BALF-112X-01D3

BALF-112X-01D3 50 ohm nominal input / conjugate match balun CC1120, CC1125 (868-928 MHz), with integrated harmonic filter Datasheet - production data Description STMicroelectronics' BALF-112X-01D3 is an ultra-miniature balun, integrating both matching network and harmonics filter. Matching impedance has been customized for the CC1120, CC1125, CC1175 and CC1200 transceivers from Texas Instruments. The device uses STMicroelectronics' IPD technology on a non-conductive glass substrate, which optimizes RF performance. Flip-Chip (8 bumps) package Figure 1: Application schematic Features Applications  868 MHz and 928 MHz impedance-matched balun filter optimized for Texas Instruments® CC1120, CC1125, CC1175, CC1200 sub-GHz RFICs. February 2017 Vdd Vdd 25 DCPL_PFD_CHIP AVDD_PFD_CHIP Vdd 28 27 AVDD_SYNTH2 29 CDPL_XOSC AVDD_XOSC 31 30 Vdd 22 Vdd 21 Antenna (50Ω) 20 19 BALF -112X -01D3 18 17 NC NC PA 23 C10 L11 16 16 15 15 AV DD_RF AVDD_RF TRX_SW RBIAS RBIAS SCLK 24 C44 R13 Vdd MCU connection SPI interface and optional gpio pins C10 is a DC block capacitor: 0402/100 pF/50 V DocID029407 Rev 2 This is information on a product in full production. SI 14 14 Very low profile (< 670 μm thickness) High RF performance RF BOM and size reduction LNA_N LNA_P Vdd    DCPL_VCO DCPL 9 9 Benefits DVDD AV DD_IF AVDD_IF 8 Texas CC112X GPIO2 DVDD DVDD 7 AVDD_SYNTH1 13 13 6 GPIO3 Vdd 5 LPF1 LPF0 CSn CSn Vdd RESET_N 12 12 4 VDD_GUARD 11 11 3 XOSC_Q1 32 2 EXT_XOSC 1 GPIO0 GPIO0 Vdd XOSC_Q2 (Optional control pin from CC1121) 26 XOSC/ TCXO SO (GPIO1) SO (GPIO1)     50 Ω nominal input / conjugate match to CC1120, CC1125 Low insertion loss Low amplitude imbalance Low phase imbalance Small footprint 10 10  Optional 1/10 www.st.com Characteristics 1 BALF-112X-01D3 Characteristics Table 1: Absolute maximum ratings (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Max. - 20 Input power RFIN VESD TOP ESD ratings MIL STD883C (HBM: C = 100 pF, R = 1.5 Ω, air discharge) 500 ESD ratings machine model (MM: C = 200 pF, R = 25 W, L = 500 nH) 250 - Operating temperature -40 - dBm V +85 °C Table 2: Electrical characteristics and RF performance (Tamb = 25 °C) RX balun Symbol Parameter ZRX Nominal differential impedance ZANT Antenna impedance f S21RX-ANT Frequency range (bandwidth) Insertion loss in bandwidth Input return loss in bandwidth S11ANT 2/10 Test condition Value Unit Min. Typ. Max. Match to CC112X Ω 50 Ω 866 928 at 868 MHz -2.3 -1.9 at 928 MHz -2.8 -2.4 MHz dB at 868 MHz -22 -20 at 928 MHz -11 -9 dB Phase_imbal Output phase imbalance -10 -2.9 10 ° Ampl_imbal Output amplitude imbalance -1 -0.3 1 dB DocID029407 Rev 2 BALF-112X-01D3 Characteristics Table 3: Electrical characteristics and RF performance (Tamb = 25 °C) TX filter Value Symbol Parameter Test condition Unit Min. ZTX Nominal TX impedance ZANT Antenna impedance f S21TX-ANT S11ANT Att Frequency range (bandwidth) Insertion loss in bandwidth Input return loss in bandwidth Harmonic levels Typ. Max. Match to CC112X Ω 50 Ω 866 928 at 868 MHz -2.3 -1.9 at 928 MHz -2.7 -2.3 dB at 868 MHz -8 -6 at 928 MHz -7 -5 Attenuation at 2 fo -43 -41 Attenuation at 3 fo -50 -46 Attenuation at 4 fo -43 -40 Attenuation at 5 fo -39 -37 Attenuation at 6 fo -35 -33 Attenuation at 7 fo -19 -17 DocID029407 Rev 2 MHz dB dBm 3/10 Characteristics 1.1 BALF-112X-01D3 RF measurement Figure 2: Insertion loss (RX balun) Figure 3: Return loss antenna (RX balun) IL_RX(dB) 0 RL_antenna_RX(dB) 0 -1 -5 -2 -10 -3 -15 -4 -20 f (MHz) -5 f (MHz) -25 870 860 880 890 900 910 930 920 860 Figure 4: Amplitude imbalance (RX balun) 880 890 900 910 930 920 Figure 5: Phase imbalance (RX balun) Amplitude_lmb (dB) 1.0 870 Phase_lmb (deg) 15 10 0.5 5 0 0.0 -5 -0.5 -10 f (MHz) f (MHz) -1.0 -15 860 860 870 880 890 900 910 920 Figure 6: TX filter transmission 0.0 870 880 890 900 910 930 920 930 Figure 7: Insertion loss (TX filter) IL_TX(dB) Transmit_TX(dB) -0.0 -10 -0.5 -20 -1.0 -30 -1.5 -40 -2.0 -50 -2.5 f (MHz) f (MHz) -60 -3.0 0 4/10 1000 2000 3000 4000 5000 6000 7000 DocID029407 Rev 2 860 870 880 890 900 910 920 930 BALF-112X-01D3 Characteristics Figure 8: fo attenuation (TX filter) Figure 9: Return Loss antenna (TX filter) Transmit_TX(dB) 0 0 -10 RL_antenna_TX(dB) -5 -20 -10 -30 -15 -40 -20 -50 f (MHz) f (MHz) -60 -25 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 6500 7000 DocID029407 Rev 2 860 870 880 890 900 910 920 5/10 930 Package information 2 BALF-112X-01D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 Flip-Chip CSPG 0.4 package information Figure 10: Flip-Chip CSPG 0.4 package outline Bottom view (balls up) Top view (balls down) A2 C1 C1 C2 B1 LOGO + ECOPAK2 symbol 1st line ZZ = Part Number X = assembly site nd 2 line Y = year of production WW = Week of production B1 B3 B2 G B3 Dot indicates Ball #A1 A1 E1 Z Y Z W X W B2 B3 B1 B1 C1 C3 C4 C1 D1 D3 D2 Table 4: Flip-Chip CSPG 0.4 mechanical data Dimensions Frequency A1 A2 B1 B2 B3 C1 C2 C3 C4 D1 D2 D3 E1 BAL-112X-01D3 868 MHz 1950 1450 225 750 500 223 1004 400 604 425 205 630 255 6/10 DocID029407 Rev 2 BALF-112X-01D3 Package information Figure 11: Footprint -non solder mask defined Figure 12: Footprint - solder mask defined Figure 13: Ball assignment DocID029407 Rev 2 7/10 Package information BALF-112X-01D3 Table 5: Flip-Chip CSPG 0.4 ball description 2.2 Ball Name Designation A1 GND Ground A3 LNA- Connect to LNA_N B3 LNA+ Connect to LNA_P C1 ANT Connect to antenna D3 TRX_SW Connect to TRX switch E1 GND Ground E2 PA_C Connect to PA output thru C10 E3 PA_OUT Connect to PA Flip-chip 8 bumps packing information Figure 14: Flip-chip 8 bumps tape outline 8/10 DocID029407 Rev 2 BALF-112X-01D3 3 Ordering information Ordering information Table 6: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode BALF-112X-01D3 TF CSPG 3.02 mg 5000 Tape and reel Revision history Table 7: Document revision history Date Revision Changes 04-Jul-2016 1 First issue. 20-Feb-2017 2 Updated Front page. DocID029407 Rev 2 9/10 BALF-112X-01D3 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 10/10 DocID029407 Rev 2