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2686

2686

  • 厂商:

    ADAFRUIT

  • 封装:

    -

  • 描述:

    NEOPIXEL MINI 3535 RGB 1=10 PCS

  • 数据手册
  • 价格&库存
2686 数据手册
东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 SK6812MINI SPECIFICATION INTEGRATED LIGHT SOURCE INTELLIGENT CONTROL OF CHIP-ON-TOP SMD TYPE LED Document No.: SPC/ SK6812MINI Model No.: SK6812MINI Description: 3.5x3.7x0.95mm Top SMD Type 0.2Watt Power tegrated light source Intelligent control LED Rev. No.: 01 Date: 2015-07-22 ELECTROSTATIC SENSITIVE DEVICES 1 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 INTEGRATED LIGHT SOURCE INTELLIGENT CONTROL OF CHIP-ON-TOP SMD TYPE LED Model: SK6812MINI 1. Product Overview : SK6812mini is a smart LED control circuit and light emitting circuit in one controlled LED source, which has the shape of a 5050 LED chip. Each lighting element is a pixel, and the intensities of the pixels are contained within the intelligent digital interface input. The output is driven by patented PWM technology, which effectively guarantees high consistency of the color of the pixels. The control circuit consists of a signal shaping amplification circuit, a built-in constant current circuit, and a high precision RC oscillator. The data protocol being used is unipolar NRZ communication mode. The 24-bit data is transmitted from the controller to DIN of the first element, and if it is accepted it is extracted pixel to pixel. After an internal data latch, the remaining data is passed through the internal amplification circuit and sent out on the DO port to the remaining pixels. The pixel is reset after the end of DIN. Using automatic shaping forwarding technology makes the number of cascaded pixels without signal transmission only limited by signal transmission speed. The LED has a low driving voltage (which allows for environmental protection and energy saving), high brightness, scattering angle, good consistency, low power, and long life. The control circuit is integrated in the LED above. 2. Main Application Field: ● Full color LED string light, LED full color module, LED super hard and soft lights, LED guardrail tube, LED appearance / scene lighting ● LED point light, LED pixel screen, LED shaped screen, a variety of electronic products, electrical equipment etc.. 3. Description: ● Top SMD internal integrated high quality external control line serial cascade constant current IC; ● control circuit and the RGB chip in SMD 5050 components, to form a complete control of pixel, color mixing uniformity and consistency; ●built-in data shaping circuit, a pixel signal is received after wave shaping and output waveform distortion will not guarantee a line; ●The built-in power on reset and reset circuit, the power does not work; ●gray level adjusting circuit (256 level gray scale adjustable); ● red drive special treatment, color balance; ● line data transmission; ● plastic forward strengthening technology, the transmission distance between two points over 10M; ●Using a typical data transmission frequency of 800 Kbps, when the refresh rate of 30 frames per sec 2 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 4. Mechanical Dimensions: Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±0.1mm unless otherwise noted 5. PIN configuration NO. Symbol Function description 1 DOUT Control data signal output 2 VSS Ground 3 DIN Control data signal input 4 VDD Power supply LED 6. General Information SK6812MINI SK6812: The default is RGB chips with IC integration 3 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 7. Absolute Maximum Ratings(Ta=25℃,VSS=0V) : Parameter Symbol Range Unit Power supply voltage VDD +3.5~+5.5 V Logic input voltage VIN -0.5~VDD+0.5 V Working temperature Topt -40~+85 ℃ Storage temperature Tstg -50~+150 ℃ ESD pressure VESD 4K V 8. The electrical parameters (unless otherwise specified, TA=-20 ~ +70 ℃, VDD=4.5 ~ 5.5V, VSS=0V): Parmeter Symbol Min Typical Max Unit Test conditions The chip supply voltage VDD --- 5.2 --- V --- R/G/B port pressure VDS,M AX --- --- 26 V --- IDOH --- 49 --- mA DOUT conect ground, the maximum drive current IDOL --- -50 --- mA DOUT conect +, the largest current VIH 3.4 --- --- V VIL --- --- 1.6 V The frequency of PWM FPWM --- 1.2 --- KHZ --- Static power consumption IDD --- 1 --- mA --- DOUT drive capability The signal input flip threshold VDD=5.0V 9. The dynamic parameters (Ta=25 ℃): Parameter Symbol Min Typical Max Unit Test conditions The speed of data transmission fDIN --- 800 --- KHZ The duty ratio of 67% (data 1) DOUT transmission delay TPLH --- --- 500 ns TPHL --- --- 500 ns IOUT Rise/Drop Time Tr --- 100 --- ns Tf --- 100 --- ns 4 / 12 DIN→DOUT VDS=1.5 IOUT=13mA Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 10. The data transmission time (TH+TL=1.25µs±600ns): T0H 0 code, high level time 0.3µs ±0.15µs T0L 0 code, low level time 0.9µs ±0.15µs T1H 1 code, high level time 0.6µs ±0.15µs T1L 1 code, low level time 0.6µs ±0.15µs Trst Reset code,low level time 80µs 11. Timing waveform: Input code: Connection mode: D1 DIN DO PIX1 D2 DIN DO PIX2 D3 D4 DIN DO PIX3 12. The method of data transmission: Note: the D1 sends data for MCU, D2, D3, D4 for data forwarding automatic shaping cascade circuit. 5 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 13. The data structure of 24bit: G7 G6 G5 G4 G3 G2 G1 G0 R7 R6 R5 R4 R3 R2 R1 R0 B7 B6 B5 B4 B3 B2 B1 B0 Note: high starting, in order to send data (G7 - G6 - ...... ..B0) 14. The typical application circuit: 6 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 15. Standard LED Performance Graph: Forward Voltage vs. Forward Current Typical Relative Luminous Flux vs. Forward Current 150% 150 RED 120% Forward Current(mA) 100% BLUE/GREEN 80% 60% 40% RED 20 BLUE/GREEN 10 20% 0.00 1 15 10 0 20 150 50 1.0 0.0 Forward Current(mA) Forward Voltage(V) Tj=25 °C Wavelength Characteristics Thermal Pad Temperature vs. Relative Light Output 100% BLUE/GREEN Relative Emission Distribution Normalized Luminous Flux 120% 100% 80% RED 60% 40% 20% 0.00 0 20 40 60 5.0 4.0 3.0 2.0 80 100 120 GREEN BLUE RED 80% 60% 40% 20% 0.00 400 450 500 550 600 650 700 750 800 Wavelength (nm) Thermal Pad Temperature (T=25°C) Thermal Pad Temperature vs. Forward Current Typical Radiation Pattern 120° Forward Current (mA) 100 0 80 30° BLUE/GREEN 60 60° 40 RED 20 0 90 75 0 20 40 60 80 100 120 60 45 30 15 0 90° 0.2 0.4 0.6 0.8 1.0 Radiation Angle Thermal Pad Temperature (°C) 7 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 16. Packaging Standard: S K 6 8 1 2 M IN I C A T H O D E ID E N T IF IC A T IO N T A P E F E E D D IR E C T IO N C A R R IE R T A P E COVER TAPE R E E L (1 7 8 x 1 2 m m ) (IN N E R 1 0 0 0 p c s L E D M A X ) S M D ES D PO LY ETH YLEN E BAG P R O D U C T N O .: S K 6 8 1 2 M IN I Q U A N T IT Y .: 1 0 0 0 P C S L o t N o .: L W 2 0 1 5 0 7 0 9 0 2 -1 0 D A T E :2 0 1 5 -0 7 -0 9 L A B E L S K E T C H IN G C A R D B O A R D (IN N E R 4 5 B A G M A X .) The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or antielectrostatic bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The boxes are not water resistant and therefore must be kept away from water and moisture. 8 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 TOP SMD LED Application Notes 1. Features The Purposes of making OPSCO’s customers and users to have a clear understanding on the ways how to use the LED. 2. Description Generally. The LED can be used the same way as other general purposed semiconductors. When using OPSCO’s TOP SMD LED, the following precautions must be taken to protect the LED. 3. Cautions 3.1. Dust & Cleaning This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical properties and improved reliability. However, silicone is a softer material and prone to attract dust. While a minimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps should be taken to keep the emitter free of dust. These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in an enclosed area after installing the emitters. Surface condition of this device may change when organic solvents such as trichloroethylene or acetone were applied. Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin of not. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. 3.2. Moisture Proof Package In order to avoid the absorption of moisture during transportation and storage, LED are packed in the aluminum envelop, A desiccant is included in the aluminum envelop as it absorbs moisture. When moisture is absorbed into the AMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. 3.3. Storage In order to avoid the absorption of moisture, It is recommended to store SMD LED (in bulk or taped) in the dry box (or the desiccator ) with a desiccant, Otherwise to store them in the following environment as recommended. a. Temperature: 5℃~30℃ b. Humidity: 60% RH Max It is recommended to solder the LED as soon as possible after unpacking the aluminum envelop, But in case that the LED have to be left unused after unpacking envelop again is requested. The LED should be soldering within 1 hours after opening the package. If baking is required, A baking treatment should be performed as follows: 70℃±5℃ for more than 24 hours. 9 / 12 Document No.: SPC / SK6812mini Rev. No.: 01 东莞市欧思科光电科技有限公司 DONGGUANG OPSCO OPTOELECTRONICS CO., LTD Dongguang Factory : Side of fast in the east, Yucai Road, Dongshan Country, Qishi Town, Dongguan City. Dongguan Tel: (769)82632725 Dongguan Fax: (769)82632735 3.4. Reflow Soldering Characteristics In testing, OPSCO has found S50 LEDs to be compatible with JEDEC J-STD-020C,using the parameters listed below. As a general guideline OPSCO recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and Configurations of reflow soldering equipment. C ritical Zone T L to T P amp-up L Temperature (°C) L s max MIN Ramp down ts (Preheat) T 25°C to Peak Times Profile Feature Lead-Based Solder Lead-Free Solder Average Ramp-Up Rate (Ts max to Tp ) 3℃/second max. 3℃/second max. Preheat: Temperature Min (Ts min) 100℃ 150℃ Preheat: Temperature Min (Ts max) 150℃ 200℃ Preheat: Time ( ts min to ts max ) 60-120 seconds 60-180 seconds Time Maintained Above: Temperature (TL) 183 ℃ 217 ℃ Time Maintained Above: Time (t L) 60-150 seconds 60-150 seconds Peak/Classification Temperature (T P) 215 ℃ 255 ℃ Time Within 5℃ of Actual Peak Temperature ( tp)

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