CLH01(TE16L,Q)

CLH01 TOSHIBA High-Efficiency Rectifier Silicon Epitaxial Type CLH01 ○ Switching Mode Power Supply Applications Unit: mm ② • Forward voltage: VFM = 0.98 V (Max.) • Average forward current: IF (AV) = 3 A • Repetitive peak reverse voltage: VRRM = 200 V • Surface-mount package L−FLAT” (Toshiba package name) ① Characteristics Symbol Rating Unit Repetitive peak reverse voltage VRRM 200 V Average forward current IF(AV) 3 (Note 1) A Peak one cycle surge forward current (non-repetitive) IFSM Junction temperature Storage temperature range Note 1: Tℓ = 132°C 60 (50 Hz) 3 .2±0.2 Absolute Maximum Ratings (Ta = 25°C) ①ANODE ① アノード A ② カソード ②CATHODE Tj −40~150 °C Tstg −40~150 °C Rectangular waveform : (α = 180°) JEDEC ⎯ JEITA ⎯ TOSHIBA 3-4F1A Note 2: Using continuously under heavy loads (e.g. the application of Weight: 0.15 g (typ.) high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Electrical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit VFM (1) IFM = 0.7 A (pulse test) ⎯ 0.76 ⎯ VFM (2) IFM = 1.0A (pulse test) ⎯ 0.78 ⎯ VFM (3) IFM = 3.0 A (pulse test) ⎯ 0.88 0.98 IRRM VRRM = 200V (pulse test) ⎯ ⎯ 10 μA Reverse recovery time trr IF = 2A, di/dt = − 50 A/μs ⎯ ⎯ 35 ns Forward recovery time tfr IF = 1.0 A ⎯ ⎯ 100 ns Device mounted on a glass-epoxy board (board size:50mm x 50mm) (board thickness:1.6t) (soldering land) Cathode:5.7mm x 6.2mm Anode :4.5mm x 3.4mm ⎯ ⎯ 100 °C/W ⎯ ⎯ 5 °C/W Peak forward voltage Repetitive peak reverse current Themal resistance (junction to ambient) Rth (j-a) Themal resistance (junction to lead) Rth (j-ℓ) ⎯ V Start of commercial production 1 2004-11 2013-11-01 CLH01 Marking Abbreviation Code H01 Part No. CLH01 Standard Soldering Pad Unit: mm 2.9 2.5 5.9 1.8 2.6 4.8 Handling Precautions 1) The absolute maximum rating denotes the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for designing a circuit incorporating this device: VRRM: Use this rating with reference to (1) above. The VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account when designing a device at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and that Tj be below 120°C.When using this device, take the margin into consideration by using an allowable Ta (max)-IF (AV) curve. IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only, When using the device, design the circuit board and the soldering land size to match the appropriate thermal resistance value. Tj: Derate this rating when using the device to ensure high reliability. We recommend that the device be used at a Tj of below 120°C. 2) The thermal resistance between junction and ambient varies depending on the mounting condition of the device. When using the device, design the circuit board and the soldering land size to match the appropriate thermal resistance value. 3) See the Rectifiers databook for further information information. 2 2013-11-01 CLH01 PF (AV) – IF (AV) iF – vF 4.0 Tj = 150°C 10 Instantaneous forward current Average forward power dissipation PF (AV) (W) iF (A) 100 75°C 1 25°C 0.1 Pulse test 0.01 0.0 0.2 0.6 0.4 0.8 1.0 1.2 Instantaneous forward voltage 1.4 vF DC 3.0 α = 60° 2.0 0° α 0 1 2 Maximum allowable ambient temperature Ta max (°C) 180° DC Rectangular waveform 60 40 0° α 360° 20 0 α Conduction angle 0 1 2 3 Average forward current IF (AV) 5 (A) 4 IF (AV) 5 140 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness:1.6 t (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm 120 100 80 α = 60° 120° 60 Rectangular waveform 180° DC 40 0° α 360° 20 0 α Conduction angle 0 (A) 1 2 3 Average forward current 4 IF (AV) 5 (A) rth (j-a) – t 1000 500 300 Transient thermal impedance rth (j-a) (°C/W) Maximum allowable lead temperature Tℓ max (°C) 120 80 4 Ta max – IF (AV) 140 120° 3 Average forward current Tℓ max – IF (AV) α = 60° 360° α Conduction angle (V) 160 100 Rectangular waveform 1.0 0.0 1.6 180° 120° 100 50 30 10 5 3 Device mounted on a glass-epoxy board (board size: 50 mm × 50 mm) (board thickness:1.6 t (soldering land) Cathode 5.7 mm × 6.2 mm Anode 4.5 mm × 3.4 mm 1 0.5 0.3 0.1 0.001 0.003 0.01 0.03 0.1 0.3 Time 1 3 t 3 10 30 100 300 1000 (s) 2013-11-01 CLH01 Surge forward current Cj – V R (Typ.) (non-repetitive) 1000 80 f = 1 MHz (pF) 100 Peak surge forward current Cj Junction capacitance IFSM (A) Ta = 25°C 10 1 1 3 5 10 Reverse voltage 30 50 100 Ta = 25°C f = 50 Hz 60 40 20 0 VR (V) 1 3 5 10 30 100 Number of cycles 4 2013-11-01 CLH01 RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. • PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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