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HPPC08050B-R22M-Q8BDF

HPPC08050B-R22M-Q8BDF

  • 厂商:

    CHILISIN(奇力新)

  • 封装:

    SMD

  • 描述:

    功率电感 SMD

  • 数据手册
  • 价格&库存
HPPC08050B-R22M-Q8BDF 数据手册
RoHS & Halogen Free & REACH Compliance. SPECIFICATION FOR APPROVAL 超利維 Customer: Customer P/N: IE1-8B0365 Drawing No: Quantity: X Pcs. Date : 2018/11/21 HPPC08050B-R22M-Q8BDF Chilisin P/N: SPECIFICATION ACCEPTED BY: COMPONENT ENGINEER ELECTRICAL ENGINEER MECHANICAL ENGINEER APPROVED REJECTED 奇力新電子股份有限公司 東莞奇力新電子(東莞廠)有限公司 Chilisin Electronics Corp No. 29, Alley 301, Tehhsin Rd., Hukou,Hsinchu 303, Taiwan TEL:+886-3- 599-2646 FAX:+886-3- 599-9176 E-mail:sales@chilisin.com http://www.chilisin.com Chilisin Electronics (Dongguan) Co., Ltd. No. 78, Puxing Rd., Yuliangwei Administration Area, Qingxi Town, Dongguan City, Guangdong,China TEL:+86-769-8773-0251~3 FAX: +86-769-8773-0232 E-mail:cect@chilisin.com 奇力新電子(越南廠)有限公司 奇力新電子(湖南廠)有限公司 Chilisin Electronics (Vietnam) Limited No 143 - 145, Road No 10, VSIP Hai Phong, Lap Le Commune, Thuy Nguyen Dist, Haiphong City, Vietnam Tel:84-316 255 688 Fax:84-316 255 689 E-mail:sales@chilisin.com Drawn by 吳韋邑 Wayne.Wu HuNan Chilisin Electronics Technology Co., Ltd No. 8, Shaziao Liangshuijing Town, Yuanling County, Huaihua City, Hunan Province 419601, China Tel:86-745-867-5882 E-mail:cect@chilisin.com Checked by 吳韋邑 Wayne.Wu Approved by 劉建志 Richard.Liu YG16600082 HPPC08050B Series Specification 1 Scope: This specification applies to Large current and Low Loss SMD Power INDUCTOR 2 Part Numbering: 3 Rating: Operating Temperature: - 50°C ~ 150°C(Including self-temperature rise) Storage Temperature: (on tape & reel): -20°C to +40°C; 75% RH max. 4 Marking: Ex : HPPC08050B-R22M-Q8BDF Marking : R22 Marking color : Black 5 Standard Testing Condition Temperature Humidity Unless otherwise specified Ordinary Temperature(15 to 35℃) Ordinary Humidity(25 to 85% RH) In case of doubt 20 to 30℃ 50 to 80 %RH HPPC08050B Series Specification 6 Configuration and Dimensions: Dimensions in mm TYPE HPPC08050B A 8.1 ± 0.2 B 8.7 ± 0.3 C 5.0 Max D 3.0 ± 0.5 F 1.6 ± 0.5 7 Electrical Characteristics: Part No. HPPC08050B-R22M-Q8BDF Inductance (uH ) Tolerance (±%) Test Freq. Irms(A) Max(Typ) Isat(A) Max(Typ) RDC(mΩ) Max(Typ) Marking 0.22 20 100kHz,0.5V 33(38) 60(70) 0.75(0.65) R22 Note: 1.Operating temperature range -50℃~150℃(Including self - temperature rise) 2.Isat for Inductance drop 30% from its value without current. 3.Irms for a 40℃ temperature rise from 25℃ ambient. 4.The part temperature (ambient + temp rise) should not exceed 150°C under worst case operating conditions. Circuit design 150°C under worst case operating conditions. Component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 5.Absolute maximum voltage 30VDC HPPC08050B Series Specification 8 HPPC08050B Series 8.1 Construction: 8.2 Material List: HPPC08050B Series Specification 9 Reliability Of Large Current and Low Loss SMD Power Inductor A No Item 1-1-1 Vibration Specification Appearance: No damage Inductance:within±10% of initial value 1-1-2 Resistance to Soldering Heat Appearance: No damage 1-1-3 Solder ability The electrodes shall be at least 95% covered with new solder coating 1-1-4 Resistance to solvent There must be no change in appearance or obliteration of marking. 1-2.Environmental Performance No Item 1-2-1 Temperature Shock 1-2-2 Temperature Cycle 1-2-3 Humidity Resistance 1-2-4 Heat Life 1-2-5 Cold Resistance Specification Appearance: No damage Inductance:within±10% of initial value Test Method Test device shall be soldered on the substrate Oscillation Frequency: 10 to 55 to 10Hz for 1min Amplitude: 1.5mm Time: 2hrs for each axis (X, Y & Z), total 6hrs Pre-heating: 150℃, 1min Solder Composition: Sn/Ag3.0/Cu0.5 Solder Temperature: 260±5℃ Immersion Time: 10±1sec Pre-heating: 150℃, 1min Solder Composition: Sn/Ag3.0/Cu0.5 Solder Temperature: 245±5℃ Immersion Time: 4±1sec Inductors must withstand 6 minutes of alcohol or water. Test Method 10 cycles (Air to Air) 1 cycles shall consist of: 30 minutes exposure to –55 ℃ 30 minutes exposure to 125 ℃ 15 seconds maximum transition between temperatures One cycle: Step Time (min) Temperature (℃) 1 -55±3 30 2 25±2 3 3 125±3 30 4 25±2 3 Total: 100cycles Measured after exposure in the room condition for 24hrs Temperature: 40±2℃ Relative Humidity: 90 ~ 95% Time: 1000hrs Measured after exposure in the room condition for 24hrs Temperature: 85±3℃ Relative Humidity: 20% Applied Current: Rated Current Time: 1000hrs Measured after exposure in the room condition for 24hrs Temperature: -55±3℃ Relative Humidity: 0% Time: 1000hrs Measured after exposure in the room condition for 24hrs HPPC08050B Series Specification HPPC08050B Series Specification 10 PACKAGING 10.1 Packaging -Cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction. 10.2 Packaging Quantity TYPE PCS/REEL HPPC08050B 500 10.3 Reel Dimensions Dimensions in mm TYPE A HPPC08050B 330 B C D 100 13 24.4 HPPC08050B Series Specification 10 PACKAGING 10.4 Tape Dimensions in mm TYPE A0 B0 K0 D E W P P0 P2 HPPC08050B 8.45 9.4 5.25 1.55 1.75 24 16 4 2 11 Recommended Pattern Dimensions in mm TYPE A(mm) HPPC08050B 4.0 B(mm) C(mm) 4.9 9.2 12 Note: 1. Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. 2. Do not knock nor drop. 3. All the items and parameters in this product specification have been prescribed on the premise that our product is used for the purpose,under the condition and in the environment agreed upon between you and us. You are requested not to use our product deviating from such agreement. 4. Please keep the distance between transformer/coil and other components (refer to the standard IEC 950) 5. The moisture sensitivity level (MSL) of products is classified as level 1. HPPC08050B Series Specification 13 Graph:
HPPC08050B-R22M-Q8BDF 价格&库存

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