STD7N52K3, STP7N52K3
Datasheet
N-channel 525 V, 0.72 Ω typ., 6 A, MDmesh™ K3 Power MOSFETs
in DPAK and TO-220 packages
Features
Order codes
TAB
TAB
STD7N52K3
2 3
1
STP7N52K3
TO-220
DPAK
1
2
3
D(2, TAB)
•
•
•
•
•
VDS
RDS(on) max.
ID
PTOT
525 V
0.85 Ω
6A
90 W
100% avalanche tested
Extremely high dv/dt capability
Very low intrinsic capacitance
Improved diode reverse recovery characteristics
Zener-protected
Applications
G(1)
•
Switching applications
Description
S(3)
AM01475V1
These MDmesh™ K3 Power MOSFETs are the result of improvements applied to
STMicroelectronics’ MDmesh™ technology, combined with a new optimized vertical
structure. These devices boast an extremely low on-resistance, superior dynamic
performance and high avalanche capability, rendering them suitable for the most
demanding applications.
Product status links
STD7N52K3
STP7N52K3
Product summary
STD7N52K3
Order code
STD7N52K3
Marking
7N52K3
Package
DPAK
Packing
Tape and reel
STP7N52K3
Order code
STP7N52K3
Marking
7N52K3
Package
TO-220
Packing
Tube
DS5889 - Rev 6 - August 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
STD7N52K3, STP7N52K3
Electrical ratings
1
Electrical ratings
Table 1. Absolute maximum ratings
Symbol
Value
Unit
±30
V
Drain current (continuous) at TC = 25 °C
6
A
Drain current (continuous) at TC = 100 °C
3.8
A
IDM(1)
Drain current (pulsed)
24
A
PTOT
Total dissipation at TC = 25 °C
90
W
IAR(2)
Avalanche current, repetitive or non-repetitive
3
A
EAS(3)
Single pulse avalanche energy
100
mJ
ESD
Gate-source human body model (C = 100 pF, R = 1.5 kΩ)
2.5
kV
Peak diode recovery voltage slope
12
V/ns
-55 to 150
°C
VGS
Parameter
Gate-source voltage
ID
dv/dt(4)
Tstg
Storage temperature range
TJ
Operating junction temperature range
1. Pulse width is limited by safe operating area.
2. Pulse width is limited by TJmax.
3. Starting TJ = 25 °C, ID = IAR, VDD = 50 V
4. ISD ≤ 6 A, di/dt ≤ 400 A/µs, VDS(peak) < V(BR)DSS, VDD = 80% V(BR)DSS
Table 2. Thermal data
Symbol
Rthj-case
Rthj-pcb
(1)
Rthj-amb
Parameter
Value
DPAK
Thermal resistance junction-case
Thermal resistance junction-pcb
Thermal resistance junction-ambient
TO-220
1.39
Unit
°C/W
50
°C/W
62.5
°C/W
1. When mounted on an 1-inch² FR-4, 2oz Cu board.
DS5889 - Rev 6
page 2/21
STD7N52K3, STP7N52K3
Electrical characteristics
2
Electrical characteristics
(TC = 25 °C unless otherwise specified)
Table 3. On/off states
Symbol
V(BR)DSS
Parameter
Drain-source breakdown
voltage
Test conditions
Min.
ID = 1 mA, VGS = 0 V
Typ.
525
Zero gate voltage drain
current
IGSS
Gate body leakage current
VGS = ±20 V, VDS = 0 V
VGS(th)
Gate threshold voltage
VDS = VGS, ID = 50 µA
RDS(on)
Static drain-source onresistance
VGS = 10 V, ID = 3 A
VGS = 0 V, VDS = 525 V, TC = 125
1
µA
50
µA
±10
µA
3.75
4.5
V
0.72
0.85
Ω
Typ.
Max.
Unit
-
pF
°C(1)
3
Unit
V
VGS = 0 V, VDS = 525 V
IDSS
Max.
1. Defined by design, not subject to production test.
Table 4. Dynamic
Symbol
Parameter
Ciss
Input capacitance
Coss
Output capacitance
Crss
Test conditions
Min.
870
VDS = 50 V, f = 1 MHz, VGS = 0 V
-
Reverse transfer capacitance
(1)
70
13
Equivalent output capacitance
VDS = 0 to 420 V, VGS = 0 V,
-
53
-
pF
RG
Intrinsic gate resistance
f = 1 MHz open drain
-
3.5
-
Ω
Qg
Total gate charge
VDD = 420 V, ID = 6 A,
Qgs
Gate-source charge
VGS = 0 to 10 V
-
nC
Gate-drain charge
(see Figure 17. Test circuit for gate
charge behavior)
Coss(tr)
Qgd
33
-
6
21
1. Coss(tr) is defined as the constant equivalent capacitance giving the same storage energy as Coss when VDS increases from
0 to 420 V.
Table 5. Switching times
Symbol
td(on)
tr
td(off)
tf
DS5889 - Rev 6
Parameter
Test conditions
Turn-on delay time
VDD = 260 V, ID = 3 A,
Rise time
RG = 4.7 Ω, VGS = 10 V
Turn-off delay time
(see Figure 16. Test circuit for
resistive load switching times and
Figure 21. Switching time
waveform)
Fall time
Min.
Typ.
Max.
Unit
-
ns
13
11
-
36
19
page 3/21
STD7N52K3, STP7N52K3
Electrical characteristics
Table 6. Source-drain diode
Symbol
ISD
Parameter
Test conditions
Source-drain current
Typ.
Source-drain current (pulsed)
VSD(2)
Forward on voltage
ISD = 6 A, VGS = 0 V
trr
Reverse recovery time
ISD = 6 A, di/dt = 100 A/µs,
Qrr
Reverse recovery charge
IRRM
Reverse recovery current
VDD = 60 V (see Figure 18. Test
circuit for inductive load switching
and diode recovery times)
trr
Reverse recovery time
ISD = 6 A, di/dt = 100 A/µs,
Qrr
Reverse recovery charge
VDD = 60 V, Tj = 150 °C
Reverse recovery current
(see Figure 18. Test circuit for
inductive load switching and diode
recovery times)
24
-
-
-
Max.
6
-
ISDM(1)
IRRM
Min.
1.5
Unit
A
V
220
ns
1.8
μC
16
A
250
ns
2.2
μC
18
A
1. Pulse width limited by safe operating area.
2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%.
Table 7. Gate-source Zener diode
Symbol
V(BR)GSO
Parameter
Gate-source breakdown voltage
Test conditions
IGS = ±1 mA, ID = 0 A
Min.
Typ.
Max.
Unit
30
-
-
V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device.
The Zener voltage facilitates efficient and cost-effective device integrity protection, thus eliminating the need for
additional external componentry.
DS5889 - Rev 6
page 4/21
STD7N52K3, STP7N52K3
Electrical characteristics (curves)
2.1
Electrical characteristics (curves)
Figure 1. Safe operating area for DPAK
AM08952v1
ID (A)
Tj=150°C
Tc=25°C
S ingle puls e
Figure 2. Thermal impedance for DPAK
GC20460
K
10µs
101
n)
(o
100µs
DS
Op
Lim e ra
ite tio n
d
by in th
m is
ax ar
R e
a
is
100
100
1ms
10-1
10ms
10-1
10-1
100
VDS (V)
102
101
Figure 3. Safe operating area for TO-220
10-2
10-5
10-4
10-3
10-2
tp (s)
10-1
Figure 4. Thermal impedance for TO-220
AM08950v1
ID (A)
Tj=150°C
Tc=25°C
S ingle puls e
101
n)
(o
100µs
DS
Op
Lim e ra
ite tio n
d
by in th
m is
ax ar
R ea
is
10µs
100
1ms
10ms
10-1
10-1
100
102
101
VDS (V)
Figure 5. Output characteristics
Figure 6. Transfer characteristics
AM08953v1
ID
(A)
AM08954v1
ID (A)
VDS = 8 V
9
10
VGS =10V
8
7
8
6
6
5
4
4
3
6V
2
2
1
0
DS5889 - Rev 6
0
1
2
3
4
5
6
7
8
5V
9 VDS (V)
0
0
1
2
3
4
5
6
7
8
9 VGS (V)
page 5/21
STD7N52K3, STP7N52K3
Electrical characteristics (curves)
Figure 7. Normalized V(BR)DSS vs temperature
AM08961v1
V(BR)DSS
(norm)
1.10
Figure 8. Static drain-source on-resistance
AM08956v1
R DS (on) (Ω)
0.88
VGS =10V
0.84
0.80
1.05
0.76
0.72
1.00
0.68
0.95
0.64
0.90
-75
0.60
-25
25
75
125
TJ (°C)
Figure 9. Output capacitance stored energy
AM08958v1
E os s (µJ )
4.5
4.0
0
2
1
4
3
5
6
ID(A)
Figure 10. Capacitance variations
AM08957v1
C
(pF)
1000
Cis s
3.5
3.0
100
2.5
2.0
Cos s
1.5
10
1.0
Crs s
0.5
0
0
100
200
300
400
500
VDS (V)
Figure 11. Gate charge vs gate-source voltage
VGS
(V)
AM08955v1
12
VDD=420V
ID=6A
VDS
300
8
250
6
200
150
4
100
2
0
0
1
100
10
VDS (V)
Figure 12. Normalized on-resistance vs temperature
AM08960v1
R DS (on)
(norm)
2.5
VGS = 10 V
350
10
DS5889 - Rev 6
450 VDS
(V)
400
1
0.1
2.0
1.5
1.0
0.5
50
10
20
30
0
Q g (nC)
0
-75
-25
25
75
125
TJ (°C)
page 6/21
STD7N52K3, STP7N52K3
Electrical characteristics (curves)
Figure 13. Normalized gate threshold voltage vs
temperature
Figure 14. Maximum avalanche energy vs temperature
(norm)
120
1.10
110
100
90
80
70
60
ID = 50 μΑ
1.00
0.90
50
40
30
20
10
0
0
0.80
0.70
-75
-25
25
75
TJ (°C)
125
AM08963v1
E AS (mJ )
AM08959v1
VGS (th)
ID=3A
VDD=50 V
20
40
60
80
100 120 140 TJ (°C)
Figure 15. Source-drain diode forward characteristics
AM08962v1
VS D
(V)
0.9
TJ =-50°C
0.8
TJ =25°C
0.7
0.6
0.5
0.4
0.3
DS5889 - Rev 6
TJ =150°C
0
1
2
3
4
5
6
7
8
IS D(A)
page 7/21
STD7N52K3, STP7N52K3
Test circuits
3
Test circuits
Figure 16. Test circuit for resistive load switching times
Figure 17. Test circuit for gate charge behavior
VDD
12 V
2200
+ μF
3.3
μF
VDD
VD
VGS
1 kΩ
100 nF
RL
IG= CONST
VGS
RG
47 kΩ
+
pulse width
D.U.T.
2.7 kΩ
2200
μF
pulse width
D.U.T.
100 Ω
VG
47 kΩ
1 kΩ
AM01469v1
AM01468v1
Figure 18. Test circuit for inductive load switching and
diode recovery times
D
G
A
D.U.T.
S
25 Ω
A
L
A
B
B
3.3
µF
D
G
+
VD
100 µH
fast
diode
B
Figure 19. Unclamped inductive load test circuit
RG
1000
+ µF
2200
+ µF
VDD
3.3
µF
VDD
ID
D.U.T.
S
D.U.T.
Vi
_
pulse width
AM01471v1
AM01470v1
Figure 21. Switching time waveform
Figure 20. Unclamped inductive waveform
ton
V(BR)DSS
td(on)
VD
toff
td(off)
tr
tf
90%
90%
IDM
VDD
10%
0
ID
VDD
AM01472v1
VGS
0
VDS
10%
90%
10%
AM01473v1
DS5889 - Rev 6
page 8/21
STD7N52K3, STP7N52K3
Package information
4
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
DS5889 - Rev 6
page 9/21
STD7N52K3, STP7N52K3
DPAK (TO-252) type A2 package information
4.1
DPAK (TO-252) type A2 package information
Figure 22. DPAK (TO-252) type A2 package outline
0068772_type-A2_rev25
DS5889 - Rev 6
page 10/21
STD7N52K3, STP7N52K3
DPAK (TO-252) type A2 package information
Table 8. DPAK (TO-252) type A2 mechanical data
Dim.
mm
Min.
Max.
A
2.20
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
5.20
5.40
c
0.45
0.60
c2
0.48
0.60
D
6.00
6.20
D1
4.95
E
6.40
E1
5.10
5.20
5.30
e
2.159
2.286
2.413
e1
4.445
4.572
4.699
H
9.35
10.10
L
1.00
1.50
L1
2.60
2.80
3.00
L2
0.65
0.80
0.95
L4
0.60
R
V2
DS5889 - Rev 6
Typ.
5.10
5.25
6.60
1.00
0.20
0°
8°
page 11/21
STD7N52K3, STP7N52K3
DPAK (TO-252) type C2 package information
4.2
DPAK (TO-252) type C2 package information
Figure 23. DPAK (TO-252) type C2 package outline
0068772_C2_25
DS5889 - Rev 6
page 12/21
STD7N52K3, STP7N52K3
DPAK (TO-252) type C2 package information
Table 9. DPAK (TO-252) type C2 mechanical data
Dim.
mm
Min.
Typ.
Max.
A
2.20
2.30
2.38
A1
0.90
1.01
1.10
A2
0.00
0.10
b
0.72
0.85
b4
5.13
c
0.47
0.60
c2
0.47
0.60
D
6.00
D1
5.10
E
6.50
E1
5.20
e
2.186
2.286
2.386
H
9.80
10.10
10.40
L
1.40
1.50
1.70
L1
L2
6.20
5.60
6.60
6.70
5.50
0.90
1.25
0.51 BSC
0.60
L6
DS5889 - Rev 6
6.10
5.46
2.90 REF
L3
L4
5.33
0.80
1.00
1.80 BSC
θ1
5°
7°
9°
θ2
5°
7°
9°
V2
0°
8°
page 13/21
STD7N52K3, STP7N52K3
DPAK (TO-252) type C2 package information
Figure 24. DPAK (TO-252) recommended footprint (dimensions are in mm)
FP_0068772_25
DS5889 - Rev 6
page 14/21
STD7N52K3, STP7N52K3
DPAK (TO-252) packing information
4.3
DPAK (TO-252) packing information
Figure 25. DPAK (TO-252) tape outline
10 pitches cumulative
tolerance on tape +/- 0.2 mm
T
P0
Top cover
tape
P2
D
E
F
B1
K0
For machine ref. only
including draft and
radii concentric around B0
W
B0
A0
P1
D1
User direction of feed
R
Bending radius
User direction of feed
AM08852v1
DS5889 - Rev 6
page 15/21
STD7N52K3, STP7N52K3
DPAK (TO-252) packing information
Figure 26. DPAK (TO-252) reel outline
T
40mm min.
access hole
at slot location
B
D
C
N
A
G measured
at hub
Tape slot
in core for
tape start
2.5mm min.width
Full radius
AM06038v1
Table 10. DPAK (TO-252) tape and reel mechanical data
Tape
Dim.
mm
mm
Dim.
Min.
Max.
A0
6.8
7
A
B0
10.4
10.6
B
1.5
12.1
C
12.8
1.6
D
20.2
G
16.4
50
B1
DS5889 - Rev 6
Reel
Min.
Max.
330
13.2
D
1.5
D1
1.5
E
1.65
1.85
N
F
7.4
7.6
T
K0
2.55
2.75
P0
3.9
4.1
Base qty.
2500
P1
7.9
8.1
Bulk qty.
2500
P2
1.9
2.1
R
40
T
0.25
0.35
W
15.7
16.3
18.4
22.4
page 16/21
STD7N52K3, STP7N52K3
TO-220 type A package information
4.4
TO-220 type A package information
Figure 27. TO-220 type A package outline
0015988_typeA_Rev_21
DS5889 - Rev 6
page 17/21
STD7N52K3, STP7N52K3
TO-220 type A package information
Table 11. TO-220 type A package mechanical data
Dim.
mm
Min.
Max.
A
4.40
4.60
b
0.61
0.88
b1
1.14
1.55
c
0.48
0.70
D
15.25
15.75
D1
DS5889 - Rev 6
Typ.
1.27
E
10.00
10.40
e
2.40
2.70
e1
4.95
5.15
F
1.23
1.32
H1
6.20
6.60
J1
2.40
2.72
L
13.00
14.00
L1
3.50
3.93
L20
16.40
L30
28.90
øP
3.75
3.85
Q
2.65
2.95
page 18/21
STD7N52K3, STP7N52K3
Revision history
Table 12. Document revision history
Date
Version
Changes
07-Jul-2008
1
First release.
10-Sep-2009
2
Document status promoted from preliminary data to datasheet.
27-Jun-2011
3
Section 2.1: Electrical characteristics (curves) has been updated.
07-Mar-2012
4
Updated Section 4: Package mechanical data.
Minor text changes.
Part numbers STB7N52K3 and STF7N52K3 have been moved to a different
datasheet, and the document has been updated accordingly.
Updated features and description on cover page.
11-Jul-2018
5
Updated Table 1. Absolute maximum ratings.
Updated Section 4.1 DPAK (TO-252) type A2 package information.
Minor text changes.
01-Aug-2018
DS5889 - Rev 6
6
Updated Table 1. Absolute maximum ratings.
page 19/21
STD7N52K3, STP7N52K3
Contents
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1
Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4
Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4.1
DPAK (TO-252) type A2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2
DPAK (TO-252) type C2 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.3
DPAK (TO-252) packing information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.4
TO-220 type A package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
DS5889 - Rev 6
page 20/21
STD7N52K3, STP7N52K3
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
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Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
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ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
DS5889 - Rev 6
page 21/21