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SK84C

SK84C

  • 厂商:

    MDD(辰达半导体)

  • 封装:

    SMC(DO-214AB)

  • 描述:

    SK84C

  • 数据手册
  • 价格&库存
SK84C 数据手册
SK82C THRU SK810C Reverse Voltage - 20 to 100 Volts Forward Current - 8.0 Ampere SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features DO-214AB/SMC  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0  For surface mounted applications  Metal silicon junction,majority carrier conduction  Low power loss,high efficiency 0.245(6.22) 0.220(5.59) 0.126 (3.20) 0.114 (2.90)  Built-in strain relief,ideal for automated placement 0.280(7.11) 0.260(6.60)  High forward surge current capability  High temperature soldering guaranteed: 0.012(0.305) 0.006(0.152) 250 °C/10 seconds at terminals 0.103(2.62) 0.079(2.06) 0.060(1.52) 0.030(0.76) Mechanical Data 0.008(0.203)MAX. 0.320(8.13) 0.305(7.75) Case: JEDEC DO-214AB/SMC molded plastic body Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight : 0.007 ounce, 0.25 grams Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL(see fig.1) VRRM VRMS VDC SK82C SK83C SK835C SK84C SK845C SK86C SK88C SK810C MDD MDD SK82C SK83C MDD MDD SK835C SK84C MDD SK88C MDD SK810C 80 56 80 100 70 100 20 14 20 30 21 30 35 24.5 35 40 28 40 MDD MDD SK845C SK86C 45 31.5 45 60 42 60 UNITS V V V I(AV) 8.0 A IFSM 200 A Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) Maximum instantaneous forward voltage at 8.0A Maximum DC reverse current at rated DCblocking voltage TA=25℃ TA=125℃ Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range VF IR 0.65 0.85 V 1.0 mA CJ 20 400 RJA 18.0 ℃/W TJ -50 to +150 ℃ TSTG -50 to +150 ℃ pF Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas DN:T20825A0 http://www.microdiode.com Rev:2020A1 Page :1 SK82C THRU SK810C Reverse Voltage - 20 to 100 Volts Forward Current - 8.0 Ampere Typical Characterisitics Figure 1 Typical Forward Characteristics Figure 2 Forward Derating Curve 1000 12 600 400 10 200 8.0 100 60 40 6.0 Amps SK82C-SK86C 4.0 20 SK88C-SK810C Amps 10 2.0 6 Single Phase, Half Wave 60Hz Resistive or Inductive Load 25qC 0 4 60 80 100 120 140 160 180 °C Average Forward Rectified Current - Amperesversus Junction Temperature -°C 2 1 .6 .4 .2 .1 .2 .6 .4 .8 1.0 1.2 1.4 Volts Instantaneous Forward Current - Amperes versus Instantaneous Forward Voltage - Volts Figure 3 Junction Capacitance 100 600 400 200 pF TJ=25°C 100 60 40 20 10 .1 .2 .4 1 Volts 2 4 10 20 40 100 200 400 1000 Junction Capacitance - pF versus Reverse Voltage - Volts The curve above is for reference only. http://www.microdiode.com Rev:2020A1 Page :2 SK82C THRU SK810C Reverse Voltage - 20 to 100 Volts Forward Current - 8.0 Ampere Typical Characterisitics Figure 4 Typical Reverse Characteristics Figure 5 Peak Forward Surge Current 600 10 6 500 4 400 2 300 100°C 1 Amps 200 .6 100 .4 0 1 .2 2 4 6 8 10 20 40 60 80 100 75°C mAmps Cycles .1 Peak Forward Surge Current - Amperes versus Number Of .06 Cycles At 60Hz - Cycles .04 .02 25°C .01 .006 .004 SK82C - S K 845C SK85C -SK810C .002 .001 20 40 60 80 100 120 140 Volts Instantaneous Reverse Leakage Current - MicroAmperes versus Percent Of Rated Peak Reverse Voltage - Volts The curve above is for reference only. http://www.microdiode.com Rev:2020A1 Page :2 SK82C THRU SK810C Reverse Voltage - 20 to 100 Volts Forward Current - 8.0 Ampere Packing information unit:mm P0 P1 Item Symbol Tolerance SMC Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width A B C d D D1 D2 E F P P0 P1 T W Reel width W1 0.1 0.1 0.1 0.05 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 6.15 8.41 2.42 1.50 330.00 50.00 13.00 1.75 7.50 8.00 4.00 2.00 0.25 16.00 16.50 d E F B A W P D2 T D1 C W1 D Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (mm) SMC 13" 3,000 4.0 BOX (pcs) 6000 INNER BOX (mm) REEL DIA, (mm) 190*190*41 330 CARTON SIZE (mm) CARTON (pcs) 365*365*340 42000 APPROX. GROSS WEIGHT (kg) 14.0 Suggested Pad Layout Unit (inch) Symbol Unit (mm) A 4.3 0.170 B 0.160 C 4.1 7.9 0.311 D 3.8 0.150 E 12 0.472 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). http://www.microdiode.com Rev:2020A1 Page :3
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