Resistor
OFF Pin External Resistor Detection
Timer in Start-up
(Note 7) Tj = 25 °C guaranteed.
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Application Examples
Show a flyback circuitry example in Figure 16.
Be careful that when the DRAIN voltage turn off it is occur high voltage with ringing.
With this IC, it become able to operate to 730 V.
FUS E
FIL TER
SN UBB ER
DIO DE
BR IDG E
ER RO R
AM P
Figure 16. Flyback Application Diagram
730 V
650 V
DRAIN
0V
tpulse < 10 μs (Duty < 1 %)
Figure 17. DRAIN pin Ringing Waveform
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BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z
2000
Current at Burst operation:
ION2 [μA]
Current at Switching Operation 1A:
ION1A [μA]
Typical Performance Curves
1800
1600
1400
1200
1000
550
475
400
325
250
800
-40 -20
0
20
40
60
80
-40 -20
100
0
20
40
60
80
100
Temperature[℃]
Temperature[℃]
Figure 18. Current at Switching Operation 1A vs Temperature
Figure 19. Current at Burst Operation vs Temperature
72
Switching Frequency 1:
fSW1 [kHz]
Current at STOP:
ISTOP [μA]
230
190
150
110
70
68
66
64
62
60
58
70
-40 -20
0
20 40 60
Temperature[℃]
80 100
0
20
40
60
80 100
Temperature[℃]
Figure 20. Current at STOP vs Temperature
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Figure 21. Switching Frequency 1 vs Temperature
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15.0
VCC UVLO Detection Voltage:
VUVLO2 [V]
9.8
14.5
VUVLO1 [V]
VCC UVLO Release Voltage:
Typical Performance Curves – continued
14.0
13.5
13.0
-40 -20
0
20
40
60
80
9.4
9.0
8.6
8.2
100
-40 -20
0
Temperature[℃]
11.0
10.5
10.0
9.5
9.0
0
20
40
60
80
100
60
80
100
13.0
12.5
12.0
11.5
11.0
-40 -20
0
20
40
60
80
100
Temperature[℃]
Temperature[℃]
Figure 24. VCC Recharge Start Voltage vs Temperature
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40
Figure 23. VCC UVLO Detection Voltage vs Temperature
VCC Recharge Stop Voltage:
VCHG2 [V]
VCC Recharge Start Voltage:
VCHG1 [V]
Figure 22. VCC UVLO Release Voltage vs Temperature
-40 -20
20
Temperature[℃]
21/28
Figure 25. VCC Recharge Stop Voltage vs Temperature
TSZ02201-0F1F0A200840-1-2
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BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z
0.64
36
FB Pin Pull up Resistor:
RFB [kΩ]
SOURCE Pin OCP Voltage 5:
VOCP5 [V]
Typical Performance Curves – continued
0.62
0.60
0.58
0.56
30
27
24
-40 -20
0
20 40 60
Temperature[℃]
80
100
-40 -20
0
20 40 60
Temperature[℃]
80
100
Figure 27. FB Pin Pull up Resistor vs Temperature
Figure 26. SOURCE Pin OCP Voltage 5 vs Temperature
0.40
104
FB OLP Detection Timer:
tFBOLP1 [ms]
FB Pin Burst Voltage 5:
VBST5 [V]
33
0.38
0.36
0.34
0.32
0.30
93
82
71
60
-40 -20
0
20
40
60
80
100
0
20
40
60
80 100
Temperature[℃]
Temperature[℃]
Figure 28. FB Pin Burst Voltage 5 vs Temperature
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Figure 29. FB OLP Detection Timer vs Temperature
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I/O Equivalence Circuit
STOP
1
2
FB
Internal
Reg
Internal
Reg
STOP
FB
GND
GND
VCC
5
6
N.C .
BURST
3
Internal
Reg
Internal
Reg
BURST
OFF
GND
GND
DRAIN
7
OFF
4
8
DRAIN
DRAIN
DRAIN
VCC
GND
9
DRAIN
10
DRAIN
DRAIN
13
SOURCE
SOURCE
GND
GND
DRAIN
11
DRAIN
12
DRAIN
DRAIN
DRAIN
SOURCE
SOURCE
SOURCE
SOURCE
GND
GND
GND
GND
DRAIN
14
DRAIN
N.C .
15
16
DRAIN
DRAIN
SOURCE
Internal
Reg
MOSFET
DRAIN
SOURCE
SOURCE
GND
GND
N.C .
17
GND
18
SOURCE
GND
N.C .
19
20
VH
VH
GND
-
-
Internal
Circuit
GND
(Note) The N.C pin must be open on the board. It means not to connect GND etc.
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Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signal ground caused by large currents. Also ensure that the ground traces of external components do not
cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line
impedance.
5.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the
electrical characteristics.
6.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions
during transport and storage.
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result
in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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Operational Notes – continued
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
GND
GND
N Region
close-by
Figure 30. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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21.Apr.2021 Rev.001
BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z
Ordering Information
B
M
2
P
0
6
x
M
MOSFET Ron
0: 0.70 Ω
1: 1.00 Ω
3: 3.00 Ω
F
Package
SOP20A
-
ZE2
Packaging and forming
specification
E2: Embossed tape and reel
Lineup
Part Number Marking
BM2P060MF
BM2P061MF
BM2P063MF
MOSFET Ron
0.70 Ω
1.00 Ω
3.00 Ω
Package
SOP20A
Orderable Part Number
BM2P060MF-ZE2
BM2P061MF-ZE2
BM2P063MF-ZE2
Marking Diagram
SOP20A (TOP VIEW)
Part Number Marking
LOT Number
Pin 1 Mark
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BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z
Physical Dimension and Packing Information
Package Name
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SOP20A
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BM2P060MF-Z BM2P061MF-Z BM2P063MF-Z
Revision History
Date
Revision
21.Apr.2021
001
Changes
New Release
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Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3.
The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
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