SMHC2511-4R7MHF

SMHC2511 Series 1. Features of SMHC2511 series: • 7.40 x 6.80mm foot Print , 3.00mm Max. height SMD Power Inductor for high frequency application. Operating frequency up to 5MHz. • Inductance range from 0.10uH to 10.0uH. Custom values are welcomed. • High saturation current characteristics by distributed gapped metal dust core. • Ideal for portable device, Pad, E-reader and high density DC to DC Converter. • Lower DC resistance for higher current application. • Tape & Reel Quantity: 1000 piece per 13 inches reel. RoHS and HF compliant. 2. Electrical Characteristics of SMHC2511 series: 3. Mechanical Dimensions (unit: mm): OCL DCR DCR Isat 1 Irms 2 (uH) (mΩ) (mΩ) (A) (A) ±20% Typ. @25Ԩ Max. @25Ԩ @25Ԩ @25Ԩ SMHC2511-R10MHF 0.10 1.50 1.70 60.00 32.50 SMHC2511-R15MHF 0.15 1.90 2.40 52.00 26.00 ITG Part Number A± 0.20 B± 0.30 C Max. D± 0.30 E± 0.50 6.60 7.10 3.00 3.00 1.60 E B xxx YWW A D SMHC2511-R20MHF 0.20 2.40 2.70 41.00 24.00 SMHC2511-R22MHF 0.22 2.50 2.80 40.00 23.00 SMHC2511-R33MHF 0.33 3.50 3.90 30.00 20.00 SMHC2511-R47MHF 0.47 4.00 4.20 26.00 17.50 SMHC2511-R68MHF 0.68 5.00 5.50 25.00 15.50 SMHC2511-R82MHF 0.82 6.70 8.00 24.00 13.00 SMHC2511-1R0MHF 1.0 9.00 10.00 22.0 11.00 SMHC2511-1R5MHF 1.5 14.00 15.00 18.0 9.00 G 3.70 Typ. H 3.50 Typ. SMHC2511-2R2MHF 2.2 18.00 20.00 14.00 8.00 SMHC2511-3R3MHF 3.3 28.00 30.00 13.50 6.00 SMHC2511-4R7MHF 4.7 37.00 40.00 10.00 5.50 SMHC2511-6R8MHF 6.8 54.00 60.00 8.00 4.50 SMHC2511-8R2MHF 8.2 64.00 68.00 7.50 4.00 SMHC2511-100MHF 10.0 102.00 105.00 7.00 3.00 Part Marking: xxx : inductance value in uH. YWW: Y is Year Code , WW is week. C Pad Dimension SMHC2511 F 7.40 Typ. F H G Recommend PCB Layout Notes: 1. Isat: DC current that causes inductance to drop 30%(Typ.) from OCL (Ta=25Ԩ). 2. Irms: DC current for an approximate temperature rise of 40Ԩ without core loss. Derating is necessary for AC currents. PCB pad layout,trace thickness and width,air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions as verified in the end application. 3. Test conditions: 100KHz, 1.0V, 25˚C ambient temperature . 4. Operating Temperature Range: -55˚C to 125˚C . ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.1: May 17 , 2017 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SMHC2511 Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SMHC2511 Series : 0.080 80 0.120 TEMP RISE(Ԩ) 0.060 60 INDUCTANCE(μH) 0.040 40 0.020 20 0.000 0 SMHC2511‐R15MHF 80 TEMP RISE(Ԩ) 0.090 40 0.030 20 0.000 0 0 10 20 30 40 50 60 70 DC  BIAS(Amps) DC  BIAS(Amps) SMHC2511‐R20MHF SMHC2511‐R22MHF 80 0.176 TEMP RISE(Ԩ) 60 INDUCTANCE(μH) 0.080 40 0.040 20 0.000 0 20 30 40 50 60 80 TEMP RISE(Ԩ) 0.132 60 INDUCTANCE(μH) 0.088 40 0.044 20 0.000 0 70 0 DC  BIAS(Amps) 0.376 60 0.132 40 0.066 20 0.000 0 5 10 15 20 25 30 35 40 45 DC  BIAS(Amps) 40 50 60 70 100 80 INDUCTANCE(μH) 80 INDUCTANCE(μH) 0 ● 0.470 TEMP RISE(Ԩ) 0.198 30 SMHC2511‐R47MHF 100 TEMP RISE(Ԩ) INDUCTANCE(μH) 0.264 20 DC  BIAS(Amps) SMHC2511‐R33MHF 0.330 10 TEMP RISE(Ԩ) 0.282 60 INDUCTANCE(μH) 0.188 40 0.094 20 0.000 0 0 TEMP RISE(Ԩ) 0.120 100 TEMP RISE(Ԩ) 0.220 INDUCTANCE(μH) INDUCTANCE(μH) 0.160 100 TEMP RISE(Ԩ) 0.200 10 60 INDUCTANCE(μH) 0.060 0 10 20 30 40 50 60 70 80 90 0 100 TEMP RISE(Ԩ) 0.150 INDUCTANCE(μH) 100 TEMP RISE(Ԩ) INDUCTANCE(μH) SMHC2511‐R10MHF 0.100 5 10 15 20 25 30 35 40 45 DC  BIAS(Amps) ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.1: May 17 , 2017 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SMHC2511 Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SMHC2511 Series : SMHC2511‐R82MHF SMHC2511‐R68MHF 80 0.656 TEMP RISE(Ԩ) 60 INDUCTANCE(μH) 0.272 40 0.136 20 0.000 0 0.492 60 INDUCTANCE(μH) 0.328 40 0.164 20 0.000 0 5 10 15 20 25 30 35 40 0 5 10 DC  BIAS(Amps) 80 1.20 60 INDUCTANCE(μH) 0.40 40 0.20 20 0.00 0 0.30 20 0.00 0 0 80 2.64 60 0.88 40 0.44 20 0.00 0 INDUCTANCE(μH) 3.30 TEMP RISE(Ԩ) INDUCTANCE(μH) ● 6 9 12 15 18 21 24 27 SMHC2511‐3R3MHF 100 INDUCTANCE(μH) DC  BIAS(Amps) 3 DC  BIAS(Amps) TEMP RISE(Ԩ) 0 2 4 6 8 10 12 14 16 18 20 60 INDUCTANCE(μH) 40 SMHC2511‐2R2MHF 1.32 80 TEMP RISE(Ԩ) 0.60 DC  BIAS(Amps) 1.76 35 0.90 0 3 6 9 12 15 18 21 24 27 30 2.20 30 100 INDUCTANCE(μH) 1.50 TEMP RISE(Ԩ) 0.60 25 SMHC2511‐1R5MHF 100 TEMP RISE(Ԩ) INDUCTANCE(μH) 0.80 20 DC  BIAS(Amps) SMHC2511‐1R0MHF 1.00 15 TEMP RISE(Ԩ) 0 80 TEMP RISE(Ԩ) 100 80 TEMP RISE(Ԩ) 1.98 60 INDUCTANCE(μH) 1.32 40 0.66 20 0.00 0 TEMP RISE(Ԩ) 0.408 100 TEMP RISE(Ԩ) 0.820 INDUCTANCE(μH) 0.544 100 TEMP RISE(Ԩ) INDUCTANCE(μH) 0.680 0 2 4 6 8 10 12 14 16 18 20 DC  BIAS(Amps) ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.1: May 17 , 2017 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SMHC2511 Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SMHC2511 Series : SMHC2511‐4R7MHF SMHC2511‐6R8MHF 80 5.44 TEMP RISE(Ԩ) 2.82 60 INDUCTANCE(μH) 1.88 40 0.94 20 0.00 0 2 4 6 8 4.08 2.72 40 1.36 20 0.00 0 10 12 14 16 0 2 4 6 8 10 12 14 DC  BIAS(Amps) SMHC2511‐8R2MHF SMHC2511‐100MHF 100 10.00 100 6.56 80 8.00 80 4.92 TEMP RISE(Ԩ) 60 3.28 INDUCTANCE(μH) 40 1.64 20 0.00 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 DC BIAS(Amps) INDUCTANCE(μH) 8.20 TEMP RISE(Ԩ) INDUCTANCE(μH) 60 INDUCTANCE(μH) DC  BIAS(Amps) ● 80 TEMP RISE(Ԩ) 6.00 TEMP RISE(Ԩ) 60 4.00 INDUCTANCE(μH) 40 2.00 20 0.00 0 TEMP RISE(Ԩ) 0 100 TEMP RISE(Ԩ) 6.80 INDUCTANCE(μH) INDUCTANCE(μH) 3.76 100 TEMP RISE(Ԩ) 4.70 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 DC BIAS(Amps) ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.1: May 17 , 2017 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SMHC2511 Series 5.PACKAGE SPECIFICATION.(UNIT:mm): (1).ENCAPSOLATION MODE: P0 P2 P1 E1 D0 D1 F Marking TOP VIEW W A0 B0 16.0±0.30 7.0±0.10 7.5±0.10 K0 B0 A0 P1 K0 User Direction of Feed (2).DIMENSION(mm): W T P0 3.4±0.15 12.0±0.10 4.0±0.10 (3).REEL SIZE: P2 D0 D1 F 2.0±0.10 1.5±0.10 1.5±0.10 BOTTOM VIEW E1 T 7.5±0.10 1.75±0.10 0.4±0.05 (4).PACKAGE MODE: (5).PACKAGING LIST: No. Packing Part Dimension (mm) Material Quantity 1 2 Reel Bag 330 450 X 360 X 0.075 Plastic Plastic 1000PCS / Reel 1Reel / Bag 3 Small Box 340 X 335 X 45 Paper 2Bag / Small Box 4 Middle Box 356 X 350 X 226 Paper 4Small Boxes / Middle Box 5 Outer Box 378 X 362 X 252 Paper 1Middle Box / Outer Box (6).WEIGHT: N.W: 0.79g/pcs TOTAL6.32Kg(APPROX) , G.W: TOTA11.92Kg(APPROX). (7).Storage conditions: -40Ԩ~85Ԩ ,75%RH (Max.). ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.1: May 17 , 2017 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SMHC2511 Series 6.RELIABILITY TEST: 6.1 Mechanical Reliability Item Solderability Specification and Requirement Test Method The surface of terminal immersed shall be Solder heat proof: minimum of 95% covered with a new coating 1. Preheating: 160 ± 10 ℃ 2. Retention time: 245 ± 5 ℃ for 2 ± 0.5 seconds of solder Vibration Inductance change: Within ± 10% Without mechanical damage such as break 1. Vibration frequency: (10 Hz to 55 Hz to 10Hz) in 60 seconds as a period 2. Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions. 3. Amplitude: 1.5 mm max. Shock Inductance change: Within ±10% Without mechanical damage such as break 1. Peak value: 100 G 2. Duration of pulse: 11ms 3. 3 times in each positive and negative direction of 3 mutual perpendicular directions. Thermal Shock Inductance change: Within ± 10% Without distinct damage in appearance 1. Repeat 100 cycles as follow: (-55 ± 2 ℃; 30 ± 3 min) →(Room temp., 5 min) → (+125 ± 2 ℃, 30 ± 3 min) → (Room temp., 5 min) 2. Recovery: 48 + 4 / -0 hours of recovery under the standard condition after the test. High Temperature Resistance Inductance change: Within ± 10% Without distinct damage in appearance 1. Environment condition: 85 ± 2 ℃ Applied Current: Rated current 2. Duration: 1000 + 4 / -0 hours Humidity Resistance Inductance change: Within ± 10% Without distinct damage in appearance 1. Environment condition: 60 ± 2 ℃ Humidity: 90–95% Applied Current: Rated current 2. Duration: 1000 + 4 / -0 hours Low Temperature Store Inductance change: Within ± 10% Without distinct damage in appearance Store temperature: -55 ± 2 ℃,1000 + 4 / -0 hours High Temperature Store Inductance change: Within ± 10% Without distinct damage in appearance Store temperature: +125 ± 2 ℃,1000 + 4 / -0 hours 6.2 Endurance Reliability ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.1: May 17 , 2017 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SMHC2511 Series Soldering Reflow Chart Stage Precaution Recommended temperature profile Temperature profile can be referenced after confirming of adhesion , temperature of resistance to soldering heat , component size , soldering etc. sufficient . Reflow soldering Note: please refer to the latest IPC/JEDEC J-STD-020: “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices" ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.1: May 17 , 2017 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase.