W3DG7232V10JD1

White Electronic Designs 256MB - 32Mx72 SDRAM UNBUFFERED FEATURES PC100 and PC133 Compatible Burst Mode Operation Auto and Self Refresh capability LVTTL compatible inputs and outputs Serial Presence Detect with EEPROM Fully synchronous: All signals are registered on the positive edge of the system clock Programmable Burst Lengths: 1, 2, 4, 8 or Full Page 3.3V ± 0.3V Power Supply 144 Pin SO-DIMM JEDEC • Package height options: JD1: 31.75 (1.25") W3DG7232V-D1 -JD1 PRELIMINARY* DESCRIPTION The W3DG7232V is a 32Mx72 synchronous DRAM module which consists of nine 32Mx8 SDRAM components in TSOP II package, and one 2K EEPROM in an 8 pin TSSOP package for Serial Presence Detect which are mounted on a 144 Pin SO-DIMM multilayer FR4 Substrate. * This product is under development, is not qualified or characterized and is subject to change without notice. PIN CONFIGURATIONS (FRONT SIDE/BACK SIDE) PIN FRONT PIN BACK PIN FRONT PIN BACK PIN FRONT PIN BACK 1 VSS 2 VSS 49 DQ13 50 DQ45 97 DQ22 98 DQ54 3 DQ0 4 DQ32 51 DQ14 52 DQ46 99 DQ23 100 DQ55 5 DQ1 6 DQ33 53 DQ15 54 DQ47 101 VCC 102 VCC 7 DQ2 8 DQ34 55 VSS 56 VSS 103 A6 104 A7 9 DQ3 10 DQ35 57 CB0 58 CB4 105 A8 106 BA0 11 VCC 12 VCC 59 CB1 60 CB5 107 VSS 108 VSS 13 DQ4 14 DQ36 61 CLK0 62 CKE0 109 A9 110 BA1 15 DQ5 16 DQ37 63 VCC 64 VCC 111 A10 112 A11 17 DQ6 18 DQ38 65 RAS# 66 CAS# 113 VCC 114 VCC 19 DQ7 20 DQ39 67 WE# 68 NC 115 DQMB2 116 DQMB6 21 VSS 22 VSS 69 SO# 70 A12 117 DQMB3 118 DQMB7 23 DQMB0 24 DQB4 71 NC 72 NC 119 VSS 120 VSS 25 DQMB1 26 DQB5 73 NC 74 CLK1 121 DQ24 122 DQ56 27 VCC 28 VCC 75 VSS 76 VSS 123 DQ25 124 DQ57 29 A0 30 A3 77 CB2 78 CB6 125 DQ26 126 DQ58 31 A1 32 A4 79 CB3 80 CB7 127 DQ27 128 DQ59 33 A2 34 A5 81 VCC 82 VCC 129 VCC 130 VCC 35 VSS 36 VSS 83 DQ16 84 DQ48 131 DQ28 132 DQ60 37 DQ8 38 DQ40 85 DQ17 86 DQ49 133 DQ29 134 DQ61 39 DQ9 40 DQ41 87 DQ18 88 DQ50 135 DQ30 136 DQ62 41 DQ10 42 DQ42 89 DQ19 90 DQ51 137 DQ31 138 DQ63 43 DQ11 44 DQ43 91 VSS 92 VSS 139 VSS 140 VSS 45 VCC 46 VCC 93 DQ20 94 DQ52 141 SDA 142 SCL 47 DQ12 48 DQ44 95 DQ21 96 DQ53 143 VCC 144 VCC A0 – A12 BA0-1 DQ0-63 CB0-7 CLK0,CK1 CKE0 CS0# RAS# CAS# WE# DQMB0-7 VCC VSS SDA SCL DNU NC PIN NAMES Address input (Multiplexed) Select Bank Data Input/Output Check bit (Data-in/data-out) Clock input Clock Enable input Chip select Input Row Address Strobe Column Address Strobe Write Enable DQM Power Supply (3.3V) Ground Serial data I/O Serial clock Do not use No Connect September 2004 Rev. 0 1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs FUNCTIONAL BLOCK DIAGRAM WE# S0# DQMB0 DQM DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# DQ32 DQ33 DQ34 DQ35 DQ36 DQ37 DQ38 DQ39 DQMB4 DQM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# W3DG7232V-D1 -JD1 PRELIMINARY D0 D5 DQMB1 DQM DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# DQMB5 DQM DQ40 DQ41 DQ42 DQ43 DQ44 DQ45 DQ46 DQ47 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# D1 D6 DQMB6 DQM CB0 CB1 CB2 CB3 CB4 CB5 CB6 CB7 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# DQ48 DQ49 DQ50 DQ51 DQ52 DQ53 DQ54 DQ55 DQM I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# D2 D7 DQMB2 DQM DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# DQMB7 DQM DQ56 DQ57 DQ58 DQ59 DQ60 DQ61 DQ62 DQ63 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# D3 D8 DQMB3 DQM DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7 S0# WE# NOTE: DQ wiring may differ than described in this drawing, however DQ/DQMB/CKE/S relationships must be maintained as shown. D4 *CLOCK WIRING CLOCK INPUT *CLK0 *CLK1 SDRAMS 4 OR 5 SDRAMS 4 OR 5 SDRAMS RAS# CAS# CKE0 BA0-BA1 A0-A12 RAS#: SDRAM D0-D8 CAS#: SDRAM D0-D8 CKE: SDRAM D0-D8 BA0-BA1: SDRAM D0-D8 A0-A12: SDRAM D0-D8 *Wire per Clock Loading Table/Wiring Diagrams VCC D0-D8 SCL A0 SERIAL PD SDA A1 A2 VSS D0-D8 September 2004 Rev. 0 2 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative to VSS Voltage on VCC supply relative to VSS Storage Temperature Power Dissipation Short Circuit Current Symbol VIN, VOUT VCC, VCCQ TSTG PD IOS Value -1.0 ~ 4.6 -1.0 ~ 4.6 -55 ~ +150 9 50 W3DG7232V-D1 -JD1 PRELIMINARY Units V V °C W mA Note: Permanent device damage may occur if “ABSOLUTE MAXIMUM RATINGS” are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. RECOMMENDED DC OPERATING CONDITIONS Voltage Referenced to: VSS = 0V, 0°C ≤ TA ≤ +70°C Parameter Supply Voltage Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Input Leakage Current Symbol VCC VIH VIL VOH VOL ILI Min 3.0 2.0 -0.3 2.4 — -10 Typ 3.3 3.0 — — — — Max 3.6 VCCQ+0.3 0.8 — 0.4 10 Unit V V V V V µA 1 2 IOH = -2mA IOL= -2mA 3 Note Note: 1. VIH (max)= 5.6V AC. The overshoot voltage duration is ≤ 3ns. 2. VIL (min)= -2.0V AC. The undershoot voltage duration is ≤ 3ns. 3. Any input 0V ≤ VIN ≤ VCCQ Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs. CAPACITANCE TA = 25°C, f = 1MHz, VCC = 3.3V, VREF = 1.4V ± 200mV Parameter Input Capacitance (A0-A12) Input Capacitance (RAS#,CAS#,WE#) Input Capacitance (CKE0) Input Capacitance (CK0) Input Capacitance (CS0#) Input Capacitance (DQM0-DQM7) Input Capacitance (BA0-BA1) Data Input/Output Capacitance (DQ0-DQ63) Data input/output capacitance (CB0-CB7) Symbol CIN1 CIN2 CIN3 CIN4 CIN5 CIN6 CIN7 COUT COUT1 Max 50 50 50 22 50 8 50 9.5 9.5 Unit pF pF pF pF pF pF pF pF pF September 2004 Rev. 0 3 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs OPERATING CURRENT CHARACTERISTICS VCC = 3.3V, 0°C ≤ TA ≤ +70°C W3DG7232V-D1 -JD1 PRELIMINARY Version Parameter Operating Current (One bank active) Precharge Standby Current in Power Down Mode Symbol ICC1 Conditions Burst Length = 1 tRC ≤ tRC(min) IOL = 0mA CKE ≤ VIL(max), tCC = 10ns CKE & CK ≤ VIL(max), tCC = ∞ CKE ≥ VIH(min), CS ≥ VIH(min), tcc =10ns Input signals are charged one time during 20 CKE ≥ VIH(min), CK ≥VIL(max), tCC = ∞ Input signals are stable CKE ≥ VIL(max), tCC = 10ns CKE & CK ≤ VIL(max), tCC = ∞ CKE ≥ VIH(min), CS ≥ VIH(min), tcc = 10ns Input signals are changed one time during 20ns CKE ≥ VIH(min), CK ≤ VIL(max), tcc = ∞ Input signals are stable Io = mA Page burst 4 Banks activated tCCD = 2CK tRC ≥ tRC(min) CKE ≤ 0.2V 100/133 900 Units mA Note 1 ICC2P ICC2PS ICC2N 18 18 180 mA Precharge Standby Current in Non-Power Down Mode ICC2NS ICC3P ICC3PS ICC3N mA 90 54 54 270 225 mA mA mA Active Standby Current in Power-Down Mode Active Standby Current in Non-Power Down Mode ICC3NS ICC4 Operating Current (Burst mode) 990 mA 1 Refresh Current Self Refresh Current Notes: 1. Measured with outputs open. 2. Refresh period is 64ms. ICC5 ICC6 1980 27 mA mA 2 September 2004 Rev. 0 4 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs PACKAGE DIMENSIONS FOR JD1 Ordering Information W3DG7232V10JD1 W3DG7232V7JD1 W3DG7232V75JD1 Speed 100MHz 133MHz 133MHz CAS Latency CL=2 CL=2 CL=3 W3DG7232V-D1 -JD1 PRELIMINARY Height* 31.75 (1.25”) 31.75 (1.25”) 31.75 (1.25”) Note: For industrial temperature range product, add an "I" to the end of the part number. PACKAGE DIMENSIONS FOR JD1 67.72 (2.661 Max) 2.01 (0.079 Min) 3.81 (0.150) MAX. WEDC 301 3.99 (0.157) 31.75 (1.25) Max 19.99 (0.787) 23.14 (0.913) 28.2 (1.112) 32.79 (1.291) 4.60 (0.181) 1.50 (0.059) 0.99 (0.039) (± 0.004) * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES). September 2004 Rev. 0 5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs PACKAGE DIMENSIONS FOR D1 Ordering Information W3DG7232V10D1 W3DG7232V7D1 W3DG7232V75D1 Speed 100MHz 133MHz 133MHz CAS Latency CL=2 CL=2 CL=3 W3DG7232V-D1 -JD1 PRELIMINARY Height* 31.75 (1.25”) 31.75 (1.25”) 31.75 (1.25”) Note: For industrial temperature range product, add an "I" to the end of the part number. PACKAGE DIMENSIONS FOR D1 67.72 (2.661 Max) 2.01 (0.079 Min) 3.81 (0.150) MAX. 3.99 (0.157) 31.75 (1.25) Max 19.99 (0.787) 23.14 (0.913) 28.2 (1.112) 32.79 (1.291) 4.60 (0.181) 1.50 (0.059) 0.99 (0.039) (± 0.004) * ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES). September 2004 Rev. 0 6 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com White Electronic Designs Document Title 256MB - 32Mx72 SDRAM UNBUFFERED W3DG7232V-D1 -JD1 PRELIMINARY Revision History Rev # Rev A History A.1 Changed the module height to 1.095" A.2 Changed part number to WED3DG7232V-AD1 Release Date 6-2-03 Status Advanced Rev 0 0.1 Updated CAP and IDD Spec. 0.2 Created document title page 0.3 Moved from Advanced to Preliminary 0.4 Removed "ED" from part number 9-04 Preliminary September 2004 Rev. 0 7 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com