FSMD050-1210-R

NO. FUZETEC TECHNOLOGY CO., LTD. PQ19-01ER Product Specification and Approval Sheet Version A1 Page 1/4 Surface Mountable PTC Resettable Fuse: FSMD1210 Series 1. Summary (a) RoHS Compliant & Halogen Free (b) Applications: All high-density boards (c) Product Features: Small surface mountable, Solid state, Faster time to trip than standard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.05A~2.00A (e) Maximum Voltage: 6V~60VDC (f) Temperature Range : -40℃ to 85℃ 2. Agency Recognition UL : C-UL: TÜ V: File No. E211981 File No. E211981 File No. R50090556 3. Electrical Characteristics (23℃) Part Hold Trip Rated Max Typical Max Time to Trip Current Current Voltage Current Power Current Time RMIN R1MAX IH, A IT, A VMAX, VDC IMAX, A Pd, W A Sec Ohms Ohms 0.05 0.10 0.20 0.35 0.50 0.75 0.75 1.10 1.10 1.50 1.75 2.00 0.15 0.25 0.40 0.70 1.00 1.50 1.50 2.20 2.20 3.00 4.00 4.00 60 60 30 16 16 8 24 8 16 6 6 6 100 100 100 100 100 100 100 100 100 100 100 100 0.60 0.60 0.60 0.60 0.60 0.60 0.60 0.80 0.80 0.80 0.80 0.80 0.25 0.50 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 8.00 1.50 1.50 0.02 0.20 0.10 0.10 0.10 0.30 0.30 0.50 0.60 1.00 3.600 1.600 0.800 0.320 0.250 0.130 0.130 0.060 0.060 0.040 0.020 0.015 50.000 15.000 5.000 1.300 0.900 0.400 0.400 0.210 0.210 0.110 0.080 0.070 Number FSMD005-1210-R FSMD010-1210-R FSMD020-1210-R FSMD035-1210-R FSMD050-1210-R FSMD075-1210-R FSMD075-24-1210R FSMD110-1210R FSMD110-16-1210R FSMD150-1210R FSMD175-1210R FSMD200-1210R Resistance IH=Hold current-maximum current at which the device will not trip at 23℃still air. IT=Trip current-minimum current at which the device will always trip at 23℃ still air. V MAX=Maximum voltage device can withstand without damage at it rated current.(I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. RMIN=Minimum device resistance at 23℃ prior to tripping. R1MAX=Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin NOTE : Specification subject to change without notice. 2015/12/16 NO. FUZETEC TECHNOLOGY CO., LTD. PQ19-01ER Product Specification and Approval Sheet Version A1 Page 2/4 4. FSMD Product Dimensions (Millimeters) Part Number FSMD005-1210-R FSMD010-1210-R FSMD020-1210-R FSMD035-1210-R FSMD050-1210-R FSMD075-1210-R FSMD075-24-1210R FSMD110-1210R FSMD110-16-1210R FSMD150-1210R FSMD175-1210R FSMD200-1210R A B C D E Min Max Min Max Min Max Min Max Min Max 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 3.43 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.35 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 2.80 0.60 0.60 0.40 0.40 0.30 0.30 0.80 0.60 0.60 0.50 0.80 0.80 1.15 1.15 0.85 0.80 0.75 0.70 1.20 1.00 1.00 0.90 1.40 1.40 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.75 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 5. Thermal Derating Curve FSMD1210 Series Percent of Rated Hold and Trip Current 200% 150% 100% 50% 0% -40 -20 0 20 40 60 80 Ambient Temperature (℃) NOTE : Specification subject to change without notice. 2015/12/16 NO. FUZETEC TECHNOLOGY CO., LTD. PQ19-01ER Product Specification and Approval Sheet Version A1 Page 3/4 6. Typical Time-To-Trip at 23℃ B C D E F G H IJ 100 10 A Time to Trip (S) A =FSMD005-1210 -R B =FSMD010-1210 -R C =FSMD020-1210 -R D =FSMD035-1210 -R E =FSMD050-1210 -R F =FSMD075-1210 -R / 075-24-1210R G =FSMD110-1210R / 110-16-1210R H =FSMD150-1210R I =FSMD175-1210R J =FSMD200-1210R 1 0.1 0.01 0.001 0.1 1 10 100 Fault Current (A) 7. Material Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8. Part Numbering and Marking System Part Numbering System F S M D □ □ □ – □ □ – 1210 R Part Marking System F75 F □ □ Part Identification Voltage Rating Current Rating Example F75 F Example Fuzetec Logo F □ □ □ Part Identification Fuzetec Logo Warning: -Operation beyond the specified maximum ratings or improper use may result in damage and possible 甲、 electrical arcing and/or flame. -PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance. NOTE : Specification subject to change without notice. 2015/12/16 FUZETEC TECHNOLOGY CO., LTD. NO. PQ19-01ER Product Specification and Approval Sheet Version A1 Page 4/4 9. Pad Layouts、Solder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout for each FSMD1210 device Pad dimensions (millimeters) A B Device Nominal Nominal All 1210 Series 2.00 1.00 C Nominal 2.80 Solder reflow ※ Due to “Lead Free” nature, Temperature and Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : 20-40 seconds Temperature (tp) Ramp-Down Rate : 6 ℃/second max. 8 minutes max. Time 25 ℃ to Peak Temperature : Note 1: All temperatures refer to of the package, measured on the package body surface. 1. Recommended max past thickness > 0.25mm. 2. Devices can be cleaned using standard methods and aqueous solvent. 3. Rework use standard industry practices. 4. Storage Envorinment : < 30℃ / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. 2. Devices are not designed to be wave soldered to the bottom side of the board. Reflow Profile NOTE : Specification subject to change without notice. 2015/12/16