XC9223B082AR-G

XC9223/XC9224 Series ETR0509_017 1A Driver Transistor Built-In Step-Down DC/DC Converters ☆Green Operation Compatible ■GENERAL DESCRIPTION The XC9223/XC9224 series are synchronous step-down DC/DC converters with a 0.21Ω (TYP.) P-channel driver transistor and a synchronous 0.23Ω (TYP.) N-channel switching transistor built-in. A highly efficient and stable current can be supplied up to 1.0A by reducing ON resistance of the built-in transistor. With a high switching frequency of 1.0MHz or 2.0MHz, a small inductor is selectable; therefore, the XC9223/XC9224 series are ideally suited to applications with height limitation such as HDD or spacesaving applications. Current limit value can be chosen either 1.2A (MIN.) when the LIM pin is high level, or 0.6A (MIN.) when the LIM pin is low level for using the power supply which current limit value differs such as USB or AC adapter. With the MODE/SYNC pin, the XC9223/XC9224 series provide mode selection of the fixed PWM control or automatically switching current limit PFM/PWM control. As for preventing unwanted switching noise, the XC9223/XC9224 series can be synchronized with an external clock signal within the range of ± 25% toward an internal clock signal via the MODE/SYNC pin. For protection against heat damage of the ICs, the XC9223/XC9224 series build in three protection functions: integral latch protection, thermal shutdown, and short-circuit protection. With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel driver transistor is forced OFF when input voltage becomes 1.8V or lower. The XC9223B/XC9224B series’ detector function monitors the discretional voltage by external resistors. ■APPLICATIONS ●Magnetic disk drive ●Note PCs / Tablet PCs ●CD-R / RW, DVD ●Mobile devices / terminals ●Digital still cameras / Camcorders ●Multi-function power supplies ■FEATURES Input Voltage Range Output Voltage Range Oscillation Frequency Output Current Maximum Current Limit Controls Protection Circuits Soft-Start Time Voltage Detector : 2.5V ~ 6.0V : 0.9V ~ VIN (set by FB pin) : 1MHz, 2MHz (+15% accuracy) : 1.0A : 0.6A (MIN.) ~ 0.9A (MAX) with LIM pin=’L’ : 1.2A (MIN.) ~ 2.0A (MAX.) with LIM pin=’H’ : PWM/PFM or PWM by MODE pin : Thermal shutdown Integral latch method Short-circuit protection : 1ms (TYP.) internally set : 0.712V Detection, N-channel open drain : 0.21Ω Built-in P-channel MOSFET Built-in Synchronous : 0.23Ω N-channel MOSFET (No Schottky Barrier Diode Required) High Efficiency : 95% (VIN=5.0V, VOUT=3.3V) Synchronized with an External Clock Signal Ceramic Capacitor Compatible Packages : MSOP-10, USP-10B Environmentally Friendly : EU RoHS Compliant, Pb Free ■TYPICAL APPLICATION CIRCUIT ■TYPICAL PERFORMANCE CHARACTERISTICS ●Efficiency vs. Output Current XC9223B081Ax XC9223B081Ax 100 VIN=5V, FOSC=1MHz, VIN=5V, FOSC=1MHz, L=4.7uH(CDRH4D28C), L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic) CIN=10uF(ceramic), CL=10uF(ceramic) 90 (*1) A capacitor of 2200pF～0.1μF is recommended to place at the CDD between the AGND pin and the VIN pin. Please refer to the page showing INSTRUCTION ON PATTERN LAYOUT for more detail. Efficiency: EFFI (%) 80 70 VOUT=3.3V 60 50 VOUT=1.5V 40 30 20 PWM/PFM PWM 10 0 1 10 100 Output Current: IOUT (mA) 1000 1/24 XC9223/XC9224 Series ■BLOCK DIAGRAM ●XC9223B/XC9224B Series VIN LIM Error Amp. FB Current Limit PFM Comparator PWM Logic Buffer Driver Current Feedback LX Vref with Soft-Start, CE CE MODE/ SYNC PGND Ramp Wave Generator, OSC PMW/PFM Thermal Shutdown AGND VD VDOUT VDIN ■PRODUCT CLASSIFICATION ●Ordering Information XC9223①②③④⑤⑥-⑦(*1) XC9224①②③④⑤⑥-⑦(*1) DESIGNATOR DESCRIPTION ① Type B ②③ Reference Voltage 08 Fixed reference voltage ②=0, ③=8 ④ DC/DC Oscillation Frequency 1 1.0MHz 2 2.0MHz Packages (Order Unit) AR MSOP-10 (1,000pcs/Reel) AR-G MSOP-10 (1,000pcs/Reel) DR USP-10B (3,000pcs/Reel) DR-G USP-10B (3,000pcs/Reel) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant. ●Selection Guide 2/24 SYMBOL Transistor built-in, Output voltage freely set (FB voltage), Current Limit: 0.6A/1.2A ⑤⑥-⑦ (*1) ITEM XC9223/XC9224 Series ■PIN CONFIGURATION V IN VIN　1 10　PGND PGND VDIN VDIN　2 LX 9　LX AGND　3 AGND 8　CE CE VDOUT　4 VDOUT 7　MODE/SYNC MODE/SYNC FB　5 FB FB 5 FB V DOUT VDOUT 4 6 LIM LIM 7 MODE/SYNC MODE/SYNC AGND 3 AGND 8 CE CE VDIN VDIN 2 9 LX LX 6　LIM LIM VIN VIN 1 MSOP-10 MSOP-10 MSOP-10 (　TOP　VIEW　) 10 PGND PGND USP-10B USP-10B USP-10B ( BOTTOM VIEW ) (BOTTOM VIEW) VIEW) (BOTTOM (TOPVIEW) VIEW) (TOP * For mounting intensity and heat dissipation, please refer to recommended mounting pattern and recommended metal mask when soldering the pad of USP-10B. Mounting should be connected to the GND (No.3,10) pin. ■PIN ASSIGNMENT PIN NUMBER MSOP-10 * USP-10B * 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 10 PIN NAME FUNCTION VIN VDIN AGND VDOUT FB LIM MODE/SYNC CE Lx PGND Input Voltage Detector Input Analog Ground VD Output Output Voltage Monitor Over Current Limit Setting Mode Switch / External Clock Input Chip Enable Output of Internal Power Switch Power Ground * For MSOP-10 and USP-10B packages, please short the GND pins (pin #3 and 10) ■FUNCTION CHART 1. CE (*1) CE PIN OPERATIONAL STATE H L ON OFF *1 Except for a voltage detector block in the XC9224 series. 2. MODE MODE PIN FUNCTION H L PWM Control PWM/PFM Automatic Control 3. LIM LIM PIN FUNCTION H L Maximum Output Current: 1.0A Maximum Output Current: 0.4A 3/24 XC9223/XC9224 Series ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage VDIN Pin Voltage VIN VDIN -0.3 ~ 6.5 -0.3 ~ 6.5 V V VDOUT Pin Voltage VDOUT Pin Current VDOUT IDOUT -0.3 ~ 6.5 10 V mA FB Pin Voltage LIM Pin Voltage VFB VLIM -0.3 ~ 6.5 -0.3 ~ 6.5 V V MODE/SYNC Pin Voltage CE Pin Voltage VMODE/SYNC VCE -0.3 ~ 6.5 -0.3 ~ 6.5 V V Lx Pin Voltage Lx Pin Current VLx ILx -0.3 ~ VIN + 0.3 2000 V mA Power Dissipation (Ta=25℃) MSOP-10 USP-10B 500 (40mm x 40mm Standard board)(*1) Pd Operating Ambient Temperature Topr Storage Temperature Tstg 1000 (40mm x 40mm Standard -40 ~ 85 All voltages are described based on the GND (AGND and PGND) pin. (*1) The power dissipation figure shown is PCB mounted and is for reference only. The mounting condition is please refer to PACKAGING INFORMATION. 4/24 mW 150 -55 ~125 board)(*1) ℃ ℃ XC9223/XC9224 Series ■ELECTRICAL CHARACTERISTICS XC9223/XC9224 Series Ta=25℃ PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT Input Voltage VIN 2.5 - 6.0 V - FB Voltage VFB 0.784 0.800 0.816 V ① Output Voltage Setting Range VOUTSET 0.9 - VIN V ③ (*1) IOUTMAX1 0.4 - - A ③ Maximum Output Current 2 (*1) IOUTMAX2 1.0 - - A ③ U.V.L.O. Voltage VUVLO 1.55 1.80 2.00 V ① Supply Current 1 IDD1 D1-1 (*2) μA ② Supply Current 2 IDD2 D1-2 (*2) μA ② Stand-by Current ISTB D1-6 (*2) μA ② D1-3 (*2) MHz ③ D1-4 (*2) MHz ④ ④ Maximum Output Current 1 FB=VFB x 0.9, VIN Voltage which Lx pin voltage holding ‘L’ level (*8) FB=VFB x 0.9, MODE/SYNC=0V FB=VFB x 1.1 (Oscillation stops), MODE/SYNC=0V CE=0V Connected to external components, IOUT=10mA Connected to external components, IOUT=10mA, apply an external clock signal to the MODE/SYNC Oscillation Frequency fosc External Clock Signal Synchronized Frequency SYNCOSC External Clock Signal Cycle SYNCDTY Maximum Duty Cycle MAXDTY FB=VFB x 0.9 Minimum Duty Cycle MINDTY PFM Switch Current IPFM FB=VFB x 1.1 Connected to external components, MODE/SYNC=0V, IOUT=10mA Connected to external components, VIN=5.0V, VOUT=3.3V, IOUT=200mA FB=VFB x 0.9, ILx=VIN-0.05V Efficiency (*3) EFFI Lx SW ‘H’ On Resistance (*4) RLxH 25 - 75 % 100 - - % ① - - 0 % ① - 200 250 mA ③ - 95 - - % ③ 0.21 0.3 (*7) Ω ① 0.23 0.3 (*7) Ω - Lx SW ‘L’ On Resistance RLxL Current Limit 1 ILIM1 LIM=0V 0.6 - 0.9 A ① ILIM2 LIM=VIN 1.2 - 2.0 A ① TLAT FB=VFB x 0.9, Short Lx by 1Ω resistance ms ① Current Limit 2 Integral Latch Time (*5) Short Detect Voltage VSHORT Soft-Start Time TSS Thermal Shutdown Temperature Hysteresis Width FB Voltage which Lx becomes ‘L’ D1-5 (*2) 0.3 0.4 0.5 V ① 0.5 1.0 2.0 ms ① TTSD - 150 - O C - THYS - 20 - O C - 1.2 - 6.0 V ① AGND - 0.4 V ① (*8) CE=0V→VIN, IOUT=1mA FB=VFB x 0.9, Voltage which Lx becomes ‘H’ after CE voltage changed from 0.4V to 1.2V (*8) FB=VFB x 0.9, Voltage which Lx becomes ‘L’ after CE voltage changed from 1.2V to 0.4V (*8) CE “H” Voltage VCEH CE “L” Voltage VCEL MODE/SYNC “H” Voltage VMODE/SYNCH 1.2 - 6.0 V ③ MODE/SYNC “L” Voltage VMODE/SYNCL AGND - 0.4 V ③ LIM “H” Voltage VLIMH 1.2 - 6.0 V ① AGND - 0.4 V ① - - 0.1 μA ⑤ - 0.1 - - μA ⑤ - - 0.1 μA ⑤ - 0.1 - - μA ⑤ - - 0.1 μA ⑤ - 0.1 - - μA ⑤ - - 0.1 μA ⑤ LIM “L” Voltage VLIML IOUT=ILIM1 x 1.1, Check LIM voltage which Lx oscillated after CE voltage changed from 1.2V to 0.4V CE “H” Current ICEH VIN=CE=6.0V CE “L” Current ICEL VIN=6.0V, CE=0V MODE/SYNC “H” Current IMODE/SYNCH VIN=6.0V MODE/SYNC “L” Current IMODE/SYNCL VIN=6.0V, MODE/SYNC=0V LIM “H” Current ILIMH VIN=LIM=6.0V LIM “L” Current ILIML VIN=6.0V, LIM=0V FB “H” Current IFBH VIN=FB=6.0V VIN=6.0V, FB=0V FB “L” Current IFBL - 0.1 - - μA ⑤ Lx SW “H” Leak Current ILeakH VIN=Lx=6.0V, CE=0V - - 1.0 μA ⑥ Lx SW “L” Leak Current (*6) ILeakL VIN=6.0V, Lx=CE=0V - 3.0 - - μA ⑥ 5/24 XC9223/XC9224 Series ■ELECTRICAL CHARACTERISTICS (Continued) XC9223/XC9224 Series (Continued), Voltage Detector Block PARAMETER SYMBOL Ta=25℃ CONDITIONS VDIN Voltage which VDOUT becomes ‘H’ to ‘L’, Pull-up resistor 200kΩ VDIN Voltage which VDOUT becomes ‘L’ to ‘H’, Pull-up resistor 200kΩ Detect Voltage VDF Release Voltage VDR Hysteresis Width VHYS VHYS=(VDR-VDF) / VDF x 100 Output Current IDOUT Delay Time TDLY VDIN=VDF x 0.9, apply 0.25V to VDOUT Time until VDOUT becomes ‘L’ to ‘H’ after VDIN changed from 0V to 1.0V VDIN “H” Current IVDINH VIN=VDIN=6.0V VDIN “L” Current IVDINL VIN=6.0V, VDIN=0V VDOUT “H” Current IVDOUTH VIN=VDIN=VDOUT=6.0V VDOUT “L” Current IVDOUTL VIN=VDIN=6.0V, VDOUT=0V MIN. TYP. MAX. UNIT CIRCUIT 0.676 0.712 0.744 V ⑦ 0.716 0.752 0.784 V ⑦ - 5 - % - 2.5 4.0 - mA ⑦ 0.5 2.0 8.0 ms ⑦ - - 0.1 μA ⑤ - 0.1 - - μA ⑤ - - 1.0 μA ⑤ - 1.0 - - μA ⑤ Test Condition: Unless otherwise stated, VIN=3.6V, CE=VIN, MODE/SYNC=VIN NOTE: (*1) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes. If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance. Refer to the chart below. (*3) EFFI = { ( output voltage x output current ) / ( input voltage x input current) } x 100 (*4) On resistance (Ω)= (VIN- Lx pin measurement voltage) / 100mA (*2) (*5) Time until it short-circuits Lx with GND through 1Ω of resistance from a state of operation and is set to Lx=Low from current limit pulse (*6) When temperature is high, a current of approximately 100μA may leak. generating. (*7) Designed value. (*8) Whether the Lx pin is high level or low level is judged at the condition of “H”>VIN-0.1V and “L” # ms Current Limit LEVEL IOUT 0mA VOUT VSS LX CE VIN 8/24 Restart XC9223/XC9224 Series ■OPERATIONAL EXPLANATION (Continued) For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown circuit starts operating and the driver transistor will be turned off when the chip’s temperature reaches 150OC. When the temperature drops to 130OC or less after shutting of the current flow, the IC performs the soft start function to initiate output startup operation. The short-circuit protection circuit monitors FB voltage. In case where output is accidentally shorted to the Ground and when the FB voltage decreases less than half of the FB voltage, the short-circuit protection operates to turn off and to latch the driver transistor. In latch mode, the operation can be resumed by either turning the IC off and on via the CE pin, or by restoring power supply to the VIN pin. The detector block of the XC9223/9224 series detects a signal inputted from the VDIN pin by the VDOUT pin (N-ch opendrain). When the VIN pin voltage becomes 1.8V (TYP.) or lower, the driver transistor is forced OFF to prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.0V (TYP.) or higher, switching operation takes place. By releasing the U.V.L.O. function, the IC performs the soft-start function to initiate output startup operation. The U.V.L.O. function operates even when the VIN pin voltage falls below the U.V.L.O. operating voltage for tens of ns. A MODE/SYNC pin has two functions, a MODE switch and an input of external clock signal. The MODE/SYNC pin operates as the PWM mode when applying high level of direct current and the PFM/PWM automatic switching mode by applying low level of direct current, which is the same function as the normal MODE pin. By applying the external clock signal (±25% of the internal clock signal, ON duty 25% to 75%), the MODE/SYNC pin switches to the internal clock signal. Also the circuit will synchronize with the falling edge of external clock signal. While synchronizing with the external clock signal, the MODE/SYNC pin becomes the PWM mode automatically. If the MODE/SYNC pin holds high or low level of the external clock signal for several μs, the MODE/SYNC pin stops synchronizing with the external clock and switches to the internal clock operation. (Refer to the chart below.) ・External Clock Synchronization Function VOUT 50mV/div Lx 2V/div Operates by the internal clock 1MHz Synchronous with the external clock 1.2MHz External Clock Signal MODE/SYNC 2V/div 1.2MHz Duty50% Delay time to the external clock synchronization 1.0μs/div * When an input of MODE/SYNC is changed from “L” voltage into a clock signal of 1.2MHz and 50% duty. 9/24 XC9223/XC9224 Series ■OPERATIONAL EXPLANATION (Continued) In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-ch MOSFET on. time that the P-ch MOSFET is kept on (TON) can be given by the following formula. TON= L×IPFM / (VIN－VOUT) In this case, →IPFM① In PFM control operation, the maximum duty cycle (MAXPFM) is set to 50% (TYP.). Therefore, under the condition that the duty increases (e.g. the condition that the step-down ratio is small), it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. →IPFM② IPFM② IPFM① Ton FOSC Maxumum IPFM Current Lx Lx I Lx 10/24 IPFM 0mA I Lx IPFM 0mA XC9223/XC9224 Series ■NOTES ON USE 1. 2. 3. 4. 5. The XC9223/XC9224 series is designed for use with ceramic output capacitors. If, however, the potential difference between dropout voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on the output. In this case, use a larger capacitor etc. to compensate for insufficient capacitance. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done. In PWM control, very narrow pulses will be outputted, and there is the possibility that some cycles may be skipped completely. This may happens while synchronizing with an external clock. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and there is the possibility that some cycles may be skipped completely. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when dropout voltage or load current is high, current limit starts operating, and this can lead to instability. When peak current becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the peak current according to the following formula: Ipk = (VIN - VOUT) x OnDuty / (2 x L x fosc) + IDOUT L: Coil Inductance Value fosc: Oscillation Frequency 6. When the peak current, which exceeds limit current, flows within the specified time, the built-in P-ch driver transistor is turned off (an integral latch circuit). During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the coil. 7. The voltage drops because of ON resistance of a driver transistor or in-series resistance of a coil. For this, the current limit may not be attained to the limit current value, when input voltage is low. 8. Malfunction may occur in the U.V.L.O. circuit because of the noise when pulling current at the minimum operation voltage. 9. This IC and the external components should be used within the stated absolute maximum ratings in order to prevent damage to the device. 10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. The board should be laid out so that capacitors are placed as close to the chip as possible. 11. In heavy load, the noise of DC/DC may influence and the delay time of the voltage detector may be prolonged. 12. Output voltage may become unstable when synchronizing high internal frequency with the external clock. In such a case, please use a larger output capacitor etc. to compensate for insufficient capacitance. 13. When a voltage lower than minimum operating voltage is applied, the output voltage may fall before reaching the over current limit. 14. When the IC is used in high temperature, output voltage may increase up to input voltage level at light load (less than 100μA) because of the leak current of the driver transistor. 15. The current limit is set to LIM=H: 2000mA (MAX.). However, the current of 2000mA or more may flow. In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current, which is supposed to be limited originally. The short protection does not operate during the soft-start time. The short protection starts to operate and the circuit will be disabled after the soft-start time. Current larger than over current limit may flow because of a delay time of the IC when step-down ratio is large. A coil should be used within the stated absolute maximum rating in order to prevent damage to the device. ①Current flows into P-ch MOSFET to reach the current limit (ILIM). ②The current of ILIM (2000mA, MAX.) or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET. ③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small. ④Lx oscillates very narrow pulses by the current limit for several msec. ⑤The short protection operates, stopping its operation. ② ③ ① ④ #ms ⑤ Delay VLX Overcurrent Limit Value ILX （Coil Current） 11/24 XC9223/XC9224 Series ●INSTRUCTION ON PATTERN LAYOUT 1. In order to stabilize VIN’s voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to the VIN & VSS pins. 2. Please mount each external component, especially CIN, as close to the IC as possible. 3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of switching may result in instability of the IC. 5. Unstable operation may occur at the heavy load because of a spike noise. 2200pF~0.1μF of a capacitor, CDD, is recommended to use between the AGND pin and the VIN pin for reducing noise. ・TOP VIEW ・BOTTOM VIEW 12/24 L Inductor 0 Jumper Chip R Resistor C Ceramic Capaticor XC9223/XC9224 Series ■TEST CIRCUITS Circuit ② Circuit ① Waveform Measurement Point 1uF VIN CE MODE/ SYNC ILIM ILx LX A VIN A FB 1uF V LX CE MODE/ SYNC ILIM FB VDOUT VDIN VDOUT VDIN AGND PGND AGND PGND Circuit ③ Waveform Measurement Point VIN A LX L CE V MODE/ SYNC ILIM CIN VDOUT V AGND IOUT RFB1 FB V CFB RFB2 A CL VDIN PGND * External Components L (1MHz) : 4.7μH (CDRH4D28C, SUMIDA) L (2MHz) : 2.2μH (VLCF4020T-2R2N1R7, TDK) 　　CIN : 10μF (ceramic) 　　CL : 10μF (ceramic) 　　RFB1 : 130kΩ 　　RFB2 : 150kΩ 　　CFB : 62pF (ceramic) Circuit ④ Waveform Measurement Point VIN LX CE CIN ～ PULSE MODE/ SYNC ILIM L IOUT RFB1 FB RFB2 VDOUT VDIN AGND PGND CFB CL * External Components L (1MHz) : 4.7μH (CDRH4D28C, SUMIDA) L (2MHz) : 2.2μH (VLCF4020T-2R2N1R7, TDK) 　　CIN : 10μF (ceramic) 　　CL : 10μF (ceramic) 　　RFB1 : 130kΩ 　　RFB2 : 150kΩ 　　CFB : 62pF (ceramic) 13/24 XC9223/XC9224 Series ■TEST CIRCUITS (Continued) Circuit ⑤ VIN A A CE A A 1μF LX A MODE/ SYNC ILIM FB VDOUT VDIN AGND PGND A A Circuit ⑥ VIN LX CE 1μF MODE/ SYNC ILIM A FB VDOUT VDIN AGND PGND Circuit ⑦ VIN LX CE 1μF A MODE/ 200kΩ SYNC ILIM VDOUT AGND Waveform Measurement Point 14/24 FB VDIN PGND XC9223/XC9224 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (1) Efficiency vs. Output Current VINXC9223B081Ax =5V, FOSC=1MHz, L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic) VIN=5V, FOSC=1MHz, L=4.7uH(CDRH4D28C), CIN=10uF(ceramic), CL=10uF(ceramic) 100 90 90 80 80 Efficiency: EFFI (%) Efficiency: EFFI (%) 100 70 VOUT=3.3V 60 50 VOUT=1.5V 40 30 20 PWM/PFM PWM 10 VINXC9223B082Ax =5V, FOSC=2MHz, L=2.2μH (CDRH4D28), CIN=10μF (ceramic), CL=10μF (ceramic) VIN=5V, FOSC=2MHz, L=2.2uH(CDRH4D28), CIN=10uF(ceramic), CL=10uF(ceramic) 70 VOUT=3.3V 60 50 VOUT=1.5V 40 30 PWM/PFM PWM 20 10 0 0 1 10 100 Output Current: IOUT (mA) 1 1000 10 100 Output Current: IOUT (mA) XC9223B081Ax XC9223B082Ax XC9223B081Ax VIN=3.3V, FOSC=2MHz, L=2.2μH (CDRH4D28), CIN=10μF (ceramic), CL=10μF (ceramic) VIN=3.3V, FOSC=1MHz, L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic) VIN=3.3V,FOSC=2MHz VIN=3.3V,FOSC=1MHz L=4.7uH(CDRH4D28C),CIN=10uF(ceramic),CL=10uF(ceramic) 100 L=2.2uH(CDRH4D28),CIN=10uF(ceramic),CL=10uF(ceramic) 100 90 Efficiency: EFFI (%) Efficiency[%} 90 Efficiency: EFFI (%) Efficiency[%} 1000 80 70 VOUT =2.5V 60 50 VOUT =1.5V 40 30 PWM/PFM 20 80 70 60 VOUT =2.5V 50 VOUT =1.5V 40 30 PWM/PFM 20 PWM PWM 10 10 0 0 10 Current: IOUT 100 Output (mA) 1 10 Current: IOUT 100 (mA) Output 1 1000 1000 Output Current : IOUT (mA) Output Current : IOUT (mA) (2) Output Voltage vs. Output Current VXC9223B081Ax IN=5.0V, Topr=25℃, L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic) VIN=5.0V, Topr=25 oC, L:4.7uH(CDRH4D28C), CIN=10uF(ceramic),CL=10uF(ceramic) 3.5 PWM Control PWM Control 1.55 3.4 3.3 3.2 1.5 1.45 PWM/PFM Automatic Switching Control 3.1 1.6 Output Voltage: VOUT (V) Output Voltage: VOUT (V) 3.6 VIN=5.0V, Topr=25℃, L=4.7μH (CDRH4D28C), XC9223B082Ax CIN=10μF (ceramic), CL=10μF (ceramic) VIN=5.0V,Topr=25 oC, L:4.7uH(CDRH4D28C), CIN=10uF(ceramic),CL=10uF(ceramic) PWM/PFM Automatic Switching Control 1.4 3 1 10 100 Output Current: IOUT (mA) 1000 1 10 100 Output Current: IOUT (mA) 1000 15/24 XC9223/XC9224 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (2) Output Voltage vs. Output Current (Continued) VIN =3.3V, Topr=25℃, L=4.7μH (CDRH4D28C), XC9223B081Ax CIN=10μF (ceramic), CL=10μF (ceramic) VIN=3.3V,Topr=25 oC, L:4.7uH(CDRH4D28C), CIN=10uF(ceramic), CL=10uF(ceramic) 2.7 1.6 PWM Control PWM Control Output Voltage: VOUT (V) Output Voltage: VOUT (V) 2.8 1.55 2.6 2.5 2.4 1.5 PWM/PFM Automatic Switching Control 1.45 PWM/PFM Automatic Switching Control 2.3 VIN =3.3V, Topr=25℃, L=4.7μH (CDRH4D28C), XC9223B082Ax CIN=10μF (ceramic), CL=10μF (ceramic) o VIN=3.3V,Topr=25 C, L:4.7uH(CDRH4D28C), CIN=10uF(ceramic),CL=10uF(ceramic) 2.2 1.4 1 10 100 Output Current: IOUT (mA) 1000 (3) Oscillation Frequency vs. Ambient Temperature 1 10 100 Output Current: IOUT (mA) (4) U.V.L.O. Voltage vs. Ambient Temperature XC9223/XC9224 Series XC9223/24 Series XC9223/XC9224 Series XC9223/24 Series 2.8 1MHz 2.4 1.00 2 2MHz 0.80 1.6 0.60 -50 -25 0 25 50 75 Ambient Temperature : Ta (oC) 1.2 100 2.8 UVLO Voltage : UVLO1,UVLO2 (V) Oscillation Frequency: FOSC (MHz) 1.40 1.20 1000 2.6 UVLO2 2.4 2.2 2.0 1.8 1.6 UVLO 1.4 -50 -25 0 25 50 75 Ambient Temperature : Ta (oC) 100 (5) Supply Current 2 vs. Input Voltage XC9223/XC9224 Series (1MHz) XC9223/XC9224 Series (2MHz) XC9223/24 Series (2MHz) XC9223/9424 Series (1MHz) CE=FB=VIN, MODE=0V 80 60 40 20 0 80 60 40 20 0 2 16/24 CE=FB=VIN, MODE=0V 100 Supply Current 2: IDD2 (uA) Supply Current 2: IDD2 (uA) 100 3 4 5 Input Voltage: VIN (V) 6 7 2 3 4 5 Input Voltage: VIN (V) 6 7 XC9223/XC9224 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (6) Soft Start Time XC9223/XC9224 Series XC9223/XC9224 Series 500μs / div 500μs / div (7) FB Voltage vs. Supply Voltage XC9223/XC9224 Series XC9223/9424 Series IOUT=0.1mA,Topr=25 oC FB Voltage: VFB (V) 0.816 0.808 0.800 0.792 0.784 2.0 3.0 4.0 5.0 Input Voltage: VIN (V) 6.0 7.0 17/24 XC9223/XC9224 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response XC9223B081Ax VIN=5.0V, VOUT=3.3V, MODE/SYNC=VIN (PWM control) L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 500μs / div 50μs / div 500μs / div VIN=5.0V, VOUT=3.3V, MODE/SYNC=0V (PWM/PFM automatic switching control) L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 18/24 500μs / div XC9223/XC9224 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response (Continued) XC9223B081Ax (Continued) VIN=5.0V, VOUT=1.5V, MODE/SYNC=VIN (PWM control) L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 200μs / div 50μs / div 200μs / div VIN=5.0V, VOUT=1.5V, MODE/SYNC=0V (PWM/PFM automatic switching control) L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 200μs / div 19/24 XC9223/XC9224 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response (Continued) XC9223B082Ax VIN=5.0V, VOUT=3.3V, MODE/SYNC=VIN (PWM control) L=2.2μH (CDRH4D28), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 500μs / div 50μs / div 500μs / div VIN=5.0V, VOUT=3.3V, MODE/SYNC=0V (PWM/PFM automatic switching control) L=2.2μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 20/24 500μs / div XC9223/XC9224 Series ■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (8) Load Transient Response (Continued) XC9223B082Ax (Continued) VIN=5.0V, VOUT=1.5V, MODE/SYNC=VIN (PWM control) L=2.2μH (CDRH4D28), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 200μs / div 50μs / div 200μs / div VIN=5.0V, VOUT=1.5V, MODE/SYNC=0V (PWM/PFM automatic switching control) L=2.2μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25OC 50μs / div 200μs / div 21/24 XC9223/XC9224 Series ■PACKAGING INFORMATION For the latest package information go to, www.torexsemi.com/technical-support/packages PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS MSOP-10 MSOP-10 PKG MSOP-10 Power Dissipation USP-10B USP-10B PKG USP-10B Power Dissipation 22/24 XC9223/XC9224 Series ■MARKING RULE ●MSOP-10 ① represents products series MARK 0 PRODUCT SERIES XC9223xxxxAx A XC9224xxxxAx MSOP-10 MSOP10 (TOP VIEW) 10 9 8 7 6 ② represents type of DC/DC converters MARK B PRODUCT SERIES XC9223/9224BxxxAx ③④ represents reference voltage MARK ③ 0 ② ③ ④ ⑤ ⑥ ⑦ PRODUCT SERIES ④ 8 XC9223/9224x08xAx ⑤ represents oscillation frequency MARK 1 2 ① OSCILLATION FREQUENCY 1.0MHz 2.0MHz 1 PRODUCT SERIES XC9223/9224xxx1Ax XC9223/9224xxx2Ax 2 3 4 5 USP-10B USP-10B (BOTTOM VIEW) ⑥⑦ represents production lot number 01 to 09, 0A to 0Z, 10 to 19, 1A~ in order. Note: No character inversion used. (G, I, J, O, Q, W excluded) 2 9 3 MARKING ⑥ 0 1 ⑦ 3 A PRODUCTION LOT NUMBER 03 1A 4 5 ① ② ③ 10 ④ ⑤ ⑥ ⑦ x. e) 1 8 7 6 23/24 XC9223/XC9224 Series 1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. The information in this datasheet is intended to illustrate the operation and characteristics of our products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet. 3. Applicable export control laws and regulations should be complied and the procedures required by such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported. 4. The product is neither intended nor warranted for use in equipment of systems which require extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance. 5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features. 6. Our products are not designed to be Radiation-resistant. 7. Please use the product listed in this datasheet within the specified ranges. 8. We assume no responsibility for damage or loss due to abnormal use. 9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex Semiconductor Ltd in writing in advance. TOREX SEMICONDUCTOR LTD. 24/24