CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
Description
Pin Configuration
The CLAMP0524P_LC is an ultra low capacitance TVS
array,utilizing leading monolithic silicon technology to
provide fast response time and low ESD clamping voltage,
making this device an ideal solution for protecting voltage
sensitive high-speed data lines. The CLAMP0524P_LC
has an ultra-low capacitance with a typical value at 0.2pF,
and complies with the IEC 61000-4-2 (ESD) standard with
±25kV air and ±20kV contact discharge. It is assembled
into a 10-pin 2.5x1.0x0.5mm lead-free DFN package. The
Mechanical Characteristics
flow through style package allows for easy PCB layout and
matched trace lengths necessary to maintain con- sistent
impedance between high speed differential lines such as
Package: DFN2510-10 (2.5×1.0×0.5mm)
USB 3.0 and HDMI. The small size, ultra-low capacitance
Lead Finish: Matte Tin
Case Material: “Green” Molding Compound.
Moisture Sensitivity: Level 3 per J-STD-020
Terminal Connections: See Diagram Below
Marking Information: See Below
and high ESD surge protection make CLAMP0524P_LC
an ideal choice to protect HDMI, MDDI, USB3.0 and other
high speed ports.
Features
Ultra low capacitance: 0.3pF typical (I/O to I/O)
Ultra low leakage: nA level
Low operating voltage: 5V
Low clamping voltage
HDMI 1.3 & 1.4, USB 2.0 & 3.0 and MDDI ports
Up to 4 lines protects
Monitors and flat panel displays
Leadless flow-through package
Set-top box and Digital TV
Complies with following standards:
Video graphics cards
– IEC 61000-4-2 (ESD) immunity test
Digital Video Interface (DVI)
Air discharge: ±25kV
Notebook Computers
Contact discharge: ±20kV
PCI Express and Serial SATA Ports
IEC61000-4-5 (Lightning) 4A (8/20µs)
RoHS Compliant
Applications
Marking information
Dot denotes Pin1
Ordering Information
Part Number
CLAMP0524P_LC
Rev.A_Aug,2016
Packaging
3000/Tape & Reel
Details marking code reference specification of approval
Reel Size
7 inch
-1-
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
Absolute Maximum Ratings (TA=25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Peak Pulse Power (8/20µs)
Ppk
60
W
Peak Pulse Current (8/20µs)
IPP
4
A
ESD per IEC 61000−4−2 (Air)
±25
VESD
ESD per IEC 61000−4−2 (Contact)
Operating Temperature Range
Storage Temperature Range
±20
kV
TJ
−55 to +125
°C
Tstg
−55 to +150
°C
Electrical Characteristics (TA=25°C unless otherwise specified)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Min
Typ
VRWM
VBR
Max
Unit
5
V
Any I/O pin to ground
V
IT = 1mA, any I/O pin to ground
0.5
µA
VRWM = 5V, any I/O pin to ground
6
Reverse Leakage Current
IR
Clamping Voltage
VC
10
V
Clamping Voltage
VC
15
V
Junction Capacitance
CJ
0.2
0.3
pF
Junction Capacitance
CJ
0.4
0.5
pF
Rev.A_Aug,2016
0.2
-2-
Test Condition
IPP = 1A (8 x 20µs pulse), any I/O
pin to ground
IPP = 4A (8 x 20µs pulse), any I/O
pin to ground
VR = 0V, f = 1MHz, between I/O
pins
VR = 0V, f = 1MHz, any I/O pin to
ground
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
Typical Performance Characteristics (TA=25°C unless otherwise Specified)
Insertion Loss S21 of I/O to GND
Normalized Capacitance vs. Reverse Voltage
2.0
1.5
0.0
1.4
1.3
Normalized Capacitance
Insertion Loss (dB)
-2.0
-4.0
-6.0
-8.0
-10.0
1.2
1.1
1.0
0.9
0.8
0.7
-12.0
0.6
0.5
-14.0
1.0E+05
1.0E+06
1.0E+07
1.0E+08
0
1.0E+09
1
2
ESD Clamping
(+8kV Contact per IEC 61000-4-2)
4
5
ESD Clamping
(-8kV Contact per IEC 61000-4-2)
20.0
60.0
10.0
50.0
0.0
Clamping Voltage (V)
70.0
.
.
Clamping Voltage (V)
3
Reverse Voltage (V)
Frequency (Hz)
40.0
30.0
20.0
10.0
-10.0
-20.0
-30.0
-40.0
0.0
-50.0
-10.0
-60.0
-70.0
-20.0
-50
0
50
100
150
-50
200
50
100
150
200
Time (ns)
Time (ns)
Rev.A_Aug,2016
0
-3-
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
Typical Application
The CLAMP0524P_LC is designed for easy PCB layout by allowing the traces to run straight through the device. ThePCB
traces could be used to connect the pin pairs for each line. For example, line 1 enters at pin 1 and exits at pin 10 and the
PCB trace connects Pin 1 and Pin 10 together. Ground is connected at Pin 3 and Pin 8.
10
1
9
2
8
3
7
4
6
5
CLAMP0524P_LC on USB 3.0 Port Application
Rev.A_Aug,2016
-4-
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
CLAMP0524P_LC on DVI Port Application
Rev.A_Aug,2016
-5-
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
CLAMP0524P_LC on HDMI Port Application
Rev.A_Aug,2016
-6-
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
CLAMP0524P_LC on VGA Port Application
CLAMP0524P_LC on eSATA Port Application
Rev.A_Aug,2016
-7-
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
Soldering parameters
Pb-Free assembly
(see FIG.2)
Reflow Condition
Pre Heat
-Temperature Min (Ts(min))
+150℃
-Temperature Max(Ts(max))
+200℃
-Time (Min to Max) (ts)
60-180 secs.
Average ramp up rate (Liquid us Temp (TL) to peak)
3℃/sec. Max
Ts(max) to TL - Ramp-up Rate
3℃/sec. Max
Reflow
-Temperature(TL) (Liquid us)
+217℃
-Temperature(tL)
60-150 secs.
Peak Temp (Tp)
+260(+0/-5)℃
Time within 5℃ of actual Peak Temp (tp)
30 secs. Max
Ramp-down Rate
6℃/sec. Max
Time 25℃ to Peak Temp (TP)
8 min. Max
Do not exceed
+260℃
Rev.A_Aug,2016
-8-
www.wpmtek.com
CLAMP0524P_LC
Integrated in
OVP&OCP products
provider
4-Line Ultra Low Capacitance TVS Diode Array
Package mechanical data
DIMENSIONS
SYM
MILLIMETERS
MIN
NOM
MAX
INCHES
MIN
NOM
MAX
A
0.45
0.50
0.55
0.018
0.020
0.022
A1
0.00
0.02
0.05
0.000
0.001
0.002
b
0.15
0.20
0.25
0.006
0.008
0.010
b1
0.35
0.40
0.45
0.014
0.016
0.018
b2
0.20
0.25
0.30
0.008
0.010
0.012
c
0.10
0.15
0.20
0.004
0.006
0.008
D
2.45
2.50
2.55
0.098
0.100
0.102
e
0.50BSC
0.020BSC
Nd
2.00BSC
0.080BSC
E
0.95
1.00
1.05
0.038
0.040
0.042
L
0.35
0.40
0.45
0.014
0.016
0.018
L1
0.075REF
0.003REF
L2
0.050REF
0.002REF
h
0.08
0.12
0.15
0.003
0.005
0.006
R
0.05
0.10
0.15
0.002
0.004
0.006
Suggested Land Pattern
DIMENSIONS
SYM
MILLIMETERS
INCHES
X1
0.200
0.008
X2
0.400
0.016
X3
0.500
0.020
Y
0.600
0.024
Z
1.400
0.056
Contact information
WPMTEK Incorporated Limited
Floor 1 Building 4#, Binxianghua Industry Park, No.7,
Huada Road, Hualian Community, Longhua New District, Shenzhen
TEL:86755-29308003
FAX:86755-23739900
wpmtek Incorporated Limited (WPM) reserves the right to make changes to the product specification and data in this document without notice. WPM
makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does WPM assume any liability
arising from the application or use of any products or circuits, and specifically dis- claims any and all liability, including without limitation special,
consequential or incidental damages.
Rev.A_Aug,2016
-9-
www.wpmtek.com
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