M27C4002-10F6

M27C4002 4 Mbit (256Kb x16) UV EPROM and OTP EPROM Feature summary ■ 5V ± 10% Supply voltage for Read operations ■ Access time: 45ns ■ Low Power consumption – Active Current 70mA at 10MHz – Standby current 100µa ■ Programming Voltage: 12.75V ± 0.25V ■ Programming Time: 100µs/word ■ Electronic Signature – Manufacturer Code: 20h – Device Code: 44h ■ ECOPACK® packages available 40 ) s ( ct 40 1 1 du FDIP40W (F) e t e ol bs PLCC44 (C) PDIP40 (B) o r P TSOP40 (N) 10 x 20 mm O ) s ( t c u d o r P e t e l o s b O April 2006 Rev 4 1/24 www.st.com 1 Contents M27C4002 Contents 1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.3 Two line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.6 PRESTO II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11 ) s ( ct u d o r P e t e l o s b O 3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 ) (s t c u d o r 7 t e l o s b O 2/24 P e Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 M27C4002 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read Mode AC Characteristics 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read Mode AC Characteristics 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read Mode AC Characteristics 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data . . . . . . 18 PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data . . . . . . . . . . . . . . 19 PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data. . . . . . . . . . . . 20 TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, mechnical data . . . . . . . . . . . 21 Ordering Information Scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 3/24 List of figures M27C4002 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18 PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19 PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20 TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, Package Outline . . . . . . . . . . 21 ) s ( ct u d o r P e t e l o ) (s t c u d o r P e t e l o s b O 4/24 s b O M27C4002 1 Summary description Summary description The M27C4002 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large programs and is organized as 262,144 words of 16 bits. The FDIP40W (window ceramic frit-seal package) has transparent lids which allow the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27C4002 is offered in PDIP40, PLCC44 and TSOP40 (10 x 20 mm) packages. ) s ( ct In order to meet environmental requirements, ST offers the M27C4002 in ECOPACK® packages. u d o ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. r P e ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. t e l o Logic Diagram bs VCC VPP O ) s ( t c 18 A0-A17 u d o r P e s b O t e l o E 16 Q0-Q15 M27C4002 G VSS AI00727B 5/24 Summary description Table 1. M27C4002 Signal Names A0-A17 Address Inputs Q0-Q15 Data Outputs E Chip Enable G Output Enable VPP Program Supply VCC Supply Voltage VSS Ground NC Not Connected Internally Figure 2. VPP E Q15 Q14 Q13 Q12 Q11 Q10 Q9 Q8 VSS Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 G ) (s t c u d o r P e t e l o s b O 6/24 ) s ( ct DIP Connections 1 40 2 39 3 38 4 37 5 36 6 35 7 34 8 33 9 32 10 31 M27C4002 11 30 12 29 13 28 14 27 15 26 16 25 17 24 18 23 19 22 20 21 VCC A17 A16 A15 A14 A13 A12 A11 A10 A9 VSS A8 A7 A6 A5 A4 A3 A2 A1 A0 t e l o r P e s b O AI00728 u d o M27C4002 Summary description LCC Connections Q13 Q14 Q15 E VPP NC VCC A17 A16 A15 A14 Figure 3. 1 44 Q12 Q11 Q10 Q9 Q8 VSS NC Q7 Q6 Q5 Q4 12 A13 A12 A11 A10 A9 VSS NC A8 A7 A6 A5 34 M27C4002 23 u d o r P e Q3 Q2 Q1 Q0 G NC A0 A1 A2 A3 A4 Figure 4. t e l o TSOP Connections A9 A10 A11 A12 A13 A14 A15 A16 A17 VCC VPP E DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 DQ9 DQ8 )1 s b O 40 s ( t c u d o r P e s b O t e l o 10 11 20 M27C4002 (Normal) ) s ( ct 31 30 21 AI00729 VSS A8 A7 A6 A5 A4 A3 A2 A1 A0 G DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 VSS AI01831 7/24 Device operation 2 M27C4002 Device operation The operating modes of the M27C4002 are listed in the Operating Modes table. A single power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature. 2.1 Read mode The M27C4002 has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after a delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV. ) s ( ct 2.2 u d o r P e Standby mode t e l o The M27C4002 has a standby mode which reduces the supply current from 50mA to 100µA. The M27C4002 is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input. ) (s 2.3 s b O Two line output control t c u Because EPROMs are usually used in larger memory arrays, the product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows: ● ● P e t e l o s b O 8/24 d o r The lowest possible memory power dissipation Complete assurance that output bus contention will not occur. For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is required from a particular memory device. M27C4002 2.4 Device operation System considerations The power switching characteristics of Advanced CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of the transient current peaks is dependent on the output capacitive and inductive loading of the device. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point.The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces. ) s ( ct 2.5 u d o Programming r P e When delivered (and after each erasure for UV EPROM), all bits of the M27C4002 are in the '1' state. Data is introduced by selectively programming '0's into the desired bit locations. Although only '0's will be programmed, both '1's and '0's can be present in the data word. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27C4002 is in the programming mode when VPP input is at 12.75V, G is at VIH and E is pulsed to VIL. The data to be programmed is applied to 16 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V ± 0.25V. t e l o ) (s s b O t c u 2.6 PRESTO II programming algorithm d o r PRESTO II Programming Algorithm allows the whole array to be programmed with a guaranteed margin, in a typical time of 26.5 seconds. Programming with PRESTO II consists of applying a sequence of 100µs program pulses to each byte until a correct verify occurs (see Figure 5). During programming and verify operation, a MARGIN MODE circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides necessary margin to each programmed cell. P e s b O t e l o 9/24 Device operation Figure 5. M27C4002 Programming Flowchart VCC = 6.25V, VPP = 12.75V n=0 E = 100µs Pulse NO ++n = 25 NO ++ Addr VERIFY YES YES Last Addr FAIL ) s ( ct NO u d o YES CHECK ALL WORDS 1st: VCC = 6V 2nd: VCC = 4.2V let r P e 2.7 Program Inhibit o s b AI00726C O ) Programming of multiple M27C4002 devices in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C4002 may be common. A TTL low level pulse applied to a M27C4002 E input, with VPP at 12.75V, will program that M27C4002. A high level E input inhibits the other M27C4002 devices from being programmed. s ( t c 2.8 u d o t e l o s b O 2.9 r P e Program Verify A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and VCC at 6.25V. Electronic Signature The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C ambient temperature range that is required when programming the M27C4002. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C4002 with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics 10/24 M27C4002 Device operation M27C4002, these two identifier bytes are given in Table 3: Electronic Signature and can be read-out on outputs Q7 to Q0. 2.10 Erasure operation (applies to UV EPROM) The erasure characteristics of the M27C4002 are such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C4002 in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C4002 is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C4002 window to prevent unintentional erasure. The recommended erasure procedure for the M27C4002 is exposure to short wave ultraviolet light which has wavelength 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C4002 should be placed within 2.5cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. ) s ( ct u d o Table 2. r P e Mode E G A9 VPP Q15-Q0 VIL X VCC or VSS Data Out VIH X VCC or VSS Hi-Z VIL Pulse VIH X VPP Data In VIH VIL X VPP Data Out VIH VIH X VPP Hi-Z VIH X X VCC or VSS Hi-Z VIL VIL VID VCC Codes Read VIL Output Disable VIL ) (s Program ct Verify du Program Inhibit o r P Standby Electronic Signature e t e ol t e l o Operating modes(1) s b O 1. X = VIH or VIL, VID = 12V ± 0.5V. Table 3. O bs Electronic Signature(1) Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data Manufacturer’s Code VIL 0 0 1 0 0 0 0 0 20h Device Code VIH 0 1 0 0 0 1 0 0 44h 1. Outputs Q15-Q8 are set to '0'. 11/24 Maximum rating 3 M27C4002 Maximum rating Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. Absolute Maximum Ratings Symbol TA Parameter Ambient Operating TBIAS Temperature Under Bias TSTG Storage Temperature VIO(2) Input or Output Voltage (except A9) VCC VA9(2) VPP Value Temperature(1) uc od Supply Voltage e t e l A9 Voltage o s b Program Supply Voltage 1. Depends on range. ) s ( t –40 to 125 –50 to 125 Pr Unit °C °C –65 to 150 °C –2 to 7 V –2 to 7 V –2 to 13.5 V –2 to 14 V 2. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns. O ) s ( t c u d o r P e t e l o s b O 12/24 M27C4002 4 DC and AC parameters DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 5. AC Measurement Conditions Parameter High Speed Standard Input Rise and Fall Times ≤10ns ≤20ns Input Pulse Voltages 0 to 3V 0.4V to 2.4V 1.5V 0.8V and 2V Input and Output Timing Ref. Voltages Figure 6. AC Testing Input Output Waveform ) s ( ct r P e High Speed t e l o 3V 0V ) (s Standard t c u let P e Figure 7. o s b 1.5V s b O 2.4V d o r u d o 2.0V 0.8V 0.4V AI01822 AC Testing Load Circuit 1.3V 1N914 O 3.3kΩ DEVICE UNDER TEST OUT CL CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance AI01823B 13/24 DC and AC parameters Table 6. M27C4002 Capacitance(1)(2) Symbol Parameter Test Condition Max Unit VIN = 0V 6 pF VOUT = 0V 12 pF Input Capacitance CIN COUT Output Capacitance Min 1. TA = 25 °C, f = 1 MHz. 2. Sampled only, not 100% tested. Table 7. Read Mode DC Characteristics(1)(2) Symbol Parameter ILI Input Leakage Current ILO Output Leakage Current Test Condition Max Unit 0V ≤VIN ≤VCC ±10 µA 0V ≤VOUT ≤VCC ±10 µA d o r E = VIL, G = VIL, IOUT = 0mA, f = 5MHz P e 70 mA 50 mA 1 mA ICC1 Supply Current (Standby) TTL ICC2 Supply Current (Standby) CMOS E > VCC – 0.2V 100 µA IPP Program Current 10 µA VIL Input Low Voltage so –0.3 0.8 V 2 VCC + 1 V 0.4 V VIH (3) Output Low Voltage )- s ( t c Output High Voltage TTL VOH let VPP = VCC Input High Voltage VOL E = VIH ) s ( t uc E = VIL, G = VIL, IOUT = 0mA, f = 10MHz Supply Current ICC Min du Output High Voltage CMOS b O IOL = 2.1mA IOH = –400µA 2.4 V IOH = –100µA VCC – 0.7V V o r P 1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Maximum DC voltage on Output is VCC +0.5V. e t e ol Table 8. bs O Symbol Programming Mode DC Characteristics(1)(2) Parameter Test Condition Min VIL ≤VIN ≤VIH Max Unit ±10 µA 50 mA 50 mA ILI Input Leakage Current ICC Supply Current IPP Program Current VIL Input Low Voltage –0.3 0.8 V VIH Input High Voltage 2 VCC + 0.5 V VOL Output Low Voltage 0.4 V VOH Output High Voltage TTL VID A9 Voltage E = VIL IOL = 2.1mA IOH = –400µA 2.4 11.5 V 12.5 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 14/24 V M27C4002 Table 9. DC and AC parameters Read Mode AC Characteristics 1(1)(2) M27C4002 Symbol Alt Parameter - 45(3) Test Condition Min tAVQV tACC Address Valid to Output Valid tELQV tCE tGLQV -60 (3) Max Min -70 Max Min Unit Max E = VIL, G = VIL 45 60 70 ns Chip Enable Low to Output Valid G = VIL 45 60 70 ns tOE Output Enable Low to Output Valid E = VIL 25 30 35 ns tEHQZ(4) tDF Chip Enable High to Output Hi-Z G = VIL 0 30 0 30 30 ns tGHQZ(4) tDF Output Enable High to Output Hi-Z E = VIL 0 30 0 30 30 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 u d o 0 r P e 0 ) s ( ct 0 0 ns t e l o 1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. s b O 3. Speed obtained with High Speed AC measurement conditions. 4. Sampled only, not 100% tested. Table 10. Symbol tAVQV ) (s Read Mode AC Characteristics 2(1)(2) Alt t c u Parameter od r P e tACC t e l o Address Valid to Output Valid M27C4002 Test Condition -80 Min -90 Max Min -10 Max Min Unit Max E = VIL, G = VIL 80 90 100 ns Chip Enable Low to Output Valid G = VIL 80 90 100 ns 40 40 50 ns tELQV tCE tGLQV bs tOE Output Enable Low to Output Valid E = VIL tEHQZ(3) tDF Chip Enable High to Output Hi-Z G = VIL 0 30 0 30 0 30 ns tGHQZ(3) tDF Output Enable High to Output Hi-Z E = VIL 0 30 0 30 0 30 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 O 0 0 ns 1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested. 15/24 DC and AC parameters M27C4002 Read Mode AC Characteristics 3(1)(2) Table 11. M27C4002 Symbol Alt Parameter Test Condition -12 Min tAVQV tACC Address Valid to Output Valid tELQV tCE tGLQV -15 Max Min -20 Max Min Unit Max E = VIL, G = VIL 120 150 200 ns Chip Enable Low to Output Valid G = VIL 120 150 200 ns tOE Output Enable Low to Output Valid E = VIL 60 60 70 ns tEHQZ(3) tDF Chip Enable High to Output Hi-Z G = VIL 0 40 0 50 80 ns tGHQZ(3) tDF Output Enable High to Output Hi-Z E = VIL 0 40 0 50 80 ns tAXQX tOH Address Transition to Output Transition E = VIL, G = VIL 0 ) s ( ct 0 u d o r P e 0 0 0 ns t e l o 1. TA = 0 to 70°C or –40 to 85°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested. Figure 8. Read Mode AC Waveforms ) (s VALID A0-A17 ct tAVQV u d o E r P e G let o s b Q0-Q15 O 16/24 s b O tGLQV tELQV VALID tAXQX tEHQZ tGHQZ Hi-Z AI00731B M27C4002 DC and AC parameters Programming Mode AC Characteristics(1)(2)(3) Table 12. Symbol Alt Parameter Test Condition Min Max tAVEL tAS Address Valid to Chip Enable Low 2 µs tQVEL tDS Input Valid to Chip Enable Low 2 µs tVPHEL tVPS VPP High to Chip Enable Low 2 µs tVCHEL tVCS VCC High to Chip Enable Low 2 µs tELEH tPW Chip Enable Program Pulse Width 95 tEHQX tDH Chip Enable High to Input Transition 2 µs tQXGL tOES Input Transition to Output Enable Low 2 µs tGLQV tOE Output Enable Low to Output Valid tGHQZ tDFP Output Enable High to Output Hi-Z 0 tGHAX tAH Output Enable High to Address Transition 0 105 µs ) s ( t 100 1. TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V. Unit c u d 130 o r P ns ns ns 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. e t e ol 3. Sampled only, not 100% tested. Figure 9. Programming and Verify Modes AC Waveforms ) (s tAVEL Q0-Q15 DATA IN tQVEL b O so e t e l ct u d o VPP VCC s b O VALID A0-A17 Pr DATA OUT tEHQX tVPHEL tGLQV tVCHEL tGHQZ tGHAX E tELEH tQXGL G PROGRAM VERIFY AI00730 17/24 Package mechanical data 5 M27C4002 Package mechanical data Figure 10. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline A2 A3 A A1 B1 B L α e C eA D2 eB D ) s ( ct S N ∅ E1 E u d o 1 r P e FDIPW-a 1. Drawing is not to scale. Table 13. millimeters Symbol Typ Min )- P e t e l o D bs O 4.57 0.154 0.180 3.89 4.50 0.153 0.177 0.41 0.56 0.016 0.022 – – – – 0.23 0.30 0.009 0.012 51.79 52.60 2.039 2.071 du 0.057 D2 48.26 – – 1.900 – – E 15.24 – – 0.600 – – 13.06 13.36 0.514 0.526 E1 e 2.54 – – 0.100 – – eA 14.99 – – 0.590 – – eB 16.18 18.03 0.637 0.710 L 3.18 S 1.52 2.49 – – α 4° 11° N 40 ∅ 18/24 1.45 0.225 s ( t c 3.91 B1 5.72 Max 0.055 A2 ro Min 0.020 0.51 B Typ inches 1.40 A1 A3 s b O Max A C t e l o FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Mechanical Data 7.62 0.125 0.300 0.060 0.098 – – 4° 11° 40 M27C4002 Package mechanical data Figure 11. PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline A2 A1 B1 B A α L e1 C eA D2 eB D S N E1 E ) s ( ct 1 PDIP u d o 1. Drawing is not to scale. Table 14. r P e PDIP40 - 40 pin Plastic DIP, 600 mils width, Package Mechanical Data millimeters inches t e l o Symbol Typ Min Max A 4.45 – – A1 0.64 0.38 Min Max 0. 175 – – 0.025 0.015 – 3.91 0.140 0.154 0.53 0.015 0.021 ct 1.78 0.045 0.070 0.31 0.008 0.012 51.78 52.58 2.039 2.070 – – – – 14.80 16.26 0.583 0.640 13.46 13.99 0.530 0.551 2.54 – – 0.100 – – 15.24 – – 0.600 – eB 15.24 17.78 0.600 0.700 L 3.05 3.81 0.120 0.150 S 1.52 2.29 0.060 0.090 α 0° 15° 0° 15° N 40 A2 3.56 B 0.38 B1 1.14 du C 0.20 D D2 ete E ol E1 e1 s b O eA o r P 48.26 s b O – ) (s Typ 1.900 40 19/24 Package mechanical data M27C4002 Figure 12. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline D D1 A1 c 1 N B1 E3 e E2 E1 E B D3 ) s ( ct A2 A r P e 1. Drawing is not to scale. Table 15. Symbol Typ Min A c u d B ro B1 P e CP let c o s b D Max 4.570 0.1654 0.1799 2.290 3.040 0.0902 0.1197 3.650 3.700 0.1437 0.1457 0.331 0.533 0.0130 0.0210 0.661 0.812 0.0260 0.0320 )- t(s A2 s b O Max Typ inches Min 4.200 A1 20/24 t e l o PLCC-B PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Mechanical Data millimeters O u d o CP D2 0.101 0.510 0.0040 0.0201 17.400 17.650 0.6850 0.6949 D1 16.510 16.662 0.6500 0.6560 D2 14.990 16.000 0.5902 0.6299 – – – – E 17.400 17.650 0.6850 0.6949 E1 16.510 16.660 0.6500 0.6559 E2 14.990 16.000 0.5902 0.6299 D3 12.700 0.5000 E3 12.700 – – 0.5000 – – e 1.270 – – 0.0500 – – N 44 44 M27C4002 Package mechanical data Figure 13. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, Package Outline A2 N 1 e E B N/2 D1 A CP D ) s ( ct DIE u d o C A1 TSOP-a α r P e 1. Drawing is not to scale. Table 16. L t e l o TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, mechnical data millimeters Symbol Typ Min )- A t(s A1 0.050 A2 0.950 ro C P e CP let D Typ Min 1.200 Max 0.0472 0.150 0.0020 0.0059 1.050 0.0374 0.0413 0.170 0.270 0.0067 0.0106 0.100 0.210 0.0039 0.0083 c u d B s b O Max inches 0.100 0.0039 19.800 20.200 0.7795 0.7953 18.300 18.500 0.7205 0.7283 – – – – E 9.900 10.100 0.3898 0.3976 L 0.500 0.700 0.0197 0.0276 α 0 5 0 5 D1 o s b e 0.500 O N 40 0.0197 40 21/24 Part numbering 6 M27C4002 Part numbering Table 17. Ordering Information Scheme Example: M27C4002 -80 X C 1 TR Device Type M27 Supply Voltage ) s ( ct C = 5V Device Function 4002 = 4 Mbit (256Kb x16) u d o r P e Speed -45 = 45 ns (1) t e l o -60 (1) = 60 ns -70 = 70 ns -80 = 80 ns -90 = 90 ns -10 = 100 ns -12 = 120 ns -15 = 150 ns -20 = 200 ns ) (s s b O t c u d o r VCC Tolerance blank = ± 10% X = ± 5% P e t e l o Package s b O F = FDIP40W B = PDIP40 C = PLCC44 N = TSOP40: 10 x 20 mm Temperature Range 1 = 0 to 70 °C 6 = –40 to 85 °C Options TR = Tape & Reel Packing 1. High Speed, see Section 4: DC and AC parameters for further information. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you. 22/24 M27C4002 7 Revision history Revision history Table 18. Document revision history Date Revision September 1998 1 First Issue 25-Sep-2000 2 AN620 Reference removed 30-Aug-2001 3 70ns speed class added 4 Datasheet converted to new corporate template. Packages are ECOPACK® compliant. JLCCC32W package removed. PLCC44 outline and mechanical data. TSOP40 10x20mm mechanical data updated. Additional Burn-in options removed from Table 17: Ordering Information Scheme. 06-Apr-2006 Changes ) s ( ct u d o r P e t e l o ) (s s b O t c u d o r P e t e l o s b O 23/24 M27C4002 ) s ( ct Please Read Carefully: u d o Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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