SSL1308M-R32MF-R32

HIGH CURRENT POWER INDUCTORS 1. PART NO. EXPRESSION : SSL1308M SERIES SSL1308M-R21MF-R32 (a) (b) (c) (d) (e) (f) (g) (a) Series code (b) Dimension code (c) Material code (d) Inductance code (e) Tolerance code : M = ± 20% (f) F : RoHS Compliant (g) DCR code 2. CONFIGURATION & DIMENSIONS : A E R21 0939.32 D B G H G C PCB Pattern Unit:m/m A B C D E G I H I 13.46 Max. 12.95 Max. 8.0 Max. 5.08± 0.25 2.54± 0.25 3.18± 0.25 7.11± 0.25 7.62± 0.25 3. SCHEMATIC : 4. GENERAL SPECIFICATION : a) Operating temp. : -40° C to +125° C b) Irms (A) : Will cause coil temp. to rise approximately T=40°C without core loss. c) Isat (A) : Will cause L 0 to drop approximately 20% d) Part temperature (ambient + temp. rise) : Should not exceed 125° C under worst case operating conditions. NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS 5. ELECTRICAL CHARACTERISTICS : Part No. SSL1308M-R21MF-R32 SSL1308M-R26MF-R32 SSL1308M-R32MF-R32 SSL1308M-R44MF-R32 SSL1308M-R21MF-R53 SSL1308M-R26MF-R53 SSL1308M-R53MF-R53 SSL1308M-R44MF-R53 Inductance L0 ( uH ) 0.21 ± 20% 0.26 ± 20% 0.32 ± 20% 0.44 ± 20% 0.21 ± 20% 0.26 ± 20% 0.32 ± 20% 0.44 ± 20% Test Freq. ( Hz ) 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M 0.25V/1M DCR (m ) ± 9.4% 0.32 0.32 0.32 0.32 0.53 0.53 0.53 0.53 SSL1308M SERIES Irms (A) Max. 45 45 41 30 45 45 41 30 Isat (A) Max. 71 60 50 35 71 60 50 35 6. CHARACTERISTICS CURVES : SSL1308M-R21MF-R32 0 .4 SLPI1308M- R21M-R32 SSL1308M-R26MF-R32 80 70 0.5 SLPI1308M-R26M-R32 80 70 0.4 INDUCTANCE (uH) INDUCTANCE (uH) 0 .3 60 60 50 40 0.2 30 20 0.1 10 0 0 50 0 .2 40 30 0 .1 20 10 0 0 TEMP. RISE(oC) 0.3 0 15 30 45 60 0 15 30 45 60 DC CURRENT(A) DC CURRENT(A) SSL1308M-R32MF-R32 0.6 SLPI1308M-R32M-R32 SSL1308M-R44MF-R32 80 70 0.8 SLPI1308M-R44M-R32 80 70 INDUCTANCE (uH) INDUCTANCE (uH) 0.45 60 0.6 60 50 50 0.3 40 30 0.15 20 10 0 0 TEMP. RISE(oC) 0.4 40 30 0.2 20 10 0 0 0 10 20 30 40 50 0 7 14 21 28 35 DC CURRENT(A) DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 TEMP. RISE(oC) TEMP. RISE(oC) 08.04.2011 HIGH CURRENT POWER INDUCTORS 6. CHARACTERISTICS CURVES : SSL1308M-R21MF-R53 SLPI1308M- R21M-R53 SSL1308M SERIES SSL1308M-R26MF-R53 80 70 0 .4 0 .5 SLPI1308M-R26M-R53 80 70 0 .4 INDUCTANCE (uH) INDUCTANCE (uH) 0 .3 60 60 50 40 0 .2 30 20 0 .1 10 0 0 TEMP. RISE(oC) 50 0 .2 40 30 0 .1 20 10 0 0 0 .3 0 15 30 45 60 0 12 24 36 48 60 DC CURRENT(A) SSL1308M-R32MF-R53 SLPI1308M- R32M-R53 DC CURRENT(A) SSL1308M-R44MF-R53 80 70 0 .6 0 .8 SLPI1308M- R44M-R53 80 70 INDUCTANCE (uH) INDUCTANCE (uH) 0.45 60 0 .6 60 50 50 0 .3 40 30 0.15 20 10 0 0 TEMP. RISE(oC) 0 .4 40 30 0 .2 20 10 0 0 0 10 20 30 40 50 0 7 14 21 28 35 DC CURRENT(A) DC CURRENT(A) NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 TEMP. RISE(oC) TEMP. RISE(oC) HIGH CURRENT POWER INDUCTORS 7. RELIABILITY AND TEST CONDITION : SSL1308M SERIES TEST CONDITION ITEM Electrical Characteristics Test Inductance DCR Heat Rated Current (Irms) Saturation Current (Isat) Mechanical Performance Test Solderability Test PERFORMANCE Refer to standard electrical characteristics list HP4284A HIOKI3540 Irms(A) will cause the coil temperature rise approximately T=40°C without core loss Isat(A) will cause Lo to drop approximately 20% More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 245° C Natural cooling 150° C 60 seconds 5± 0.5 seconds After fluxing, component shall be dipped in a melted solder bath at 245± 5° C for 5 secs Solder Heat Resistance 1. Appearance : No significant abnormality 2. Inductance change : Within ± 20% of initial value Preheat : 150° C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260± 5° C Flux : rosin 260° C Dip Time : 10± 0.5sec. 150° C Preheating Dipping Natural cooling 60 seconds 10± 0.5 seconds Reliability Test High Temperature Life Test Temperature : 125± 5° C Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. 1. Appearance : No damage 2. Inductance : Within ± 20% of initial value. No disconnection or short circuit. Thermal Shock Temperature : -40± 5° C Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Conditions of 1 cycle. Step 1 2 3 4 Temperature (° C) -25± 3 Room Temperature 85± 3 Room Temperature Times (min.) 30± 3 Within 3 30± 3 Within 3 Low Temperature Life Test Total : 5 cycles Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ± 20% of initial value. No disconnection or short circuit. Temperature : 40± 5° C Humidity : 90% to 95% Applied Current : Rated Current Time : 500± 12 hours Recovery : 4 to 24hrs of recovery under the standard condition after the removal from test chamber. Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions and times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). Random Vibration Test Appearance : Cracking, chipping and any other defects harmful to the characteristics should not be allowed. NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT POWER INDUCTORS 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern G H G SSL1308M SERIES Unit:m/m G I H I 3.18± 0.25 7.11± 0.25 7.62± 0.25 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 8-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150° C. b) 280° C tip temperature (max) c) Never contact the ceramic with the iron tip d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm f) Limit soldering time to 3 secs. Preheating TEMPERATURE ° C Soldering 20~40s max. TP(260° C/10s max.) 217 200 150 60~180s 480s max. 25 60~150s TEMPERATURE ° C Natural cooling Preheating 350 300 150 Soldering Natural cooling TIME(sec.) Over 1min. Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 HIGH CURRENT POWER INDUCTORS 9. PACKAGING INFORMATION : 9-1. Reel Dimension SSL1308M SERIES COVER TAPE 2.0± 0.5 D B ØC A EMBOSSED CARRIER Type 13" x 24mm A(mm) 24.0± 0.5 B(mm) 75± 2 C(mm) 13.5± 0.5 D(mm) 330 9-2 Tape Dimension 1.75± 0.1 4.0± 0.1 2.0± 0.1 Ø1.5+0.1 t W 0.15 MIN P Ao Bo Ko Series SSL1308M Ao(mm) 13.8± 0.1 Bo(mm) 13.8± 0.1 Ko(mm) 8.2± 0.1 P(mm) 16.0± 0.1 W(mm) t(mm) 24.0± 0.3 0.35± 0.05 9-3 Packaging Quantity Size Chip / Reel Inner Box Carton SSL1308M 400 800 3200 NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 HIGH CURRENT POWER INDUCTORS SSL1308M SERIES 9-4. Tearing Off Force F 165° to 180° The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions. (referenced ANSI/EIA-481-C-2003 of 4.11 standard) Room Temp. (° C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300 Top cover tape Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 40° C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 08.04.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7