FM-3528BK-470M

佛山市国星光电股份有限公司 FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD 产品规格书 S P E C I F I C AT I O N 顾客名称 产品名称 Customer Product 顾客部品号 产品型号 Customer No. Type 顾 客 确 TOP LED FM-3528BK-470M 认 APPROVED SIGNATURES 地址：广东省佛山市禅城区华宝南路 18 号 Add: NO.18 South Huabao Rd,Foshan,Guangdong,China 电话（Tel） ：0086-0757-83985607,82100231,82109348 传真（Fax） ：0086-0757-82100221,82960551 邮编（Zip） ：528000 http://www.nationstar.com 研 究 开 发 中 心 Research & Development Center 批 准 APPROVE 审 核 CHECK 版本号（Version NO） ：B1 发放日期 (Release Date)：2012-03-20 制 定 DRAW TOP 发光二极管 FM-3528BK-470M TOP 发光二极管 TOP Light Emitting Diode 技术数据表 Technical Data Sheet 本产品主要作为信号指示及照明的电子元件广泛应用于各类使用表面贴装 结构的电子产品中。本产品也广泛用于各类室内外的装饰照明。 This product is generally used as indicator and luminary for electronic equipment . And it also be widely used for indoor and outdoor decorative lighting. 管芯材料： InGaN Material: 特性：  Features: 发光颜色：蓝色 Emitting Color: Blue  封装材料：环氧树脂 Encapsulation: Resin  焊接方法：无铅回流焊 Soldering methods: Pb-Free reflow soldering  光强高，功耗低，可靠性好，寿命长 High Luminous Intensity ,Low Power Dissipation,good Reliability and Long Life  符合欧盟公布的 ROHS 指令要求 Complied With ROHS Directive 目录 Catalogue 光电参数 Electro-Optical Characteristics……………………………..…………….………………………………2 典型特性曲线 Typical Characteristic Curves.....................................................................................................................3 可靠性实验 Reliability Test Items And Conditions........................................................................................................4 外形尺寸 Outline Dimensions......................................................................................................................................5 包装 Packaging......................................................................................................................................................6 焊接指导 Guideline for Soldering................................................................................................................................8 使用注意事项 Precautions....................................................................................................................................................9 * 产品规格如因工艺改进而有所改变，恕不另行通知。 *The Specifications of the product may be modified for improvement without notice. 1 TOP 发光二极管 光电参数 Electro-Optical Characteristics （温度=25℃）：  极限参数 Absolute Maximum Ratings (Temperature=25°C): 参数名称 Parameter 符号 Symbol 数值 Rating 单位 Unit 正向电流 Forward Current IF 25 mA 正向脉冲电流* Pulse Forward Current* IFP 100 mA 反向电压 Reverse Voltage VR 5 V 工作温度 Operating Temperature TOPR -30 ~ +85 ℃ 贮存温度 Storage Temperature Tstg -40 ~ +100 ℃ 功耗 Power Dissipation PD 90 mW * 注：脉冲宽度≤0.1ms，占空比≤1/10 * Note: Pulse width≤0.1ms, Duty≤1/10 ：  光电参数（温度=25℃） Electro-Optical Characteristics (Temperature=25°C): 参数名称 Parameter 符号 Symbol 条件 Condition 反向电流 Reverse Current IR VR=5V 正向电压 Forward Voltage VF 峰值波长 Peak Wavelength λP 主波长 Dominant Wavelength λD 半波宽度 Spectrum Radiation Bandwidth Δλ 光强 Luminous Intensity IV 视角度 View Angle 2θ1/2 最小值 Min. 2.6 典型值 Typ. 3.2 最大值 Max. 单位 Unit 10 μA 3.6 V 465 IF=20mA 463 470 nm 472 30 250 450 110 nm nm 600 mcd deg. 2 TOP 发光二极管 典型特性曲线 相对光 强(Relative Lu minous Intensity )(%) Typical Characteristics Curves 伏安特性 正向电流(Forward Current)(mA) Volt -Ampere Characteristics 50 T Ambient = 25℃ 40 30 20 10 0 2. 5 3.0 3. 5 4.0 4. 5 5.0 相对光强与正向电流特性 Relative Luminous Intensity VS Forward Current 2. 0 T Ambient = 25℃ 1. 0 0 0 正向电压 (F orward Voltage )(V ) 相对光强(Relative Luminous Intensity)(%) 正向电流降额曲线 正向电流(Forward Current)(mA) 50 40 30 20 10 0 20 40 60 80 100 光谱分布特性曲线 Relative Spectral Distribution 1. 2 1. 0 0.8 0.6 0. 4 0. 2 0 400 450 500 550 600 650 波 长( Wavelength ) (nm ) 700 750 光强与环境温度曲线 Luminous Intensity VS Ambient Temperature 2 1 0. 5 0. 2 0. 1 -30 - 10 0 10 30 50 70 环境温度(Ambient Temperature )(℃) 相 对 光 强( Re lativ e L u min ou s I nten sity ) ( % ) 相 对 光 强 ( Relativ e Lu min o us In ten s ity ) ( % ) 环境温度(Ambient Temperature )(℃) 350 40 正向电流(Forward Current )(mA ) Forward Current Derating Curve 0 20 光强分布特性曲线 Typical Spatial Distribution 1 0° 10° 20° 30° 40° 50° 60° 0.5 70° 80° 90° 0 -90 °-80 °-70 °-60 °-50 °-40 °-30 °-20 °-10 ° 0 0.5 1 角 度 (Angle ) (Deg . ) 3 TOP 发光二极管 可靠性试验 Reliability Test Items And Conditions 实验项目 Test Items 参考标准 Reference 实验条件 Test Conditions 冷热冲击 Thermal Shock MIL-STD-202G -40℃(30min)←→100℃(30min) 湿热循环 Temperature And Humidity Cyclic JEITA ED-4701 200 203 高温储存 High Temperature Storage 时间 Time 样品数 Quantity 判据 Criterion 22 0/22 22 0/22 循环 200 次 200 cycles 25℃～65℃ ，90%RH 循环 10 次 24hrs./1cycle 10 cycles JEITA ED-4701 200 201 Ta=100℃ 1000h 22 0/22 低温储存 Low Temperature Storage JEITA ED-4701 200 202 Ta=-40℃ 1000h 22 0/22 高温高湿储存 High Temperature High Humidity Storage JEITA ED-4701 100 103 Ta=60℃，RH=90% 1000h 22 0/22 常温寿命试验 Life Test JESD22-A108D 1000h 22 0/22 高温寿命 High Temperature Life Test JESD22-A108D 1000h 22 0/22 低温寿命 Low Temperature Life Test JESD22-A108D 1000h 22 0/22 高温高湿寿命 High Temperature High Humidity Life Test JEITA ED-4701 100 102 1000h 22 0/22 耐焊接热 Resistance to Soldering Heat GB/T 4937,Ⅱ,2.2&2.3 22 0/22 Ta=25℃ IF =20mA Ta=80℃ IF =20mA Ta=-40℃ IF =20mA Ta=60℃，RH=90% IF =20mA Tsol*=(240±5)℃ 10secs. 2次 2 times 失效判断标准 Criteria For Judging Damage 测试项目 Test Items 符号 Symbol 测试条件 Test Conditions 判定标准 Criteria For Judging Damage 正向电压 Forward Voltage VF IF= IFT 初始值±10% Initial Data±10% 反向电流 Reverse Current IR VR= 5V IR≤10μA 光强 Luminous Intensity IV IF = IFT 平均 IV 衰减≤30%，单个 IV 衰减≤50% Average IV degradation≤30%; Single LED IV degradation≤50% 耐焊接热 Resistance to Soldering Heat 材料无内部裂痕、无材料间爆裂、剥离、无死灯。 Meterial without internal cracks，no meterial between stripped， no deaded light。 注：Tsol-锡液温度；IFT：典型电流 * Note: Tsol-Temperature of tin liquid； IFT：Typical current. 4 TOP 发光二极管 外形尺寸 Outline Dimension ① ② ① ② 推荐焊盘 Recommended Soldering Pad ② ① 极性 Polarity Note: A ：缺口标志 A ：Nick Mark 单位：mm； All dimensions in mm. 公差： X.X ±0.1 mm X.XX ±0.05mm Tolerances：X.X ±0.1 mm X.XX ±0.05mm 5 TOP 发光二极管 包装（1） Packaging (1)  载带 Carrier Tape 单位：mm，未注公差：±0.1 mm All dimensions in mm, tolerances unless mentioned is ±0.1 mm.  编带细节 Details Of Carrier Tape 前进方向Progressive Direction  A：盖带，300 mm；B：引导，空带，200mm；C：编载产品 2000 只；D：尾部，空带，200mm A: Top Cover Tape, 300mm; B: Leader, Empty, 200mm; C: 2000 Lamps Loaded; D: Trailer, Empty, 200mm.  带盘 Reel Dimension  前进方向Progressive Direction LED PRODUCTS IF = x mA TYPE: XX-XXXXX-XX λd: (xxx-xxx) nm QTY: XXXX IV: (xxx-xxx) mcd BIN: XX VF: ||||||||||||||||||||||||||||||||| QC: LOT:  (xx-xx) V QC PASS xxxx FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD 佛山市国星光电股份有限公司 标签 Label 6 TOP 发光二极管 包装（2） Packaging (2) 防潮抗静电包装 Moisture Proof and Anti-Electrostatic Foil Bag 标签 Label 防潮抗静电包装袋 Moisture Proof and Anti-Electrostatic Foil Bag 干燥剂 密封 标签 Moisture Absorbent Material Sealed Label 外包装箱 Cardboard Box LED PRODUCTS TYPE: XX-XXXXX-XX QTY: XXXX BIN: LOT: IF = x mA λd: (xxx-xxx) nm IV: (xxx-xxx) mcd XX VF: ||||||||||||||||||||||||||||||||| QC: (xx-xx) V QC PASS xxxx FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD 佛山市国星光电股份有限公司 佛山市国星光电股份有限公司 FOSHAN NATIONSTAR OPTOELECTRONICS CO.,LTD 地址：佛山市禅城区华宝南路18号 TEL:(86-757)83980208 邮编：528000 FAX:(86-757)82100206 标签说明 Label Explanation   TYPE：产品型号 LED PRODUCTS QTY：数量 Quantity IF = x mA BIN：分档 Rank TYPE: XX-XXXXX-XX λd: (xxx-xxx) nm LOT：批号 Lot Number QTY: XXXX IV: (xxx-xxx) mcd BIN: XX VF: ||||||||||||||||||||||||||||||||| QC: λd：波长范围 Wavelength Range LOT: (xx-xx) V QC PASS IV：光强范围 Luminous Intensity Range xxxx VF：正向电压范围 Forward Voltage Range 佛山市国星光电股份有限公司 FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD IF：测试电流 Testing Current 7 TOP 发光二极管 焊接指导（1） Guideline for Soldering (1) 1. 使用烙铁人手焊接 Hand Soldering 推荐使用功率低于 20W 的烙铁，焊接时烙铁的温度必须保持在 360℃以下，且每个电极只能进行一次焊 接，每次焊接的持续时间不得超过 3 秒。 人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 A soldering iron of less than 20W is recommended to be used in Hand Soldering. Please keep the temperature of the soldering iron under 360℃ while soldering. Each terminal of the LED is to go for less than 3 second and for one time only. Be careful because the damage of the product is often started at the time of the hand soldering. 2. 回流焊接：推荐使用以下无铅回流焊接温度图进行。 Reflow Soldering: Use the conditions shown in the under Figure of Pb-Free Reflow Soldering. 推荐温度焊接曲线 Recommended Solder Profile 255 温 度( Temperature ) (℃) 240 245 ±5 升温 1-5℃/sec Ramp - up 1-5℃/sec 217 200 10sec . M ax . 60 sec. max 150 预热 Preheat ( 60 - 120 ) sec. 降温 7℃/sec .max Ramp - down 7℃/sec .max 时间( Time) · 回流焊接最多只能进行一次。 Reflow soldering should not be done more than one time. · 在回流焊接升温过程中，请不要对 LED 施加任何压力。 Stress on the LEDs should be avoided during heating in soldering process. · 在焊接完成后，待产品温度下降到室温之后，再进行其他处理。 After soldering, do not deal with the product before its temperature drop down to room temperature. 8 TOP 发光二极管 焊接指导（2） Guideline for Soldering (2) 3. 清洗： Cleaning 在焊接后推荐使用酒精进行清洗，在温度不高于 30℃的条件下持续 3 分钟，不高于 50℃的条件下持续 30 秒。使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂部分造成损伤。 超声波清洗也是有效的方法，一般最大功率不应超过 300W，否则可能对 LED 造成损伤。请根据具体的 情况预先测试清洗条件是否会对 LED 造成损伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Ultrasonic cleaning is also an effective way for cleaning. But the influence of Ultrasonic cleaning on LED depends on factors such as ultrasonic power. Generally, the ultrasonic power should not be higher than 300W. Before cleaning, a pre-test should be done to confirm whether any damage to LEDs will occur. * 注意：此一般指导原则并不适用于所有 PCB 设计和焊接设备的配置。具体工艺受到诸多因素的影响， 请根据特定的PCB设计和焊接设备来确定焊接方案。 * Note: This general guideline may not apply to all PCB designs and configurations of all soldering equipment. The technique in practice is influenced by many factors it should be specialized base on the PCB designs and configurations of the soldering equipment. 9 TOP 发光二极管 使用注意事项（1） Precautions (1) 1. 贮存： Storage · 本产品使用密封防潮抗静电袋包装，并附有干燥剂，未开封的产品有一年的保存时间。 Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep moisture to a minimum. · 开封前，产品须存放在温度不高于 30℃，湿度不高于 60%RH 的环境中。 Before opening the package, the product should be kept at 30℃ or less and humidity less than 60% RH, and be used within a year. · 开封后，产品应在 2 小时内使用完，如未能使用完，余料须存放在温度不高于 30℃，湿度不高于 10%RH 的环境中，最长存放时间 24 小时。建议工作环境为温度不高于 30℃，湿度不高于 60%RH。 After opening the package, the product should be soldered within 2 hours. If not ,please store at 30℃ or less and humidity less than 10%RH within 24 hours， It is recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 60%RH. · 对于尚未焊接的 LED，如果吸湿剂或包装失效，或者产品没有符合以上有效存储条件，烘焙可以起到一定 的性能恢复效果。烘焙条件： （80±5）℃，持续 24 小时。 If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should be performed based on the following condition: (80±5)℃ for 24 hours. 2. 静电： Static Electricity 静电和电涌会导致产品特性发生改变，例如正向电压降低等，如果情况严重甚至会损毁产品。所以在使用 时必须采取有效的防静电措施。 所有相关的设备和机器都应该正确接地，同时必须采取其他防止静电和电涌的措施。 使用防静电手环，防静电垫子，防静电工作服、工作鞋、手套，防静电容器，都是有效的防止静电和电涌 的措施。 Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. even not light. All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs. 10 TOP 发光二极管 使用注意事项（2） Precautions (2) 3. 设计建议： Design Consideration 设计电路时，通过 LED 的电流不能超过规定的最大值，同时，还需使用保护电阻，否则，微小的电压变 化将会引起较大的电流变化，可能导致产品损毁。 建议使用以下（A）电路，该电路能够很好的调节通过每个 LED 的电流；不推荐使用（B）电路，该电路 在持续的电压驱动下，LED 的正向电压（VF）发生变化，电流会随之而发生变化，可能使某些 LED 承受高于 规定的电流值。 In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. In the meanwhile, resistors for protection should be applied, otherwise slight voltage shift will cause big current change, burn out may happen. It is recommended to use Circuit A which regulates the current flowing through each LED rather than Circuit B. When driving LEDs with a constant voltage in Circuit B, the current through the LEDs may vary due to the variation in Forward Voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the Absolute Maximum Rating. (A) (B) … … LED 的特性容易因为自身的发热和环境的温度的改变而发生改变。温度的升高会降低 LED 的发光效率、 影响发光颜色等，所以在设计时应充分考虑散热的问题。 Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color changed and so on. Please consider the heat generation of the LEDs when making the system design. 11 TOP 发光二极管 使用注意事项（3） Precautions (3) 4. 其他事项： Others 直接用手拿取产品不但会污染封装树脂表面，也可能由于静电等因素导致产品性能的改变。过度的压力也 可能直接影响封装内部的管芯和金线，因此请勿对产品施加过度压力，特别当产品处于高温状态下，例如在回 流焊接过程中。 When handling the product, touching the encapsulant with bare hands will not only contaminate its surface, but also affect on its optical characteristics. Excessive force to the encapsulant might result in catastrophic failure of the LEDs due to die breakage or wire deformation. For this reason, please do not put excessive stress on LEDs, especially when the LEDs are heated such as during Reflow Soldering. LED 的环氧树脂封装部分相当脆弱，请勿用坚硬、尖锐的物体刮、擦封装树脂部分。在用镊子夹取的时 候也应当小心注意。 The epoxy resin of encapsulant is fragile, so please avoid scratch or friction over the epoxy resin surface. While handling the product with tweezers, do not hold by the epoxy resin, be careful. 5. 反压保护 Reverse voltage protection 通常 LED 的反向漏电流都很小，不会影响正常使用。如果 LED 长期遭受超过其所能承受的反向电压冲击 时，LED 会被损伤，反向漏电流会迅速变大，引起 LED 迅速衰减。在设计中，要注意控制反向电压，建议加 在 LED 上的反向电压值不超过 10V。 In generally the reverse current of LED is very small, it can't effect using the component normally, but when it often suffered the reverse voltage which exceed the limits of the component than it will be damaged，the reverse current increases rapidly causing the LED degenerating rapidly so when designing , please pay attention to control the reverse voltage we suggest the reverse voltage less than 10V. 12