W7SD002G1XA-H60PB-02D.01

Secure Digital Cards W7SDxxxxxXA-H60Px Series ROHS Compliant 128MB – 8GB Industrial Grade Secure Digital Cards W7SDxxxx1XA-H60Px Series INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO WINTEC INDUSTRIES PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AN “AS-IS” BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  Please contact your nearest Wintec representative for the latest updates or additional product information. Wintec W7SD H6 Series Product Specification Rev. 1.1 February 2009  Wintec Industries, Inc. 1 Secure Digital Cards W7SDxxxxxXA-H60Px Series ROHS Compliant 128MB – 8GB Revision History Revision Month Year 1.0 1.1 January February 2009 2010 Wintec W7SD H6 Series Product Specification Rev. 1.1 February 2009  Wintec Industries, Inc. History -Preliminary Release -Updated Ordering Guide 2 Secure Digital Cards W7SDxxxxxXA-H60Px Series ROHS Compliant 128MB – 8GB Secure Digital Card W7SDxxxx1XA-H60Px ROHS Compliant Features GENERAL  Density up to 8GB  32-bit RISC/DSP Controller  Solid State Data Storage  Dual 3.3V / 1.8V Interface  Industry Standard Compatibility  ROHS Compliant PERFORMANCE  High Performance 24 MB/s (Sustained Read)  High Performance 23 MB/s (Sustained Write)  Dual Channel operation  Low Power Consumption Wintec Secure Digital Card (PHOTO) RELIABILITY  > 2,000,000 Program/Erase Cycles  Industrial Wear Leveling - Includes Static Block Management  Spares & Bad Block Management  On-chip ECC and CRC16 unit for flash data protection  Hardware support for CPRM COMPATIBILITY  SD standard, rev. 1.01 /1.10 / 2.0 Description The Wintec Industries W7SDxxxxx1XA-H60Px series of ROHS Compliant Secure Digital Cards are constructed with Samsung NAND-type single-level-cell (SLC) flash memory devices paired to a powerful 32-bit RISC/DSP-based system controller for virtual-to-physical address mapping and other flash management functions. Wintec Secure Digital Cards employ a variety of sophisticated error checking and flash management utilities allowing for maximum levels of data reliability and card endurance. Patented wear-leveling methods ensure even wear of flash blocks across the entire card capacity. Background operations track erase counts, prioritize new writes to blocks with lower wear, and relocate static data to blocks with higher wear. Bad-block Management routines replace worn Wintec W7SD H6 Series Product Specification Rev. 1.1 February 2009  Wintec Industries, Inc. 3 Secure Digital Cards W7SDxxxxxXA-H60Px Series ROHS Compliant 128MB – 8GB blocks with spare blocks reserved by the controller on card initialization. Reed-Solomon based ECC algorithms capable of correcting 4 bytes in a 512 byte sector are implemented on the fly without performance degradation to ensure data reliability through user data transfers and background wear-leveling operations. Additional information regarding the specifics of wear leveling, ECC methods, and application-specific card life calculations are available upon request and under NDA. Wintec W7SD H6 Series Product Specification Rev. 1.1 February 2009  Wintec Industries, Inc. 2 Secure Digital Cards W7SDxxxxxXA-H60Px Series ROHS Compliant 128MB – 8GB 1.0 General Product Specification For all the following specifications, values are defined at ambient temperature and nominal supply voltage unless otherwise stated. Table 1: Performance Specifications Parameter Spec Burst Transfer Rate To/From Host: Read Write Burst Transfer Rate To/From Flash Active-to-Sleep Delay after processing the last command Sleep-to-Write (Max.) Sleep-to-Read (Max.) Startup Times Reset-to-Ready (Typical) Reset-to-Ready (Max.) Table 2: Card Endurance 24 MB/s 23 MB/s 40.0 MB/s per channel 0s No Delay No Delay 100.0 ms 500.0 ms Table 3: Card Data Reliability Parameter Program/Erase Cycles Read Cycles Spec > 2,000,000 Cycles Data Retention 10 Years (Min.) Unlimited Parameter Non-Recoverable Errors Erroneous Correction ECC Correctability Spec < 1 in 1020 Bytes Read < 1 in 1020 Bytes Read 4 Random Bytes/Sector Table 4: Environmental Specifications Parameters Temperature (Commercial Temp) Temperature (Extended Temp) Relative Humidity Vibration Altitude Shock Acoustic Operating 0C to 70C -25C to 85C 25% to 95% (Non-Condensing) 15 G rms 80,000 ft. (Max.) 1,000 G (Max.) 0 db Non-Operating -40C to 125C -40C to 125C 40% to 93% (Non-Condensing) 15 G rms N/A 1,000 G (Max.) N/A NOTE: 1. Input voltage 3.3V (5%) or 1.8V (10%) with a maximum ripple of 100mV peak-to-peak. 2. All values listed are at 25C and nominal supply voltage. 3. Stated figures are based on primary configurations and may vary as larger density component NAND flashes are released. Wintec W7SD H6 Series Product Specification Rev. 1.1 February 2009  Wintec Industries, Inc. 3 Secure Digital Cards W7SDxxxxxXA-H60Px Series ROHS Compliant 128MB – 8GB 2.0 Architecture Figure 1: Card Block Diagram PIN NO 1 2 3 4 5 6 7 8 9 Table 5: Card Pin Assignment NAME TYPE DESCRIPTION CD/DAT I/O/PP3 Card Detect/Data Line [Bit3] CMD PP Command / Response VSS1 S Supply voltage ground VDD S Supply voltage CLK I Clock VSS2 S Supply voltage ground DAT0 I/O/PP Data Line [Bit0] DAT1 I/O/PP Data Line [Bit1] DAT2 I/O/PP Data Line [Bit2] 1) S : power supply ; I : input ; O : output ; PP : push-pull ; OD : open-drain NC : Not connected (or logical high) 2) The DAT line for read - when card is in output mode only Wintec W7SD H6 Series Product Specification Rev. 1.1 February 2009  Wintec Industries, Inc. 4 Secure Digital Cards W7SDxxxxxXA-H60Px Series ROHS Compliant 128MB – 8GB 3.0 Ordering Information Table 6: Product Availability List & Naming Card Capacity 128 MB 256 MB 512 MB 1 GB 2 GB 4 GB 8 GB Part Number W7SD128M1XA(I)-H60PC-002.01 W7SD256M1XA(I)-H60PB-002.01 W7SD512M1XA(I)-H60PB-002.01 W7SD001G1XA(I)-H60PB-002.01 W7SD002G1XA(I)-H60PB-02D.01 W7SD004GHXA(I)-H60PB-2Q2.01 W7SD008GHXA(I)-H60PB-2Q2.01 Contact Us (US & Int’l) Wintec Industries OEM Sales 675 Sycamore Drive, Milpitas, CA 95035 Ph: 408-856-0500 Fx: 408-856-0518 oemsales@wintecind.com http://www.wintecind.com/oem About Wintec Industries, Inc. Wintec, founded in 1988, is headquartered in Milpitas, California. Wintec, a leading third party memory module manufacturer, specializes in a variety of module design and manufacturing, such as memory module, flash module, Handspring module, modem module, game module, etc. Besides a complete line of DDR, SDR, and EDO/FPM legacy memory modules, Wintec also distribute CPU, motherboard, peripherals, PC software, and consumer Flash products (such as MMC, SD, SMC, CompactFlash, PC Card, etc.). With excellent design engineering and manufacturing capability, Wintec provides a wide range of design and manufacturing services for our valuable customers from concept design to final product delivery. Wintec is ISO90012000 certified. Important Notice Wintec Industries, Inc. makes no representations or warranties with respect to the contents of this User Guide and specifically disclaims any implied warranties of any product design for any particular purpose. Wintec Industries, Inc. reserves the rights to revise this publication and to make changes from time to time in the content hereof without obligation of Wintec Industries, Inc. to notify any person or organization of such revisions or changes. Wintec W7SD H6 Series Product Specification Rev. 1.1 February 2009  Wintec Industries, Inc. 5