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Eccosorb® LS Lossy, Flexible, Foam Microwave Absorber LOSSY, FLEXIBLE FOAM ABSORBER Eccosorb LS is the most widely known, used, and recommended polyurethane foam absorber. Eccosorb LS obtains its microwave properties via impregnation with a carbon black dispersion and is therefore electrically conductive. It is a very low cost solution for many applications over the thinner, more expensive rubber absorbers. FEATURES AND BENEFITS MARKETS • Flexible, foam material • High loss, low density • Very low cost • Commercial Telecom • Test Boxes • Security and Defense SPECIFICATIONS TYPICAL PROPERTIES ECCOSORB LS Max. Service Temperature °C (°F) Frequency Range 90 (194) ≥ 1 GHz Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. Attenuation (dB/cm) Relative Impedance (|Z|/Z0) 3 GHz 10 GHz 3 GHz 10 GHz LS-14 1.0 1.7 0.83 0.89 LS-16 1.5 2.3 0.78 0.87 LS-18 3.2 4.7 0.69 0.82 LS-20 4.2 7.0 0.61 0.78 LS-22 7.4 14.9 0.55 0.74 LS-24 11 24 0.25 0.44 LS-26 16 34 0.18 0.31 LS-28 20 40 0.16 0.27 LS-30 24 46 0.13 0.22 APPLICATIONS Americas: +1.866.928.8181 Europe: +49.(0)8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com • Eccosorb LS is used to lower cavity Q’s in RF amplifiers, oscillators, cabinets containing microwave devices, computer housings, LNB’s and isolation of antennas by insertion loss. • Eccosorb LS is also used to reduce surface currents on radiating elements and outer ground-plane type surfaces. • Reflectivity of an object (metal or otherwise) can be reduced somewhat by applying one or more layers of Eccosorb LS to its surface. Eccosorb®LS AVAILABILITY • Standard sheets are 610mm x 610mm (24”x24”). • Standard thicknesses are 3.2 mm (1/8”), 6.4 mm (1/4”), 9.5 mm (3/8”), 12.7 mm (1/2”), 19.1 mm (3/4”). • All Eccosorb LS types can be delivered in special sizes or customer specified configurations upon request. This includes die-cut and kiss cut parts to reduce installation labor by allowing quick assembly. • Usually Eccosorb LS is supplied with a pressure sensitive adhesive. • Upon special request, Eccosorb LS can be supplied with an anti-dust coating to prevent carbon fallout. • It can also be supplied, upon request, with a coating to prevent moisture uptake in high humidity to moderately wet environments. INSTRUCTIONS FOR USE • For optimal performance, Eccosorb LS should be bonded to a metallic surface. • To obtain a strong bond, the surface should be thoroughly cleaned with a degreasing solvent. • It can be securely bonded to itself or to other materials such as metal, wood and common plastic composites. Our specific Eccostock® foam adhesive is recommended or the selfadhesive version can be used. • The material can be easily cut with a sharp knife, scissors or die. Approximate Insertion Loss at 3 GHz and 45° dB Insertion Loss 60 LS-30 LS-28 LS-26 LS-24 LS-22 LS-20 LS-18 LS-16 LS-14 50 40 30 20 10 0 3.2 6.4 9.5 12.7 19.1 Thickness (mm) RFP-DS-LS 070116 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 2