ORH-B36G

PLCC LED Series Datasheet ORH-B36G(IF=2mA) 1. Features:         Emitted Color : Super Blue. Lens Appearance : Water Clear. Mono-color type. 1.6x0.8x0.4mm(0603) standard package. Suitable for all SMT assembly methods. Compatible with infrared and vapor phase reflow solder process. Compatible with automatic placement equipment. This product doesn’t contain restriction substance, comply ROHS standard. 2. Applications:     Automotive : Dashboards, stop lamps, turn signals. Backlighting : LCDs, Key pads advertising. Status indicators : Comsumer & industrial electronics. General use. Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G 3.Package Dimensions: NOTES: 1).All dimensions are in millimeters (inches). 2).Tolerance is ± 0.10mm (0.004”) unless otherwise specified. 3).Specifications are subject to change without notice. 4.Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 120 mW Forward Current IF 30 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -25℃~80℃ - Storage Temperature Tstg -30℃~85℃ - Soldering Temperature Tsol 260℃ - ＊1 Condition for IFp is pulse of 1/10 duty and 0.1msec width. Copyright© 2018 Orient Tech Corporation. All rights Reserved 2 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G 5. Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=2mA 2.6 - 3.1 V Luminous Intensity Iv IF=2mA 23 - 53 mcd Reverse Current IR VR=5V - - 1 μA Peak Wave Length λp IF=2mA - 460 - nm Dominant Wave Length λd IF=2mA 458 - 475 nm Spectral Line Half-width Δλ IF=2mA - 30 - nm Veiwing Angle 2θ1/2 IF=2mA - 120 - deg 6.Typical Electro-Optical Characteristics Curves Fig.2 Forward current derating curve Fig.1 Relative intensity vs. wavelength vs. ambient temperature 1.0 60 Relative radiant intensity 50 40 0.5 30 20 10 0 410 460 0 510 20 100 2.5 30 20 10 1 2 3 4 (Normalized @ 20mA) Relative luminous intensity Forward current (mA) 80 3.0 40 2.0 1.5 1.0 0.5 0 -40 5 -20 Forward voltage(V) 0 20 40 60 A Ambient temperature Ta( C) Fig.6 Radiation diagram Fig.5 Relative luminous intensity vs. forward current 0 2.0 10 20 30 RELATIVE RADIANT INTENSITY Relative luminous intensity (@20mA) 60 Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage 50 0 40 Ambient temperature Ta( C) Wavelength (nm) 1.5 1.0 0.5 0 10 20 30 40 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0.5 50 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Copyright© 2018 Orient Tech Corporation. All rights Reserved 3 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G 7.Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 Note: 1).U means the upper limit of specified characteristics. S means initial value. 2).Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. 8.Bin Limits In t e n s i t y Bi n Li m i t s (A t 2 mA ) BI N CO D E Mi n . (m c d ) Ma x . (m c d ) L 23 35 M 35 53 BI N CO D E Mi n . (n m ) Ma x . (n m ) 2 4 58 4 61 46 1 46 4 46 4 46 7 46 7 47 0 47 0 47 5 Co l o r Bi n Li m i t s (A t 2 mA ) 3 4 5 6 Copyright© 2018 Orient Tech Corporation. All rights Reserved 4 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G V F Bi n Li m i t s (A t 2 mA ) 9 . BI N ： x BI N CO D E Mi n . ( v ) F1 2.6 2. 75 F2 2.75 2. 85 G1 2.85 2.9 5 G2 2.95 3.1 x Ma x . ( v ) x VF BIN CO DE Co lor BIN CODE In ten sity BIN CO DE 10.Tapping and packaging specifications(Units: mm) USER DIRECTION OF FEED 13.0∮ 0.5 0.5 ∮ 0.05 1.5!O0.1 4.0∮ 0.1 2.0!O0.05 LEADER 0.3 FIXING TAPE NOTE: 3000 pcs PER REEL Copyright© 2018 Orient Tech Corporation. All rights Reserved 179∮ 1 71.0∮ 1 TRAILER 13.0∮ 0.5 8.0∮ 0.3 3.5∮ 0.05 CATHODE 4.0∮ 0.1 1.75∮ 0.05 END 5.3∮ 0.05 START 1.75∮ 0.1 ANODE 0.9 ∮0.05 5 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G 11.Package Method:(unit:mm) 12. Package and Label of Products: (1) Package: Products are packed in one bag of 4000 pcs (one taping reel) and a label is attached on each bag. (2) Label: ORIENT LOGO Part No. Quantity BIN Sealing Date x xx xx xx Year Month Day Manufacture Location Copyright© 2018 Orient Tech Corporation. All rights Reserved 6 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G 13.Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions Result Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs 0/20 0/20 High Ta=+85℃±5℃ Test time=1,000hrs 0/20 Low Ta=-35℃±5℃ Test time=1,000hrs 0/20 -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle 0/20 -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 0/20 0/20 14. Soldering : 1). Manual Of Soldering The temperature of the iron tip should not be higher than 300 ℃ (572 ℉ ) and Soldering within 3 seconds per solder-land is to be observed. 2). Reflow Soldering Preheating : 140℃~160℃±5℃,within 2 minutes. Operation heating : 260℃(Max.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching). Copyright© 2018 Orient Tech Corporation. All rights Reserved 7 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G 10 SEC. MAX. Temperature 140~160℃ 260℃ MAX. 4℃ /SEC. MAX. 4℃ /SEC. MAX. OVER 2 MIN. Time 3). DIP soldering (Wave Soldering) : Preheating : 120℃~150℃,within 120~180 sec. Operation heating : 245℃±5℃ within 5 sec.260℃ (Max) Gradual Cooling (Avoid quenching). Temperature Soldering heat Max. 260 ℃ 245 ±5℃ within 5 sec. 120~150℃ Preheat 120~180 sec. Time 15.Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook. 16. Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. Copyright© 2018 Orient Tech Corporation. All rights Reserved 8 Ver, A0 SHENZHEN ORIENT ELECTRONICS CO. ,LTD. ORH-B36G 17.Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a....Completed within 24 hours. b....Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60℃±3℃. Copyright© 2018 Orient Tech Corporation. All rights Reserved 9 Ver, A0