EK-Z7-ZC702-CES-G

ZYNQ-7000 EPP ZYNQ-7000 EPP ZC702 EVALUATION KIT POWE R FU L EVALUATION KIT FOR TH E ZYNQ-7000 EXTE NSI B LE PROCESSI NG PLATFOR M ZYNQ-7000 EPP ZC702 EVALUATION KIT Xilinx Solution Highlights • Productivity-boosting kit, including silicon, development tools, IP, and reference designs • Wide feature set, with abundant I/O expandability, to develop solutions for most markets • Foundation for Zynq-7000 EPP-based designs • Best-in-class tools, operating system support, and ecosystem (including ARM community) The Xilinx® ZYNQ™-7000 EPP ZC702 Evaluation Kit gives developers a complete development platform including hardware, development tools, IP, and pre-verified reference designs. The included targeted reference design jump-starts development, and enables in-depth exercising of the ARM processing system and Xilinx 28nm scalable optimized programmable logic architecture. Additional reference designs and industry-standard FPGA Mezzanine Connectors (FMCs) let developers scale and customize designs using Xilinx and third-party daughter cards to best fit their application and system with this development board. This evaluation kit offers a wide feature set and abundant I/O expandability, to shorten time to market for applications that call for industry-leading performance, feature differentiation, and power efficiency. What’s Inside the ZC702 Evaluation Kit • ZC702 Evaluation Board featuring the XC7Z020-1CLG484CES device • Agile Mixed Signal (AMS) A New Class of Devices: Zynq-7000 Extensible Processing Platform ® • ARM dual-core Cortex™-A9 processor meets Xilinx 28nm programmable logic • ASIC-like performance and power with the flexibility of an FPGA and ease of programming of a microprocessor • Flexibility to create a custom ARMbased ASSP by adding peripherals and accelerators to the programmable logic • Full seat ISE® Design Suite Embedded Edition • Cables and Power Supply: Documentation, Designs, and Demos • Step-by-Step Getting Started Guide • Hardware User Guide • Reference Design and Design Example User Guide – Universal 12V power supply • Schematics and PCB files – USB cables, Ethernet cable • Demonstrations – 8 GB Class 4 SD card • Board design files • USB Flash Drive (contains documentation, designs, and demos) ZYNQ-7000 EPP ZYNQ-7000 EPP ZC702 EVALUATION KIT Z C702 EVALUATI O N B OAR D User Push-buttons, Active High I2C Program-user Clock 3.3V LVDS FMC1 LPC connector Xilinx XADC Header FMC2 LPC Connector Quad SPI Flash Memory(1Gb) Eight-user LEDs SD Card Interface Connector User 2-pole DIP Switch Configuration Mode Select Switch Zynq-7000 Extensible Processing Platform (EPP) System Clock, 200 MHz, 2.5V LVDS Power Management System (bottom and top of board) Power On/Off Slide Switch FPGA PROG Push-button I2C Bus Switch I2C Real-Time Clock (RTC) CAN Bus Transceiver DDR3 Component Memory (1 GB) HDMI Controller, HDMI Video Connector USB JTAG Module with integrated USB Mini-B Connector RGMII Ethernet PHY Oscillator, 25.000 MHz 10/100/1000 MHz Ethernet PHY, RJ45 with Magnetics USB 2.0 ULPI Transceiver, USB Mini-B Connector Ethernet Status LEDs 2x6 and 1x6 PMOD I/O Header USB-to-UART Bridge, USB Mini-B Connector 2x6 Male Pin I/O Header driven from I2C Expander U80 Take the NEXT STEP For more information about the ZC702 Evaluation Kit, please visit: www.xilinx.com/zc702 For more information about the Zynq-7000 EPP product family, please visit: www.xilinx.com/zynq Corporate Headquarters Europe Japan Asia Pacific Pte. Ltd. Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124 USA Tel: 408-559-7778 www.xilinx.com Xilinx Europe One Logic Drive Citywest Business Campus Saggart, County Dublin Ireland Tel: +353-1-464-0311 www.xilinx.com Xilinx K.K. Art Village Osaki Central Tower 4F 1-2-2 Osaki, Shinagawa-ku Tokyo 141-0032 Japan Tel: +81-3-6744-7777 japan.xilinx.com Xilinx, Asia Pacific 5 Changi Business Park Singapore 486040 Tel: +65-6407-3000 www.xilinx.com © Copyright 2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners. Printed in the U.S.A. PN 2514