601F

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS HIGH-PERFORMANCE, HIGH-POWER HEAT SINKS FOR VERTICAL BOARD MOUNTING 677 SERIES Standard P/N Height Above PC Board “A” in. (mm) 677-10ABEP 677-15ABEP 677-20ABEP 677-25ABEP Thermal Performance at Typical Load Maximum Footprint in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) 2.500 (63.5) TO-218; TO-220; TO-247; 15-Lead Multiwatt Natural Convection 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 52°C @ 6W 46°C @ 6W 40°C @ 6W 35°C @ 6W Forced Convection 3.1°C/W @ 200 LFM 2.8°C/W @ 200 LFM 2.5°C/W @ 200 LFM 2.2°C/W @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 677 SERIES (EXTRUSION PROFILE 8719) MAXIMUM EFFICIENCY OMNIDIRECTIONAL HEAT SINKS TO-3; TO-220 680 SERIES Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). Standard P/N 680-5A 680-75A 680-10A 680-125A 680-5220 680-75220 680-10220 680-125220 Height Above PC Board “A” in. (mm) Horizontal Mounting Footprint Dimensions in. (mm) 0.500 (12.7) 0.750 (19.1) 1.000 (25.4) 1.250 (31.8) 0.500 (12.7) 0.750 (19.1) 1.000 (25.4) 1.250 (31.8) 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq Thermal Performance at Typical Load Natural Convection 70°C @ 7.5W 58°C @ 7.5W 52°C @ 7.5W 45°C @ 7.5W 70°C @ 7.5W 58°C @ 7.5W 52°C @ 7.5W 45°C @ 7.5W Forced Convection 3.0°C/W @ 400 LFM 2.4°C/W @ 400 LFM 2.0°C/W @ 400 LFM 1.5°C/W @ 400 LFM 3.0°C/W @ 400 LFM 2.4°C/W @ 400 LFM 2.0°C/W @ 400 LFM 1.5°C/W @ 400 LFM Semiconductor Mounting Hole Pattern Weight lbs. (grams) (1) TO-3 (1) TO-3 (1) TO-3 (1) TO-3 (2) TO-220 (2) TO-220 (2) TO-220 (2) TO-220 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) HIGHEST EFFICIENCY/LOWEST UNIT COST HEAT SINKS TO-3; TO-66; TO-220 690 SERIES These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91°C. Standard P/N Height Above PC Board in. (mm) Outline Dimensions in. (mm) 690-3B 690-66B 690-220B 1.310 (33.3) 1.310 (33.3) 1.310 (33.3) 1.860 (47.2)-sq 1.860 (47.2)-sq 1.860 (47.2)-sq Thermal Performance at Typical Load Natural Forced Convection Convection 44°C @ 7.5W 44°C @ 7.5W 44°C @ 7.5W Semiconductor Mounting Hole Pattern 2.0°C/W @ 400 LFM 2.0°C/W @ 400 LFM 2.0°C/W @ 400 LFM (1) TO-3 (1) TO-66 (2) TO-220 0.0700 (31.75) 0.0700 (31.75) 0.0700 (31.75) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS TO-3 601 & 603 SERIES 74 TO-66 *TWO TO-220’S *TWO TO-220’S LOW-HEIGHT HEAT SINKS DO-4/DO-5 Diodes Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary. 601E 601F 601K 603K TO-3 K Dimensions: in. (mm) Standard P/N Dimensions: in. (mm) 220 A Weight lbs. (grams) Material: Aluminum, Black Anodized SEMICONDUCTOR MOUNTING HOLES SEMICONDUCTOR MOUNTING HOLES Footprint Dimensions in. (mm) Height in. (mm) 2.000 (50.8) x 1.250 (31.8) 2.000 (50.8) x 1.250 (31.8) 2.000 (50.8) x 1.250 (31.8) 2.000 (50.8) x 2.000 (50.8) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) Thermal Performance at Typical Load Mounting Hole Dia. Natural Forced in. (mm) Convection Convection 0.200 (5.1) 0.270 (6.9) None None 52°C @ 5.0W 52°C @ 5.0W 52°C @ 5.0W 41°C @ 5.0W 4.5°C/W @ 175 LFM 4.5°C/W @ 175 LFM 4.5°C/W @ 175 LFM 4.0°C/W @ 175 LFM Weight lbs. (grams) 0.0500 (22.68) 0.0500 (22.68) 0.0500 (22.68) 0.0810 (36.74) Material: Aluminum Alloy, Black Anodized 75