PCAN0603K4R70FST5

PCAN www.vishay.com Vishay Dale Thin Film High Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Chip Resistor (Up to 6 W) FEATURES • High thermal conductivity aluminum nitride substrate Available • Power rating up to 6.0 W Available • Resistance range 2 Ω to 30.1 kΩ • Resistor tolerance to ± 0.1 % • TCR to ± 25 ppm/°C • Flame resistant UL 94 V-0 Available • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details APPLICATIONS Infographics PCAN series chip resistors are designed on aluminum nitride ceramic substrates with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users circuit assembly. Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the ability to remove the heat is critical to the overall performance of the device. • Power supplies • Power switching • Braking system TYPICAL PERFORMANCE ABSOLUTE TCR 25 TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST Material Resistance Range TCR: Absolute Tolerance: Absolute Power Rating: Resistor Stability: Absolute Voltage Coefficient Working Voltage Operating Temperature Range Storage Temperature Range Noise Shelf Life Stability: Absolute SPECIFICATIONS Passivated nichrome 2 Ω to 30.1 kΩ 25 ppm/°C (standard) and 100 ppm/°C 0.1 %, 0.25 %, 0.5 %, 1.0 %, 2.0 %, and 5.0 % 0.5 W to 6.0 W (1) ΔR 1.0 % < 0.1 ppm/V 75 V to 100 V -55 °C to +155 °C -55 °C to +155 °C < -30 dB ± 0.01 % CONDITIONS -55 °C to +150 °C Maximum at +70 °C 1000 h at +70 °C 1 year at +25 °C Note (1) Dependant on component mounting by user COMPONENT RATINGS CASE SIZE 0603 0805 1206 2512 POWER RATING (mW) 500 (1) 1000 (1) 2000 (1) 6000 (1) WORKING VOLTAGE (V) 75 100 100 100 RESISTANCE RANGE (Ω) 2 to 30.1K 2 to 30.1K 2 to 30.1K 2 to 30.1K Note Dependant on component mounting by user (1) Revision: 08-Mar-2021 Document Number: 60125 1 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCAN www.vishay.com Vishay Dale Thin Film ENVIRONMENTAL TESTS ENVIRONMENTAL TEST (1) TEST LIMITS TYPICAL VISHAY PERFORMANCE Resistance temperature characteristic ± 25 ppm/°C ± 15 ppm/°C Maximum ambient temperature at rated wattage +70 °C +70 °C Maximum ambient temperature at power derating +150 °C +150 °C Thermal shock ± 0.25 % ± 0.10 % Low temperature operation ± 0.25 % ± 0.01 % Short time overload ± 0.5 % ± 0.2 % High temperature exposure ± 0.2 % ± 0.05 % Resistance to soldering heat ± 0.25 % ± 0.025 % Moisture resistance ± 0.4 % ± 0.01 % Life at +70 °C for 1000 h ± 1.00 % ± 0.4 % Note (1) Environmental testing was performed based on MIL-STD-202 standard test methods DIMENSIONS in inches D T D W T E L L LENGTH L WIDTH W THICKNESS T MIN. / MAX. TOP PAD D BOTTOM PAD E 0603 0.064 ± 0.006 0.032 ± 0.005 0.015 ± 0.003 0.012 ± 0.005 0.021 ± 0.005 0805 0.080 ± 0.006 0.050 ± 0.005 0.015 ± 0.003 0.016 ± 0.005 0.025 ± 0.005 1206 0.126 ± 0.008 0.063 ± 0.005 0.015 ± 0.003 0.020 + 0.005 / - 0.010 0.040 ± 0.005 2512 0.259 + 0.009 / - 0.015 0.124 ± 0.005 0.015 ± 0.003 0.020 ± 0.005 0.050 ± 0.005 CASE SIZE LAND PATTERN DIMENSIONS in inches 0603 Land Pattern 1206 Land Pattern 0.0920 0.1730 0.0340 0.0710 0.0140 0.0390 0.0220 0.0755 0805 Land Pattern 2512 Land Pattern 0.1050 0.2910 0.0520 0.1260 0.0200 0.0425 0.1090 0.0910 Revision: 08-Mar-2021 Document Number: 60125 2 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCAN www.vishay.com Vishay Dale Thin Film STANDARD MATERIAL SPECIFICATIONS Resistive element Passivated nichrome Substrate material Aluminum nitride Terminations (tin/lead) Terminations (lead (Pb)-free) Tin / lead solder over nickel barrier Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over nickel barrier PCAN0603 CHIP TEMP VS. APPLIED POWER PCAN0805 CHIP TEMP VS. APPLIED POWER 7.0 8.0 5.0 7.0 200 Ω 6.0 Applied Power (W) Applied Power (W) 6.0 20 Ω 4.0 3.0 2.0 200 Ω 5.0 4.0 3.0 2.0 1.0 0.0 50 Ω 1.0 70 150 Chip Surface Temperature Temperature (°C) 0.0 200 70 150 Chip Surface Temperature Temperature (°C) 200 Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate testcard surface temperature of 75 °C Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate testcard surface temperature of 75 °C PCAN1206 CHIP TEMP VS. APPLIED POWER PCAN2512 CHIP TEMP VS. APPLIED POWER 12.0 12.0 8.0 175 Ω 6.0 4.0 2.0 0.0 10.0 30 Ω Applied Power (W) Applied Power (W) 10.0 30 Ω 150 Ω 8.0 6.0 4.0 2.0 70 150 Chip Surface Temperature Temperature (°C) 200 Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C • Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full range of power levels • Thermal imaging and load life testing was conducted mounting one device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both surfaces. Thermal vias on 50 mil centers were utilized for heat transfer between surfaces of the test card Revision: 08-Mar-2021 0.0 70 150 Chip Surface Temperature Temperature (°C) 200 Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C Document Number: 60125 3 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCAN www.vishay.com Vishay Dale Thin Film DERATING CURVE Percent of Rated Power 100 80 60 40 20 0 0 70 125 155 Ambient Temperature °C SINGLE PULSE LOAD TESTING 100 Ω - 2512 10 100 Ω - 1206 Peak Power (W) 100 1 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Duration (s) GLOBAL PART NUMBER INFORMATION New Global Part Numbering: PCAN1206H1000BBT1 P C A N 1 GLOBAL MODEL CASE SIZE TCR CHARACTERISTIC PCAN 0603 0805 1206 2512 E = ± 25 ppm/°C H = ± 50 ppm/°C K = ± 100 ppm/°C (1) 2 0 6 H 1 RESISTANCE TOLERANCE The first 3 digits are significant figures and the last digit specifies the number of zeros to follow. “R” designates the decimal point. B = ± 0.1 % (2) C = ± 0.25 % D = ± 0.5 % F = ± 1.0 % (1) G = ± 2.0 % J = ± 5.0 % Example: 10R0 = 10 Ω 1000 = 100 Ω 0 0 0 TERMINATION B = wraparound Sn/Pb solder w/ nickel barrier S = wraparound lead (Pb)-free solder (e1) RoHS compliant G = wraparound Au, over Ni (gold) termination epoxy bondable RoHS compliant (e4) B B T 1 PACKAGING BS = BULK 100 min., 1 mult. WS = WAFFLE 100 min., 1 mult. W0 = 100 pc min. waffle, 1 mult. WI = 100 min., 1 mult. (package unit single lot date code) TAPE AND REEL T0 = 100 min., 100 mult. T1 = 1000 min., 1000 mult. T3 = 300 min., 300 mult. T5 = 500 min., 500 mult. TF = full reel TS = 100 min., 1 mult. TI = 100 min., 1 mult. (item single lot date code) TP = 100 min., 1 mult. (package unit single lot date code) Notes (1) Less than 10 Ω. 100 ppm/°C and 1 % tolerance best (2) Available on 10 Ω and higher Revision: 08-Mar-2021 Document Number: 60125 4 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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