SPC65R90G
Sinai Power Technologies
www.sinai-power.com
N-channel Power MOSFET
PRODUCT SUMMARY
VDS (V) at TJ max.
RDS(on) max. at 25oC (mΩ)
Qg max. (nC)
Qgs (nC)
Qgd (nC)
Configuration
Features
700
VGS=10V
90
85
15
25
single
New Technology For High Voltage Device
ID=30A(Vgs=10V)
Ultra Low Gate Charge
Improved dv/dt Capability
RoHS compliant
Applications
Switching Mode Power Supplies (SMPS)
Server and Telecom Power Supplies
Welding& Battery Chargers
Solar(PV Inverters)
AC/DC Bridge Circuits
Schematic diagram
TO-220F
ORDERING INFORMATION
Device
SPC65R90G
Device Package
TO-220F
Marking
65R90G
ABSOLUTE MAXIMUM RATINGS (TC = 25oC, unless otherwise noted)
Parameter
Drain to Source Voltage
Symbol
Limit
Unit
VDSS
650
V
o
Continuous Drain Current (@TC=25 C)
(1)
A
19 (1)
A
(1)
A
ID
30
Drain current pulsed (2)
IDM
90
Gate to Source Voltage
VGS
± 30
V
Single pulsed Avalanche Energy (3)
EAS
810
mJ
dv/dt
25
V/ns
dv/dt
15
PD
33.8
V/ns
W
0.27
-55 to + 150
260
W/oC
o
C
o
C
0.4~0.6
N.m
o
Continuous Drain Current (@TC=100 C)
MOSFET dv/dt ruggedness (@VDS=0~400V)
Peak diode Recovery dv/dt
(4)
Total power dissipation (@TC=25oC)
Derating Factor above 25oC
Operating Junction Temperature & Storage Temperature
Maximum lead temperature for soldering purpose
Mounting torque
(5)
TSTG, TJ
TL
Notes
1. Drain current is limited by maximum junction temperature.
2. Repetitive rating : pulse width limited by junction temperature.
3 L =20mH, I AS = 9A, VDD = 50V, RG=25Ω, Starting at TJ = 25oC
4. ISD ≤ ID, di/dt = 100A/us, VDD ≤ BVDSS, Starting at TJ =25oC
5. Mounting consideration for TO220 Fullpack:
M3 screw plus flat washer is suggested, free of burr between devices and contact area,
the devices are to be mounted to a hole not larger than 3.6mm in contact diameter (chamfer included).
18-1204-Rev 00
1
Document Number: 18030
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
SPC65R90G
Sinai Power Technologies
www.sinai-power.com
THERMAL CHARACTERISTICS
Parameter
Value
Symbol
Thermal resistance, Junction to case
Rthjc
Thermal resistance, Junction to ambient
Unit
o
C/W
3.7
Rthja
o
C/W
38
ELECTRICAL CHARACTERISTICS ( TC = 25oC unless otherwise specified )
Parameter
Off Characteristics
Drain to source breakdown voltage
Breakdown voltage temperature coefficient
Drain to source leakage current
Gate to source leakage current, forward
Gate to source leakage current, reverse
On Characteristics
Gate threshold voltage
Drain to source on state resistance
Forward Transconductance
Gate Resistance
Symbol
Test conditions
BVDSS
VGS=0V, ID=250uA
ΔBVDSS /
ΔTJ
IDSS
IGSS
VGS(TH)
RDS(ON)
Gfs
Rg
Dynamic Characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn on delay time
Rising time
Turn off delay time
Fall time
Total gate charge
Gate-source charge
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Gate-drain charge
Qgd
Min.
Typ.
Max.
Unit
650
--
--
V
ID=250uA, referenced to
25oC
--
0.38
--
V/oC
VDS=650V, VGS=0V
VDS=520V, TC=125oC
VGS=30V, VDS=0V
VGS=-30V, VDS=0V
-----
-----
1
50
100
-100
uA
uA
nA
nA
2.5
---
-80
28
1.2
4.5
90
--
V
mΩ
S
Ω
----------
3010
102
2.5
32
72
110
67
65
15
-------85
--
--
25
--
VDS=VGS, ID=250uA
VGS=10V, ID =15A
VDS = 30 V, ID=15A
VDS = 0 V
VGS=0V, VDS=200V, f=1MHz
VDS=320V, ID=15A,
RG=25Ω
VDS=520V, VGS=10V, ID=30A
pF
ns
nC
SOURCE TO DRAIN DIODE RATINGS CHARACTERISTICS
Parameter
Continuous source current
Symbol
Test conditions
Min.
Typ.
Max.
Unit
IS
--
--
30
A
--
--
90
A
Pulsed source current
ISM
Integral reverse p-n Junction
diode in the MOSFET
Diode forward voltage drop.
VSD
IS=30A, VGS=0V
--
0.9
1.2
V
Reverse recovery time
Trr
--
405
--
ns
Reverse recovery Charge
Qrr
IS=15A, VGS=0V,
dIF/dt=100A/us
--
6.8
--
uC
18-1204-Rev 00
2
Document Number: 18030
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
Sinai Power Technologies
Fig1. Output characteristics
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Fig2. Maximum Drain Current vs. Case Temperature
Fig3. Gate charge characteristics
Fig 4. Capacitance Characteristics
Fig 6. - Temperature vs. Drain-to-Source Voltage
Fig 5. RDS(ON) vs junction temperature
18-1204-Rev 00
SPC65R90G
3
Document Number: 18030
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
SPC65R90G
Sinai Power Technologies
Fig 7 . Safe operating area
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Fig 8. Forward characteristics of reverse diode
Fig 9 . Transient thermal impedance
Fig 10. Gate charge test circuit & waveform
VGS
QG
10V
QGS
QGD
Charge
18-1204-Rev 00
4
nC
Document Number: 18030
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
SPC65R90G
Sinai Power Technologies
www.sinai-power.com
Fig 11. Switching time test circuit & waveform
VDS
RL
90%
VDS
RGS
VDD
VIN
10VIN
DUT
10%
10%
td(on)
td(off)
tr
tON
tf
tOFF
Fig 12. Unclamped Inductive switching test circuit & waveform
Fig 13. Peak diode recovery dv/dt test circuit & waveform
DUT
+ VDS
10V
VGS (DRIVER)
L
IS
di/dt
IS (DUT)
IRM
VDS
RG
Diode reverse current
VDD
Diode recovery dv/dt
Same type
as DUT
10VGS
VDS (DUT)
*. dv/dt controlled by RG
*. Is controlled by pulse period
18-1204-Rev 00
VF
VDD
Body diode forward voltage drop
5
Document Number: 18030
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.
Sinai Power Technologies
SPC65R90G
www.sinai-power.com
Disclaimer
SINAI assumes no responsibility for equipment failures that result from using products at
values that exceed, even momentarily, rated values (such as maximum ratings, operating
condition ranges, or other parameters) listed in products specifications of any and all SINAI
products described or contained herein.
Specifications of any and all SINAI products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent
state, and are not guarantees of the performance, characteristics, and functions of the
described products as mounted in the customer’s products or equipment. To verify symptoms
and states that cannot be evaluated in an independent device, the customer should always
evaluate and test devices mounted in the customer’s products or equipment.
In the event that any or all SINAI products(including technical data, services) described or
contained herein are controlled under any of applicable local export control laws and regulations,
such products must not be exported without obtaining the export license from the authorities
concerned in accordance with the above law.
This catalog provides information as of Nov. 2014. Specifications and information herein are
subject to change without notice.
18-1204-Rev 00
6
Document Number: 18030
For technical questions, contact: Tech@Sinai-power.com.
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. © COPYRIGHT Sinai-Power Technologies. ALL RIGHTS RESERVED.