VS-20CTH03-M3
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Hyperfast Rectifier, 2 x 10 A FRED Pt®
FEATURES
• Hyperfast recovery time
• Low forward voltage drop
• 175 °C operating junction temperature
• Low leakage current
1
• Designed and qualified according to JEDEC®-JESD 47
2
3
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
3L TO-220AB
Base
common cathode
4
DESCRIPTION / APPLICATIONS
300 V series are the state of the art hyperfast recovery
rectifiers designed with optimized performance of forward
voltage drop and hyperfast recovery time.
2
Common
cathode
3
Anode
1
Anode
The planar structure and the platinum doped life time
control, guarantee the best overall performance,
ruggedness and reliability characteristics.
VS-20CTH03-M3
These devices are intended for use in the output rectification
stage of SMPS, UPS, DC/DC converters as well as
freewheeling diodes in low voltage inverters and chopper
motor drives.
PRIMARY CHARACTERISTICS
IF(AV)
2 x 10 A
VR
300 V
VF at IF
0.85 V
trr typ.
See Recovery table
TJ max.
175 °C
Package
3L TO-220AB
Circuit configuration
Common cathode
Their extremely optimized stored charge and low recovery
current minimize the switching losses and reduce over
dissipation in the switching element and snubbers.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Peak repetitive reverse voltage
TEST CONDITIONS
VALUES
UNITS
300
V
VRRM
per diode
Average rectified forward current
IF(AV)
per device
Non-repetitive peak surge current
IFSM
Operating junction and storage temperatures
TC = 160 °C
10
TJ = 25 °C
120
20
TJ, TStg
A
-65 to +175
°C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Breakdown voltage,
blocking voltage
Forward voltage
SYMBOL
VBR,
VR
VF
TEST CONDITIONS
MIN.
TYP.
MAX.
300
-
-
IF = 10 A
-
1.05
1.25
0.95
IR = 100 μA
IF = 10 A, TJ = 125 °C
-
0.85
VR = VR rated
-
-
20
TJ = 125 °C, VR = VR rated
-
6
200
UNITS
V
Reverse leakage current
IR
Junction capacitance
CT
VR = 300 V
-
30
-
pF
Series inductance
LS
Measured lead to lead 5 mm from package body
-
8
-
nH
μA
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DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER
SYMBOL
Reverse recovery time
TEST CONDITIONS
trr
MIN.
TYP.
MAX.
IF = 1 A, dIF/dt = 50 A/μs, VR = 30 V
-
-
35
IF = 1 A, dIF/dt = 100 A/μs, VR = 30 V
-
-
30
TJ = 25 °C
-
31
-
TJ = 125 °C
Peak recovery current
IRRM
Reverse recovery charge
IF = 10 A
dIF/dt = 200 A/μs
VR = 200 V
TJ = 25 °C
TJ = 125 °C
Qrr
-
42
-
-
2.4
-
-
5.6
-
UNITS
ns
A
TJ = 25 °C
-
36
-
TJ = 125 °C
-
120
-
MIN.
TYP.
MAX.
UNITS
-65
-
175
°C
-
-
1.5
°C/W
nC
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
Maximum junction and storage
temperature range
TEST CONDITIONS
TJ, TStg
Thermal resistance,
junction-to-case per diode
RthJC
Marking device
Mounting surface, flat, smooth,
and greased
Case style 3L TO-220AB
20CTH03
100
100
IR - Reverse Current (µA)
IF - Instantaneous
Forward Current (A)
TJ = 175 °C
10
TJ = 175 °C
TJ = 125 °C
TJ = 25 °C
1
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
TJ = 150 °C
10
TJ = 125 °C
1
TJ = 100 °C
TJ = 75 °C
0.1
TJ = 50 °C
0.01
TJ = 25 °C
0.001
50
100
150
200
250
300
VF - Forward Voltage Drop (V)
VR - Reverse Voltage (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage
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CT - Junction Capacitance (pF)
1000
100
TJ = 25 °C
10
0
100
50
150
200
250
300
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
ZthJC - Thermal Impedance (°C/W)
10
1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
PDM
t1
0.1
t2
Notes:
1. Duty factor D = t1/t2 .
2. Peak TJ = PDM x ZthJC + TC
Single pulse
(thermal resistance)
0.01
0.00001
0.0001
0.001
0.01
0.1
.
1
10
t1 - Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
20
Average Power Loss (W)
Allowable Case Temperature (°C)
180
170
DC
Square wave (D = 0.50)
Rated VR applied
160
150
16
RMS limit
12
D = 0.01
D = 0.02
D = 0.05
D = 0.1
D = 0.2
D = 0.5
8
4
DC
See note (1)
0
140
0
2
4
6
8
10
12
14
16
0
2
4
6
8
10
12
14
16
IF(AV) - Average Forward Current (A)
IF(AV) - Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
Fig. 6 - Forward Power Loss Characteristics
Note
(1) Formula used: T = T - (Pd + Pd
C
J
REV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 5);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = rated VR
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1000
100
IF = 10 A
IF = 10 A
Qrr (nC)
trr (ns)
TJ = 125 °C
TJ = 25 °C
TJ = 125 °C
100
TJ = 25 °C
VR = 200 V
VR = 200 V
10
100
10
100
1000
1000
dIF/dt (A/µs)
dIF/dt (A/µs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt
Fig. 8 - Typical Stored Charge vs. dIF/dt
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
di(rec)M/dt (5)
0.75 IRRM
(1) diF/dt
(1) diF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
(4) Qrr - area under curve defined by trr
and IRRM
Qrr =
trr x IRRM
2
(5) di(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 9 - Reverse Recovery Waveform and Definitions
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ORDERING INFORMATION TABLE
Device code
VS-
20
C
T
H
03
-M3
1
2
3
4
5
6
7
1
-
Vishay Semiconductors product
2
-
Current rating (20 = 20 A)
3
-
C = common cathode
4
-
T = TO-220, D2PAK (TO-263AB)
5
-
H = hyperfast recovery
6
-
Voltage rating (03 = 300 V)
7
-
Environmental digit:
-M3 = halogen-free, RoHS-compliant, and termination lead (Pb)-free
ORDERING INFORMATION (Example)
PREFERRED P/N
QUANTITY PER T/R
MINIMUM ORDER QUANTITY
PACKAGING DESCRIPTION
VS-20CTH03-M3
50
1000
Antistatic plastic tube
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?96154
Part marking information
www.vishay.com/doc?95028
SPICE model
www.vishay.com/doc?96583
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Outline Dimensions
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3L TO-220AB
DIMENSIONS in millimeters and inches
A
0.014 M B A M
(6)
E
A
ØP
Q
B
A
(6)
(E)
A1
Thermal pad
1
D
(H1)
H1
C
D2
(6) D
2 3
D
L1 (2)
C
(6)
c
3xb
D1
3 x b2
Detail B
Detail B
A2
L
E1 (6)
C
(b, b2)
Base metal
A
c1 (4)
c
2x e
Plating
View A - A
e1
b1, b3
(4)
Section C - C and D - D
0.015 M B A M
Lead tip
Conforms to JEDEC® outline TO-220AB
SYMBOL
A
A1
A2
b
b1
b2
b3
c
c1
D
D1
MILLIMETERS
MIN.
MAX.
4.25
4.65
1.14
1.40
2.50
2.92
0.69
1.01
0.38
0.97
1.20
1.73
1.14
1.73
0.36
0.61
0.36
0.56
14.85
15.35
8.38
9.02
INCHES
MIN.
MAX.
0.167
0.183
0.045
0.055
0.098
0.115
0.027
0.040
0.015
0.038
0.047
0.068
0.045
0.068
0.014
0.024
0.014
0.022
0.585
0.604
0.330
0.355
NOTES
4
4
4
3
SYMBOL
D2
E
E1
e
e1
H1
L
L1
ØP
Q
MILLIMETERS
MIN.
MAX.
11.68
13.30
10.11
10.51
6.86
8.89
2.41
2.67
4.88
5.28
6.09
6.48
13.52
14.02
3.32
3.82
3.54
3.91
2.60
3.00
INCHES
MIN.
MAX.
0.460
0.524
0.398
0.414
0.270
0.350
0.095
0.105
0.192
0.208
0.240
0.255
0.532
0.552
0.131
0.150
0.139
0.154
0.102
0.118
NOTES
6, 7
3, 6
6
6
2
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension and finish uncontrolled in L1
(3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4) Dimension b1, b3, and c1 apply to base metal only
(5) Controlling dimensions: inches
(6) Thermal pad contour optional within dimensions E, H1, D2, and E1
(7) Outline conforms to JEDEC® TO-220, except D2
Revision: 13-Jun-2019
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