TJ-S3528RGSSZJLB88-A3

GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 承 認 書 Specification For Approval Customer: (客戶) Description: (產品描述) Part number:(產品型號) Date: ＳＭＤ３５２８红翠绿 ＴＪ－Ｓ３５２８ＲＧＳＳＺＪＬＢ８８－Ａ３ (日期) Approved By: (客戶承認) Prepared By:(我司承認) Approval 核准 Check Design 審核 製作 Sales 業務 Customer Service Hotline：400-676-8616 TEL：0769-8662 5999 0769-8200 2226 E-MIAL∶ｄｇ＠ｔｏｇｉａｌｅｄ．ｃｏｍ FAX：0769-8200 2227 WEB：www.togi aled. c om GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD Package Dimensions（封装尺寸） R G Recommended Soldering Patter (n 推荐焊盘式样) Note ： 1：All dimensions are in millimeters (inches). 2：Tolerance is ±0.25mm (.010”) unless otherwise noted. 3: Specifications are subject to change without notices. 4：This specification is for reference only for one year GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 极限参数 Absolute maximum ratings 参数 Parameter （Ta=25°C） 符号 Symbol 正向电流 Forward current 数值 Value 单位 Unit If 40 mA 反向耐压 Reverse voltage Vr 5 V 耗散功率 Power dissipation 工作环境温度 Operating temperature range Pd 104 mW Top -25~+80 °C 贮藏温度 Storage temperature range Tstg -30~+85 °C 峰 值 脉 冲 电 流 Peak pulsing current （ 1/8 duty f=1KHz） Ifp 52 mA Tj 115 ℃/W ESD 1000 V 结温 Junction Temperature 静电 Electrostatic Discharge(HBM) (TA=25°C) 光电特性 Electro-Optical characteristics 测试条件 Test Condition 符号 Symbo l 颜色 色温 Color Temperature 正向电压 Forward voltage IF=20mA CCT IF=20mA 光通量 luminous flux 参数 Parameter 数值 Value 单位 Unit Min Typ Max -- -- -- -- K Vf R G 1.8 2.8 -- 2.4 3.4 V IF=20mA φ R G 600 1500 -- 800 2000 mcd 视角 Viewing angle at 50% IV IF=20mA 2θ1/2 R G -- 120 -- Deg 主波长 Dominant wavelength IF=20mA λd R G 620 520 -- 630 530 nm 反向电流 Reverse current 显色性指数 Color Rendering Index Vr=5V Ir R G -- 5 -- μA IF=20mA CRI -- -- -- -- Ra GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 典型的光电特性曲线图表 Typical photo-electricity characteristic curve chart Forward Current VS. Forward Voltage Forward Current(mA) Relative Luminous Intensity Forward Current VS. Relative Intensity Forward Voltage(V) Forward Current(mA) Ambient Temperature VS. Relative Intensity Forward Current(mA) Relative Luminous Intensity Ambient Temperature VS. Forward Current 0 20 40 60 80 100 Ambient Temperature Ta( °C) 0° 30° 50 0 50 90° 90° 20 60° 100 0 40 60 80 Ambient Temperature Ta( °C) 60° 30° -20 100 Relative Luminous Intensity(%) GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 可靠性实验项目 Test items and results of reliability Environmental Sequence 类 别 Typ e 测试项目 Test item 测试条件 Test Conditions -25°C 30min ↑↓5min 80°C 30min -25°C 15min ↑↓5min 80°C 15min 高低温循环 Temperature Cycle JIS C 7021 (1977)A-4 热冲击 Thermal Shock MIL-SLD-107D 高温度热循环 High Humidity Heat Cycle JIS C 7021 (1977)A-5 高温存储 High Temperature Storage 高温高湿存储 Humidity Heat Storage 低温存储 Low Temperature Storage 备注 Note 不良数量 Number of Damaged 100 cycle 22 0 50 cycle 22 0 30°C〈=〉65°C 90%RH 24hrs/1cycle 10 cycle 22 0 JIS C 7021 (1977)B-10 Ta=80°C 1000hrs 22 0 JIS C 7021 (1977)B-11 Ta=60°C RH=90% 1000hrs JIS C 7021 (1977)B-12 Ta=－30°C 1000hrs JIS C 7035 (1985) Ta=25°C IF=20mA 1000hrs 22 0 高温高湿寿命测试 High Humidity Heat Life Test 60°C RH=90% IF=20mA 500hrs 22 0 低温寿命测试 Low Temperature Life Test Ta=-25°C IF=20mA 1000hrs 22 0 常温寿命测试 Life Test Operation Sequence 参照标准 Standard 数量 ity Quantity 22 22 0 0 请参考可靠性测试标准规范。Refer to reliability test standard specification for in this line. 失效判定标准 Criteria For Judging Damage 测试项目 符号 测试条件 正向电压 Forward Voltage VF IF=IFT 反向电流 Reverse Current IR VR=5V IR≦10μA IF=IFT 平均 IV 衰减≦30℅，单个平均 IV 衰减≦50℅ Average IV degradation≦30℅ Single LED IV degradation≦50℅ -- 材料无内部裂痕、无材料间爆裂、剥离、无死灯 Meterial without internal cracks, no material between stripped, no deaded light. 光强 Luminous Intensity 耐焊接热 Resistance to Soldering Heat IV -- 判定标准 初始值±10℅ Initial Data±10℅ *数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许可的授权 The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 焊接指导 Guideline for Soldering 1、 回流焊接：推荐以下无铅回流焊接温度图进行。 Reflow Soldering: Use the conditions shown in the under Figure of Pb-Free Reflow Soldering. SMD-Reflow Soldering Profile for lead free soldering( Acc.to J-STD-020B) 300 ℃ T 255℃ 240℃ 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile 217℃ 200 +0℃ 260℃ -5℃ 245℃ ±5℃ 235℃ +5℃ -0℃ 10s min 30s max Ramp Down 6K/s(max) 150 120s max 100s max 100 Ramp Up 3 K/s(max) 50 25℃ 0 0 50 100 150 200 250 s 300 t Remark: If not lead free soldering, the recommended solder profile is 230℃and max solder profile is 245℃. 2、 使用烙铁人手焊接 Hand Soldering 1)、 推荐使用低功率于 20W 的烙铁，焊接时烙铁的温度必须保持在 360℃以下，且每个电极只能进行一次焊 接，每次焊接的持续时间不得超过 3 秒。 A soldering iron of less than 20W is recommended to be used in Hand Soldering Please keep the temperature of the soldering iron under 360℃ while soldering Each terminal of the LED is to go for less than 3 second and for onetime only. 2)、 人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 Be careful because the damage of the product is often started at the time of the hand soldering. 3、 清洗 Cleaning 1） 、在焊接后推荐使用酒精进行清洗，在温度不高于 30℃的条件下持续 3 分钟，不高于 50℃的条件下持续 30 秒，使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂造成损伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. 2）、超声波清洗也是有效的方法，一般最大功率不应超过 300W，否则可能对 LED 造成损伤，请根据具 体的情况预先测试清洗条件是否会对 LED 造成损伤。 Ultrasonic cleaning is also an effective way for cleaning. But the influence of Ultrasonic cleaning on LED depends on factors such an ultrasonic power. Generally, the ultrasonic power should not be higher than 300W.Before cleaning, a pre-test should be done to confirm whether any damage to LEDs will occur. GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 编带和包装 Tape and Packaging 1、带盘 Tape leader and reel M oisture Resistant Packaging 2. 2、防潮袋包装 防潮带包装 Moisture Resistant Packaging Lable A lum inum m oisture-proof bag D esiccant Lable GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD Operation precautions 操作注意事项 1. It is suggested that reflow soldering should not be more than twice, and the temperature curve should meet the standard, and the maximum temperature should not exceed 260 ℃; 回流焊建议不要超过两次，且温度曲线符合标准,最高不超过 260℃，避免胶体过度膨胀死灯； 2. In the process of operation, do not press the colloidal surface of the lamp bead in front. It is recommended to use special tweezers to operate from the side; 在作业过程中，请勿正面按压灯珠胶体表面，建议使用专用镊子从侧面操作； 3. After reflow soldering, do not stack one side of PCB board containing exposed LED together. External impact may scratch the colloid and cause damage to internal circuit; 回流焊后，不要将含有暴露 LED 的一面 PCB 板堆叠在一起，外部的冲击可能会划伤胶体导 致内部电路损坏； 4. After welding to PCB, it is not recommended to bend the PCB board, which may cause dark crack of the bracket and not bright during assembly; 焊接到 PCB 板后，不建议弯曲 PCB 板，这样可能会造成支架出现暗裂，在组装时出现不亮； 5. In SMT, a proper suction nozzle should be larger than the luminous surface of the lamp bead colloid to prevent damage to the colloid of the lamp bead or the internal circuit until the lamp is not on; SMT 时采用合适的吸嘴，应大于灯珠胶体发光面，防止损伤灯珠胶体或内部电路至死灯不亮； 6. Pay attention to static electricity when operating LED. If the static electricity is too high, it will break down the internal chip, resulting in poor short circuit. Wear anti-static Bracelet during operation, and the production machinery must be grounded; 操作 LED 时，注意静电，静电过大会击穿内部芯片，造成短路不良，作业时应佩戴防静电手 环，生产机械必须接地； Precautions for use 使用注意事项 1. Please pay attention not to use in the environment with serious acid and alkali and sulfur ion serious chemical sites, which may lead to excessive corrosion of LED colloid and bracket, and eventually led does not light up; 请注意使用环境勿在带酸碱性严重以及硫离子严重的化工场所，这样可能会使 LED 胶体以及 支架过度腐蚀，最终导致 LED 不亮； 2. If it is used in humid environment or outdoor for a long time, waterproof work should be done to avoid short circuit or dead light phenomenon of lamp bead due to damp; 如长期在潮湿环境下或室外使用，应做好防水工作，避免灯珠因受潮出现短路或死灯现象； 3. After the buyer receives the goods, according to the operation guidance, 100 lamp beads in small batch trial production, confirm the quality and parameters of mass production, so as to avoid losses, otherwise, the supplier will not compensate for expanded losses. At the same time, the liability of the supplier is not more than the transaction amount of the batch. 需方收货后，根据作业指导，100 个灯珠内小批量试产，确认品质及参数再批量生产，以免 造成损失，否则，对于扩大损失供方不予赔偿。同时，涉及供方责任，均不超当批次交易金 额。 GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 4. Please strictly refer to the electrical parameters recommended by our company to avoid other adverse phenomena; 请严格参照我司建议的电性参数使用，避免出现其他不良现象； 5. Use in BIN area to avoid color mixing 分 BIN 区使用，以免造成混色 6. The shelf life of this product is 1 year 该产品保质期 1 年 7. Before using the product, please dehumidify and bake according to the moisture level of the humidity card before use, so as to avoid the lamp bead reflow welding and death due to the damp without dehumidification 使用该产品在使用前请根据湿度卡的受潮等级进行使用前的除湿烘烤，避免因为灯珠受 潮未除湿而造成灯珠过回流焊而死灯 8. In the use of LED lamp beads, heat dissipation should be done well. Long term work under high temperature will accelerate the aging of LED lamp beads, light failure, and even death of light; LED 灯珠在使用工作过程中，应做好散热工作，长期在高温状态下工作，会使 LED 灯珠加速 老化，光衰，严重的会出现死灯不良；