L6210

L6210 Dual Schottky diode bridge Features ■ ■ ■ ■ ■ ■ Monolithic array of eight Schottky diodes High efficiency 4 A peak current Low forward voltage Fast recovery Time two separated diode bridges Description The L6210 is a monolithic IC containing eight Schottky diodes arranged as two separated diode bridges. This diodes connection makes this device versatile in many applications. They are used particular in bipolar stepper motor applications, where high efficient operation, due to low forward voltage drop and fast reverse recovery time, are required. Table 1. Device summary Order code E-L6210 Package PDIP 16 Packing Tube PDIP 16 The L6210 is available in a 16 pin powerdip package (12 + 2 + 2) designed for the 0 to 70°C ambient temperature range. April 2008 Rev 2 1/8 www.st.com 8 Contents L6210 Contents 1 2 Block and pin connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 2.2 2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3 4 5 Mounting instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2/8 L6210 Block and pin connection diagram 1 Block and pin connection diagram Figure 1. Block diagram Figure 2. Pin connection (top view) 3/8 Electrical specifications L6210 2 2.1 Electrical specifications Absolute maximum ratings Table 2. Symbol IF VR TAMB TSTG Absolute maximum ratings Parameter Repetitive Forward Current Peak Peak Reverse Voltage (per diode) Operating Ambient Temperature Storage Temperature Range Value 2 50 70 –55 to +150 Unit A V °C °C 2.2 Thermal data Table 3. Symbol RTH J-CASE RTH J-AMB Thermal data Parameter Thermal Impedance Junction-case Thermal Impedance Junction-ambient without External Heatsink Min. Typ. Max. 14 65 Unit °C/W °C/W 2.3 Electrical characteristics Table 4. Symbol Electrical characteristics (TJ = 25°C unless otherwise specified) Parameter Test conditions IF = 100 mA Min. Typ. 0.65 0.8 1 Max. 0.8 1 1.2 1 Unit V V V mA VF Forward Voltage Drop IF = 500 mA IF = 1 A IL Leakage Current VR = 40 V, TAMB = 25 °C Note: At forward currents of greater than 1 A, a parasitic current of approximately 10 mA may be collected by adiacent diodes. 4/8 L6210 Mounting instructions 3 Mounting instructions The Rth j-amb of the L6210 can be reduced by soldering the GND pins to suitable copper area of the printed circuit boards as shown in Figure 3 or to an external heatsink (Figure 4). During soldering the pin temperature must not exceed 260°C and the soldering time must not be longer then 12 s. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 3. Example of PC board copper area which is used as heatsink Figure 4. Example of an external heatsink 5/8 Package information L6210 4 Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. PDIP 16 mechanical data and package dimensions mm DIM. MIN. A A1 A2 b b2 c D(*) E E1(*) e e1 eA eB L 2.920 3.300 0.380 2.920 0.360 1.140 0.200 3.300 0.460 1.520 0.250 TYP. MAX. 5.330 0.0150 4.950 0.1150 0.1299 0.1949 0.560 0.0142 0.0181 0.0220 1.780 0.0449 0.0598 0.0701 0.360 0.0079 0.0098 0.0142 MIN. TYP. MAX. 0.2098 inch OUTLINE AND MECHANICAL DATA 18.670 19.180 19.690 0.7350 0.7551 0.7752 7.620 6.100 7.870 6.350 2.540 17.780 7.620 10.920 8.260 0.3000 0.3098 0.3252 7.110 0.2402 0.2500 0.2799 0.1000 0.7000 0.3000 0.4299 3.810 0.1150 0.1299 0.1500 PDIP 16 (*)“D” and “E1” dimensions do not include mold flash or protusions. Mold flash or protusions shall not exceed 0.25mm. 0015895_E 0015895 E 6/8 L6210 Revision history 5 Revision history Table 5. Date 31-Jul-2003 23-Apr-2008 Document revision history Revision 1 2 Initial release. Package information updated. Changes 7/8 L6210 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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