TB6581HG

TB6581H/HG TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) TB6581H/HG 3-Phase Full-Wave Sine-Wave PWM Brushless Motor Controller The TB6581H/HG is a high-voltage PWM BLDC motor driver. The product integrates the TB6551F/FG sine-wave controller and the TPD4103AK high-voltage driver in a single package (“2-in-1”). It is designed to change the speed of a BLDC directly motor by using a speed control signal (analog) from a microcontroller. Features • • • • • • • • • • A sine wave PWM drive controller and a high-voltage driver integrated in a single package. IGBTs arranged in three half-bridge units Triangle wave generator (carrier frequency = fosc/254 (Hz)) Dead-time insertion (1.9 µs) High-side bootstrap supply Bootstrap diode Overcurrent protection, thermal shutdown, and undervoltage lockout On-chip regulator (Vreg = 7 V (typ.), 30 mA (max), Vrefout = 5 V (typ.), 30 mA (max)) Operating power supply voltage range: VCC = 13.5~16.5 V Motor power supply operating voltage range: VB = 50~400 V Weight: HZIP25-P-1.00K: 7.7 g (typ.) TB6581HG: TB6581HG is a Pb-free product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230˚C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245˚C *dipping time = 5 seconds *the number of times = once *use of R-type flux 1 2006-03-02 TB6581H/HG Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Symbol PGND VREG IS NC VCC7 Vrefout Idc SGND Xin Xout Ve HU HV HW LA FG REV BSU U BSV V BSW W VB VCC15 Description Grounding pin Power ground Function Reference voltage output Connected to pin 5. 7 V (typ.), 30 mA (max) IGBT emitter pin Not connected Signal control power supply pin Reference voltage output Current limit input Grounding pin Clock input Clock output Voltage command input U-phase position sensing input V-phase position sensing If the position sensing inputs are all HIGH or LOW, the outputs are turned off. This pin has a pull-up resistor. input W-phase position sensing input Lead angle control input FG signal output Reverse rotation signal Bootstrap supply (phase U) U-phase output pin Bootstrap supply (phase V) V-phase output pin Bootstrap supply (phase W) W-phase output pin High-voltage power supply pin Power supply pin for the power stage Power supply pin for driving a motor. Power stage operating range: VCC = 15 V 0 to 58° in 32 steps This pin drives three pulses per rotation. For reverse rotation detection. For connecting a bootstrap capacitor to the U-phase output. ⎯ For connecting a bootstrap capacitor to the V-phase output. ⎯ For connecting a bootstrap capacitor to the W-phase output. ⎯ This pin has a pull-down resistor. For connecting a current sensing resistor to ground. This pin is left open and can be used as a jumper on a PCB. Connected to pin 2. The control stage operating voltage: VCC = 6 to 10 V 5 V (typ.), 30 mA (max) For connecting a bypass capacitor for internal VDD. DC link input Reference potential of 0.5 V. This pin has a filter ( ∼ 1 µs). − Signal ground These pins have a feedback resistor. For connecting to a crystal oscillator. 2 2006-03-02 TB6581H/HG Pin Assignment 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 PGND IS Xin U V W VCC15 VCC7 Idc Ve HV LA REV VREG Vrefout SGND Xout BSU BSV BSW VB NC HU HW FG Absolute Maximum Ratings (Ta = 25°C) Characteristics Symbol VCC7 Power supply voltage VCC15 VB Vin (1) Input voltage Vin (2) PWM output current Power dissipation Operating temperature Storage temperature IOUT PD Topr Tstg Rating 12 18 500 −0.3 to VCC1 (Note 1) −0.3 to 5.5 (Note 2) 2 (Note 3) 40 (Note 4) −30 to 115 (Note 5) −50 to 150 A W °C °C V Unit V Note 1: Vin (1) pin: Ve, LA Note 2: Vin (2) pin: Idc, HU, HV, HW Note 3: Apply pulse Note 4: Package thermal resistance (θ j-c = 1°C/W) with an infinite heat sink at Ta = 25°C Note 5: The operating temperature range is determined according to the PD MAX − Ta characteristics. 3 2006-03-02 TB6581H/HG Recommended operating conditions (Ta = 25°C) Characteristics Power supply voltage Crystal oscillator frequency Motor power supply voltage Output current Symbol VCC7 VCC15 Xin VB Iout Min 6 13.5 2 50 ⎯ Typ. 7 15 4 280 1 Max 10 16.5 5 400 2 MHz V A Unit V PD Max – Ta 80 (W) (1) INFINITE HEAT SINK Rθj-c = 1°C/W (2) HEAT SINK (RθHS = 3.5°C/W) Rθj-c + RθHS = 4.5°C/W (3) NO HEAT SINK Rθj-a = 39°C/W PD max Power dissipation 60 40 (1) 20 (2) (3) 0 0 25 50 75 100 125 150 Ambient temperature Ta (°C) 4 2006-03-02 TB6581H/HG Electrical Characteristics (Ta = 25°C) Characteristics Symbol IB ICC15 Current dissipation ICC7 IBS (ON) IBS (OFF) Iin (LA) Input current Iin (Ve) Iin (Hall) VB = 400 V Vreg = OPEN, VCC = 15 V Vrefout = OPEN, VCC = 7 V VBS = 15 V, high-side ON VBS = 15 V, high-side OFF Vin = 5 V, LA Vin = 5 V, Ve Vin = 0 V, HU, HV, HW Test Condition Min ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ −50 Vrefout −1 ⎯ 5.1 1.8 0.7 (Note 6) Xin = 4.19 MHz Xin = 4.19 MHz ⎯ ⎯ ⎯ ⎯ ⎯ Typ. 0.1 1.1 3 260 230 25 35 −25 ⎯ ⎯ 5.4 2.1 1.0 0.3 4.0 4.0 2.4 2.4 Max 0.5 3 6 410 370 50 70 ⎯ Vrefout 0.8 5.7 2.4 1.3 ⎯ ⎯ ⎯ 3 3 ⎯ 1.0 5.5 7.5 2.0 2.0 1.2 0.53 200 ⎯ 12.5 12 10.5 10 4.8 4.3 3 3 ⎯ ⎯ µs ns µs V V °C V V V V V µs V µA µA mA Unit HIGH Vin HU, HV, HW (Hall) LOW Input voltage Vin (Ve) Input hysteresis voltage Input delay time HIGH PWM Duty 100% Middle Refresh → Start motor operation LOW VH VDT VDC Output saturation voltage VCEsatH VCEsatL VFG (H) Output voltage VFG (L) Vrefout Vreg FRD forward voltage BSD forward voltage Current detection Thermal shutdown protection TSDhys VCC15 undervoltage protection for driver VBS undervoltage protection for driver VCC7 undervoltage protection for controller Output turn-on/-off delay time Dead time FRD reverse recovery time VCC15 (H) VCC15 (L) VBS (H) VBS (L) VCC7 (H) VCC7 (L) ton toff tdead trr Undervoltage positive-going threshold Undervoltage negative-going threshold Undervoltage positive-going threshold Undervoltage negative-going threshold Undervoltage positive-going threshold Undervoltage negative-going threshold VBB = 280 V, VCC = 15 V, IC = 0.5 A VBB = 280 V, VCC = 15 V, IC = 0.5 A Xin = 4.19 MHz VBB = 280 V, VCC = 15 V, IC = 0.5 A VFH VFL VF (BSD) Vdc TSD (Note 7) Turned-off → Refresh HU, HV, HW HU, HV, HW Idc VCC = 15 V, IC = 0.5 A VCC = 15 V, IC = 0.5 A IOUT = 1 mA IOUT = −1 mA IOUT = 30 mA IOUT = 30 mA IF = 0.5 A, high-side IF = 0.5 A, low-side IF = 500 µA Idc FG FG Vrefout V Vrefout Vrefout − 1.0 − 0.2 ⎯ 4.5 6.5 ⎯ ⎯ ⎯ 0.47 150 ⎯ 10.5 10 8.5 8 4.2 3.7 ⎯ ⎯ 1.5 ⎯ 0.2 5.0 7 1.3 1.3 0.9 0.5 165 20 11.5 11 9.5 9 4.5 4.0 1.5 1.2 1.8 200 V Note 6 and Note 7: Toshiba does not implement testing before shipping. 5 2006-03-02 TB6581H/HG Functional Description 1. Basic operation The motor is driven by the square-wave turn-on signal based on a positional signal. When the positional signal reaches number of rotations f = 5 Hz or higher, the rotor position is estimated according to the positional signal and a modulation wave is generated. The modulation wave and the triangular wave are compared; then the sine-wave PWM signal is generated and the motor is driven. From start to 5 Hz: When driven by square wave (120° turn-on) f = fosc/(212 × 32 × 6) 5 Hz~: When driven by sine-wave PWM (180° turn-on); when fosc = 4 MHz, approx. 5 Hz 2. Ve voltage command input and bootstrap power supply (1) (2) (3) Voltage command input: When Ve < 1.0 V = U, V and W signals are stopped to protect IGBTs Voltage command input: When 1.0 V < Ve < 2.1 V = The low-side IGBTs are turned on at a fixed frequency (carrier frequency) (duty cycle: 8%). Voltage command input: When Ve > 2.1 V The U, V and W signals are driven out during sine wave drive. The low-side IGBTs are forced to on at fixed frequency (carrier frequency) during square-wave drive (duty cycle: 8%). Note 1: At startup, the low-side IGBTs must be turned on for a fixed period at 1.0 V < Ve < 2.1 V to charge the = high-side IGBT power supply. PWM duty cycle 100% (1) 0 to 1.0 V: Reset state (All outputs are off.) (2) Ve = 1.0 to 2.1 V: Startup operation (duty cycle of 8% for the low-side IGBTs) (3) Ve = 2.1 to 5.4 V: Running state (5.4 V or higher: PWM duty cycle = 100%) (1) 1.0 V (2) 2.1 V (3) 5.4 V Ve 3. Dead time function: upper/lower transistor output off-time When the motor is driven by sine-wave PWM, dead time is digitally generated inside the IC to prevent short circuit caused by the simultaneously turning on of upper and lower external power devices. When a square wave is generated in full-duty cycle mode, the dead time function is turned on to prevent a short circuit. Internal Counter 8/fosc TOFF 1.9 µs TOFF values above are obtained when fosc = 4.19 MHz. fosc = reference clock (crystal oscillation) 4. Correcting the lead angle The lead angle can be corrected in the turn-on signal range from 0 to 58° in relation to the induced voltage. Analog input from LA pin (0 V to 5 V divided by 32) 0 V = 0° 5 V = 58° (when more than 5 V is input, 58°) 6 2006-03-02 TB6581H/HG 5. Setting the carrier frequency This function sets the triangular wave cycle (carrier cycle) necessary for generating the PWM signal. (The triangular wave is used for forcibly turning on the lower transistor when the motor is driven by square wave.) Carrier cycle = fosc/252 (Hz) fosc = reference clock (crystal oscillation) 6. Outputting the reverse rotation detection signal This function detects the motor rotation direction every electrical angle of 360°. This function judges whether the actual direction of a rotating motor coincides with that of the internal reference voltage. Actual Motor Rotating Direction CW (forward) CCW (reverse) REV Pin HIGH LOW Drive Mode Square waveform (120° turn-on mode) Sine-wave waveform (180° turn-on mode) *: CW or CCW of the motor is determined by the direction of the Hall signal, which is specified in the timing chart on page 9. *: W hen the REV pin is set to LOW, and the Hall signal is higher than 5 Hz, sine-wave drive mode is turned on. 7. Protecting input pin (1) Overcurrent protection (Pin Idc) When the DC-link-current exceeds the internal reference voltage, gate block protection is performed. Overcurrent protection is released for each carrier frequency. Reference voltage = 0.5 V (typ.) Positional signal abnormality protection Output is turned off when the positional signal is HHH or LLL; otherwise, it is restarted. Monitor protection for VCC7/ VCC15 low supply voltage For power supply on/off outside the operating voltage range, the U, V and W drive outputs are turned off and the motor is stopped when there is a power supply fault. < VCC7> VCC7 Power supply voltage 4.5 V (typ.) 4.0 V (typ.) GND (2) (3) VB Turn-on drive output Turn-off drive output Output Turn-off drive output < VCC15> VCC15 Power supply voltage 11.5 V (typ.) 11.0 V (typ.) GND VB Turn-on drive output Turn-off drive output Output Turn-off drive output 7 2006-03-02 TB6581H/HG (4) Monitor protection for VBS Bootstrap power supply When VBS power supply is lowered, the high-side IGBT is turned off. VBS (Output -BS) 9.5 V (typ.) 9.0 V (typ.) High-side IGBT Turn-off high-side IGBT Output Turn-off high-side IGBT (5) Overheat protection The overheat protection circuit will operate and all IGBTs will be turned off if the chip temperature becomes abnormally high due to internal or external heat generation. TSD = 165°C (typ.) TSDhys = 20°C (typ.) After the overheat protection circuit is turned on, the return temperature is 145°C (typ.). 8 2006-03-02 TB6581H/HG Timing Chart • CW (forward) mode (CW mode means that the Hall signal is input in the order shown below.) Hu Hv Hw Hall signal (input) FG signal (output) REV signal (output) FG REV (HIGH ) U Turn-on signal V when driven W by square wave X (inside the IC) Y Z Vuv Motor drive output waveform (line voltage) Vvw Vwu * The waveform of actual operation is the PWM • CCW (reverse) mode (CCW mode means that the Hall signal is input in the order shown below.) Hu Hv Hw Hall signal (input) FG signal (output) REV signal (output) FG REV (LO W) Su Modulation waveform when driven by sine Sv wave (inside of IC) Sw Motor drive output waveform (line voltage) Vuv Vvw Vwu * The waveform of actual operation is the PWM 9 2006-03-02 TB6581H/HG Example of Application Circuit Power supply for motor Vrefout C6 C7 C9 C8 15 V 15 LA 2 VREG 25 VCC15 24 VB X1 Xin R1 Hall IC input R2 R3 C1 C2 C3 Xout HU HV HW Ve VCC7 S-GND MCU C4 Vrefout 9 10 12 13 14 11 5 Regula tor Internal Phase reference matchin voltage Position detector Counter Output waveform generator Selecting Phase V data Phase W System clock generator 5-bit AD 4 bit Triangular wave generator 6-bit Phase U 18 20 Comparator 7-V Regulator Undervoltage protection UnderUnderUndervoltage voltage voltage protection protection protection BSU BSV BSW 22 Comparator Comparator 120°/180° 8 6 Power-on reset FG Rotating direction Comparator PWM HU HV HW Charger FG REV 16 17 Protection ST/SP & BRK (CHG) reset ERR GB 120°turn-on matrix Switching 120°/180° & gate block protection on/off High-side level shift driver 19 21 C10 C11 C12 U X Setting dead time V Y W Z HU HV HW LU LV LW Low-side driver Input control Thermal shutdown U V W Motor 23 (Controller) (Driver) 7 Idc R4 C5 1 P-GND 3 IS R5 10 2006-03-02 TB6581H/HG External Parts Symbol X1 C1, C2, C3 R1, R2, R3 C4 C5 R4 R5 C6 C7 C8 C9 C10, C11, C12 Overcurrent detection VREG power supply stability Vrefout oscillation protection Noise absorber Purpose Internal clock generation Noise absorber Recommended value 4.19 MHz 10 V/1000 pF 10 kΩ 10 V/0.1 µF~1.0 µF 10 V/1000pF 5.1 kΩ 0.62 Ω ± 1% (1 W) 16 V/1.0 µF~10 µF 10 V/1000 pF 25 V/0.1 µF 25 V/10 µF 25 V/2.2 µF (Note 3) (Note 5) (Note 2) (Note 3) (Note 2) (Note 4) (Note 3) Note (Note 1) VCC15 power supply stability Bootstrap capacitor Note 1: For carrier frequency and dead time, connect a 4.19 MHz ceramic resonator. Note 2: These parts are used as a low-pass filter for noise absorption. Test to confirm noise filtering, then set the filter time-constant. Note 3: This part is used as a capacitor for power supply stability. Adjust the part to the application environment as required. When mounting, place it as close as possible to the base of the leads of this product to improve the noise elimination. Note 4: This part is used to set the value for overcurrent detection. Iout (max) = Vdc ÷ R5 (Vdc = 0.5 V (typ.)) Note 5: The required bootstrap capacitance value varies according to the motor drive conditions. The voltage stress for the capacitor is the value of VCC15. Other Precautions Utmost care is necessary in the design of the output, VCC, VM, and GND lines since the IC may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. In turning on the power, first supply Vcc15 and confirm its stability; then apply Vcc7 and the driving input signal. Vcc15 and VB may be turned on in either order. In turning off the power, take care not to cut off the VB line by relay while the motor is spinning. Doing so may cause the IC to break down by cutting the current-producing route for VB. The TB6581H/HG is sensitive to electrostatic discharge. Handle with care. The product should be mounted by the solder-flow method. The preheating time is from 60 to 120 seconds at 150˚C. The maximum heat is 260˚C, to be applied within 10 seconds and as far as the lead stopper. 11 2006-03-02 TB6581H/HG Package Dimensions W eight: 7.7 g (typ.) 12 2006-03-02 TB6581H/HG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. Timing charts may be simplified for explanatory purposes. The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. 2. Equivalent Circuits 3. Timing Charts 4. Application Circuits 5. Test Circuits IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 13 2006-03-02 TB6581H/HG Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 14 2006-03-02 TB6581H/HG 15 2006-03-02