PRELIMINARY SPECIFICATIONS
GP
HSX321S 25.000MHZ
Customer Name :
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSX321S
Sample Order No:
Date:
CRYSTAL
25.000MHz
2012/01/06
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN (R.O.C.)
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄縣大寮鄉大發工業區華東路 39 號
NO. 39, HWA DONG RD., TA FA IND.
DIST., TA LIAO KAOHSIUNG HSIEN 831,
TAIWAN, R.O.C.
TEL: (07)787-1555-6
FAX: (07)787-1557
Tittle HSX321S
Date
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6, 200740-1
FAX: (032)200742
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深圳市福永鎮塘尾村塘橋路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-7309272 / 7309262
FAX: 0755-7309755
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1
HSX321S
SPECIFICATION
INDEX
ITEM
PAGE
1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．．
3
2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．．
4
3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．．
5
4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．．
a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．．
6
b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．．
6-7
c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．．
7
d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．．．．．．
7
e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．．
7
f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．．
7
g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．．
8
h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．．
8
i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．．
8
5. MECHANICAL PERFORMANCE．．．．．．．．．．．．．．．．．
9
6. ENVIRONMENTAL PERFORMANCE．．．．．．．．．．．．．．．
9
7. SUPPLEMENT ．．．．．．．．．．．．．．．．．．．．．．．．
10-11
8. FLOW CHART．．．．．．．．．．．．．．．．．．．．．．．．．
12
9. Environmental Workload Chemical Substance Components List．
13
10. TEST DATA．．．．．．．．．．．．．．．．．．．．．．．．．．
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1. QUARTZ CRYSTAL UNIT SPECIFICATION
1. Frequency:
25.000000MHz
2. Holder type :
HSX321S
3. Frequency tolerance:
+/- 10 ppm at 25deg.C +/-3deg.C
4. Equivalent resistance:
60 ohms Max. / SERIES
5. Storage temperature range:
-40 deg.C To +85 deg.C
6. Operable temperature range:
-30 deg.C To +85 deg.C
7. Temperature drift:
+/-20 ppm at -30 deg.C To +85deg.C
8. Loading capacitance (CL) :
20.0 pF +/- 0.2 pF
9. Drive level:
10 uW +/- 2 uW
10. Shunt Capacitance:
2.0 pF Max
11. Insulation resistance :
More than 500M ohms at DC 100V
12. Mode of oscillation:
Fundamental
13. Circuit:
Measured in HP/E5100A,S&A 250B
14. Shocking :
Dropping from 50 cm height 3 times on firm wood
Variation :
Frequency less than +/-5 ppm
Resistance less than +/- 15 ﹪or 2ohms max.
15. Aging:
Less than +/- 5 ppm/Year
16. Holder
HSX321S Seam type
17. Dimensions and marking
Refer to page.4
18. Emboss carrier tape & reel
Refer to page.6 and page.7
19. Note:
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2. HSX321S MARKING & DIMENSIONS
*Marking should be printed as following:
Logo, Nominal Frequency, Manufactured year & month
*Nominal frequency = integer only
( ex. 14.31818 MHz Æ 14 )
*Manufacturing Lot No.
(Y: year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1)
(M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2).
Marking : Laser marking.
(Table-1)
Year
2000
2010
0
Code
2001
2011
1
2002
2012
2
2003
2013
3
2004
2014
4
2005
2015
5
2006
2016
6
2007
2017
7
2008
2018
8
2009
2019
9
(Table-2)
Jan.
A
Feb.
B
Mar.
C
Apr.
D
May. Jun.
E
F
Jul.
G
Aug. Sep.
H
J
Tittle HSX321S
Date
Oct.
K
Nov. Dec.
L
M
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3. INSIDE STRUCTURE
※Reference drawing
(1) Base:
Alumina Ceramic (Al2O3)
Metallized Pad: W
Ni Plating
Au Plating
Supplier: Kyocera
NTK
(2) Lid :
Fe- Ni -Co
(3) Crystal Enclosure Seal:
Seal Seam
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) Adhesive
Silver Conductive Silicon Resin
Adhesive bonding:
upper & lower bonding/lower bonding only
(6) Electrode
Cr+Ag
(7) PAD
Alumina Ceramic (W. Ni. Au)
(8) Kovaring：
Fe-Ni-Co Alloy
Tittle HSX321S
Date
The use prohibition chemistry
substance of Table 1 of DHE-0204-1
(QA-QM-08) is not included in this
item.
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4. HSX321S EMBOSS CARRIER TAPE & REEL
a.) Dimensions of Carrier Tape
b.) Dimensions of Reel
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(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
12.8+/-0.3
Outer Width
W2
Out Line diameter
B
15.5+/-1.0
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Width
Center
Core slit
Position
Spindle diameter
Key Ditch
Width
c.) Storage condition
Temperature: +40deg.C Max.
Relative Humidity: 80% Max.
d.) Standard packing quantity
3,000PCS / REEL
e.) Material of the tape
Tape
Carrier tape
Top tape
Material
PS Conductive
Polyester
f.) Label contents
.The type of product
.Our specification No.
.Your Part No.
.Lot No.
.Nominal Frequency
.Quantity
.Our Company Name
Sticks label for every reel.
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g.) Taping dimension
Cover-tape
Leader
Carrier-tape
Cover-tape
Terminal
Carrier-tape
Terminal
The length of cover-tape in the leader is more than 400 mm including empty
embossed area.
After all products were packaged, must remain more than twenty pieces or
400 mm empty area, which should be sealed by cover-tape.
The tip of cover-tape shall be fixed temporary by paper tape and roll around
the core of reel one round.
The empty embossed area which are sealed by top cover-tape must remain
more the 40 mm.
Components
Leader
Emptv compartments
Emptv compartments
Top cover-tape
Embossed Carrier-tape
h.) Joint of tape
The carrier-tape and top cover-tape should not be jointed.
i.) Release strength of cover tape
It has to between 0.1N to 0.7N under following condition.
Pulling direction 165° to 180°
Speed
300mm/min.
Otherwise unless specified.
165°~ 180°
Pulling direction
Other standards shall be based on JIS C 0806-1990.
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5. Mechanical Performance
Specifications
Code
Item
Test Methods
1
Natural Drop
2
Vibration
3
Sealing Tightness
4
Solderability
Drop 3 times from the height of 50cm onto min. 30mm thickness hard
wooden board.
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z
3 axes, Duration of 2 hours to each axis.
Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak
detector. – Fine Leakage.
After applying ROSIN Flux, dipping in solder bath at
245deg.C+/-5deg.C for 3+/-0.5 sec.
6.
2
3
4
5
--B
Specifications
Code
Test Methods
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours.
Back to room temperature first, then in 1~2 hours, the component shall
be checked.
-40deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
+85deg.C +/-2deg.C, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
-40deg.C +/-2deg.C (30min) ↔ +85deg.C +/-2deg.C (30min) 25
cycles. Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
FC-70(the boiling point:+215℃)Vapor for 30 sec
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
Humidity
Storage in Low
Temperature
Storage in High
Temperature
Temperature cycles
VPS
A
A
A
A
A
Specifications code
Specifications
A
Frequency variation shall be within +/-5ppm and equivalent resistance shall be within
the specification after the test
More than 90% of lead shall be covered by new solder.
B
Tittle HSX321S
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A
Environment Performance
Item
1
A
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7. Supplement
7.1.Soldering
7.2.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
7.3.Land pattern layout(Example)
7.4.Solder iron (Example)
Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max.
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7.5.Mounting
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be sure
of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause Soldering
Process.
7.6.Cleaning
Cleaning liquid which corrodes Nickel shall not be used
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
7.7.Storage
Please keep away from high temperature and high humidity ,which may cause put solderbility. No
direct Sunlight, No dew as well.
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8. Flow Chart
LID(外 殼 蓋 )
BLANK(晶 片 )
LID進 料 檢 查
1
2
Incoming Inspection
of LID
LID洗 淨
Cleaning of LID
BASE(基 座 )
BLANK進 料 檢 查
5
6
7
BASE進 料 檢 查
3
Incoming Inspection
of BLANK
化學蝕刻
Incoming Inspection
of BASE
BASE洗 淨
4
Etching
Cleaning of BASE
頻率選別
Freq. Sorting
蒸著前洗淨
8
9
10
Cleaning before
Base Plating
微蝕刻
Flash Etching
基 礎 蒸 著 ($)
Base Plating
押入接著
11
Blank Ass'y
12
Adhesive Curing
13
Bonding Check
14
15
接著硬化
25
接 著 檢 查 ($)
Leak Check II
(Helium Pressurization)
27
Leak Check II
中 間 檢 查 ($)
28
Annealing
in High Vacuum
17
18
29
Se am前 外 觀 檢 查 (C)
熔 接 Seam Seal
強 勵 振 Over Driver
20
REFLOW
30
34
23
Check of Tapping
出貨檢查
Outgoing Inspection
Marking & Check
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出貨捆包
Outgoing Packing
to Shipment/Stock
印 字 +外 觀
Tittle HSX321S
Tapping外 觀 檢 查
REFLOW (C)
35
HARMONY
Tapping
CF檢 查 (C)
Check of CF
2012/01/06 F. S. TSAI
Check of
Temp. Characteristics
老 化 Aging
22
Date
Final Check
溫 特 檢 查 (C)
33
24
REFLOW (C)
最 終 檢 查 ($)
31
32
($)： 特 殊 特 性
(For Special Characteristics)
(C)： 指 定 製 程
(Specific Assignment)
最 終 檢 查 ($)(C)
Final Check
Appearance Check
19
21
氣 密 檢 查 II(HE)($)
Middle Check
高真空烘烤
16
氣 密 檢 查 II(氦 氣 加 壓 )
26
調整蒸著
Partial Plating
氣 密 檢 查 I (AIR)($)
Leak Check I
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9. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
H(D)SX321S
PERCENTAGE
20.5(mg)
ppm
Si
0.04715
9.6658
Au
0.15785
32.3593
Co & Co Compound
1.21770
249.6285
Mo & Mo Compound
0.04100
8.4050
Ag
0.42640
87.4120
Cu
0.11890
24.3745
Cr & Cr Compound
0.04100
8.4050
Al
5.09630
1044.7415
Mn & Mn Compound
0.02460
5.0430
W & W Compound
0.19885
40.7643
Ni & Ni Compound
3.06680
628.6940
Fe
4.14715
850.1658
Chemical Substance Components
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REV. No.
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REASON
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CONTENTS
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