Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
BluNor BM832/A/E are powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) modules using
Nordic nRF52 SoC. With an ARM CortexTM M4(F) MCU, up to 512KB flash, 64KB RAM, embedded 2.4GHz
multi-protocol transceiver, and an integrated PCB trace antenna. It allows faster time to market with reduced
development cost.
BM832/A/E are designed to minimize PCB cost and to maximize efficiency in production line dedicated for
Bluetooth module. The cost of using BM832/A/E modules can be lower than
designing-in SoC at any quantity. At low cost, BM832/A/E offer full features. Inductors
for DCDC converter are integrated. All 32 GPIOs are accessible.
Bluetooth ranges are measured in environments with Low Multiple Path Interference
(LMPI or antennas at 3 meters above ground) and antennas at 5 feet (1.52 meters,
typical height of thermostat in the USA). Bluetooth range is much shorter in
environments with radio frequency interference and severe multiple path interference.
BM832 Specifications:
Nordic nRF52 with ARM Cortex M4F.
Complete RF solution with integrated antenna
Integrated DC-DC converter
Serial Wire Debug (SWD)
Nordic SoftDevice Ready
Over-the-Air (OTA) firmware update
Flash/RAM: 512KB/64KB or 256KB/32KB.
32 General purpose I/O pins
12 bit/200KSPS ADC, 8 configurable channels
with programmable gain.
3X SPI Master/Slave (8Mbps)
3X 4-channel pulse width modulator (PWM)
Low power comparator
2X 2-wire Master/Slave (I2C compatible)
I2S audio interface
UART (with CTS/RTS and DMA)
20 channel CPU independent Programmable
Peripheral Interconnect (PPI).
Quadrature Demodulator (QDEC)
128-bit AES HW encryption
5 x 32 bits, 3 x 24 bits Real Time Counters (RTC)
Available NFC-A tag interface for OOB pairing
Receiver Sensitivity: -96 dBm at 1Mbps
TX power: +/- 0 dBm; programmable 4 dBm to
-20dBm in 4 dB steps.
Hybrid pins: 16 castellated and 24 LGA.
Integrated PCB trace antenna;
Operation voltage: 1.7V to 3.6V
Embedded inductors for DCDC converter
Operation temperature: - 4 0 ° C t o + 8 5 ° C
FCC ID: X8WBM832
IC ID: 4100A-BM832
CE: Certified
TELEC: 201-180924
Australia/New Zealand: Certified
QDID:97989
Applications
Wearable
Beacons/Proximity
Fitness/Sports
Smart toys
Connected appliances
Lighting products
Sensors
Home and building automation
Key fobs
Wireless charger
Interactive entertainment devices
Model Summaries
module
Flash/RAM
Size
GPIO
Antenna
BT range, antenna at LMPI
BT range, antenna at 1.52 M
Availability
BM832
512KB/64KB
10.2x15x1.9mm
BM832A
192KB/24KB
10.2x15x1.9mm
32
PCB Trace
340 meters
270 meters
Production
32
PCB Trace
340 meters
270 meters
Production
!1
BM832E
512KB/64KB
10.2x15x1.9mm
32
u.FL
Production
Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
Table Of Contents
1. Introduction ........................................................................................................................................................3
BM832 Block Diagram ....................................................................................................................................... 3
BM832
3
BM832A .............................................................................................................................................................3
BM832E ............................................................................................................................................................3
2. Codes Development Using Nordic Tools ........................................................................................................... 4
Easy, fast and safe code development.............................................................................................................. 4
Over-The-Air DFU .............................................................................................................................................4
SoftDevices ....................................................................................................................................................... 4
Development Tools ............................................................................................................................................4
3. Product Overview .............................................................................................................................................. 5
Nordic SoCs ...................................................................................................................................................... 5
Mechanical Drawings ........................................................................................................................................ 7
BM832/BM832A Pin Functions ..........................................................................................................................8
Mounting BM832 on the Host PCB ..................................................................................................................11
4. Bluetooth Range Measurements .....................................................................................................................12
Measurement Results...................................................................................................................................... 12
5. Evaluation Board .............................................................................................................................................13
Nordic Development Environment ................................................................................................................... 13
Loading Firmware into Evaluation Board Through a Nordic DK...................................................................... 13
Evaluation Board Schematic ...........................................................................................................................17
Suggestion for Battery Power Application .......................................................................................................18
6. Preloaded Firmware ........................................................................................................................................19
Reprogram with New AT Command Codes .....................................................................................................19
Reprogram with User’s Codes.........................................................................................................................19
7. Miscellaneous..................................................................................................................................................20
Soldering Temperature-Time Profile for Re-Flow Soldering ............................................................................ 20
Cautions, Design Notes, and Installation Notes .............................................................................................. 20
Packaging ........................................................................................................................................................ 23
FCC Label ....................................................................................................................................................... 23
8. Revision History ..............................................................................................................................................24
9. Contact Us .......................................................................................................................................................25
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
1. Introduction
BluNor BM832 is powerful, highly flexible, ultra low power Bluetooth Low Energy (BLE) modules using Nordic
nRF52 SoCs. With an ARM CortexTM M4F MCU, available 512KB flash, 64KB RAM, embedded 2.4GHz multiprotocol transceiver, and an integrated antenna, it allows faster time to market with reduced development cost.
The following is a block diagram of BM832. Antenna circuit and main clock are integrated. All 32 GPIOs of
nRF52832 can be accessed from main board. For lower power consumption at idle state, a 32.768 kHz crystal
is added on the host board. Connection to an external NFC (Near Field Communication) antenna is provided.
BlurNor BM832A and BM832E are sister modules of BM832. They are pin to pin compatible.
In this data sheets, BM832, BM832E, and BM832A can be referred as B832.
BM832 Block Diagram
BM832 Series modules have the same features except the followings.
BM832
•
512KB flash, 64 KB RAM
•
Integrated PCB trace antenna
BM832A
•
192 KB flash, 24 KB RAM
•
Integrated PCB trace antenna
BM832E
•
512KB flash/64KB RAM
•
An u.FL connector for external antenna
•
Certified with ANT020 external antenna.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
2. Codes Development Using Nordic Tools
Development tools by Nordic and other third party development tools recommended by Nordic should be
used .
Easy, fast and safe code development
Nordic development environment for nRF52 offers a clean separation between application code development
and embedded protocol stacks. This means compile, link and run time dependencies with the embedded stack
and associated debugging challenges are removed. The Bluetooth low energy and ANT stack is a pre-compiled
binary, leaving application code to be compiled stand-alone. The embedded stack interface uses an
asynchronous and event driven model removing the need for RTOS frameworks.
Over-The-Air DFU
The nRF52 SoC is supported by an Over-The-Air Device Firmware Upgrade (OTA DFU) feature. This allows for
in the field updates of application software and SoftDevice.
SoftDevices
The Nordic protocol stacks are known as SoftDevices and complement the nRF52 Series SoCs. All nRF52
Series are programmable with software stacks from Nordic. This bring maximum flexibility to application
development and allows the latest stack version to be programmed into the SoC.
SoftDevices available from Nordic:
S112 SoftDevice
•
The S112 SoftDevice is a Bluetooth low energy peripheral protocol stack solution. It supports up to
four peripheral connections with an additional broadcaster role running concurrently. The S112
SoftDevice integrates a Bluetooth low energy Controller and Host, and provides a full and flexible
API for building Bluetooth low energy nRF52 System on Chip (SoC) solutions. S112 can be used for
for BM832A.
S132 SoftDevice
•
The S132 SoftDevice is a Bluetooth low energy Central and Peripheral protocol stack solution. It
supports up to twenty connections with an additional observer and a broadcaster role all running
concurrently. The S132 SoftDevice integrates a Bluetooth low energy Controller and Host, and
provides a full and flexible API for building Bluetooth low energy nRF52 System on Chip (SoC)
solutions. S132 can be used for BM832 or BM832A.
Development Tools
Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52
Series devices. nRF52 DK board is recommended for firmware development.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
3. Product Overview
Nordic SoCs
For full description of the SoC, please download data sheets from Nordic Semiconductor website.
https://www.nordicsemi.com/eng/Products/Bluetooth-low-energy
The following is a block diagram of Nordic nRF52832 Bluetooth Low Energy (BLE) SoC. NFC is not supported
in nRF52810.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
The 32 bit ARM Cortex M4F MCU with hardware supports for DSP instructions and floating point operations,
code density and execution speed are higher than other Cortex M MCU. The Programmable Peripheral
Interconnect (PPI) system provides a 20-channel bus for direct and autonomous system peripheral
communication without CPU intervention. This brings predictable latency times for peripheral to peripheral
interaction and power saving benefits associated with leaving CPU idle. The device has 2 global power modes
ON/OFF, but all system blocks and peripherals have individual power management control which allows for an
automatic switching RUN/IDLE for system blocks based only on those required/not required to achieve
particular tasks.
The radio supports Bluetooth low energy and ANT. Output power is scalable from a maximum of +4dBm down
to -20 dBm in 4dB steps. Sensitivity is increased to -96 dBm to -89 dBm, depending on data rate. Sensitivity for
BLE is -96 dBm, and -92.5 dBm for ANT.
The NFC block supports NFC-A tags with proximity detection and Wake-on-field from low power mode. The
NFC enables Out-Of-Band (OOB) Bluetooth pairing of devices and thus greatly simplifying deployment.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
Mechanical Drawings
The followings are mechanical drawings of BTM832 and BM832A, top view. Size of module is
10.2x15.0x1.9mm. X-axis and Y-axis coordinate of each pin is shown in table.
Library components for PADS and EAGLE can be downloaded from
http://www.fanstel.com/download-document/
For other PCB layout tools, please download evaluation Gerber files and extract library component.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
BM832/BM832A Pin Functions
The followings are BM832/BM832A pin assignment. Pin functions are in a table below. Please refer to Nordic
nRF52832 and nRF52810 Product Specifications for detailed descriptions and features supported.
http://infocenter.nordicsemi.com/pdf/nRF52832_PS_v1.4.pdf
BM832A uses nRF52810, Product Specifications:
http://infocenter.nordicsemi.com/pdf/nRF52810_PS_v1.2.pdf
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Bluetooth 5 Module BM832/A/E Data Sheets
BM832/BM832A Pin Functions
BM832
nRF52832/nRF52810
pin# pin name
pin#
pin name
1 GND
45 VSS
2 GND
3 GND
4 GND
5 GND
6 P025
37 P0.25
7 P026
38 P0.26
8 P027
39 P0.27
9 P028
40 P0.28/AIN4
10 P029
41 P0.29/AIN5
11 P030
42 P0.30/AIN6
12 P031
43 P0.31/AIN7
13
14
15
16
17
18
19
20
21
22
23
24
25
26
GND
VDD
GND
P000
P001
GND
GND
P003
P004
P002
P005
P007
P006
P009
27
P008
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
VDD
P010
GND
P011
P012
P014
P013
P015
P016
P017
P018
P019
P021/RST
P020
SWDCLK
Ver 1.01 Dec. 2018
Descriptions
Ground
Ground
Ground
Ground
Ground
GPIO
GPIO
GPIO
GPIO, Analog input
GPIO, Analog input
GPIO, Analog input
GPIO, Analog input
5
6
4
7
9
8
11
P0.03/AIN1
P0.04/AIN2
P0.02/AIN0
P0.05/AIN3
P0.07
P0.06
P0.09/NFC1
Ground
DC supply 1.7V to 3.6V
Ground
GPIO, connection for 32.768kHz crystal
GPIO, connection for 32.768kHz crystal
Ground
Ground
GPIO, Analog input
GPIO, Analog input
GPIO, Analog input
GPIO, Analog input
GPIO
GPIO
GPIO, NFC antenna connection (nRF52832 only)
10
P0.08
GPIO
12
VDD
P0.10/NFC2
14
15
17
16
18
19
20
21
22
24
23
25
P0.11
P0.12
P0.14
P0.13
P0.15
P0.16
P0.17
P0.18
P0.19
P0.21/RST
P0.20
SWDCLK
DC supply 1.7V to 3.6V
GPIO, NFC antenna connection (nRF52832 only)
Ground
GPIO, used as UART RX on evaluation board
GPIO, used as UART TX on evaluation board
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO, configurable as RESET pin
GPIO
Serial Wire Debug clock input
36
2
3
VDD
P0.00/XL1
P0.01/XL2
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Bluetooth 5 Module BM832/A/E Data Sheets
43
SWDIO
26
SWDIO
Serial Wire Debug I/O
44
P022
27
P0.22
GPIO
45
46
47
GND
P023
P024
28
29
P0.23
P0.24
Ground
GPIO
GPIO
!10
Ver 1.01 Dec. 2018
Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
Mounting BM832 on the Host PCB
The following figure shows recommended mounting of BM832 module on the host PCB.
•
For the best Bluetooth range performance, the antenna area of module shall extend 4.4 mm outside the
edge of host PCB board, or 4.4 mm outside the edge of a ground plane.
•
The next choice is to place a module on a corner of host PCB, the antenna area shall extend 4.4 mm from
the edge of ground plane. Ground plane shall be at least 5 mm from the edge of the antenna area of
module.
•
We don’t recommend mounting BM832 module in the middle of a host PCB.
For the best Bluetooth range performance, keep all external metal at least 30mm from the antenna area.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
4. Bluetooth Range Measurements
Bluetooth range measurement hex codes can be downloaded from Bluetooth Range Measurements section
of this webpage.
http://www.fanstel.com/download-document/
Description of measurement site, measurement methods, and range raw data are available at:
https://www.fanstel.com/testreport/
Measurement Results
Bluetooth ranges are measured for antennas at two heights.
• 1.52 meters or 5 feet, the typical height of thermostat in the USA.
• 3.0 meters. It has 85% Fresnel zone clearance when transmitter and receiver are 400 meters away.
Multiple path interference caused by ground is low.
Antenna height, meters
3.0
1.52
BM832, BT832A Bluetooth range, meters
340
270
In actual application environments, Bluetooth range is much shorter because of radio frequency interference
and severe multiple path interference.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
5. Evaluation Board
An evaluation board can be used to evaluate performance of module and to develop and test your firmware
before an application-specific host board is developed.
Nordic Development Environment
Nordic Semiconductor provides a complete range of hardware and software development tools for the nRF52
Series devices. nRF52 DK board is recommended for firmware development. Document and Software
development tools can be downloaded by the following links.
Get started with Nordic chip and all online documents.
http://infocenter.nordicsemi.com/index.jsp?topic=/com.nordic.infocenter.nrf52/dita/nrf52/
development/nrf52_dev_kit.html&cp=1_1
Nordic SDK with many example projects.
https://developer.nordicsemi.com/nRF5_SDK/
Nordic development zone.
https://devzone.nordicsemi.com/tutorials/b/getting-started/posts/development-with-gcc-andeclipse
Programming the Nordic chip
Download and install Nrf5x-Command-Line Tools
https://www.nordicsemi.com/eng/nordic/Products/nRF52840/nRF5x-Command-Line-ToolsWin32/58850
Download and install nRFgo Studio
https://www.nordicsemi.com/eng/Products/2.4GHz-RF/nRFgo-Studio/
nRF52DK
The nRF52 DK is a versatile single board development kit for Bluetooth® low energy, ANT and 2.4GHz
proprietary applications using the nRF52832 SoC. This kit supports development for the nRF52832 and
nRF52810 SoC.
It supports the standard Nordic Software Development Tool-chain using SES, Keil, IAR and GCC. Program/
Debug options on the kit is Segger J-Link OB.
Loading Firmware into Evaluation Board Through a Nordic DK
Procedures to connect a Nordic DK to a Fanstel nRF52 module evaluation board.
• Connect Nordic nRF52DK debug out to Fanstel evaluation board debug in using the 10-pin flat
cable as shown below.
• Connect Nordic nRF52DK to PC.
• Connect a DC power source to micro or mini USB port of evaluation board.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
Check COM Port Connection
After connecting nRF52DK and an nRF52 sensor/evaluation board, you can see You can J-Link device and COM
port on the PC control panel Device Manager.
Starting Nordic nRFgo
Open nRFgo Studio.
1. Click Segger 682990549 as in the example below.
2. Erase all if needed
3. Browse for Bootloader and program. After programming bootloader, you can use OTA for
firmware update.
4. Browse for the SoftDevice and program.
5. Browse for the application hex file and program
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Bluetooth 5 Module BM832/A/E Data Sheets
!15
Ver 1.01 Dec. 2018
Bluetooth 5 Module BM832/A/E Data Sheets
!
!16
Ver 1.01 Dec. 2018
Bluetooth 5 Module BM832/A/E Data Sheets
Evaluation Board Schematic
!17
Ver 1.01 Dec. 2018
Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
Suggestion for Battery Power Application
Standby current consumption is important for battery-powered product. We suggest adding a 32.768 kHz
crystal and 2 capacitors as shown in the upper left corner of the evaluation board schematics. The 32MHz main
clock won’t be active at idle state to save power.
Two inductors required for DCDC converter are inside BM832 module. You can enable DCDC to
lower power consumption.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
6. Preloaded Firmware
Modules are loaded with production test codes to
•
enable Bluetooth transmitter for power measurement.
•
set each GPIO pin to high/low for continuity measurement.
Production test codes are not erased when modules are shipped from factory. To reprogram with your codes,
follow the procedures in Reprogram with User’s Codes Section.
Starting with November 2018 production (date code 1847 or later), AT command codes for UART interface with
boot loader are used in production testing. You can use AT command codes as loaded or erase and reprogram
with your codes.
Fanstel may upgrade AT command codes and use new firmware in production testing. If you prefer to use a
specific version of AT command codes, please download and save.
AT command codes are free to use as loaded. Programming services for a specific version of codes or user’s
codes are available in factory for fee and with Minimum Order Quantity.
Reprogram with New AT Command Codes
Up to date AT command codes for UART and SPI interfaces can be downloaded from Fanstel website.
http://www.fanstel.com/download-document/
You can reprogram new AT command codes using OTA DFU (Over The Air Device Firmware Upgrade).
Reprogram with User’s Codes
To load your application codes, SoftDevice, and bootloader, you need to chiperase and reprogram modules.
An example for BT832 module:
//program BT832 Bootloader+Softdevice+Application hex
nrfjprog -f NRF52 --program BT832_AT_3in1PC181113.hex --chiperase --reset
//The file BT832_AT_3in1PC181113.hex = softdevice S1320v6.1.1+BT832_AT_UARTwithout32K+bootloader
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
7. Miscellaneous
Soldering Temperature-Time Profile for Re-Flow Soldering
Maximum number of cycles for re-flow is 2. No opposite side re-flow is allowed due to module weight.
Cautions, Design Notes, and Installation Notes
Failure to follow the guidelines set forth in this document may result in degrading of the product’s
functions and damage to the product.
Design Notes
(1)Follow the conditions written in this specification, especially the control signals of this module.
(2)The supply voltage has to be free of AC ripple voltage (for example from a battery or a low noise
regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in
series connection and a bypass capacitor to ground of at least 47uF directly at the module).
(3)This product should not be mechanically stressed when installed.
(4)Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
(5)Avoid assembly and use of the target equipment in conditions where the products' temperature
may exceed the maximum tolerance.
(6)The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or
spikes.
(7)this product away from other high frequency circuits.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
Notes on Antenna and PCB Layout
(1)Don’t use a module with internal antenna inside a metal case.
(2)For PCB layout:
•
•
•
Avoid running any signal line below module whenever possible,
No ground plane below antenna,
If possible, cut-off the portion of main board PCB below antenna.
Installation Notes
(1)Reflow soldering is possible twice based on the time-temperature profile in this data sheets. Set up
the temperature at the soldering portion of this product according to this reflow profile.
(2)Carefully position the products so that their heat will not burn into printed circuit boards or affect
the other components that are susceptible to heat.
(3)Carefully locate these products so that their temperatures will not increase due to the effects of
heat generated by neighboring components.
(4)If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate
toxic gas, damaging the insulation. Never allow contact between the cover and these products to
occur.
(5)This product should not be mechanically stressed or vibrated when reflowed.
(6)If you want to repair your board by hand soldering, please keep the conditions of this chapter.
(7)Do not wash this product.
(8)Refer to the recommended pattern when designing a board.
(9)Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the
unit.
(10)For more details on LGA (Land Grid Array) soldering processes refer to the application note.
Usage Condition Notes
(1)Take measures to protect the unit against static electricity. If pulses or other transient loads (a large
load applied in a short time) are applied to the products, check and evaluate their operation before
assembly on the final products.
(2)Do not use dropped products.
(3)Do not touch, damage or soil the pins.
(4) Follow the recommended condition ratings about the power supply applied to this product.
(5)Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB
(6) Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage.
(7) These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information and communication
equipment.
Storage Notes
(1)The module should not be stressed mechanically during storage.
(2)Do not store these products in the following conditions or the performance characteristics of the
product, such as RF performance will be adversely affected:
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
•
Storage in salty air or in an environment with a high concentration of corrosive gas.
•
Storage in direct sunlight
•
Storage in an environment where the temperature may be outside the range specified.
•
Storage of the products for more than one year after the date of delivery storage period.
(3) Keep this product away from water, poisonous gas and corrosive gas.
(4) This product should not be stressed or shocked when transported.
(5) Follow the specification when stacking packed crates (max. 10).
Safety Conditions
These specifications are intended to preserve the quality assurance of products and individual
components. Before use, check and evaluate the operation when mounted on your products. Abide by
these specifications, without deviation when using the products. These products may short-circuit. If
electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short
circuit occurs, then provide the following failsafe functions, as a minimum.
(1)Ensure the safety of the whole system by installing a protection circuit and a protection device.
(2)Ensure the safety of the whole system by installing a redundant circuit or another system to
prevent a dual fault causing an unsafe status.
Other Cautions
(1)This specification sheet is copyrighted. Reproduction of this data sheets is permissible only if
reproduction is without alteration and is accompanied by all associated warranties, conditions,
limitations, and notices.
(2)Do not use the products for other purposes than those listed.
(3)Be sure to provide an appropriate failsafe function on your product to prevent an additional damage
that may be caused by the abnormal function or the failure of the product.
(4)This product has been manufactured without any ozone chemical controlled under the Montreal
Protocol.
(5)These products are not intended for other uses, other than under the special conditions shown
below. Before using these products under such special conditions, check their performance and
reliability under the said special conditions carefully to determine whether or not they can be used
in such a manner.
•
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may
splash.
•
In direct sunlight, outdoors, or in a dusty environment
•
In an environment where condensation occurs.
•
In an environment with a high concentration of harmful gas.
(6) If an abnormal voltage is applied due to a problem occurring in other components or circuits,
replace these products with new products because they may not be able to provide normal
performance even if their electronic characteristics and appearances appear satisfactory.
(7) When you have any question or uncertainty, contact Fanstel.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
Packaging
Production modules are delivered in reel, 1000 modules in each reel.
FCC LABEL
The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled
with its own FCC ID number. This includes a clearly visible label on the outside of the final product enclosure
that displays the contents shown below. If the FCC ID is not visible when the equipment is installed inside
another device, then the outside of the device into which the equipment is installed must also display a label
referring to the enclosed equipment
The end product with this module may subject to perform FCC part 15 unintentional emission test requirement
and be properly authorized.
This device is intended for OEM integrator only.
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Bluetooth 5 Module BM832/A/E Data Sheets
Ver 1.01 Dec. 2018
8. Revision History
• June 2018, Ver. 0.50: The first draft copy
• August 2018, Ver. 0.60, The second draft copy
• September 2018,Ver. 1.00: Initial release.
• December 2018, Ver. 1.01: add certification information and add preloaded firmware section.
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Bluetooth 5 Module BM832/A/E Data Sheets
9. Contact Us
United States:
Fanstel Corp.
7466 E. Monte Cristo Ave. Scottsdale AZ 85260
Tel. 1 480-948-4928
Fax. 1-480-948-5459
Email: info@fanstel.com
Website: www.fanstel.com
Taiwan:
Fanstel Corp.
10F-10, 79 Xintai Wu Road
Xizhu, New Taipei City, Taiwan 22101
泛世公司
臺灣省新北市汐止區新臺五路79號10樓之10, 22101
Tel. 886-2-2698-9328
Fax. 886-2-2698-4813
Email: info@fanstel.com
Website: www.fanstel.com
China:
Fanstel Technologies Corp.
11 Jiale Street
Ping-Dih, Long-Gang, Shen Zhen, GD 518117
泛世康科技(深圳)有限公司
廣東省深圳市龍崗區坪地鎮佳樂街11號
Tel. 86-755-8409-0928
Fax. 86-755-8409-0973
QQ. 3076221086
Email: info@fanstel.com
Website: www.fanstel.com
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