PLCC LED Series Datasheet
ORH-R36A(IF=20mA)
1. Features:
Chip material: AlGaInP/GaAs.
Emitted Color: Super Orange Red.
Lens Appearance: Water Clear.
Mono-color type.
1.6x0.8x0.6mm (0603) standard package.
Suitable for all SMT assembly methods.
Compatible with infrared and vapor phase reflow solder process.
Compatible with automatic placement equipment.
This product doesn’t contain restriction substance, comply ROHS standard.
2. Applications:
Automotive: Dashboards, stop lamps, turn signals.
Backlighting: LCDs, Key pads advertising.
Status indicators: Comsumer & industrial electronics.
General use.
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ORH-R36A
3..Package Dimensions:
NOTES:
1).All dimensions are in millimeters (inches).
2).Tolerance is ± 0.10mm (0.004”) unless otherwise specified.
3).Specifications are subject to change without notice.
4.Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
Rating
Unit
Power Dissipation
Pd
100
mW
Forward Current
IF
30
mA
Peak Forward Current *1
IFP
100
mA
Operating Temperature
Topr
-25℃~80℃
-
Storage Temperature
Tstg
-30℃~85℃
-
Soldering Temperature
Tsol
260℃
-
*1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
5. Electrical and optical characteristics(Ta=25℃)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Forward Voltage
Vf
IF=20mA
1.6
-
2.4
V
Luminous Intensity
Iv
IF=20mA
63
-
210
mcd
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IR
Reverse Current
VR=5V
-
-
100
μA
630
-
nm
630
nm
Peak Wave Length
λp
IF=20mA
-
Dominant Wave Length
λd
IF=20mA
618
Spectral Line Half-width
Δλ
IF=20mA
-
17
-
nm
Veiwing Angle
2θ1/2
IF=20mA
-
120
-
deg
6.Typical Electro-Optical Characteristics Curves
F ig .2 F o r w a rd c u r re n t d e r a tin g c u rv e
v s . a m b ie n t te m p e ra tu re
F ig .1 R e la tiv e in te n s ity v s . w a v e le n g th
1 .0
60
Forward current (mA)
Relative radiant intensity
50
0 .5
40
30
20
10
0
580
630
0
680
20
W a v e le n g th (n m )
80
100
3 .0
Relative Luminous intensity
30
20
(Normalized @20mA)
2 .5
40
Forward current (mA)
60
F ig .4 R e la tiv e lu m in o u s in te n s ity v s .
a m b ie n t te m p e ra tu re
F ig .3 F o r w a rd c u r re n t v s . fo r w a rd v o lta g e
50
10
0
40
A m b ie n t te m p e r a tu re T a ( C )
2 .0
1 .5
1 .0
0 .5
1
2
3
4
0
-4 0
5
-2 0
F o r w a rd v o lta g e (V )
0
20
40
60
A m b ie n t te m p e r a tu re T a ( C )
F ig .5 R e la tiv e lu m in o u s in te n s ity
v s . fo r w a rd c u r re n t
F ig .6 R a d ia tio n d ia g ra m
0
4 .0
10
20
3 .0
Relative radiant intensity
Relative luminous intensity (@20mA)
30
2 .0
1 .0
40
1 .0
0 .9
50
0 .8
60
70
0 .7
80
90
0
10
20
30
40
0 .5
50
0 .3
0 .1
0 .2
0 .4
0 .6
F o r w a r d c u rre n t (m A )
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-R36A
7.Judgment criteria of failure for the reliability
Measuring items
Forward voltage
Reverse current
Luminous intensity
Symbol
VF ( V)
IR(uA)
Iv ( mcd )
Measuring conditions
IF=20mA
VR=5V
IF=20mA
Judgement criteria for failure
Over Ux1.2
Over Ux2
Below SX0.5
Note: 1). U means the upper limit of specified characteristics. S means initial value.
2). Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
8.Bin Limits
In t e n s i t y Bi n Li m i t s (A t 20 mA )
BI N CO D E
Mi n . (m c d )
Ma x . (m c d )
P
63
94
Q
94
140
R
140
21 0
To l e r a n c e for ea c h Bi n li m i t is ± 15% .
Co l o r Bi n Li m i t s (A t 20 mA )
BI N CO D E
Mi n . (n m )
Ma x . (n m )
6
618
625
7
625
630
To l e r a n c e for ea c h Bi n li m i t is ± 1n m .
V F Bi n Li m i t s (A t 20 mA )
BI N CO D E
Mi n . ( v )
Ma x . ( v )
A
1.6
1.8
B
1.8
2.0
C
2.0
2.2
D
2.2
2.4
To l e r a n c e for ea c h Bi n li m i t is ± 0. 0 5 V.
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ORH-R36A
9. BI N : x
x
x
VF BIN CO DE
Co lor BIN CODE
Intensity BIN CODE
10.Tapping and packaging specifications(Units: mm)
USER DIRECTION OF FEED
13.0∮ 0.5
0.5 ∮ 0.05
4.0∮ 0.1
1.5!O0.1
4.0∮ 0.1
2.0!O0.05
TRAILER
179∮ 1
13.0∮ 0.5
71.0∮ 1
1.75∮ 0.05
8.0∮ 0.3
CATHODE
3.5∮ 0.05
5.3∮ 0.05
END
1.75∮ 0.1
ANODE
0.9 ∮0.05
START
LEADER
0.3
FIXING TAPE
NOTE: 3000 pcs PER REEL
11.Package Method:(unit:mm)Vacuum
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ORH-R36A
12. Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on
each bag.
(2) Label:
ORIENT LOGO
Part No.
Quantity
BIN
Sealing Date
x
xx
xx
xx
Year Month Day
Manufacture Location
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ORH-R36A
13.Reliability Test
Classification
Test Item
Operation Life
High Temperature
Endurance
Test
High Humidity
Storage
Reference Standard
MIL-STD-750:1026
Connect with a power If=20mA
MIL-STD-883:1005
Ta=Under room temperature
JIS-C-7021
Test time=1,000hrs
Ta=+65℃±5℃
:B-1
MIL-STD-202:103B
JIS-C-7021
:B-11
MIL-STD-883:1008
Storage
JIS-C-7021
:B-10
Test time=1,000hrs
JIS-C-7021
:B-12
0/20
Low Ta=-35℃±5℃
0/20
Test time=1,000hrs
Temperature
MIL-STD-202:107D
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
Cycling
MIL-STD-750:1051
60min 20min
MIL-STD-883:1010
Test Time=5cycle
JIS-C-7021
Thermal Shock
Test
Solder Resistance
60min
20min
0/20
:A-4
MIL-STD-202:107D
-35℃±5℃ ~+85℃±5℃
MIL-STD-750:1051
20min
MIL-STD-883:1011
Test Time=10cycle
Preheating:
MIL-STD-202:201A
MIL-STD-750:2031
JIS-C-7021
0/20
0/20
High Temperature
Storage
Result
RH=90%-95%
Test time=240hrs
High Ta=+85℃±5℃
Low Temperature
Environmental
Test Conditions
20min
0/20
140℃-160℃,within 2 minutes.
0/20
Operation heating:
:A-1
260℃(Max.), within 10seconds. (Max.)
14. Soldering :
1). Manual Of Soldering
The temperature of the iron tip should not be higher than 300 ℃ (572 ℉ ) and Soldering within 3
seconds per solder-land is to be observed.
2). Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 260℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
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ORH-R36A
10 SEC. MAX.
Temperature
140~160℃
260℃ MAX.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
OVER 2 MIN.
Time
3). DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
Temperature
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec.
120~150℃
Preheat
120~180 sec.
Time
15.Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
16.Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
Copyright© 2018 Orient Tech Corporation.
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SHENZHEN ORIENT ELECTRONICS CO. ,LTD.
ORH-R36A
17.Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a....Completed within 168 hours.
b....Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
48 hours at 60℃±3℃.
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