Notice for TAIYO YUDEN products
1
Please read this notice before using the TAIYO YUDEN products.
■ Product information in this catalog is as of October 2008. All of the contents specified herein are
subject to change without notice due to technical improvements, etc. Therefore, please check for the
latest information carefully before practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment
incorporating such products, which are caused under the conditions other than those specified in this
catalog or individual specification.
INFORMATION ON THE GENERAL CATALOG
REMINDERS
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual
specification is available.
■ Please conduct validation and verification of products in actual condition of mounting and operating
environment before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and
intended for use in general electronics equipment.(for AV, office automation, household, office supply,
information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the
components or devices into any equipment in the field such as transportation,( automotive control, train
control, ship control), transportation signal, disaster prevention, medical, public information network
(telephone exchange, base station) etc. which may have direct influence to harm or injure a human
body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear
control, submarine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic
equipment, if the equipment or the electric circuit require high safety or reliability function or
performances, a sufficient reliability evaluation check for safety shall be performed before commercial
shipment and moreover, due consideration to install a protective circuit is strongly recommended at
customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices
or distributors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that
may occur in connection with a third party's intellectual property rights and other related rights arising
from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign
Exchange and Foreign Trade Control Law”of Japan,“U.S. Export Administration Regulations”
, and
other applicable regulations. Should you have any question or inquiry on this matter, please contact our
sales staff.
Should you have any question or inquiry on this matter, please contact our sales staff.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
3
大容量積層セラミックコンデンサ
HIGH VALUE MULTILAYER CERAMIC
CAPACITORS
Code Temp.characteristics Operating temp. range
B
−25∼＋85℃
BJ
X5R*
−55∼＋85℃
B7
X7R
−55∼＋125℃
OPERATING TEMP.
F
−25∼＋85℃
F
Y5V
−30∼＋85℃
*個別仕様の取交しにより、X7R 仕様に対応している場合があります。
*We may provide X7R for some items according to the individual specification.
特長 FEATURES
・The use of Nickel(Ni) as material for both the internal and external electrodes improves the solderability and heat resistance characteristics.
This almost completely eliminates migration and raises the level of reliability significantly.
・Low equivalent series resistance(ESR) provides excellent noise absorption characteristics.
・Compared to tantalum or aluminum electrolytic capacitors these ceramic
capacitors offer a number of excellent features, including:
Higher permissible ripple current values
Smaller case sizes relative to rated voltage
Improved reliability due to higher insulation resistance and breakdown voltage.
・電極にNi金属を使用し、端子電極部にメッキをしてあることにより、
はんだ付け性および耐熱性にすぐれ、マイグレーションもほとんど発生
せず、高い信頼性を示します
・等価直列抵抗（ESR）が小さく、ノイズ吸収性にすぐれています。
・特にタンタルおよびアルミ電解コンデンサに比較した場合：
高い許容リップル電流値
高い定格電圧でありながら小型形状
絶縁抵抗、破壊電圧が高く信頼性にすぐれている
等の特徴があります
用途 APPLICATIONS
・デジタル回路全般
・電源バイパスコンデンサ
液晶モジュール用
液晶駆動電圧ライン用
電源電圧の高いLSI、IC、OPアンプ用
・平滑コンデンサ
DC-DCコンバータ（入力、出力側用）
スイッチング電源（2次側用）
・General digital circuit
・Power supply bypass capacitors
Liquid crystal modules
Liquid crystal drive voltage lines
LS I, I C, converters(both for input and output)
・Smoothing capacitors
DC-DC converters (both for input and output)
Switching power supplies (secondary side)
形名表記法 ORDERING CODE
1
3
5
7
9
定格電圧〔VDC〕
端子電極
温度特性
容量許容差
個別仕様
A
J
L
E
T
G
U
4
6.3
10
16
25
35
50
メッキ品
K
4
形状寸法
〔EIA〕L×W
（mm）
107（0603）
212（0805）
316（1206）
325（1210）
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
2
シリーズ名
M
△F
△＝スペース
−
＋80
−20 ％
Z
包装
製品厚み〔mm〕
6
K
A
D
F
G
H
L
N
Y
M
47,000
1,000,000
積層コンデンサ
標準
10
8
公称静電容量〔pF〕
例
473
105
±10％
±20％
K
M
B
X5R
X7R
F
Y5V
BJ
B7
T
0.45
0.8
0.85
1.15
1.25
1.5
1.6
1.9
2.0max
2.5
P
φ178mm テーピング
（4mmピッチ）
全形状
φ178mm テーピング
（4mmピッチ,1000個/リール）
325形状 厚み：M
11
当社管理記号
△
△＝スペース
標準品
J M K 3 1 6 B J 1 0 6 M L _ T △
1
2
3
4
8
7
10
9
1
3
5
7
9
Rated voltage
〔VDC〕
End termination
Temperature characteristics code
Capacitance tolerance
Special code
A
J
L
E
T
G
U
4
6.3
10
16
25
35
50
K
Plated
△F
Dimensions
〔case size〕
（mm）
107（0603）
212（0805）
316（1206）
325（1210）
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
Series name
M
BJ
B7
4
2
44
6
5
△＝Blank space
B
X5R
X7R
F
Y5V
K
M
Z
K
A
D
F
G
H
L
N
Y
M
6
47,000
1,000,000
9
−
Standard products
10
Packaging
Thickness
〔mm〕
Multilayer ceramic
capacitors
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
＋80
−20 ％
8
Nominal capacitance〔pF〕
example
473
105
±10％
±20％
11
0.45
0.8
0.85
1.15
1.25
1.5
1.6
1.9
2.0max
2.5
T
P
φ178mm Taping
（4mm pitch）
All types
φ178mm Taping
（4mm pitch,1000pcs/reel）
1210Type Thickness：M
11
Internal code
△
Standard products
△＝Blank space
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
外形寸法 EXTERNAL DIMENSIONS
Type（EIA ）
L
□MK107
(0603)
□MK212
（0805）
2.0±0.10*1,*3
（0.079±0.004）
□MK316
(1206)
T
0.45±0.05
（0.018±0.002）
0.8±0.10 *3,*4
（0.031±0.004）
0.45±0.05
（0.018±0.002）
0.85±0.10
（0.033±0.004）
1.25±0.10 *1,*3
（0.049±0.004）
0.85±0.10
（0.033±0.004）
1.15±0.10
（0.045±0.004）
1.25±0.10
（0.049±0.004）
1.6±0.20
（0.063±0.008）
0.85±0.10
（0.033±0.004）
1.15±0.10
（0.045±0.004）
1.5±0.10
（0.059±0.004）
1.9±0.20
（0.075±0.008）
1.9 ＋0.1
−0.2
（0.075＋0.004
−0.008 ）
1.25±0.10*1,*3
（0.049±0.004）
*3
1.6±0.15*3
3.2±0.15
（0.126±0.006）
（0.063±0.006）
2.5±0.20*2
（0.098±0.008）
3.2±0.30
（0.126±0.012）
e
K
A
0.35±0.25
（0.014±0.010）
K
D
0.5±0.25
（0.020±0.010）
G
D
F
G
＋0.35
0.50000
−0.25
（0.020＋0.014
）
−0.010
4
L
CAPACITORS
□MK325
(1210)
注： ＊1. ±0.15mm公差あり
＊2. ±0.3mm公差あり
＊3. ±0.2mm公差あり
＊4. ＋0.15/−0.1mm公差あり
Note: ＊1. Inclulding dimension tolerance±0.15mm（±0.006 inch）.
Note: ＊2. Inclulding dimension tolerance±0.3mm（±0.012 inch）.
Note: ＊3. Inclulding dimension tolerance±0.2mm（±0.008 inch）.
Note: ＊4. Inclulding dimension tolerance＋0.15/−0.1mm（＋0.006/−0.004 inch）.
W
0.8±0.10*3,*4
1.6±0.10*3,*4
（0.063±0.004） （0.031±0.004）
D
F
H
N
0.6±0.3
（0.024±0.012）
Y
2.5±0.20 *2
（0.098±0.008）
M
Unit：mm
（inch）
概略バリエーシ ョン AVAILABLE CAPACITANCE RANGE
Type
107
212
316
325
TC B/X7R
B/X5R
X5R
F/Y5V
B/X7R
B/X5R
X5R
F/Y5V
B/X7R
B/X5R
X5R
F/Y5V B/X7R
B/X5R
X5R
F/Y5V
6.3 35 25 16 10 6.3 10 6.3 4 50 25 16 10 50 35 25 16 10 50 35 25 16 10 6.3 50 25 16 10 6.3 50 16 10 6.3 50 25 16 10 6.3 50 25 16 10 6.3 50 25 10 6.3 4 35 25 16 10 25 16 10 35 25 16 10 6.3 50 35 16 10 6.3 16 10 6.3
Cap VDC 16 10
［μF］3[digits]
0.1 104
0.15 154
0.22 224 A A
0.33 334
0.47 474
A
0.68 684
1 105 A A
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
47 476
100 107
A
A
A A A
A
A A A
A A A A A
A A A
G
G
A
G
G
A A
G
A A
A A
L
G G
G G G G
G G
A A
G G G G
G G G
G
G
G
L
L
G
L L
L L L
L
G
G G G
G
A A
A
L
G
G G G
G G
G
L L
L
G G
N
L L
L L L L
N
N N
L
L L L
L L L
L
L L L
N
L
N
N N
M N
N N M.N N N
M
M M.Y Y
L L
L L
N N
M M M.N
M M.Y
N
注：グラフの記号は製品の厚み記号です。 Note : Letters in the table indicate thickness.
■低背積層セラミックコンデンサ Low profile Multilayer Ceramic Capacitors
Type
107
X5R
B/X7R
TC B/X5R
Cap VDC 10 6.3 25 16 10 6.3 4 16 10
［μF］3[digits]
0.1 104
0.22 224
0.33 334
0.47 474
K
D
0.68 684
1 105 K K K K
D D
2.2 225
K K K
3.3 335
4.7 475
K K
6.8 685
10 106
22 226
47 476
212
316
325
B/X5R X5R F/Y5V B/X7R B/X5R
X5R
F/Y5V B/X7R B/X5R F/Y5V
25 16 10 10 6.3 4 50 10 6.3 25 16 25 16 10 6.3 25 16 10 6.3 50 35 10 6.3 50 25 50 25 16 10 50 35 10
D
F
D
D D D
D D
F D F
D D
D
D D K Ｄ・K
D
H
G
D
D Ｄ・K
D D
D D
D D
H
H
H
D
D H
G D
Ｄ・F
F D
D D D
D
D D
D
H F
注：グラフの記号は製品の厚み記号です。 Note : Letters in the table indicate thickness.
温度特性コード
Temp.char.Code
BJ
B7
F
温度特性
Temperature characteristics
準拠規格
Applicable standard
JIS
EIA
EIA
JIS
EIA
B
X5R
X7R
F
Y5V
温度範囲
〔℃〕
Temperature range
基準温度
〔℃〕
Ref. Temp.
−25∼＋85
−55∼＋85
−55∼＋125
−25∼＋85
−30∼＋85
20
25
25
20
25
静電容量許容差
〔％〕
tanδ
〔%〕
静電容量変化率
〔％〕 Capacitance tolerance Dissipation factor
Capacitance change
±10
±15
±15
＋30/−80
＋22/−82
±10
（K）
±20
（M）
2.5 max.*
＋80
（Z）
−20
7.0 max.*
*：代表的な値を記載しています。詳細はアイテム一覧表を参照ください。*：The figure indicates typical value. Please refer to PART NUMBERS table.
セレクションガイド
Selection Guide
P.12
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
P.46
P.54
梱包
Packaging
信頼性
Reliability Data
P.98
P.102
etc
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
9
使用上の注意
Precautions
P.108
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
45
■汎用・低背積層セラミックコンデンサ General・Low profile Multilayer Ceramic Capacitors
アイテム一覧
PART NUMBERS
■ 107TYPE
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
35V
25V
EHS
（Environmental
Hazardous
Substances）
形 名
Ordering code
1
RoHS
1
B/X5R
5
TMK107 BJ105□K*
1
RoHS
1
X5R
10
TMK107 BJ224□A
GMK107 BJ105□A*
RoHS
0.22
B/X5R
3.5
RoHS
0.47
B/X5R
3.5
1
RoHS
1
B/X5R
5
1
EMK107 BJ105□K*
RoHS
1
X5R
10
R
EMK107 BJ224□A
RoHS
0.22
B/X5R*
3.5
R/W
EMK107 BJ474□A
RoHS
0.47
B/X5R
R/W
0.8±0.1
0.8±0.1
R
0.8±0.1
0.45±0.05
0.8±0.1
3.5
0.8±0.1
RoHS
1
B/X5R
5
RoHS
2.2
B/X5R
10
1
RoHS
1
B/X5R
10
LMK107 BJ225□K*
1
RoHS
2.2
X5R
10
LMK107 BJ224□A
RoHS
0.22
B/X5R*
2
3.5
LMK107 BJ474□A
RoHS
0.47
B/X5R*
2
3.5
1
RoHS
1
B/X5R*
2
5
0.8±0.1
1
RoHS
2.2
B/X5R
10
0.8±0.1
1
RoHS
RoHS
4.7
0.47
X5R
B/X5R
10
5
0.8±0.1
0.45±0.05
1
RoHS
1
B/X5R
10
0.45±0.05
1
RoHS
2.2
X5R
10
1, 3
RoHS
4.7
X5R
10
LMK107 BJ105□K*
LMK107 BJ105□A*
LMK107 BJ225□A*
LMK107 BJ475□A*
JMK107 BJ474□K
JMK107 BJ105□K*
JMK107 BJ225□K*
JMK107 BJ475MK* *
0.8±0.1
R
±10%
±20%
0.8±0.1
0.45±0.05
0.45±0.05
R/W
0.8±0.1
0.8±0.1
0.45±0.05
R
±20%
0.45±0.05
1
RoHS
2.2
B/X5R
10
1
RoHS
4.7
X5R
10
±10%
±20%
0.8±0.1
JMK107 BJ106MA* *
1, 3
RoHS
10
X5R
10
±20%
0.8＋0.15/−0.1
1
AMK107 BJ225□K*
RoHS
2.2
X5R
10
±10%
±20%
0.45±0.05
1
RoHS
4.7
X5R
10
1
RoHS
10
X5R
10
1, 3
RoHS
22
X5R
10
JMK107 BJ225□A*
JMK107 BJ475□A*
4V
0.8±0.1
0.45±0.05
1
EMK107 BJ225□A*
6.3V
厚み
Thickness
〔mm〕
1
EMK107 BJ105□A*
10V
2
静電容量
許 容 差
Capacitance
tolerance
R
1
TMK107 BJ474□A*
TMK107 BJ105□A*
16V
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
AMK107 BJ475MK*
AMK107 BJ106MA*
AMK107 BJ226MA* *
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
*2 個別仕様の取交しにより、X7R仕様に対応している場合があります。
*3 ご使用の回路や機器により、個別仕様の取り交わしが必要になります。
必ず正規販売チャンネルにお問い合わせください。
0.8±0.1
0.45±0.05
±20%
0.8±0.1
0.8±0.2
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
*2 We may provide X7R for some items according to the individual specification.
*3 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channel.
【温度特性 Temp.char. B7:X7R】
定格電圧
Rated Voltage
16V
10V
6.3V
EHS
（Environmental
Hazardous
Substances）
形 名
Ordering code
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
1
RoHS
0.22
X7R
3.5
R/W
0.8±0.1
EMK107 B7 105□A*
LMK107 B7 224□A
LMK107 B7 474□A
1
LMK107 B7 105□A*
1
RoHS
RoHS
RoHS
RoHS
1
0.22
0.47
1
X7R
X7R
X7R
X7R
5
3.5
3.5
5
R
R/W
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
JMK107 B7 224□A
JMK107 B7 474□A
1
JMK107 B7 105□A*
RoHS
RoHS
RoHS
0.22
0.47
1
X7R
X7R
X7R
3.5
3.5
5
R/W
EMK107 B7 224□A*
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
46
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
Capacitance
factor
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
R
R
±10%
±20%
0.8±0.1
0.8±0.1
0.8±0.1
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
アイテム一覧 PART NUMBERS
【温度特性 Temp.char. F:F/Y5V】
定格電圧
Rated Voltage
50V
25V
10V
EHS
（Environmental
Hazardous
Substances）
UMK107 F104ZA
TMK107 F474ZA
EMK107 F224ZA
EMK107 F474ZA
EMK107 F105ZA
EMK107 F225ZA
LMK107 F105ZA
LMK107 F225ZA
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
0.1
0.47
0.22
0.47
1
2.2
1
2.2
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
7
7
16
16
16
16
9
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
＋80％
ー20%
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
0.8±0.1
R/W
R
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
4
CAPACITORS
16V
形 名
Ordering code
47
アイテム一覧 PART NUMBERS
■ 212TYPE
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
EHS
（Environmental
Hazardous
Substances）
形 名
Ordering code
35V
25V
0.1
B/X5R*
2
3.5
1.25±0.1
RoHS
0.22
B/X5R*
2
3.5
1.25±0.1
1
RoHS
0.47
B/X5R
3.5
UMK212 BJ105□G*
1
RoHS
1
X5R
5
GMK212 BJ474□G
1
GMK212 BJ105□G*
RoHS
RoHS
0.47
1
B/X5R
2
B/X5R*
3.5
3.5
1.25±0.1
1.25±0.1
TMK212 BJ474□D
TMK212 BJ105□D
TMK212 BJ105□G
RoHS
RoHS
RoHS
0.47
1
1
B/X5R
B/X5R
B/X5R
3.5
5
5
0.85±0.1
0.85±0.1
1.25±0.1
1
RoHS
2.2
B/X5R
5
1.25±0.1
1
RoHS
RoHS
RoHS
RoHS
4.7
1
2.2
4.7
X5R
B/X5R
B/X5R
B/X5R
10
5
5
10
1.25±0.15
0.85±0.1
0.85±0.1
0.85±0.1
UMK212 BJ474□G*
TMK212 BJ475□G*
EMK212 BJ105□D
EMK212 BJ225□D
1, 3
EMK212 BJ475□D* *
EMK212 BJ105□G
RoHS
1
B/X5R*
2
EMK212 BJ225□G
RoHS
2.2
B/X5R*
2
1
RoHS
4.7
B/X5R
EMK212 BJ475□G*
R
R/W
±10%
±20%
3.5
5
1.25±0.1
1.25±0.1
5
1.25±0.15
RoHS
10
X5R
10
1.25±0.15
RoHS
4.7
X5R
10
0.45±0.05
LMK212 BJ105□D
LMK212 BJ225□D
LMK212 BJ475□D
1
LMK212 BJ106□D*
RoHS
RoHS
RoHS
RoHS
1
2.2
4.7
10
B/X5R*
B/X5R
B/X5R
X5R
2
3.5
5
10
10
LMK212 BJ105□G
RoHS
1
B/X5R*
2
3.5
LMK212 BJ225□G
LMK212 BJ475□G
LMK212 BJ106□G
RoHS
RoHS
RoHS
2.2
4.7
10
B/X5R*
B/X5R
X5R
2
5
5
10
R
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
R/W
1.25±0.1
1.25±0.1
1.25±0.15
1.25±0.15
1, 3
RoHS
22
X5R
10
1
RoHS
4.7
X5R
10
1, 3
JMK212 BJ106MK* *
RoHS
10
X5R
10
JMK212 BJ475□D
RoHS
4.7
X5R
10
JMK212 BJ106□D
1, 3
JMK212 BJ226MD* *
RoHS
RoHS
10
22
X5R
X5R
10
10
JMK212 BJ475□G
JMK212 BJ106□G
1, 3
JMK212 BJ226MG* *
RoHS
RoHS
RoHS
4.7
10
22
B/X5R
X5R
X5R
5
10
10
±10%
±20%
1.25±0.15
1.25±0.15
1.25±0.15
1, 3
RoHS
47
X5R
10
±20%
1.25±0.2
1
RoHS
22
X5R
10
JMK212 BJ476MG* *
AMK212 BJ226MD*
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
*2 個別仕様の取交しにより、X7R仕様に対応している場合があります。
*3 ご使用の回路や機器により、個別仕様の取り交わしが必要になります。
必ず正規販売チャンネルにお問い合わせください。
48
R
1, 3
JMK212 BJ475□K*
4V
1.25±0.1
1
LMK212 BJ226MG* *
6.3V
1.25±0.1
R/W
LMK212 BJ475□K*
EMK212 BJ106□G* *
10V
厚み
Thickness
〔mm〕
RoHS
UMK212 BJ224□G*
TMK212 BJ225□G*
16V
静電容量
許 容 差
Capacitance
tolerance
1
UMK212 BJ104□G
50V
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
Capacitance
factor
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
±20%
±10%
±20%
R
±20%
±10%
±20%
±20%
1.25±0.2
0.45±0.05
0.45±0.05
0.85±0.1
0.85±0.1
0.85±0.1
0.85±0.1
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
*2 We may provide X7R for some items according to the individual specification.
*3 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channel.
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
アイテム一覧 PART NUMBERS
【温度特性 Temp.char. B7:X7R】
定格電圧
Rated Voltage
EHS
（Environmental
Hazardous
Substances）
形 名
Ordering code
UMK212 B7 104□G
50V
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
0.1
X7R
3.5
1.25±0.1
RoHS
0.22
X7R
3.5
1.25±0.1
1
RoHS
0.47
X7R
3.5
1
RoHS
1
X7R
3.5
1
UMK212 B7 474□G*
R/W
1.25±0.1
35V
GMK212 B7 105□G*
25V
TMK212 B7 105□G*
RoHS
1
X7R
5
R
1.25±0.1
EMK212 B7 474□D
EMK212 B7 105□D
EMK212 B7 105□G
RoHS
RoHS
RoHS
0.47
1
1
X7R
X7R
X7R
3.5
5
3.5
R/W
R
R/W
0.85±0.1
0.85±0.1
1.25±0.1
RoHS
RoHS
RoHS
RoHS
RoHS
2.2
1
1
2.2
4.7
X7R
X7R
X7R
X7R
X7R
10
3.5
3.5
5
10
16V
1
10V
EMK212 B7 225□G*
LMK212 B7 105□D
LMK212 B7 105□G
LMK212 B7 225□G
1
LMK212 B7 475□G*
1.25±0.1
±10%
±20%
1.25±0.1
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.15
R
R/W
R
R/W
4
CAPACITORS
RoHS
1
UMK212 B7 224□G*
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
【温度特性 Temp.char. F:F/Y5V】
定格電圧
Rated Voltage
50V
16V
10V
6.3V
形 名
Ordering code
EHS
（Environmental
Hazardous
Substances）
UMK212 F224ZD
UMK212 F474ZG
UMK212 F105ZG
EMK212 F225ZG
LMK212 F225ZD
LMK212 F475ZG
LMK212 F106ZG
JMK212 F475ZD
JMK212 F106ZG
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
0.22
0.47
1
2.2
2.2
4.7
10
4.7
10
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
7
7
9
9
16
16
16
9
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
＋80%
ー20%
0.85±0.1
1.25±0.1
1.25±0.1
1.25±0.1
0.85±0.1
1.25±0.1
1.25±0.1
0.85±0.1
1.25±0.1
R/W
R
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
49
アイテム一覧 PART NUMBERS
■ 316TYPE
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
50V
形 名
Ordering code
EHS
（Environmental
Hazardous
Substances）
0.22
B/X5R*
2
2.5
UMK316 BJ474□L
RoHS
0.47
B/X5R*
2
3.5
RoHS
1
B/X5R*
2
3.5
1.6±0.2
RoHS
RoHS
4.7
1
X5R
B/X5R
10
3.5
1.6±0.2
0.85±0.1
1
RoHS
2.2
B/X5R
3.5
0.85±0.1
1
TMK316 BJ475□D*
RoHS
4.7
X5R
5
0.85±0.1
TMK316 BJ225□L
UMK316 BJ105□L
TMK316 BJ225□D*
2.2
B/X5R*
RoHS
4.7
B/X5R
TMK316 BJ106□L*
1
RoHS
10
X5R
5
EMK316 BJ225□D
EMK316 BJ475□D
RoHS
RoHS
2.2
4.7
B/X5R
X5R
3.5
5
EMK316 BJ106□D*
RoHS
10
X5R
EMK316 BJ105□F
RoHS
1
B/X5R*
EMK316 BJ106□F*
1
RoHS
10
X5R
EMK316 BJ225□L
EMK316 BJ475□L
1
EMK316 BJ106□L*
RoHS
RoHS
RoHS
2.2
4.7
10
B/X5R*
B/X5R
B/X5R
EMK316 BJ226ML*
LMK316 BJ475□D
LMK316 BJ106□D
1, 3
LMK316 BJ226MD* *
1
RoHS
RoHS
RoHS
RoHS
22
4.7
10
22
B/X5R
B/X5R
B/X5R
X5R
10
5
10
10
±10%
±20%
LMK316 BJ106□L
RoHS
10
B/X5R
5
±10%
±20%
1
RoHS
22
B/X5R
10
LMK316 BJ476ML* *
1, 3
RoHS
47
X5R
10
JMK316 BJ106□D
RoHS
10
B/X5R
10
1, 3
RoHS
22
X5R
10
1, 3
RoHS
47
X5R
LMK316 BJ226ML*
JMK316 BJ226MD* *
JMK316 BJ476MD* *
定格電圧
Rated Voltage
50V
25V
16V
10V
6.3V
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
50
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
1.15±0.1
10
R
1.15±0.1
3.5
5
5
R/W
1.6±0.2
1.6±0.2
1.6±0.2
±20%
±20%
±20%
R
±10%
±20%
±20%
10
2
1.6±0.2
0.85±0.1
0.85±0.1
0.85±0.1
1.6±0.2
1.6±0.2
1.6±0.2
0.85±0.1
0.85±0.1
0.85±0.1
±20%
1.6±0.2
10
100
UMK316 B7 224□L
UMK316 B7 474□L
UMK316 B7 105□L
TMK316 B7 224□F
TMK316 B7 105□L
TMK316 B7 225□L
1
TMK316 B7 106□L*
EMK316 B7 105□F
EMK316 B7 225□L
1
EMK316 B7 106□L*
LMK316 B7 225□L
LMK316 B7 475□L
1
LMK316 B7 106□L*
JMK316 B7 106□L
R/W
10
100
RoHS
EHS
（Environmental
Hazardous
Substances）
0.85±0.1
3.5
X5R
RoHS
1
形 名
Ordering code
2
1.6±0.2
0.85±0.1
0.85±0.1
10
2
1.6±0.2
X5R
1, 3
【温度特性 Temp.char. B7:X7R】
1.6±0.2
±10%
±20%
5
1.6±0.2
1.6±0.2
1.6±0.2
B/X5R*
B/X5R
X5R
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
*2 個別仕様の取交しにより、X7R仕様に対応している場合があります。
*3 ご使用の回路や機器により、個別仕様の取り交わしが必要になります。
必ず正規販売チャンネルにお問い合わせください。
R
±10%
±20%
10
22
47
AMK316 BJ107ML*
3.5
5
10
10
RoHS
RoHS
RoHS
JMK316 BJ106□L
JMK316 BJ226□L
3
JMK316 BJ476ML*
JMK316 BJ107ML* *
4V
1.6±0.2
RoHS
1
6.3V
2
1.6±0.2
R/W
1
TMK316 BJ475□L*
10V
厚み
Thickness
〔mm〕
RoHS
UMK316 BJ475□L*
TMK316 BJ105□D
16V
静電容量
許 容 差
Capacitance
tolerance
UMK316 BJ224□L
1
25V
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
1.6±0.2
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
*2 We may provide X7R for some items according to the individual specification.
*3 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channel.
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
Capacitance
factor
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
0.22
0.47
1
0.22
1
2.2
10
1
2.2
10
2.2
4.7
10
10
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
X7R
2.5
3.5
3.5
2.5
3.5
3.5
10
3.5
3.5
10
3.5
5
5
5
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
±10%
±20%
1.6±0.2
1.6±0.2
1.6±0.2
1.15±0.1
1.6±0.2
1.6±0.2
1.6±0.2
1.15±0.1
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
1.6±0.2
R/W
R
R/W
R
R/W
R
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
アイテム一覧 PART NUMBERS
【温度特性 Temp.char. F:F/Y5V】
定格電圧
Rated Voltage
50V
35V
10V
6.3V
UMK316 F225ZG
GMK316 F475ZG
GMK316 F106ZL
TMK316 F106ZL
EMK316 F106ZL
LMK316 F475ZD
LMK316 F106ZF
LMK316 F226ZL
JMK316 F106ZD
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
2.2
4.7
10
10
10
4.7
10
22
10
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
9
9
9
9
16
16
16
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
＋80%
ー20%
1.25±0.1
1.25±0.1
1.6±0.2
1.6±0.2
1.6±0.2
0.85±0.1
1.15±0.1
1.6±0.2
0.85±0.1
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
±10%
±20%
1.5±0.1
R/W
R
4
CAPACITORS
25V
16V
EHS
（Environmental
Hazardous
Substances）
形 名
Ordering code
■ 325TYPE
【温度特性 Temp.char. BJ:B/X5R】
定格電圧
Rated Voltage
EHS
（Environmental
Hazardous
Substances）
形 名
Ordering code
RoHS
1
B/X5R*2
3.5
1
RoHS
4.7
X5R
5
2.5±0.2
UMK325 BJ106MM*
GMK325 BJ225MN
1
GMK325 BJ475MN*
1
RoHS
RoHS
RoHS
10
2.2
4.7
X5R
B/X5R
X5R
5
3.5
10
2.5±0.2
1.9±0.2
1.9±0.2
1
RoHS
10
B/X5R
5
1.9±0.2
TMK325 BJ106MD*
1
RoHS
10
B/X5R
5
0.85±0.1
TMK325 BJ225MH
RoHS
2.2
B/X5R*
2
3.5
1.5±0.1
TMK325 BJ335MN
RoHS
3.3
B/X5R*
2
3.5
1.9±0.2
TMK325 BJ475MN
RoHS
4.7
B/X5R*
2
3.5
1.9±0.2
TMK325 BJ106MN
RoHS
10
B/X5R
5
1.9±0.2
TMK325 BJ106MM*
1
RoHS
10
B/X5R
3.5
2.5±0.2
1
RoHS
10
B/X5R
5
0.85±0.1
EMK325 BJ226MD* *
1, 3
RoHS
22
B/X5R
10
0.85±0.1
EMK325 BJ475MN
RoHS
4.7
B/X5R*
3.5
1.9±0.2
EMK325 BJ106MN
RoHS
10
B/X5R
3.5
1
RoHS
22
B/X5R
5
EMK325 BJ476MM*
1
RoHS
47
X5R
10
2.5±0.2
LMK325 BJ335MD
LMK325 BJ475MD
RoHS
RoHS
3.3
4.7
B/X5R
B/X5R
3.5
5
0.85±0.1
0.85±0.1
UMK325 BJ105□H
50V
35V
UMK325 BJ475MM*
GMK325 BJ106MN*
25V
EMK325 BJ106MD*
16V
EMK325 BJ226MM*
R
±20%
1.9±0.2
2.5±0.2
RoHS
10
B/X5R
5
0.85±0.1
LMK325 BJ226MY *
1
RoHS
22
B/X5R
5
1.9＋0.1/ー0.2
LMK325 BJ106MN
RoHS
10
B/X5R*
3.5
1.9±0.2
LMK325 BJ226MM
RoHS
22
B/X5R
5
2.5±0.2
2
1
RoHS
47
X5R
10
2.5±0.2
1, 3
LMK325 BJ107MM* *
JMK325 BJ226MY
RoHS
RoHS
100
22
X5R
B/X5R
10
5
2.5±0.3
1.9＋0.1/ー0.2
1, 3
RoHS
100
X5R
10
1.9＋0.1/ー0.2
1
RoHS
47
X5R
10
1.9±0.2
1
RoHS
47
X5R
10
2.5±0.2
1
RoHS
100
X5R
10
2.5±0.3
LMK325 BJ476MM*
JMK325 BJ107MY * *
6.3V
2
R/W
1
LMK325 BJ106MD*
10V
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
Capacitance
factor
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
JMK325 BJ476MN*
JMK325 BJ476MM*
JMK325 BJ107MM*
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
*2 個別仕様の取交しにより、X7R仕様に対応している場合があります。
*3 ご使用の回路や機器により、個別仕様の取り交わしが必要になります。
必ず正規販売チャンネルにお問い合わせください。
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
*2 We may provide X7R for some items according to the individual specification.
*3 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channel.
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
51
アイテム一覧 PART NUMBERS
【温度特性 Temp.char. B7:X7R】
定格電圧
Rated Voltage
50V
25V
16V
10V
EHS
（Environmental
Hazardous
Substances）
形 名
Ordering code
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
UMK325 B7 105□H
RoHS
1
X7R
3.5
TMK325 B7 225MH
TMK325 B7 335MN
RoHS
RoHS
2.2
3.3
X7R
X7R
3.5
3.5
1
RoHS
4.7
X7R
3.5
TMK325 B7 106MN*
1
RoHS
10
X7R
5
EMK325 B7 475MN
LMK325 B7 106MN
RoHS
RoHS
4.7
10
X7R
X7R
3.5
3.5
TMK325 B7 475MN*
R/W
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
±10%
±20%
1.5±0.1
1.5±0.1
1.9±0.2
R
±20%
1.9±0.2
1.9±0.2
1.9±0.2
1.9±0.2
□ Please specify the capacitance tolerance code.
*1 Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
形名の□には静電容量許容差記号が入ります。
*1 高温負荷試験の試験電圧は定格電圧の 1.5 倍
【温度特性 Temp.char. F:F/Y5V】
定格電圧
Rated Voltage
50V
35V
16V
10V
6.3V
52
形 名
Ordering code
EHS
（Environmental
Hazardous
Substances）
UMK325 F475ZH
GMK325 F106ZH
EMK325 F226ZN
LMK325 F106ZF
LMK325 F226ZN
JMK325 F476ZN
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
実装条件
公 称
tanδ
温度特性
静電容量
Dissipation Soldering method
Temperature
factor
Capacitance
R:リフロー Reflow soldering
characteristics
〔%〕Max. W: フロー Wave soldering
〔μF〕
4.7
10
22
10
22
47
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
7
7
16
16
16
16
9
R
静電容量
許 容 差
Capacitance
tolerance
厚み
Thickness
〔mm〕
＋80％
ー20%
1.5±0.1
1.5±0.1
1.9±0.2
1.15±0.1
1.9±0.2
1.9±0.2
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
特性図 ELECTRICAL CHARACTERISTICS
インピーダンス・ESR−周波数特性例 Example of Impedance ESR vs. Frequency characteristics
・当社積層セラミックコンデンサ例 (Taiyo Yuden multilayer ceramic capacitor)
TMK107BJ105KA
54
AMK107BJ226MA
JMK107BJ106MA
EMK212BJ105KG
EMK212BJ106KG
JMK212BJ226MG
TMK316BJ106KL
JMK316BJ476ML
JMK316BJ107ML
GMK325BJ106MN
EMK325BJ476MM
JMK325BJ107MY
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
特性図 ELECTRICAL CHARACTERISTICS
UMK107F104ZA
LMK107F225ZA
LMK107F105ZA
4
CAPACITORS
UMK212F224ZD
UMK212F105ZG
LMK212F106ZG
UMK316F225ZG
GMK316F106ZL
LMK316F226ZL
UMK325F475ZH
GMK325F106ZH
JMK325F476ZN
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
9
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
55
梱包 PACKAGING
①最小受注単位数 Minimum Quantity
■テーピング梱包 Taped packaging
形式
（EIA ）
Type
標準数量
Standard quantity
[ pcs ]
製品厚み
Thickness
紙テープ
paper
エンボステープ
Embossed tape
C
15000
̶
P
15000
̶
10000
̶
10000
̶
10000
̶
mm
（inch）
code
□MK042
（01005）
0.2
（0.008）
□MK063
（0201）
0.3
（0.012）
0.3
（0.012）
P
0.45
（0.018）
K
□2K096
（0302）
□WK105
（0204）
□MK105
（0402）
□VK105（0402）
0.3
（0.012）
0.5
（0.020）
P
V, W
W
0.45
（0.018）
K
4000
̶
0.5
（0.020）
V
̶
4000
0.8
（0.031）
A
4000
̶
0.5
（0.020）
V
4000
̶
0.8
（0.031）
A
4000
̶
0.6
（0.024）
B
4000
̶
0.45
（0.018）
K
4000
̶
0.85
（0.033）
D
4000
̶
1.25
（0.049）
G
̶
3000
□4K212
（0805）
0.85
（0.033）
D
4000
̶
□2K212
（0805）
0.85
（0.033）
D
4000
̶
0.85
（0.033）
D
4000
̶
1.15
（0.045）
F
1.25
（0.049）
G
̶
3000
1.6
（0.063）
L
̶
2000
0.85
（0.033）
D
̶
2000
□MK107
（0603）
□WK107
（0306）
□2K110
（0504）
□MK212
（0805）
□WK212
（0508）
□MK316
（1206）
□MK325
（1210）
□MK432
（1812）
1.15
（0.045）
F
1.5
（0.059）
H
1.9
（0.075）
N
2.0max
（0.079）
Y
̶
③バルクカセット Bulk Cassette
2000
2.5
（0.098）
M
̶
500（Ｔ）,
1000（Ｐ）
2.5
（0.098）
M
̶
500
②テーピング材質 Taping material
※□WK
※プレスポケットタイプは、
ボトムテープ無し。
Unit：mm（inch）
105, 107, 212形状で個別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch)
※□WK
98
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
梱包 PACKAGING
③テーピング寸法 Taping dimensions
紙テープ Paper Tape（8mm幅）
（0.315inches wide）
エンボステープ Embossed tape（8mm幅）
（0.315inches wide）
部品挿入角穴
4
2.0±0.05
テープ厚み
挿入ピッチ
Insertion Pitch Tape Thickness
チップ挿入部
Chip Cavity
Type
（ＥＩＡ）
Ａ
Ｂ
Ｆ
Ｔ
T1
0.25
□MK042
（01005）
（0.010）
2.0±0.05
0.36max. 0.27max.
0.45
（0.018） （0.079±0.002） （0.014） （0.011）
0.37
□MK063
（0201）
（0.016）
2.0±0.05
0.45max. 0.42max.
0.67
（0.027） （0.079±0.002） （0.018） （0.017）
0.65
□WK105
（0204）
（0.026）
2.0±0.05
0.45max 0.42max
1.15
（0.045） （0.079±0.002）（0.018max）（0.017max）
チップ挿入部
Type
□WK107（0306）
□MK212（0805）
Unit：mm（inch）
□MK316（1206）
部品挿入角穴
□MK325（1210）
テープ厚み
Insertion Pitch Tape Thickness
Chip cavity
（EIA）
挿入ピッチ
CAPACITORS
T1
2.0±0.05
A
B
1.0
1.8
F
1.3max. 0.25±0.1
K
T
（0.039）
（0.071）
（0.051max.）
（0.01±0.004）
1.655
2.4
（0.065）
（0.094）
2.0
3.6
（0.079）
（0.142）
2.8
3.6
（0.110）
（0.142）
4.0±0.1
（0.157±0.004）3.4max. 0.6max.
（0.134max.）（0.024max.）
Unit：mm（inch）
エンボステープ Embossed tape（12mm幅）
（0.472inches wide）
2.0±0.05
2.0±0.05
Type
（EIA）
□2K096
（0302）
チップ挿入部
挿入ピッチ
Chip Cavity
Insertion Pitch Tape Thickness
A
B
0.72
1.02
（0.028）
□MK105
（0402）
0.655
□VK105
（0402）
（0.026）
F
テープ厚み
T
52.0±0.05 0.45max.(0.018max)
（0.040） （0.079±0.002）0.6max.(0.024max)
1.155
52.0±0.05
0.8max.
（0.045） （0.079±0.002）（0.031max.）
Unit：mm（inch）
Type
（EIA）
□MK432（1812）
チップ挿入部
A
3.7
（0.146）
挿入ピッチ
テープ厚み
Insertion Pitch Tape Thickness
Chip cavity
B
F
4.9
8.0±0.1
K
T
4.0max. 0.6max.
（0.193） （0.315±0.004） （0.157max.）（0.024max.）
Unit：mm（inch）
Type
（EIA）
チップ挿入部
挿入ピッチ
Chip Cavity
Insertion Pitch Tape Thickness
A
□MK107
（0603）
1.0
（0306） （0.039）
□WK107
□2K110
（0504）
1.15
（0.045）
B
F
T
1.8
4.0±0.1
1.1max.
（0.071） （0.157±0.004） （0.043max.）
1.55
4.0±0.1
1.0max.
（0.061） （0.157±0.004） （0.039max.）
□MK212
（0805）
□WK212
（0508）
1.655
2.4
□4K212
（0805）
（0.065）
（0.094）
4.0±0.1
1.1max.
（0.157±0.004） （0.043max.）
□2K212
（0805）
□MK316
（1206）
テープ厚み
2.0
3.6
（0.079）
（0.142）
Unit：mm（inch）
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
99
梱包 PACKAGING
④リーダー部／空部 Leader and Blank portion
160mm以上
（6.3inches or more）
100mm以上
（3.94inches or more）
引き出し方向
Direction of tape feed
400mm以上
（15.7inches or more）
⑤リール寸法 Reel size
⑥トップテープ強度 Top Tape Strength
トップテープのはがし力は下図矢印方向にて0.1∼0.7Nとなります。
The top tape requires a peel-off force of 0.1∼0.7N in the direction of the
arrow as illustrated below.
100
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
1/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Item
Standard
1.Operating Temperature
High Permitivity（Class 2）
Temperature Compensating（Class 1）
High Frequency Type
Standard Note1
BJ：−55 to ＋125℃
−55 to ＋125℃
Test Methods and Remarks
High Value
−25 to ＋85℃
High Capacitance Type
BJ（X7R）
：−55∼＋125℃, BJ（X5R）
：−55∼＋85℃
−25 to ＋85℃
High Capacitance Type
BJ（X7R）
：−55∼＋125℃, BJ（X5R）
：−55∼＋85℃
F：−25 to ＋85℃
Range
2. S t o r a g e Te m p e r a t u r e
BJ：−55 to ＋125℃
−55 to ＋125℃
E（Y5U）：−30∼＋85℃, F（Y5V）：−30∼＋85℃
F：−25 to ＋85℃
Range
50VDC,25VDC,
16VDC
16VDC
50VDC
No breakdown or
No abnormality
50VDC,25VDC
E（Y5U）：−30∼＋85℃, F（Y5V）：−30∼＋85℃
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC, 2.5VDC
4.Withstanding Voltage
Between terminals
Applied voltage: Rated voltage×3 （Class 1）
No breakdown or damage
Rated voltage×2.5（Class 2）
damage
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max.（Class 1,2）
5.Insulation Resistance
500 MΩμF. or 10000 MΩ., whichever is the Applied voltage: Rated voltage
10000 MΩ min.
Duration: 60±5 sec.
smaller.
Charge/discharge current: 50mA max.
Note 5
6.Capacitance（Tolerance）
0.5 to 5 pF: ±0.25 pF
0.5 to 2 pF : ±0.1 pF
BJ: ±10%, ±20%
BJ：±10％、±20％
1 to 10pF: ±0.5 pF
2.2 to 5.1 pF : ±5%
F：＋80%
F：−20％／＋80％
5 to 10 pF: ±1 pF
−20
11 pF or over: ± 5%
±10%
105TYPER△, S△, T△, U△ only
0.5∼2pF: ±0.1pF
2.2∼20pF: ±5%
7.Q or Tangent of Loss Angle
Under 30 pF
R e f e r t o d e t a i l e d BJ: 2.5% max.（50V, 25V） BJ：2.5％ max.
（tan δ）
: Q≧400 ＋ 20C
specification
F: 5.0% max.（50V, 25V） F：7％ max.
Note 4
30 pF or over : Q≧1000
Note 4
C= Nominal capacitance
Measuring frequency：
Class1： 1ＭHz±10%（C≦1000pF）
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4
Class1：0.5∼5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
Bias application: None
Multilayer:
Measuring frequency：
Class1： 1ＭHz±10%（C≦1000pF）
1ｋHz±10%（C＞1000pF）
Class2： 1ｋHz±10%（C≦10μF）
120Hz±10Hz（C＞10μF）
Measuring voltage：
Note 4 Class1：0.5∼5Vrms（C≦1000pF）
1±0.2Vrms（C＞1000pF）
Class2： 1±0.2Vrms（C≦10μF）
0.5±0.1Vrms（C＞10μF）
Bias application: None
HighーFrequencyーMultilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
8.Temperature
（Without
CK：0±250
CH：0±60
BJ：±10％（−25∼85℃） BJ：±10％
According to JIS C 5102 clause 7.12.
Characteristic
voltage ap-
CJ：0±120
RH：−220±60
F： ＋30％（−25∼85℃）
（−25∼＋85℃）
Temperature compensating:
BJ（X7R）
：±15％
F：＋30％／−80％
Measurement of capacitance at 20℃ and 85℃ shall be
F（Y5V）
：＋22
％
（−25∼＋85℃）
made to calculate temperature characteristic by the fol-
of Capacitance plication）
CH：0±60
4
CAPACITORS
3.Rated Voltage
（ppm/℃）
CG：0±30
−80
−82
RH：−220±60
BJ（X7R、X5R）
：
SK：−330±250
±15％
SJ：−330±120
F（Y5V）
：
SH：−330±60
＋22％／−82％
lowing equation.
（C85ー C20）
× 106 （ppm/℃）
C20×△T
High permitivity:
TK：−470±250
Change of maximum capacitance deviation in step 1 to 5
TJ：−470±120
Temperature at step 1: ＋20℃
UK：−750±250
Temperature at step 2: minimum operating temperature
UJ：−750±120
Temperature at step 3: ＋20℃（Reference temperature）
S L ： ＋ 350 t o ー 1000
Temperature at step 4: maximum operating temperature
Temperature at step 5: ＋20℃
（ppm/℃）
Reference temperature for X7R, X5R, Y5U and Y5V shall be ＋25℃
9.Resistance to Flexure of
Substrate
Appearance:
Appearance:
Appearance:
No abnormality
No abnormality
No abnormality
Capacitance change:
Capacitance change:
Capacitance change:
Within ±5% or ±0.5 pF,
Within±0.5 pF
BJ：Within ±12.5%
whichever is larger.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
Warp: 1mm
Testing board: glass epoxyーresin substrate
Thickness: 1.6mm（063 TYPE : 0.8mm）
The measurement shall be made with board in the bent position.
F：Within ±30%
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
103
2/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating（Class 1）
Item
Standard
10.Body Strength
High Frequency Type
High Permittivity（Class 2）
Standard Note1
Test Methods and Remarks
High Value
No mechanical dam-
High Frequency Multilayer:
age.
Applied force: 5N
4
Duration: 10 sec.
A
11.Adhesion of Electrode
No separation or indication of separation of electrode.
A
（LW Reverse）
Applied force: 5N
（01005, 0201, 0302 TYPE 2N）
Duration: 30±5 sec.
12.Solderability
At least 95% of terminal electrode is covered by new solder.
Solder temperature: 230±5℃
13.Resistance to soldering
Appearance: No ab- Appearance: No ab-
Appearance: No abnormality
normality
Capacitance change: Within ±7.5%（BJ）
CAPACITORS
A
Duration: 4±1 sec.
normality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
Within ±20%（F）
Capacitance change: Capacitance change:
W i t h i n ± 2 . 5 % o r Within ±2.5%
tan δ: Initial value
±0.25pF, whichever is
Q: Initial value
Insulation resistance: Initial value
larger.
Insulation resistance:
Withstanding voltage（between terminals）
: No
Q: Initial value
Initial value
abnormality
Note 4
Duration: 3±0.5 sec.
Preheating conditions: 80 to 100℃, 2 to 5 min. or 5 to 10 min.
150 to 200℃, 2 to 5 min. or 5 to 10 min.
Recovery: Recovery for the following period under the
Insulation resistance: Withstanding voltage
standard condition after the test.
6∼24 hrs（Class 1）
（between terminals）:
Initial value
（Applicable to Class 2.）
Solder temperature: 270±5℃
24±2 hrs（Class 2）
Withstanding voltage No abnormality
（between terminals）:
No abnormality
14.Thermal shock
Appearance: No ab- Appearance: No abnormality
normality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
Appearance: No abnormality
Capacitance change: Within ±7.5%（BJ）
Within ±20%（F）
Capacitance change: Capacitance change:
（Applicable to Class 2.）
Conditions for 1 cycle:
0 ℃ 30±3 min.
Step 1: Minimum operating temperature ＋
−3
W i t h i n ± 2 . 5 % o r Within ±0.25pF
tan δ: Initial value
±0.25pF, whichever is
Q: Initial value
Insulation resistance: Initial value
Step 2: Room temperature
larger.
Insulation resistance:
Withstanding voltage（between terminals）
: No
0 ℃ 30±3 min.
Step 3: Maximum operating temperature −
＋
Q: Initial value
Initial value
abnormality
Step 4: Room temperature
Note 4
2 to 3 min.
Number of cycles: 5 times
Insulation resistance: Withstanding voltage
Recovery after the test: 6∼24 hrs（Class 1）
（between terminals）:
Initial value
2 to 3 min.
3
24±2 hrs（Class 2）
Withstanding voltage No abnormality
（between terminals）:
No abnormality
15.Damp Heat（steady state）
Appearance: No ab-
Appearance: No ab-
Multilayer：
normality
normality
Preconditioning: Thermal treatment（at 150℃ for 1 hr）
Capacitance change: Capacitance change:
Capacitance change:
Capacitance change:
Within ±5% or ±0.5pF,
Within ±0.5pF,
BJ: Within ±12.5%
BJ:Within ±12.5%
Temperature: 40±2℃
whichever is larger.
Insulation resistance:
F: Within ±30%
Note 4
Humidity: 90 to 95% RH
Q:
1000 MΩ min.
tan δ: BJ: 5.0% max.
tan δ:
Duration: 500 ＋24
−0 hrs
BJ: 5.0% max. Note 4.
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
Appearance: No ab- Appearance: No abnormality
normality
C≧30 pF
F: 7.5% max.
: Q≧350
10 ≦ C ＜ 30 p F : Q ≧
Note 4
F: 11.0% max.
275 ＋ 2.5C
Insulation resistance:
Insulation resistance:
C＜10 pF
: Q≧200
50 MΩμF or 1000 MΩ 50 MΩμF or 1000 MΩ
（Applicable to Class 2.）
6∼24 hrs（Class 1）
24±2 hrs（Class 2）
＋ 10C
whichever is smaller.
whichever is smaller.
HighーFrequency Multilayer:
C: Nominal capacitance
Note 5
Note 5
Temperature: 60±2℃
Insulation resistance:
Humidity: 90 to 95% RH
1000 MΩ min.
＋24 hrs
Duration: 500 −
0
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6∼24 hrs（Class 1）
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3/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Item
16.Loading under Damp Heat
High Permittivity（Class 2）
Test Methods and Remarks
Standard
High Frequency Type
Standard Note1
High Value
Appearance: No abnormality
Capacitance change:
Within ± 7.5% or ±
0.75pF, whichever is
larger.
Q: C≧30 pF: Q≧200
C＜30 pF: Q≧100 ＋
10C/3
C ： Nominal capacitance
Insulation resistance:
500 MΩ min.
Appearance: No abnormality
Capacitance change:
C≦2 pF: Within ±0.4 pF
C＞2 pF: Within ±0.75
pF
C ： Nominal capacitance
Insulation resistance:
500 MΩ min.
Appearance: No abnormality
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
tan δ: BJ: 5.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
Appearance: No abnormality
Capacitance change:
BJ：Within±12.5％
F：Within±30％
Note 4
tanδ：
BJ：5.0％max.
F：11％max.
Note 4
Insulation resistance:
25 MΩμF or 500 MΩ,
whichever is the smaller.
Note 5
According to JIS C 5102 Clause 9. 9.
Multilayer:
Preconditioning: Voltage treatment（Class 2）
Temperature: 40±2℃
Humidity: 90 to 95% RH
Duration: 500 ＋24
hrs
−0
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.（Class 1,2）
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
6∼24 hrs（Class 1）
24±2 hrs（Class 2）
HighーFrequency Multilayer:
Temperature: 60±2℃
Humidity: 90 to 95% RH
＋24
Duration: 500 −
hrs
0
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 6∼24 hrs of recovery under the standard
condition after the removal from test chamber.
Appearance: No abnormality
Capacitance change:
Within ±3% or
±0.3pF, whichever is
larger.
Q: C≧30 pF : Q≧350
10≦C＜30 pF: Q≧275
＋ 2.5C
C＜10 pF: Q≧200 ＋
10C
C：Nominal
capacitance
Insulation resistance:
1000 MΩ min.
Appearance: No abnormality
Capacitance change:
Within ±3% or ±
0.3pF, whichever is
larger.
Insulation resistance:
1000 MΩ min.
Appearance: No abnormality
Capacitance change:
BJ：Within±12.5％
Within±20％※※
Within±25％※※
F：Within±30％
Note 4
tanδ：
BJ：5.0％max.
F：11％max.
Note 4
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
According to JIS C 5102 clause 9.10.
Multilayer:
Preconditioning: Voltage treatment（Class 2）
Temperature:125±3℃（Class 1, Class 2: B, BJ（X7R）
）
85±2℃（Class 2: BJ,F）
＋48
Duration: 1000 −
0 hrs
Applied voltage: Rated voltage×2 Note 6
Recovery: Recovery for the following period under the
standard condition after the removal from test chamber.
6∼24 hrs（Class 1）
24±2 hrs（Class 2）
HighーFrequency Multilayer:
Temperature: 125±3℃（Class 1）
Duration: 1000＋48
hrs
−0
Applied voltage: Rated voltage×2
Recovery: 6∼24 hrs of recovery under the standard
condition after the removal from test chamber.
Appearance: No abnormality
Capacitance change:
BJ: Within ±12.5%
F: Within ±30%
Note 4
tan δ:
BJ: 4.0% max.
F: 7.5% max.
Note 4
Insulation resistance:
50 MΩμF or 1000 MΩ,
whichever is smaller.
Note 5
4
CAPACITORS
17.Loading at High Temperature
Temperature Compensating（Class 1）
Note 1
:For 105 type, specified in "High value".
Note 2
:Thermal treatment（Multilayer）
: 1 hr of thermal treatment at 150 ＋0 /−10 ℃ followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
Note 3
:Voltage treatment（Multilayer）: 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 24±2 hrs of recovery under the standard condition shall be performed before the measurement.
Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications.
Note 6
:Some of the parts are applicable in rated voltage×1.5. Please refer to individual specifications.
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative
humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
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107
1/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
1.Circuit Design
Precautions
Technical considerations
Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear
4
reactors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
CAPACITORS
used in such equipment may require higher safety and/or
reliability considerations and should be clearly differentiated
from components used in general purpose applications.
Operating Voltage（Verification of Rated voltage）
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the
two peak voltages should be lower than the rated value of
the capacitor chosen. For a circuit where both an AC and a
pulse voltage may be present, the sum of their peak voltages
should also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high frequency AC voltage or a pulse voltage having rapid rise time
is present in the circuit.
2.PCB Design
Pattern configurations
（Design of Land-patterns）
1. When capacitors are mounted on a PCB, the amount of
solder used（size of fillet）can directly affect capacitor per-
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.（larger fillets which extend above the component
end terminations）
Examples of improper pattern designs are also shown.
formance. Therefore, the following items must be carefully
considered in the design of solder land patterns:
（1）Recommended land dimensions for a typical chip capacitor land patterns for PCBs
（1）The amount of solder applied can affect the ability of
chips to withstand mechanical stresses which may lead
to breaking or cracking. Therefore, when designing
land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in
turn determines the amount of solder necessary to form
the fillets.
Recommended land dimensions for wave-soldering （unit: mm）
（2）When more than one part is jointly soldered onto the
Type
107
212
316
L
1.6
2.0
3.2
3.2
W
0.8
51.25
1.6
2.5
same land or pad, the pad must be designed so that each
component's soldering point is separated by solder-resist.
Size
325
A
0.8∼1.0
1.0∼1.4
1.8∼2.5
1.8∼2.5
B
0.5∼0.8
0.8∼1.5
0.8∼1.7
0.8∼1.7
C
0.6∼0.8
0.9∼1.2
1.2∼1.6
1.8∼2.5
Recommended land dimensions for reflow-soldering （unit: mm）
Type
Size
042
063
105
107
212
316
325
L
0.4
0.6
1.0
1.6
2.0
3.2
3.2
432
4.5
W
0.2
0.3
0.5
0.8
51.25
1.6
2.5
3.2
A
0.15∼0.25 0.20∼0.30 0.45∼0.55 0.8∼1.0 0.8∼1.2 1.8∼2.5 1.8∼2.5 2.5∼3.5
B
0.10∼0.20 0.20∼0.30 0.40∼0.50 0.6∼0.8 0.8∼1.2 1.0∼1.5 1.0∼1.5 1.5∼1.8
C
0.15∼0.30 0.25∼0.40 0.45∼0.55 0.6∼0.8 0.9∼1.6 1.2∼2.0 1.8∼3.2 2.3∼3.5
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns.
Size
Type
2.0
W
1.25
a
0.5∼0.6
b
0.5∼0.6
c
0.2∼0.3
d
0.5
Type
212（2 circuits） 110（2 circuits）096（2 circuits）
L
2.0
1.37
W
1.25
1.0
0.6
a
0.5∼0.6
0.35∼0.45
0.25∼0.35
b
0.5∼0.6
0.55∼0.65
0.15∼0.25
c
0.5∼0.6
0.3∼0.4
0.15∼0.25
d
1.0
0.64
0.45
Size
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212（4 circuits）
L
0.9
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109
2/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
LWDC Recommended land dimensions for reflow-soldering
4
Size
L
107
212
50.8
1.25
1.0
1.6
2.0
W
A
0.18∼0.22 0.25∼0.3 0.5∼0.7
B
0.2∼0.25 0.3∼0.4
C
0.9∼1.1
1.5∼1.7
CAPACITORS
105
0.52
Type
0.4∼0.5
1.9∼2.1
（unit: mm）
（2）Examples of good and bad solder application
2.PCB Design
Not recommended
Items
Recommended
Mixed mounting
of SMD and
leaded components
Component
placement close
to the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Pattern configurations
（Capacitor layout on panelized [breakaway] PC boards）
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should
be located to minimize any possible mechanical stresses from board warp or deflection.
1. After capacitors have been mounted on the boards, chips
can be subjected to mechanical stresses in subsequent
Not recommended
Recommended
manufacturing processes（PCB cutting, board inspection,
mounting of additional parts, assembly into the chassis, wave
soldering the reflow soldered boards etc.） For this reason,
Deflection of
planning pattern configurations and the position of SMD ca-
the board
pacitors should be carefully performed to minimize stress.
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the
amount of mechanical stresses given will vary depending on capacitor layout. The
example below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress
on the capacitors can vary according to the method used.
The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving,
and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB
splitting procedure.
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PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
3.Considerations for automatic placement
Precautions
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the capacitors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
Technical considerations
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
（1）The lower limit of the pick-up nozzle should be adjusted to the surface level of the
PC board after correcting for deflection of the board.
（2）The pick-up pressure should be adjusted between 1 and 3 N static loads.
nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided
4
CAPACITORS
（3）To reduce the amount of deflection of the board caused by impact of the pick-up
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between
1. Mounting capacitors with adhesives in preliminary assembly,
the shrinkage percentage of the adhesive and that of the capacitors may result in
before the soldering stage, may lead to degraded capacitor
stresses on the capacitors and lead to cracking. Moreover, too little or too much
characteristics unless the following factors are appropriately
adhesive applied to the board may adversely affect component placement, so the fol-
checked; the size of land patterns, type of adhesive, amount
lowing precautions should be noted in the application of adhesives.
applied, hardening temperature and hardening period.
Therefore, it is imperative to consult the manufacturer of the
adhesives on proper usage and amounts of adhesive to use.
（1）
Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2）
The recommended amount of adhesives is as follows;
Figure
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212/316 case sizes as examples
a
0.3mm min
b
100 ∼120 μm
c
Adhesives should not contact the pad
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113
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PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
4. Soldering
Precautions
Technical considerations
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate
Selection of Flux
1. Since flux may have a significant effect on the performance
the flux, or highly acidic flux is used, an excessive amount of residue after soldering
of capacitors, it is necessary to verify the following condi-
may lead to corrosion of the terminal electrodes or degradation of insulation resis-
tions prior to use;
tance on the surface of the capacitors.
（1）Flux used should be with less than or equal to 0.1 wt%
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a
（equivelent to chroline）of halogenated content. Flux
large amount of flux gas may be emitted and may detrimentally affect solderability. To
minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the
flux applied should be controlled at the optimum level.
air, the residue on the surface of capacitors in high humidity conditions may cause a
（3）When using water-soluble flux, special care should be
degradation of insulation resistance and therefore affect the reliability of the compo-
taken to properly clean the boards.
nents. The cleaning methods and the capability of the machines used should also be
considered carefully when selecting water-soluble flux.
Soldering
1-1. Preheating when soldering
Temperature, time, amount of solder, etc. are specified in ac-
Heating: Ceramic chip components should be preheated to within 100 to 130℃ of the
CAPACITORS
having a strong acidity content should not be applied.
（2）When soldering capacitors on the board, the amount of
4
soldering.
cordance with the following recommended conditions.
Cooling: The temperature difference between the components and cleaning process
should not be greater than 100℃.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
Sn-Zn solder paste can affect MLCC reliability performance.
[Reflow soldering]
Please contact us prior to usage.
温度
（℃）
300
Temperature profile
Peak 260℃ max
10 sec max
200
200
徐冷
Gradually
cooling
Preheating
100
100
0
予熱150℃
60秒以上
本加熱230℃以上
40秒迄
0
※チップとはんだ温度との差が100∼１３０℃以下になるよ
うに十分予熱を行ってください。
※回数は２回迄の保証となります。
温度
（℃）
300
Caution
150℃
60 sec min
Heating above 230℃
40 sec max
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
（Pb free soldering）
Temperature
（℃）
300
1. The
ideal condition is to have solder mass （fillet）
controlled
tomax
1/2 to 1/3 of the
Peak 260℃
ピーク260℃以下
10 sec max
10秒迄
thickness of the capacitor, as shown below:
200
（Pb free soldering）
Temperature
（℃）
300
ピーク260℃以下
10秒迄
予熱150℃
200
Gradually
cooling
Preheating
150℃
徐冷
100
（Pb free soldering）
Temperature
（℃）
300
Capacitor
120秒以上
Peak
260℃
ピーク260℃以下
120
sec
min max
10 sec max
10秒迄
0
0
Solder
200 ※Ceramic chip components should be preheated to
200 ※チップとはんだ温度との差が１００∼１３０℃以下になるよ
100
温度
（℃）
300
100
うに十分予熱を行ってください。
※回数は１回迄の保証となります。
※リフロー仕様アイテムは除きます。
徐冷
PC board
100
within 100 to 130℃ of the soldering. Gradually
※Assured to be wave soldering for 1 time.
cooling
※Except for reflow
soldering type.
Preheating
2. Because
dwell times can detrimentally affect solderability,
soldering
150℃
予熱150℃ excessive
Heating abovedu230℃
本加熱230℃以上
60 sec min （Pb free
60秒以上
40 sec
max
40秒迄
soldering）
Temperature
温度
（℃）
0 （℃）
0
ration should be kept as close to recommended
as possible.
400 times
400 ※チップとはんだ温度との差が100∼
※Ceramic chip components should be preheated to
１３０℃以下になるよ
350℃以下
3秒迄
うに十分予熱を行ってください。
[Wave soldering]
300 ※回数は２回迄の保証となります。
⊿Ｔ
Temperature
200
温度
（℃）
100
300
profile
徐冷
350℃ max
within 100 to 130℃ of the soldering. 3 sec max
※Assured to be reflow soldering for 2 times.
Gradually
⊿Ｔ
cooling
300
200
（Pb free soldering）
Temperature
（℃）
100
300
ピーク260℃以下
60秒以上
10秒迄
60 secmax
min
Peak 260℃
10 sec max
0
200（※⊿Ｔ≦190℃（3216タイプ以下）、⊿Ｔ≦130℃（3225以上）。）
0
200（※⊿Ｔ≦190℃（3216Type max）, ⊿Ｔ≦130℃（3225
100
100 ※The soldering iron should not directly touch the
0
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
予熱150℃
徐冷
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
常にこれを推奨するものではございません。
120秒以上
※チップとはんだ温度との差が１００∼１３０℃以下になるよ
うに十分予熱を行ってください。
※回数は１回迄の保証となります。
※リフロー仕様アイテムは除きます。
温度
（℃）
400
Caution
Gradually
Type min）
）
Preheating
cooling
※It is recommended
to use 20W soldering
iron and
150℃
the tip is 1φ or less.
0
components.
secsoldering
min
※Assured120
to be
iron for 1 time.
※Ceramic
chip components
should
be preheated
to
Note:
The above
profiles are the
maximum
allowable
within
100 to condition,
130℃ of the
soldering.
soldering
therefore
these profiles are
※Assured
to be wave
soldering for 1 time.
not always
recommended.
※Except for reflow soldering type.
（Pb free soldering）
Temperature
（℃）
400
350℃以下
1. Make sure the capacitors
are preheated sufficiently.
350℃ max
3 sec max
3秒迄
300 and melted solder should not be
2. The temperature difference between the capacitor
Gradually
300
⊿Ｔ
200
100
徐冷
greater than 100 to 130℃
⊿Ｔ
200
cooling
3. Cooling after soldering should be as gradual as
100possible.
60 sec min
0
4. Wave60秒以上
soldering must not be applied to the capacitors designated as for reflow sol0
イプ以下）
、
⊿Ｔ≦130℃
（3225以上）
。）
（※⊿Ｔ≦190℃
（3216タ
dering
only.
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
常にこれを推奨するものではございません。
, ⊿Ｔ≦130℃（3225
（※⊿Ｔ≦190℃（3216Type max）
Type min）
）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
115
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be reflow soldering for 2 times.
※チップとはんだ温度との差が100∼１３０℃以下になるよ
うに十分予熱を行ってください。
※回数は２回迄の保証となります。
温度
（℃）
300
PRECAUTIONS
Peak 260℃ max
10 sec max
200
200
Precautions on the use of Multilayer Ceramic Capacitors
Stages
予熱150℃
100
120秒以上
0
4. Soldering
5/6
Gradually
cooling
Preheating
150℃
徐冷
100
Precautions
（Pb free soldering）
Temperature
（℃）
300
ピーク260℃以下
10秒迄
Technical considerations
0
※チップとはんだ温度との差が１００∼１３０℃以下になるよ
うに十分予熱を行ってください。
なります。
※回数は
１回迄の保証と
[Hand
soldering]
※リフロー仕様アイテムは除きます。
Temperature profile
温度
（℃）
400
⊿Ｔ
300
徐冷
200
（Pb free soldering）
Temperature
（℃）
400
350℃以下
3秒迄
300
120 sec min
※Ceramic chip components should be preheated to
within 100 to 130℃ of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
350℃ max
3 sec max
⊿Ｔ
200
Gradually
cooling
60 sec min
60秒以上
0
0
、
⊿Ｔ≦130℃
（3225以上）
。）
（※⊿Ｔ≦190℃
（3216タイプ以下）
※はんだコテは20Wで先端が1φ以下のものを推奨致します。
※コテ先がチップに直接触れないようにご留意下さい。
※回数は1回迄の保証となります。
注：上記温度プロファイルは最大許容条件であり、
常にこれを推奨するものではございません。
, ⊿Ｔ≦130℃（3225
（※⊿Ｔ≦190℃（3216Type max）
Type min）
）
※It is recommended to use 20W soldering iron and
the tip is 1φ or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
CAPACITORS
100
100
4
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
5.Cleaning
Cleaning conditions
1. When cleaning the PC board after the capacitors are all
1. The use of inappropriate solutions can cause foreign substances such as flux residue
to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a
mounted, select the appropriate cleaning solution according
degradation of the capacitor's electrical properties（especially insulation resistance）
.
to the type of flux used and purpose of the cleaning（e.g.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimen-
to remove soldering flux or other materials from the produc-
tally affect the performance of the capacitors.
tion process.）
2. Cleaning conditions should be determined after verifying,
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
（1）
Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the capacitor or the soldered
portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output
Below 20 W/ℓ
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less
6.Post cleaning processes
1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions
resulting in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recommended.
7.Handling
Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive mechanical shocks.
（1）If ceramic capacitors are dropped onto the floor or a
hard surface, they should not be used.
（2）When handling the mounted boards, be careful that the
mounted components do not come in contact with or
bump against other boards or components.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
117
6/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
8.Storage conditions
Precautions
Technical considerations
1. If the parts are stored in a high temperature and humidity environment, problems
Storage
1. To maintain the solderability of terminal electrodes and to
such as reduced solderability caused by oxidation of terminal electrodes and dete-
keep the packaging material in good condition, care must
rioration of taping/packaging materials may take place. For this reason, components
be taken to control temperature and humidity in the storage
should be used within 6 months from the time of delivery. If exceeding the above
area. Humidity should especially be kept as low as possible.
period, please check solderability before using the capacitors.
・Recommended conditions
Below 30℃
Humidity
Below 70% RH
4
CAPACITORS
Ambient temperature
The ambient temperature must be kept below 40℃. Even
under ideal storage conditions capacitor electrode solderability decreases as time passes, so should be used within
6 months from the time of delivery.
・Ceramic chip capacitors should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
（type 2 &3）will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150℃ for 1hour will return the capacitance to its initial level.
！ 当社カタログをご使用の際には
「当社製品に関するお断り」を必ずお読みください。
△
！ Please read the "Notice for TAIYO YUDEN products" before using this catalog.
△
119
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湘ICP备2023018690号
