RCC0805100RFKEA

RCC e3 www.vishay.com Vishay Medium Power Thick Film Chip Resistors FEATURES • Increased power rating • Increased operating voltage • AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS LINKS TO ADDITIONAL RESOURCES • Automotive 3D 3D • Industrial • Telecommunications 3D Models The medium power thick film chip resistor series feature a higher power rating and operating voltage as compared to standard chip resistors, offering the capability to replace standard resistors of the next larger size. • Medical TECHNICAL SPECIFICATIONS DESCRIPTION RCC0402 e3 RCC0603 e3 RCC0805 e3 RCC1206 e3 0402 0603 0805 1206 RR1005M RR1608M RR2012M Imperial size Metric size code 1 Ω to 10 MΩ; jumper (0 Ω) Resistance range Resistance tolerance RR3216M 1 Ω to 1 MΩ; jumper (0 Ω) ± 5 %; ± 1 % Temperature coefficient ± 200 ppm/K; ± 100 ppm/K Rated dissipation, P70 (1) 0.125 W 0.2 W 75 V 150 V Operating voltage, Umax. ACRMS/DC Permissible film temperature, ϑF max. (1) 0.25 W 0.5 W 200 V 200 V 155 °C Operating temperature range -55 °C to +155 °C Max. resistance change at P70 for resistance range, |ΔR/R| after (2): 1000 h ≤ 3.0 % ≤ 1.0 % 8000 h - ≤ 2.0 % Permissible voltage against ambient (insulation): 1 min, Uins Failure rate: FITobserved 100 V 200 V 300 V 300 V ≤ 0.1 x 10-9/h Notes (1) Please refer to APPLICATION INFORMATION below (2) Apply to components with stability class 1 APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 04-Jul-2022 Document Number: 20066 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCC e3 www.vishay.com Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR ± 200 ppm/K ± 100 ppm/K Jumper, Imax. = 2 A ± 200 ppm/K ± 100 ppm/K Jumper, Imax. = 3 A ± 200 ppm/K ± 100 ppm/K Jumper, Imax. = 3.5 A ± 200 ppm/K ± 100 ppm/K Jumper, Imax. = 5 A RCC0402 e3 RCC0603 e3 RCC0805 e3 RCC1206 e3 TOLERANCE ±5% ±1% ≤ 20 mΩ ±5% ±1% ≤ 20 mΩ ±5% ±1% ≤ 20 mΩ ±5% ±1% ≤ 20 mΩ RESISTANCE 1 Ω to 10 MΩ 1 Ω to 10 MΩ 0Ω 1 Ω to 10 MΩ 1 Ω to 10 MΩ 0Ω 1 Ω to 10 MΩ 1 Ω to 10 MΩ 0Ω 1 Ω to 1 MΩ 1 Ω to 1 MΩ 0Ω E-SERIES E24 E24; E96 E24 E24; E96 E24 E24; E96 E24 E24; E96 - Note • The temperature coefficient of resistance (TCR) is not specified for 0 Ω jumpers PACKAGING TYPE / SIZE RCC0402 e3 RCC0603 e3 RCC0805 e3 RCC1206 e3 CODE QUANTITY ED = ET7 EE = EF4 EI = ET2 ED = ET3 EL = ET4 EE = ET8 EA = ET1 EB = ET5 EC = ET6 EA = ET1 EB = ET5 EC = ET6 EA = ET1 EB = ET5 EC = ET6 10 000 50 000 5000 10 000 20 000 50 000 5000 10 000 20 000 5000 10 000 20 000 5000 10 000 20 000 PACKAGING STYLE WIDTH PACKAGING DIMENSIONS Ø 180 mm / 7" Ø 330 mm / 13" Ø 180 mm / 7" Ø 180 mm / 7" Ø 285 mm / 11.25" Ø 330 mm / 13" Ø 180 mm / 7" Ø 285 mm / 11.25" Ø 330 mm / 13" Ø 180 mm / 7" Ø 285 mm / 11.25" Ø 330 mm / 13" Ø 180 mm / 7" Ø 285 mm / 11.25" Ø 330 mm / 13" PITCH 2 mm 2 mm Paper tape according to IEC 60286-3, Type 1a 4 mm 8 mm 4 mm 4 mm PART NUMBER AND PRODUCT DESCRIPTION Part Number: RCC06031K00FKEA Part Number: RCC06030000Z0EA R C C 0 6 0 3 1 K 0 0 F K E TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING RCC0402 RCC0603 RCC0805 RCC1206 R = decimal K = thousand M = million 0000 = jumper F = ± 1.0 % J = ± 5.0 % Z = jumper K = ± 100 ppm/K N = ± 200 ppm/K 0 = jumper EA, EB, EC, ED, EE, EI, EL A Product Description: RCC0603 100 1K 1 % ET1 e3 Product Description: RCC0603 0R0 ET1 e3 RCC0603 100 1K 1% ET1 e3 TYPE / SIZE TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE RCC0402 RCC0603 RCC0805 RCC1206 ± 100 ppm/K ± 200 ppm/K 10R = 10 Ω 100R = 100 Ω 10K = 10 kΩ 1M0 = 1 MΩ 0R0 = jumper ± 1.0 % ± 5.0 % ET1, ET2, ET3, ET4, ET5, ET6, ET7, ET8 EF4 e3 = pure tin termination finish Revision: 04-Jul-2022 Document Number: 20066 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCC e3 www.vishay.com DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A cermet film layer and a glass-over are deposited on a high grade (AI2O3) ceramic substrate with its prepared inner contacts on both sides. A special laser is used to achieve the target value and the desired power dissipation performance by smoothly fine trimming the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a (1). ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. MATERIALS Vishay acknowledges the following systems for the regulation of hazardous substances: Vishay The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. APPROVALS The resistors are qualified according to AEC-Q200. Where applicable, the resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1, EN 60115-8 and the variety of environmental test procedures of the IEC 60068 (1) series. RELATED PRODUCTS For more information about products with superior surge and pulse performance please refer to D/CRCW-IF e3, pulse proof thick film chip resistors datasheet (www.vishay.com/doc?20024). The CRCW-HP e3 product series is designed for those applications where both enhanced power rating and superior pulse loading performance is required. For ordering CRCW-HP e3 please refer to latest edition of datasheet (www.vishay.com/doc?20043). For thick film resistors with standard requirements for power rating, please refer to D/CRCW e3, standard thick film chip resistors datasheet (www.vishay.com/doc?20035) • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 04-Jul-2022 Document Number: 20066 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCC e3 www.vishay.com Vishay DERATING Axis Title 0.6 0.5 1000 0.4 1st line 2nd line 2nd line P - Power Dissipation (W) 10000 RCC1206 RCC0805 RCC0603 RCC0402 0.3 100 0.2 0.1 10 0 -70 -50 -30 -10 10 30 50 70 90 110 130 150 ϑamb - Ambient Temperature (°C) TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 60115-8 (successor of EN 140400), sectional specification EN 140401-802, detail specification IEC 60068-2-xx, test methods The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5201-1. The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on boards in accordance with EN 60115-8, 2.4.2 unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60082-2 (1) TEST METHOD REQUIREMENTS PERMISSIBLE CHANGE (ΔR) PROCEDURE STABILITY CLASS 1 OR BETTER TEST Stability for product types: STABILITY CLASS 2 OR BETTER 1 Ω to 10 MΩ RCC e3 4.5 - Resistance - ±1% ±5% 4.8 - Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C ± 100 ppm/K ± 200 ppm/K U = P 70 x R or U = Umax. whichever is the less severe; 1.5 h on; 0.5 h off 4.25.1 - Endurance at 70 °C RCC0402 e3: 70 °C; 1000 h ± (3 % R + 0.1 Ω) RCC0603 e3 to RCC1206 e3: 70 °C; 1000 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 70 °C; 8000 h ± (2 % R + 0.05 Ω) ± (4 % R + 0.1 Ω) 155 °C; 1000 h 4.25.3 - Endurance at upper category temperature RCC0402 e3: RCC0603 e3 to RCC1206 e3: Revision: 04-Jul-2022 ± (3 % R + 0.1 Ω) ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) Document Number: 20066 4 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCC e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60082-2 (1) TEST METHOD REQUIREMENTS PERMISSIBLE CHANGE (ΔR) PROCEDURE STABILITY CLASS 1 OR BETTER TEST Stability for product types: RCC e3 4.24 4.37 78 (Cab) 67 (Cy) Damp heat, steady state Damp heat, steady state, accelerated (40 ± 2) °C; 56 days; (93 ± 3) % RH RCC0402 e3: - Climatic sequence: 4.23.2 2 (Bb) Dry heat 125 °C; 16 h 55 °C; 24 h; ≥ 90 % RH; 1 cycle 4.23.3 30 (Db) Damp 4.23.4 1 (Ab) Cold -55 °C; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 5 days; > 90 % RH; 5 cycles U = P 70 x R ≤ Umax.; 1 min 4.23.7 1 Ω to 10 MΩ ± (1 % R + 0.05 Ω) (85 ± 2) °C; (85 ± 5) % RH U = 0.1 x P 85 x R ≤ 100 V; 1000 h; RCC0603 e3 to RCC1206 e3: 4.23 STABILITY CLASS 2 OR BETTER ± (3 % R + 0.1 Ω) ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) - DC load 1 (Aa) Cold -55 °C; 2 h ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 4.19 14 (Na) Rapid change of temperature 30 min. at -55 °C and 30 min. at 125 °C 1000 cycles ± (1 % R + 0.05 Ω) no visible damage 4.13 - Short time overload U = 2.5 x P 70 x R ≤ 2 x Umax.; whichever is the less severe; 5 s ± (2 % R + 0.05 Ω) - Single pulse high voltage overload Severity no. 4: U = 10 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 10 pulses 10 μs / 700 μs ± (1 % R + 0.05 Ω) no visible damage - 4.27 U= 4.39 4.38 4.22 - - 6 (Fc) Periodic electric overload 15 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles ± (1 % R + 0.05 Ω) no visible damage Electrostatic discharge (human body model) IEC 61340-3-1 (1); 3 positive + 3 negative discharges; RCC0402 e3: 350 V RCC0603 e3: 500 V RCC0805 e3: 800 V RCC1206 e3: 1000 V ± (1 % R + 0.05 Ω) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude ≤ 1.5 mm or ≤ 200 m/s2; 7.5 h ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) no visible damage no visible damage Solder bath method, SnPb40; non-activated flux (235 ± 5) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered); no visible damage 4.17 58 (Td) Solderability Solder bath method, Sn96.5Ag3Cu0.5; non-activated flux (245 ± 5) °C; (3 ± 0.3) s 4.18 58 (Td) Resistance to soldering heat Soldering bath method; (260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol +50 °C; method 2 No visible damage Revision: 04-Jul-2022 Document Number: 20066 5 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCC e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60082-2 (1) TEST METHOD REQUIREMENTS PERMISSIBLE CHANGE (ΔR) PROCEDURE STABILITY CLASS 1 OR BETTER TEST Stability for product types: STABILITY CLASS 2 OR BETTER 1 Ω to 10 MΩ RCC e3 4.32 21 (Ue3) Shear (adhesion) RCC0402 e3: 9 N; RCC0603 e3 to RCC1206 e3: 17.7 N No visible damage 4.33 21 (Ue1) Substrate bending Depth 2 mm; 3 times ± (0.25 % R + 0.05 Ω) no visible damage, no open circuit in bent position 4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown - Flammability, needle flame test IEC 60695-11-5 (1); 10 s No burning after 30 s 4.35 Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents DIMENSIONS L T2 W H T1 DIMENSIONS AND MASS TYPE / SIZE L (mm) W (mm) H (mm) T1 (mm) T2 (mm) MASS (mg) 0.65 RCC0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.10 0.2 ± 0.10 RCC0603 e3 1.55 + 0.10 / - 0.05 0.85 ± 0.10 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2 RCC0805 e3 2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5 RCC1206 e3 3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 10 G X SOLDER PAD DIMENSIONS Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING TYPE / SIZE G (mm) Y (mm) X (mm) REFLOW SOLDERING Z (mm) G (mm) Y (mm) X (mm) Z (mm) RCC0402 e3 - - - - 0.45 0.6 0.6 1.65 RCC0603 e3 0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.25 RCC0805 e3 0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90 RCC1206 e3 1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g in standards IEC 61188-5-x (1) or in publication IPC-7351 (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 04-Jul-2022 Document Number: 20066 6 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2022 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2022 1 Document Number: 91000