SI9910DY-T1-E3

Si9910 Vishay Siliconix Adaptive Power MOSFET Driver1 FEATURES D dv/dt and di/dt Control D Undervoltage Protection D Short-Circuit Protection D trr Shoot-Through Current Limiting D Low Quiescent Current D CMOS Compatible Inputs D Compatible with Wide Range of MOSFET Devices D Bootstrap and Charge Pump Compatible (High-Side Drive) DESCRIPTION The Si9910 Power MOSFET driver provides optimized gate drive signals, protection circuitry and logic level interface. Very low quiescent current is provided by a CMOS buffer and a high-current emitter-follower output stage. This efficiency allows operation in high-voltage bridge applications with “bootstrap” or “charge-pump” floating power supply techniques. The non-inverting output configuration minimizes current drain for an n-channel “on” state. The logic input is internally diode clamped to allow simple pull-down in high-side drives. Fault protection circuitry senses an undervoltage or output short-circuit condition and disables the power MOSFET. Addition of one external resistor limits maximum di/dt of the external Power MOSFET. A fast feedback circuit may be used to limit shoot-through current during trr (diode reverse recovery time) in a bridge configuration. The Si9910 is available in both standard and lead (Pb)-free 8-pin plastic DIP and SOIC packages which are specified to operate over the industrial temperature range of −40 _C to 85 _C. FUNCTIONAL BLOCK DIAGRAM VDS VDD DRAIN Undervoltage/ Overcurrent Protection R3 *100 kW C1 *2 to 5 pF PULL-UP R2 *250 W 2-ms Delay PULL-DOWN ISENSE INPUT R1 *0.1 W VSS * Typical Values 1. Patent Number 484116. Document Number: 70009 S-42043—Rev. H, 15-Nov-04 www.vishay.com 1 Si9910 Vishay Siliconix ABSOLUTE MAXIMUM RATINGS Voltages Referenced to VSS Pin VDD Supply Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 18 V Pin 1, 4, 5, 7, 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V Pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.7 V to VDD + 0.3 V Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . "20 mA Peak Current (Ipk) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65 to 150_C Notes a. Device mounted with all leads soldered or welded to PC board. b. Derate 5.6 mW/_C above 25_C. Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40 to 85_C Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150_C Power Dissipation (Package)a 8-Pin SOIC (Y Suffix)b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 mW 8-Pin Plastic DIP (J Suffix)b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 700 mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONSa Test Conditions Unless Otherwise Specified Parameter Input High Level Input Voltage Low Level Input Voltage Input Voltage Hysteresis High Level Input Current Low Level Input Current VIH VIL Vh IIH IIL VIN = VDD VIN = 0 V 0.90 0.70 x VDD 7.4 6.0 2.0 0.35 x VDD 3.0 "1 "1 mA V Limits Minc Typb Maxc Unit Symbol VDD 10.8 V to 16.5 V TA = OperatingTemperature Range Output High Level Output Voltage Low Level Output Voltage Undervoltage Lockout ISENSE Pin Threshold Voltage Drain-Source Maximum Input Current for VDS Input Peak Output Source Current Peak Output Sink Current VOH VOL VUVLO VTH VDS IVDS IOS+ IOS− Max IS = 2 mA, Input High 100 mV Change on Drain Input High IOH = −200 mA IOL = 200 mA 8.3 0.5 8.3 VDD −3 10.7 1.3 9.2 0.66 9.1 12 1 −1 3 10.6 0.8 10.2 20.0 mA A V Supply Supply Range Supply Current VDD IDD1 IDD2 Output High, No Load Output Low, No Load 10.8 0.1 100 16.5 1 500 V mA Dynamic Propagation Delay Time Low to High Level Propagation Delay Time High to Low Level Rise Time Fall Time Overcurrent Sense Delay (VDS) Input Capacitance tPLH tPHL tr tf tDS Cin CL = 2000 pF 120 135 50 35 1 5 mS pF ns Notes a. Refer to PROCESS OPTION FLOWCHART for additional information. b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing. c. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum. www.vishay.com Document Number: 70009 S-42043—Rev. H, 15-Nov-04 2 Si9910 Vishay Siliconix AC TESTING CONDITIONS IN (IN = L) 50% tPLH 90% tPHL VDD VSS VOH VOL tr tf OUT 10% PIN CONFIGURATIONS AND ORDERING INFORMATION PDIP-8 VDS INPUT VDD DRAIN 1 2 3 4 Top View 8 7 6 5 PULL-UP Pull-DOWN VSS ISENSE VDS INPUT VDD DRAIN 1 2 3 4 SOIC-8 8 7 6 5 Top View PULL-UP PULL−DOWN VSS ISENSE ORDERING INFORMATION Part Number Si9910DY Si9910DY-T1 Si9910DY-T1—E3 Si9910DJ Si9910DJ—E3 −40 to 85_C PDIP-8 PDIP 8 SOIC-8 Temperature Range Package Document Number: 70009 S-42043—Rev. H, 15-Nov-04 www.vishay.com 3 Si9910 Vishay Siliconix PIN DESCRIPTION Pin 1: VDS Pin 1 or VDS is a sense input for the maximum source-drain voltage limit. Two microseconds after a high transition on input pin 2, an internal timer enables the VDS(max) sense circuitry. A catastrophic overcurrent condition, excessive on-resistance, or insufficient gate-drive voltage can be sensed by limiting the maximum voltage drop across the power MOSFET. An external resistor (R3) is required to protect pin 1 from overvoltage during the MOSFET “off” condition. Exceeding VDS(max) latches the Si9910 “off.” Drive is re-enabled on the next positive- going input on pin 2. If pin 1 is not used, it must be connected to pin 6 (VSS). Pin 2: INPUT A non-inverting, Schmidt trigger input controls the state of the MOSFET gate-drive outputs and enables the protection logic. When the input is low (v VIL), VDD is monitored for an undervoltage condition (insufficiently charged bootstrap capacitor). If an undervoltage (v VDD(min)) condition exists, the driver will ignore a turn-on input signal. An undervoltage (v VDD(min)) condition during an “on” state will not be sensed. “floating” applications (half-bridge, high-side) and ground-referenced applications (half-bridge, low-side). Pin 7: PULL-DOWN Pin 8: PULL-UP Pull-up and pull-down outputs collectively provide the power MOSFET gate with charging and discharging currents. Turn “on” or “off” di/dt can be limited by adding resistance (R2) in series with the appropriate output. APPLICATIONS “Floating” High-Side Drive Applications As demonstrated in Figure 1, the Si9910 is intended for use as both a ground-referenced gate driver and as a “high-side” or source-referenced gate driver in half-bridge applications. Several features of the Si9910 permit its use in half-bridge high-side drive applications. A simple and inexpensive method of isolating a floating supply to power the Si9910 in high-side driver applications had to be provided. Therefore, the Si9910 was designed to be compatible with two of the most commonly used floating supply techniques: the bootstrap and the charge pump. Both of these techniques have limitations when used alone. A properly designed bootstrap circuit can provide low-impedance drive which minimizes transition losses and the charge pump circuit provides static operation. The Si9910 is configured to take advantage of either floating supply technique if the application is not sensitive to their particular limitations, or both techniques if switching losses must be minimized and static operation is necessary. The schematic above illustrates both the charge pump and bootstrap circuits used in conjunction with an Si9910 in a high-side driver application. Input signal level shifting is accomplished with a passive pull-up (R4) and n-channel MOSFET (Q2) for pull-down in applications below 500 V. Total node capacitance defines the value of R4 needed to guarantee an input transition rate which safely exceeds the maximum dv/dt rate of the output half-bridge. Using level-shift devices with higher current capabilities may necessitate the addition of current-limiting components such as R5. Bootstrap Undervoltage Lockout When using a bootstrap capacitor as a high-side floating supply, care must be taken to ensure time is available to recharge the bootstrap capacitor prior to turn-on of the high-side MOSFET. As a catastrophic protection against abnormal conditions such as start-up, loss of power, etc., an internal voltage monitor has been included which monitors the bootstrap voltage when the Si9910 is in the low state. The Si9910 will not respond to a high input signal until the voltage on the bootstrap capacitor is sufficient to fully enhance the power MOSFET gate. For more details, please refer to Application Note AN705. Document Number: 70009 S-42043—Rev. H, 15-Nov-04 Pin 3: VDD VDD supplies power for the driver’s internal circuitry and charging current for the power MOSFET’s gate capacitance. The Si9910 minimizes the internal IDD in the “on” state (gate-drive outputs high) allowing a “floating” power supply to be provided by charge pump or bootstrap techniques. Pin 4: DRAIN Drain is an analog input to the internal dv/dt limiting circuitry. An external capacitor (C1) must be used to protect the input from exposure to the high-voltage (“off” state) drain and to set the power MOSFET’s maximum rate of dv/dt. If dv/dt feedback is not used, pin 4 must be left open. Pin 5: ISENSE ISENSE in combination with an external resistor (R1) protects the power MOSFET from potentially catastrophic peak currents. ISENSE is an analog feedback that limits current during the power MOSFET’s transition to an “on” state. It is intended to protect power MOSFETs (in a half-bridge arrangement) from “shoot-through” current, resulting from excess di/dt and trr of flyback diodes or from logic timing overlap. An 0.8-V drop across (R1) should indicate a current level that is approximately four times the maximum allowable load current. When the ISENSE input is not used, it should be tied to pin 6 (VSS). Pin 6: VSS VSS is the driver’s ground return pin. The applications diagram illustrates the connection of VSS for source-referenced www.vishay.com 4 Si9910 Vishay Siliconix APPLICATION CIRCUIT VDD (12 to 15 V) D1 VDD VDS R3 DRAIN R4 PULL-UP C2 INPUT PULL-DOWN ISENSE C3 C1 R2 Q1 R1 VDD VDS Q2 DRAIN C4 R5 PULL-DOWN INPUT ISENSE R1’ Q1’ PULL-UP C1’ R2’ R3’ Motor CMOS Logic OSC VSS C2 = Bootstrap Cap C3 = Chargepump Cap FIGURE 1. High-Voltage Half-Bridge with Si9910 Drivers Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?70009. Document Number: 70009 S-42043—Rev. H, 15-Nov-04 www.vishay.com 5 Legal Disclaimer Notice Vishay Notice Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale. Document Number: 91000 Revision: 08-Apr-05 www.vishay.com 1