INMP504ACEZ-R0

INMP504 Ultra-Low Noise Microphone with Bottom Port and Analog Output GENERAL DESCRIPTION APPLICATIONS The INMP504* is a high-performance, very low noise, low power, analog output, bottom-ported omnidirectional MEMS microphone. The INMP504 consists of a MEMS microphone element, an impedance converter and an output amplifier. The INMP504 sensitivity specification makes it an excellent choice for both near field and far field applications. The INMP504 is function- and pin-compatible with the INMP404 microphone, providing an easy upgrade path. The INMP504 has very high SNR and extended wideband frequency response, resulting in natural sound with high intelligibility. Low current consumption enables long battery life for portable applications. The INMP504 complies with the TIA-920 Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones standard. The INMP504 is available in an miniature 3.35 mm × 2.5 mm × 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The INMP504 is halide free. • • • • • • • Smartphones and Feature Phones Tablet Computers Teleconferencing Systems Digital Still and Video Cameras Bluetooth Headsets Notebook PCs Security and Surveillance FEATURES • • • • • • • • • • 3.35 × 2.50 × 0.88 mm Surface-Mount Package Very High SNR of 65 dBA Sensitivity of −38 dBV Flat Frequency Response from 100 Hz to 16 kHz Low Current Consumption: 20 Hz kHz % 3 −70 dBV 120 dB SPL 180 200 3.3 V 200 225 µA µA OUTPUT CHARACTERISTICS Output Impedance (ZOUT) 200 Ω Output DC Offset 0.8 V Output Current Limit 90 µA Maximum Output Voltage 120 dB SPL input, peak 0.35 VPEAK Noise Floor 20 Hz to 20 kHz, A-weighted, rms −103 dBV Note 1: See Figure 3 and Figure 4. Document Number: DS-INMP504-00 Revision: 1.1 Page 3 of 14 NOTES dBV dBA dBA SPL 91 1.6 VDD = 1.8 V VDD = 3.3 V MAX 1 INMP504 ABSOLUTE MAXIMUM RATINGS Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. TABLE 2. ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage (VDD) Sound Pressure Level (SPL) Mechanical Shock Vibration Operating Temperature Range Storage Temperature Range RATING −0.3 V to +3.6 V 160 dB 10,000 g Per MIL-STD-883 Method 2007, Test Condition B −40°C to +85°C −55°C to +150°C ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore proper ESD precautions should be taken to avoid performance degradation or loss of functionality. Document Number: DS-INMP504-00 Revision: 1.1 Page 4 of 14 INMP504 SOLDERING PROFILE CRITICAL ZONE TL TO TP tP TP TEMPERATURE RAMP-UP TL tL TSMAX TSMIN tS RAMP-DOWN PREHEAT t25°C TO PEAK TIME Figure 1. Recommended Soldering Profile Limits TABLE 3. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Average Ramp Rate (TL to TP) Preheat Minimum Temperature (TSMIN) Minimum Temperature (TSMIN) Time (TSMIN to TSMAX), tS Ramp-Up Rate (TSMAX to TL) Time Maintained Above Liquidous (tL) Liquidous Temperature (TL) Peak Temperature (TP) Time Within +5°C of Actual Peak Temperature (tP) Ramp-Down Rate Time +25°C (t25°C) to Peak Temperature Sn63 /Pb37 1.25°C/sec max Pb-Free 1.25°C/sec max 100°C 100°C 150°C 200°C 60 sec to 75 sec 60 sec to 75 sec 1.25°C/sec 45 sec to 75 sec 183°C 1.25°C/sec ~50 sec 217°C 215°C +3°C/−3°C 245°C +0°C/−5°C 20 sec to 30 sec 20 sec to 30 sec 3°C/sec max 3°C/sec max 5 min max 5 min max *The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J-STD-020 profile. Document Number: DS-INMP504-00 Revision: 1.1 Page 5 of 14 INMP504 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS GND 1 2 OUTPUT 3 ADMP504 VDD TOP VIEW (TERMINAL SIDE DOWN) Not to Scale Figure 2. Pin Configuration TABLE 4. PIN FUNCTION DESCRIPTIONS PIN NAME FUNCTION 1 OUTPUT 2 GND Analog Output Signal Ground 3 VDD Power Supply Document Number: DS-INMP504-00 Revision: 1.1 Page 6 of 14 INMP504 TYPICAL PERFORMANCE CHARACTERISTICS 10 10 8 5 6 SENSITIVITY (dB) SENSITIVITY (dB) 4 2 0 –2 –4 –6 0 –5 –10 –15 –8 –20 20 –10 100 1k 10k Figure 3. Frequency Response Mask –10 –20 PSR (dB) –30 –40 –50 –60 –70 1k 10k FREQUENCY (Hz) Figure 5. Typical Power Supply Rejection Ratio vs. Frequency Document Number: DS-INMP504-00 Revision: 1.1 1k Figure 4. Typical Frequency Response (Measured) 0 –80 100 100 FREQUENCY (Hz) FREQUENCY (Hz) Page 7 of 14 10k INMP504 APPLICATIONS INFORMATION CONNECTING TO AUDIO CODECS The INMP504 output can be connected to a dedicated codec microphone input (see Figure 6) or to a high input impedance gain stage (see Figure 7.) A 0.1 µF ceramic capacitor placed close to the INMP504 supply pin is used for testing and is recommended to adequately decouple the microphone from noise on the power supply. A DC-blocking capacitor is required at the output of the microphone. This capacitor creates a high-pass filter with a corner frequency at fC = 1/(2π × C × R) where R is the input impedance of the codec. A minimum value of 2.2 µF is recommended in Figure 6 because the input impedance of the codecs can be as low as 2 kΩ at its highest PGA gain setting, which results in a high-pass filter corner frequency at about 37 Hz. Figure 7 shows the INMP504 connected to an op amp configured as a non-inverting preamplifier. MICBIAS 0. 1 µF ADC OR CODEC VDD 2.2 µF M I NI M UM IN M P 504 INPUT O UT P UT G ND Figure 6. INMP504 Connected to a Codec GAIN = (R1 + R2)/R1 R1 R2 1.8-3.3 V VREF 0.1µF VDD INMP504 AMP 1µF MINIMUM OUTPUT GND 10kΩ VREF Figure 7. INMP504 Connected to an Op Amp Document Number: DS-INMP504-00 Revision: 1.1 Page 8 of 14 VOUT INMP504 SUPPORTING DOCUMENTS For additional information, see the following documents. EVALUATION BOARD USER GUIDE UG-325 Analog Output MEMS Microphone Flex Evaluation Board APPLICATION NOTES (PRODUCT SPECIFIC) AN-0207 High Performance Analog MEMS Microphone’s Simple Interface to SigmaDSP Audio Codec AN-0262 Low Noise Analog MEMS Microphone and Preamp with Compression and Noise Gating APPLICATION NOTES (GENERAL) AN-1003 Recommendations for Mounting and Connecting the Invensense Bottom-Ported MEMS Microphones AN-1068 Reflow Soldering of the MEMS Microphone AN-1112 Microphone Specifications Explained AN-1124 Recommendations for Sealing Invensense, Bottom-Port MEMS Microphones from Dust and Liquid Ingress AN-1140 Microphone Array Beamforming AN-1165 Op Amps for MEMS Microphone Preamp Circuits AN-1181 Using a MEMS Microphone in a 2-Wire Microphone Circuit Document Number: DS-INMP504-00 Revision: 1.1 Page 9 of 14 INMP504 PCB DESIGN AND LAND PATTERN LAYOUT The recommended PCB land pattern for the INMP504 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 8. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 9. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. 1.52 0.68 1.22 0.61 Ø1.55 1.90 Ø0.95 0.61 0.90 Dimensions shown in millimeters Figure 8. PCB Land Pattern Layout 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) 0.8 × 0.6 2× 1.22 0.2 × 45 TYP 1.52mm Dimensions shown in millimeters Figure 9. Suggested Solder Paste Stencil Pattern Layout Document Number: DS-INMP504-00 Revision: 1.1 Page 10 of 14 INMP504 HANDLING INSTRUCTIONS PICK AND PLACE EQUIPMENT The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the MEMS microphone structure as follows: • Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. • Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. Do not pull air out of or blow air into the microphone port. • Do not use excessive force to place the microphone on the PCB. REFLOW SOLDER For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified in Figure 1 and Table 3. BOARD WASH When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or ultrasonic cleaning. Document Number: DS-INMP504-00 Revision: 1.1 Page 11 of 14 INMP504 OUTLINE DIMENSIONS 3.425 3.350 3.275 0.75 REF REFERENCE CORNER 3.06 REF PIN 1 1.08 1.52 0.30 BSC 0.25 NOM DIA. 0.20 MIN THRU HOLE 0.90 × 0.68 (PINS 1, 3) 1.56 DIA. 1 2.575 2.500 2.425 0.95 DIA. 0.54 REF 2 1.22 BSC 2.21 REF 1.25 3 TOP VIEW 0.98 0.88 0.78 0.65 REF SIDE VIEW 0.64 REF 0.20 TYP × 45° BOTTOM VIEW 0.21 REF Figure 10. 3-Terminal Chip Array Small Outline No-Lead Cavity [LGA_CAV] 3.35 × 2.50 × 0.88 mm Body Dimensions shown in millimeters PART NUMBER PIN 1 INDIC ATION 504 YY XXX DATE CODE LOT TRACEABILITY CODE Figure 11. Package Marking Specification (Top View) Document Number: DS-ADMP504-00 Revision: 1.1 Page 12 of 14 (SOUND PORT) INMP504 ORDERING GUIDE PART 1 INMP504ACEZ-R0 * TEMP RANGE −40°C to +85°C PACKAGE 3-Terminal LGA_CAV QUANTITY 10,000 INMP504ACEZ-R7 † −40°C to +85°C 3-Terminal LGA_CAV 1,000 EV_INMP504-FX — Flex Evaluation Board — 1 * – 13” Tape and Reel † – 7” Tape and Reel to be discontinued. Check with sales@invensense.com for availability. 1 Z = RoHS-Compliant Part REVISION HISTORY REVISION DATE REVISION DESCRIPTION 02/06/2014 1.0 Initial Release 05/14/2014 1.1 Corrected typo in Features section Document Number: DS-ADMP504-00 Revision: 1.1 Page 13 of 14 INMP504 COMPLIANCE DECLARATION DISCLAIMER InvenSense believes the environmental and other compliance information given in this document to be correct but cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense, Inc. is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. ©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. ©2014 InvenSense, Inc. All rights reserved. Document Number: DS-ADMP504-00 Revision: 1.1 Page 14 of 14