TH4
www.vishay.com
Vishay Sprague
Solid Tantalum Surface-Mount Chip Capacitors
TANTAMOUNT™ Molded Case, HI-TMP®
High Temperature 175 °C, Automotive Grade
FEATURES
• Operating temperature up to 175 °C with 50 %
voltage derating
• AEC-Q200 qualified
• 100 % surge current tested
• RoHS-compliant terminations available:
matte tin (all cases), gold (D / E cases)
LINKS TO ADDITIONAL RESOURCES
3D 3D
3D Models
• Standard EIA 535BAAC case sizes
Calculators
Related
Documents
Infographics
Did You
Know?
• Moisture sensitivity level 1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Technical
Notes
APPLICATIONS
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
• Automotive
www.vishay.com/doc?40215
• Industrial
Operating Temperature: -55 °C to +175 °C
• High temperature
Capacitance Range: 10 μF to 100 μF
Capacitance Tolerance: ± 10 %, ± 20 %
Voltage Range: 6.3 VDC to 35 VDC
Note
• For recommended voltage derating guidelines see “Typical
Performance Characteristics”
ORDERING INFORMATION
TH4
C
226
K
016
C
1000
TYPE
CASE
CODE
CAPACITANCE
CAPACITANCE
TOLERANCE
DC VOLTAGE
RATING AT +85 °C
TERMINATION AND
PACKAGING
ESR
See
Ratings
and Case
Codes
table
This is expressed in
picofarads. The first
two digits are the
significant figures.
The third is the
number of zeros to
follow.
K = ± 10 %
M = ± 20 %
This is expressed in V.
To complete the
three-digit block, zeros
precede the voltage
rating. A decimal point
is indicated by an “R”
(6R3 = 6.3 V)
Matte tin
C = 7" (178 mm) reel
D = 13" (330 mm) reel
V = 7" (178 mm) reel,
dry pack
U = 13" (330 mm) reel,
dry pack
Gold plating
A = 7" (178 mm) reel
B = 13" (330 mm) reel
Maximum
100 kHz ESR
0500 = 500 mΩ
5000 = 5.0 Ω
10R0 = 10.0 Ω
Notes
• We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. Voltage
substitutions will be marked with the higher voltage rating
• Dry pack as specified in J-STD-033
• Gold plated terminations are available for D / E cases only
Revision: 09-Aug-2022
Document Number: 40152
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TH4
www.vishay.com
Vishay Sprague
DIMENSIONS in inches [millimeters]
L
W
H
Glue Pad
TH (MIN.)
TW
Glue Pad
P
CASE CODE
EIA SIZE
L
W
H
P
TW
TH (MIN.)
B
3528-21
0.138 ± 0.008
[3.5 ± 0.20]
0.110 ± 0.008
[2.8 ± 0.20]
0.075 ± 0.008
[1.9 ± 0.20]
0.031 ± 0.012
[0.80 ± 0.30]
0.087 ± 0.004
[2.2 ± 0.10]
0.028
[0.70]
C
6032-28
0.236 ± 0.012
[6.0 ± 0.30]
0.126 ± 0.012
[3.2 ± 0.30]
0.098 ± 0.012
[2.5 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
0.087 ± 0.004
[2.2 ± 0.10]
0.039
[1.0]
D
7343-31
0.287 ± 0.012
[7.3 ± 0.30]
0.169 ± 0.012
[4.3 ± 0.30]
0.110 ± 0.012
[2.8 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
0.094 ± 0.004
[2.4 ± 0.10]
0.039
[1.0]
E
7343-43
0.287 ± 0.012
[7.3 ± 0.30]
0.169 ± 0.012
[4.3 ± 0.30]
0.157 ± 0.012
[4.0 ± 0.30]
0.051 ± 0.012
[1.3 ± 0.30]
0.094 ± 0.004
[2.4 ± 0.10]
0.039
[1.0]
Note
• Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option)
RATINGS AND CASE CODES
μF
6.3 V
10 V
16 V
35 V
4.7
50 V
D (0.9)
10
B (1.8)
B (1.8)
B (2.0)
22
B (1.5)
B (1.6) C (1.4)
B (1.9) C (1.4, 1.0) D (0.8, 0.6)
47
C (0.8)
C (0.5)
C (0.8) D (0.4, 0.7)
100
D (0.5)
E (0.6)
MARKING
Indicates 175 °C temperature
Voltage
Capacitance, μF
22
Polarity
band (+)
XX
Date code
B10
2
Vishay marking
Marking
Capacitor marking includes an anode (+) polarity band, capacitance in microfarads and the voltage rating.
The Vishay identification marking is included if space permits. Vishay marking (“circled 2”) may show additives in the form of short lines,
depicting actual manufacturing facility. For A case capacitors discontinuation in polarity bar maybe used as actual manufacturing facility
designation. Capacitors rated at 6.3 V are marked 6 V.
A manufacturing date code is marked on all capacitors.
Call the factory for further explanation.
Revision: 09-Aug-2022
Document Number: 40152
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TH4
www.vishay.com
Vishay Sprague
STANDARD RATINGS
CAPACITANCE
(μF)
CASE CODE
PART NUMBER
MAX. DCL
AT +25 °C
(μA)
MAX. DF
AT +25 °C
120 Hz
(%)
MAX. ESR
AT +25 °C
100 kHz
(Ω)
MAX. RIPPLE
AT +25 °C
100 kHz
IRMS
(A)
6.3 VDC AT +85 °C; 3 VDC AT +175 °C
10
B
TH4B106(1)6R3(2)1800
0.6
6.0
1.800
0.22
22
B
TH4B226(1)6R3(2)1500
1.4
6.0
1.500
0.24
47
C
TH4C476(1)6R3(2)0800
3.0
6.0
0.800
0.37
10
B
TH4B106(1)010(2)1800
1.0
4.5
1.800
0.22
22
B
TH4B226(1)010(2)1600
2.2
6.0
1.600
0.23
22
C
TH4C226(1)010(2)1400
2.2
6.0
1.400
0.28
47
C
TH4C476(1)010(2)0500
4.7
4.5
0.500
0.47
10
B
TH4B106(1)016(2)2000
1.6
6.0
2.000
0.21
22
B
TH4B226(1)016(2)1900
3.5
6.0
1.900
0.21
22
C
TH4C226(1)016(2)1400
3.5
6.0
1.400
0.28
22
C
TH4C226(1)016(2)1000
3.5
6.0
1.000
0.33
22
D
TH4D226(1)016(2)0800
3.5
6.0
0.800
0.43
10 VDC AT +85 °C; 5 VDC AT +175 °C
16 VDC AT +85 °C; 8 VDC AT +175 °C
22
D
TH4D226(1)016(2)0600
3.5
6.0
0.600
0.50
47
C
TH4C476(1)016(2)0800
7.5
6.0
0.800
0.37
47
D
TH4D476(1)016(2)0700
7.5
6.0
0.700
0.46
47
D
TH4D476(1)016(2)0400
7.5
6.0
0.400
0.61
100
E
TH4E107(1)016(2)0600
16
8.0
0.600
0.52
22
D
TH4D226(1)035(2)0500
6.0
0.500
0.55
6.0
0.900
0.41
35 VDC AT +85 °C; 17.5 VDC AT +175 °C
6.0
50 VDC AT +85 °C; 25 VDC AT +175 °C
4.7
D
TH4D475(1)050(2)0900
2.4
Note
• Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: C, D, V, U, A, B (A and B - for cases D / E only)
POWER DISSIPATION
CASE CODE
MAXIMUM PERMISSIBLE POWER DISSIPATION AT +25 °C (W) IN FREE AIR
B
0.085
C
0.110
D
0.150
E
0.165
Revision: 09-Aug-2022
Document Number: 40152
3
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TH4
www.vishay.com
Vishay Sprague
RIPPLE CURRENT FACTOR
TEMPERATURE (°C)
DERATING FACTOR
25
1.0
85
0.9
125
0.4
150
0.3
175
0.2
STANDARD PACKAGING QUANTITY
CASE CODE
UNITS PER REEL
7" REEL
13" REEL
B
2000
8000
C
500
3000
D
500
2500
E
400
1500
PRODUCT INFORMATION
Guide for Molded Tantalum Capacitors
Pad Dimensions
www.vishay.com/doc?40074
Packaging Dimensions
Moisture Sensitivity (MSL)
www.vishay.com/doc?40135
SELECTOR GUIDES
Solid Tantalum Selector Guide
www.vishay.com/doc?49053
Solid Tantalum Chip Capacitors
www.vishay.com/doc?40091
FAQ
Frequently Asked Questions
Revision: 09-Aug-2022
www.vishay.com/doc?40110
Document Number: 40152
4
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
www.vishay.com
Vishay Sprague
Guide for Molded Tantalum Capacitors
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
THE BASICS OF TANTALUM CAPACITORS
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
“valve”metals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Revision: 25-Jan-2022
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
DIELECTRIC
Air or vacuum
Paper
Plastic
Mineral oil
Silicone oil
Quartz
Glass
Porcelain
Mica
Aluminum oxide
Tantalum pentoxide
Ceramic
e
DIELECTRIC CONSTANT
1.0
2.0 to 6.0
2.1 to 6.0
2.2 to 2.3
2.7 to 2.8
3.8 to 4.4
4.8 to 8.0
5.1 to 5.9
5.4 to 8.7
8.4
26
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
eA
C = ------t
where
C = capacitance
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Document Number: 40074
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
www.vishay.com
Vishay Sprague
SOLID ELECTROLYTE TANTALUM CAPACITORS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the leadframe.
Molded Chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. The molding
compound has been selected to meet the requirements of
UL 94 V-0 and outgassing requirements of ASTM E-595.
After assembly, the capacitors are tested and inspected to
assure long life and reliability. It offers excellent reliability
and high stability for consumer and commercial electronics
with the added feature of low cost
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified.
MOLDED CHIP CAPACITOR
Silver
Adhesive
Epoxy
Encapsulation
Anode
Polarity Bar
MnO2/Carbon/
Silver Coating
Solderable
Leadframe
Cathode
Sintered
Termination
Tantalum
Revision: 25-Jan-2022
Solderable Anode
Termination
Document Number: 40074
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
www.vishay.com
Vishay Sprague
COMMERCIAL PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
793DX-CTC3CTC4
293D
593D
TR3
TP3
TL3
High performance,
automotive grade
Very low DCL
PRODUCT IMAGE
TYPE
FEATURES
Surface mount TANTAMOUNT™, molded case
Standard
industrial grade
CECC approved
Low ESR
TEMPERATURE
RANGE
-55 °C to +125 °C
CAPACITANCE
0.1 μF to 1000 μF
RANGE
VOLTAGE RANGE
4 V to 75 V
CAPACITANCE
TOLERANCE
0.1 μF to 100 μF
1 μF to 470 μF
0.47 μF to 1000 μF
0.1 μF to 470 μF
4 V to 50 V
4 V to 50 V
4 V to 75 V
4 V to 50 V
0.1 μF to 470
μF
4 V to 50 V
± 10 %, ± 20 %
LEAKAGE
CURRENT
DISSIPATION
FACTOR
CASE CODES
TERMINATION
Low ESR
0.005 CV or
0.25 μA,
whichever is
greater
0.01 CV or 0.5 μA, whichever is greater
4 % to 30 %
4 % to 6 %
A, B, C, D, E
A, B, C, D
4 % to 15 %
4 % to 30 %
A, B, C, D, E
A, B, C, D, E, W
100 % matte tin standard, tin / lead available
4 % to 15 %
4 % to 15 %
A, B, C, D, E
A, B, C, D, E
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
TH3
TH4
TH5
PRODUCT IMAGE
TYPE
FEATURES
TEMPERATURE
RANGE
CAPACITANCE
RANGE
VOLTAGE RANGE
CAPACITANCE
TOLERANCE
LEAKAGE
CURRENT
DISSIPATION
FACTOR
CASE CODES
TERMINATION
Revision: 25-Jan-2022
High temperature +150 °C,
automotive grade
Surface mount TANTAMOUNT™, molded case
High temperature +175 °C,
Very high temperature +200 °C
automotive grade
-55 °C to +150 °C
-55 °C to +175 °C
-55 °C to +200 °C
0.33 μF to 220 μF
10 μF to 100 μF
4.7 μF to 100 μF
6.3 V to 50 V
6.3 V to 35 V
5 V to 24 V
± 10 %, ± 20 %
0.01 CV or 0.5 μA, whichever is greater
4 % to 8 %
4.5 % to 8 %
6 % to 10 %
A, B, C, D, E
100 % matte tin standard,
tin / lead and gold plated available
B, C, D, E
D, E
100 % matte tin
Gold plated
Document Number: 40074
3
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
www.vishay.com
Vishay Sprague
HIGH RELIABILITY PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
TM3
T83
CWR11
TANTAMOUNT™,
molded case, hi-rel.
TANTAMOUNT™,
molded case,
hi-rel. COTS
High reliability,
for medical Instruments
High reliability,
standard and low ESR
95158
PRODUCT
IMAGE
TYPE
FEATURES
TEMPERATURE
RANGE
CAPACITANCE
RANGE
VOLTAGE RANGE
CAPACITANCE
TOLERANCE
LEAKAGE
CURRENT
TANTAMOUNT™, molded case,
DLA approved
MIL-PRF-55365/8 qualified
Low ESR
-55 °C to +125 °C
1 μF to 220 μF
0.1 μF to 470 μF
4 V to 20 V
4 V to 63 V
0.1 μF to 100 μF
4.7 μF to 220 μF
4 V to 50 V
± 10 %, ± 20 %
± 5 %, ± 10 %, ± 20 %
0.005 CV or 0.25 μA,
whichever is greater
± 10 %, ± 20 %
0.01 CV or 0.5 μA, whichever is greater
DISSIPATION
FACTOR
4 % to 8 %
4 % to 15 %
4 % to 6 %
4 % to 12 %
CASE CODES
A, B, C, D, E
A, B, C, D, E
A, B, C, D
C, D, E
TERMINATION
100 % matte tin;
tin / lead
100 % matte tin;
tin / lead;
tin / lead solder fused
Tin / lead;
tin / lead solder fused
Tin / lead solder plated;
gold plated
Revision: 25-Jan-2022
Document Number: 40074
4
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
www.vishay.com
Vishay Sprague
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 ± 0.004
[4.0 ± 0.10]
Tape thickness
Deformation
between
embossments
0.014
[0.35]
MAX.
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Top
cover
tape
B1 MAX.
(Note 6)
Center lines
of cavity
0.069 ± 0.004
[1.75 ± 0.10]
Embossment
0.030 [0.75]
MIN. (Note 3)
B0
Top
cover
tape
For tape feeder
reference only
including draft.
Concentric around B0
(Note 5)
0.079 ± 0.002
[2.0 ± 0.05]
A0
K0
0.004 [0.1]
MAX.
10 pitches cumulative
tolerance on tape
± 0.008 [0.200]
20°
F
W
Maxim um
component
rotation
0.030 [0.75]
MIN. (Note 4)
(Side or front sectional view)
P1
USER DIRECTION OF FEED
Maximum
cavity size
(Note 1)
D1 MIN. for components
0.079 x 0.047 [2.0 x 1.2] and larger .
(Note 5)
Cathode (-)
Anode (+)
Direction of Feed
20° maximum
component rotation
Typical
component
cavity
center line
B0
Typical
component
center line
A0
(Top view)
Tape and Reel Specifications: all case sizes are available
on plastic embossed tape per EIA-481. Standard reel
diameter is 7" [178 mm], 13" [330 mm] reels are available and
recommended as the most cost effective packaging method.
3.937 [100.0]
0.039 [1.0]
MAX.
Tape
0.039 [1.0]
MAX.
0.9843 [250.0]
Camber
(top view)
Allowable camber to be 0.039/3.937 [1/100]
non-cumulative over 9.843 [250.0]
The most efficient packaging quantities are full reel
increments on a given reel diameter. The quantities shown
allow for the sealed empty pockets required to be in
conformance with EIA-481. Reel size and packaging
orientation must be specified in the Vishay Sprague part
number.
Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only
(1) A , B , K , are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
0
0
0
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location shall be applied independent of each other
(6) B dimension is a reference dimension tape feeder clearance only
1
CASE
CODE
TAPE
SIZE
B1
(MAX.)
MOLDED CHIP CAPACITORS; ALL TYPES
A
0.165
8 mm
[4.2]
B
C
D
0.32
12 mm
[8.2]
E
W
Revision: 25-Jan-2022
D1
(MIN.)
F
K0
(MAX.)
P1
W
0.039
[1.0]
0.138 ± 0.002
[3.5 ± 0.05]
0.094
[2.4]
0.157 ± 0.004
[4.0 ± 1.0]
0.315 ± 0.012
[8.0 ± 0.30]
0.059
[1.5]
0.217 ± 0.00
[5.5 ± 0.05]
0.177
[4.5]
0.315 ± 0.004
[8.0 ± 1.0]
0.472 ± 0.012
[12.0 ± 0.30]
Document Number: 40074
5
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Molded Guide
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Vishay Sprague
RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.
TEMPERATURE (°C)
Tp
TL
Ts max.
TC - 5 °C
tp
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
tL
Preheat area
Ts min.
ts
25
Time 25 °C to peak
TIME (s)
PROFILE FEATURE
Preheat / soak
Temperature min. (Ts min.)
Temperature max. (Ts max.)
Time (ts) from (Ts min. to Ts max.)
Ramp-up
Ramp-up rate (TL to Tp)
Liquidus temperature (TL)
Time (tL) maintained above TL
Peak package body temperature (Tp)
Time (tp) within 5 °C of the specified
classification temperature (TC)
Time 25 °C to peak temperature
Ramp-down
Ramp-down rate (Tp to TL)
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
100 °C
150 °C
60 s to 120 s
150 °C
200 °C
60 s to 120 s
3 °C/s max.
3 °C/s max.
183 °C
217 °C
60 s to 150 s
60 s to 150 s
Depends on case size - see table below
20 s
30 s
6 min max.
8 min max.
6 °C/s max.
6 °C/s max.
PEAK PACKAGE BODY TEMPERATURE (Tp)
PEAK PACKAGE BODY TEMPERATURE (Tp)
CASE CODE
SnPb EUTECTIC PROCESS
LEAD (Pb)-FREE PROCESS
A, B, C
235 °C
260 °C
D, E, W
220 °C
250 °C
PAD DIMENSIONS in inches [millimeters]
B
D
C
A
A
(MIN.)
MOLDED CHIP CAPACITORS, ALL TYPES
A
0.071 [1.80]
B
0.118 [3.00]
C
0.118 [3.00]
D
0.157 [4.00]
E
0.157 [4.00]
W
0.185 [4.70]
CASE CODE
Revision: 25-Jan-2022
B
(NOM.)
C
(NOM.)
D
(NOM.)
0.067 [1.70]
0.071 [1.80]
0.094 [2.40]
0.098 [2.50]
0.098 [2.50]
0.098 [2.50]
0.053 [1.35]
0.065 [1.65]
0.118 [3.00]
0.150 [3.80]
0.150 [3.80]
0.150 [3.80]
0.187 [4.75]
0.207 [5.25]
0.307 [7.80]
0.346 [8.80]
0.346 [8.80]
0.346 [8.80]
Document Number: 40074
6
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Molded Guide
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Vishay Sprague
GUIDE TO APPLICATION
1.
AC Ripple Current: the maximum allowable ripple
current shall be determined from the formula:
be established when calculating permissible
operating levels. (Power dissipation calculated using
+25 °C temperature rise).
P
-----------R ESR
6.
power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
Printed Circuit Board Materials: molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7.
Attachment:
7.1
Solder Paste: the recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering,
and hot plate methods. The soldering profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 3 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
For details see www.vishay.com/doc?40214.
I RM S =
where,
P=
RESR = the capacitor equivalent series resistance at
the specified frequency
2.
AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
V RMS = I RM S x Z
or, from the formula:
P
V R MS = Z -----------R ESR
7.2
where,
P=
power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
RESR = the capacitor equivalent series resistance at
the specified frequency
Z=
2.1
2.2
the capacitor impedance at the specified
frequency
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+25 °C.
3.
Reverse Voltage: solid tantalum capacitors are not
intended for use with reverse voltage applied.
However, they have been shown to be capable of
withstanding momentary reverse voltage peaks of up
to 10 % of the DC rating at 25 °C and 5 % of the DC
rating at +85 °C.
4.
Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
TEMPERATURE (°C)
+25
+85
+125
+150 (1)
+175 (1)
+200 (1)
DERATING FACTOR
1.0
0.9
0.4
0.3
0.2
0.1
Note
(1) Applicable for dedicated high temperature product series
5.
Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
Revision: 25-Jan-2022
7.2.1 Backward and Forward Compatibility: capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8.
Cleaning (Flux Removal) After Soldering: molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC / ODS products are not used in the production
of these devices and are not recommended.
Solvents containing methylene chloride or other
epoxy solvents should be avoided since these will
attack the epoxy encapsulation material.
8.1
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
9.
Recommended Mounting Pad Geometries: proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
or circuit board design.
Document Number: 40074
7
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Typical Performance Characteristics
www.vishay.com
Vishay Sprague
Molded Chip Tantalum Capacitors, Automotive Grade
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
PERFORMANCE CHARACTERISTICS
Category temperature range
-55 °C to +85 °C
(to +125 °C / +150 °C / +175 °C with voltage derating - refer to graph “Category Voltage vs. Temperature”) (1)
Capacitance tolerance
± 20 %, ± 10 %, tested via bridge method, at 25 °C, 120 Hz
Dissipation factor
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz
ESR
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz
Leakage current
After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 kΩ
resistor in series with the capacitor under test, leakage current at 25 °C is not more than 0.01 CV or 0.5 μA,
whichever is greater. Note that the leakage current varies with temperature and applied voltage. See graph
“Typical Leakage Current Temperature Factor” for the appropriate adjustment factor.
Capacitance change by
temperature
+30 % max. (at +175 °C)
+20 % max. (at +125 °C and +150 °C)
+10 % max. (at +85 °C)
-10 % max. (at -55 °C)
Reverse voltage
Capacitors are capable of withstanding peak voltages in the reverse direction equal to:
10 % of the DC rating at +25 °C
5 % of the DC rating at +85 °C
1 % of the DC rating at +125 °C
Ripple current
For maximum ripple current values (at 25 °C) refer to relevant datasheet. If capacitors are to be used at
temperatures above +25 °C, the permissible RMS ripple current (or voltage) shall be calculated using the
derating factors:
1.0 at +25 °C
0.9 at +85 °C
0.4 at +125 °C
0.3 at +150 °C
0.2 at +175 °C
Maximum operating
and surge voltages vs.
temperature
+85 °C
+125 °C
+150 °C / +175 °C
RATED VOLTAGE
(V)
SURGE VOLTAGE
(V)
CATEGORY
VOLTAGE
(V)
SURGE VOLTAGE
(V)
CATEGORY
VOLTAGE
(V)
4
5.2
2.7
3.4
n/a
6.3
8
4
5
3
10
13
7
8
5
16
20
10
12
8
20
26
13
16
10
25
32
17
20
12.5
35
46
23
28
17.5
50
65
33
40
25
60
33
40
n/a
75
42
50
n/a
75
50
50
n/a
50
(2)
63
75
(3)
Notes
• All information presented in this document reflects typical performance characteristics
(1) Series TH3 - up to 150 °C; TH4 - up to 175 °C
(2) Capacitance value 15 μF and higher
(3) For 293D and TR3 only
Revision: 19-Sep-2022
Document Number: 40215
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Typical Performance Characteristics
www.vishay.com
Vishay Sprague
RECOMMENDED VOLTAGE DERATING GUIDELINES (for temperature below +85 °C)
VOLTAGE RAIL (V)
≤ 3.3
5
10
12
15
24
CAPACITOR VOLTAGE RATING (V)
6.3
10
20
25
35
50 or series configuration
Notes
• For temperatures above +85 °C the same voltage derating ratio is recommended, but with respect to category voltage.
Up to +85 °C: category voltage = rated voltage
At +125 °C: category voltage = 2/3 of rated voltage
At 150 °C / 175 °C: category voltage = 1/2 of rated voltage
• For more information about recommended voltage derating see: www.vishay.com/doc?40246
CATEGORY VOLTAGE VS. TEMPERATURE
Axis Title
10000
0.8
1000
1st line
2nd line
2nd line
Category Voltage (V)
1.0
0.6
0.4
100
0.2
10
0
-55
0
25
85
125
150
175
Temperature (°C)
Note
• Below 85 °C category voltage is equal to rated voltage
TYPICAL LEAKAGE CURRENT FACTOR
Axis Title
10000
100
+175 °C
1
1000
+150 °C
+125 °C
1st line
2nd line
2nd line
Leakage Current Factor
10
85 °C
0.1
+55 °C
100
+25 °C
0.01
0 °C
-55 °C
10
0.001
0
10
20
30
40
50
60
70
80
90
100
Percent of Rated Voltage
Note
• At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table.
At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table.
At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table.
At +150 °C, the leakage current shall not exceed 15 times the value listed in the Standard Ratings table.
At +175 °C, the leakage current shall not exceed 18 times the value listed in the Standard Ratings table
Revision: 19-Sep-2022
Document Number: 40215
2
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Typical Performance Characteristics
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Vishay Sprague
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
High temperature
exposure (storage)
MIL-STD-202, method 108
1000 h, at maximum rated temperature,
unpowered
Capacitance change
Dissipation factor
Leakage current
ESR
Within ± 20 % of initial value
Initial specified limit
Initial specified limit
Initial specified limit
Operational life test
at +125 °C
AEC-Q200
1000 h application 2/3 of rated voltage
Capacitance change
Dissipation factor
Leakage current
ESR
Within ± 20 % of initial value
Initial specified limit
Shall not exceed 10 times the initial limit
Initial specified limit
Operational life test
at +150 °C (for TH3)
and at +175 °C
(for TH4)
AEC-Q200
1000 h application 1/2 of rated voltage
Capacitance change
Dissipation factor
Leakage current
ESR
Within ± 20 % of initial value
Shall not exceed 3 times the initial limit
Shall not exceed 10 times the initial limit
Shall not exceed 3 times the initial limit
Surge voltage
MIL-PRF-55365:
1000 successive test cycles at 85 °C of surge
voltage (as specified in the table above), in
series with a 33 Ω resistor at the rate of
30 s ON, 30 s OFF
Capacitance change
Dissipation factor
Leakage current
ESR
Within ± 30 % of initial value
Shall not exceed 1.5 times the initial limit
Shall not exceed 2 times the initial limit
Shall not exceed 1.5 times the initial limit
Biased humidity test
AEC-Q200
At 85 °C / 85 % RH, 1000 h,
with rated voltage applied
Capacitance change
Dissipation factor
Leakage current
ESR
Within ± 20 % of initial value
Shall not exceed 3 times the initial limit
Shall not exceed 10 times the initial limit
Shall not exceed 3 times the initial limit
Temperature cycling
AEC-Q200 / JESD22, method JA-104
-55 °C / +125 °C, for 1000 cycles
Capacitance change
Dissipation factor
Leakage current
ESR
Within ± 20 % of initial value
Initial specified limit
Initial specified limit
Initial specified limit
MECHANICAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Vibration
MIL-STD-202, method 204: 10 Hz to 2000 Hz, 5 g
peak for 20 min, 12 cycles each of 3 orientations
(total 36 cycles), at rated voltage
Capacitance change
Dissipation factor
Leakage current
Within ± 20 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Mechanical shock
MIL-STD-202, method 213, condition F, 1500 g peak,
0.5 ms, half-sine
Capacitance change
Dissipation factor
Leakage current
Within ± 20 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Resistance
to solder heat
MIL-STD-202, method 210, condition D
Solder dip 260 °C ± 5 °C, 10 s
Capacitance change
Dissipation factor
Leakage current
Within ± 20 % of initial value
Initial specified limit
Initial specified limit
Resistance to
solvents
MIL-STD-202, method 215
Capacitance change
Dissipation factor
Leakage current
Within ± 20 % of initial value
Initial specified limit
Initial specified limit
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Body marking shall remain legible.
Solderability
AEC-Q200 / J-STD-002
Electrical test not required
Terminal strength /
Shear force test
AEC-Q200-006
Apply a pressure load of 17.7 N (1.8 kg) for 60 s
horizontally to the center of capacitor side body
Exception: for case size 0603 pressure load is 5N
Part should not be sheared off the pads and no body
cracking post-conditioning. Electrical test not required.
Flammability
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %
n/a
Revision: 19-Sep-2022
Document Number: 40215
3
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of
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or for that of subsequent links.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
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