eCM-BF561
Hardware User Manual
Version 1.4
Contact
Bluetechnix Mechatronische Systeme GmbH
Waidhausenstraße 3/19
A-1140 Vienna
AUSTRIA
office@bluetechnix.com
http://www.bluetechnix.com
Date: 2013-06-18
Template No.: 900-306 / A
Table of Contents
1
2
3
Introduction ...................................................................................................................................... 5
1.1
Overview ................................................................................................................................... 5
1.2
Applications............................................................................................................................... 6
General Description .......................................................................................................................... 7
2.1
Functional Description .............................................................................................................. 7
2.2
Boot Mode ................................................................................................................................ 7
2.3
Memory Map ............................................................................................................................. 7
2.3.1
Core Module Memory ........................................................................................................ 7
2.3.2
Externally Addressable Memory (on connector)................................................................ 8
Specifications ................................................................................................................................... 9
3.1
4
5
6
7
Electrical Specifications ............................................................................................................ 9
3.1.1
Operating Conditions ......................................................................................................... 9
3.1.2
Maximum Ratings .............................................................................................................. 9
3.1.3
ESD Sensitivity ................................................................................................................... 9
Connector Description ................................................................................................................... 10
4.1
Connector X1 .......................................................................................................................... 10
4.2
Connector X2 .......................................................................................................................... 12
Application Information .................................................................................................................. 15
5.1
Supply Voltage Decoupling ..................................................................................................... 15
5.2
Reset circuit ............................................................................................................................ 15
5.3
Application Example Schematics ........................................................................................... 15
Mechanical Outline ......................................................................................................................... 16
6.1
Top View ................................................................................................................................. 16
6.2
Bottom View ............................................................................................................................ 16
6.3
Side View................................................................................................................................. 17
6.4
Footprint .................................................................................................................................. 18
6.5
Connectors .............................................................................................................................. 18
Support ........................................................................................................................................... 19
7.1
General Support ...................................................................................................................... 19
7.2
Board Support Packages ........................................................................................................ 19
7.3
Blackfin® Software Support ................................................................................................... 19
7.3.1
BLACKSheep® OS .......................................................................................................... 19
7.3.2
LabVIEW .......................................................................................................................... 19
7.3.3
uClinux ............................................................................................................................. 19
7.4
Blackfin® Design Services ....................................................................................................... 19
7.4.1
Upcoming Products and Software Releases .................................................................. 19
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8
Ordering Information ...................................................................................................................... 20
8.1
9
Predefined mounting options for CORE MODULE NICKNAME ............................................. 20
Dependability ................................................................................................................................. 21
9.1
10
MTBF ....................................................................................................................................... 21
Product History ........................................................................................................................... 22
10.1
Version Information ............................................................................................................. 22
10.1.1
eCM-BF561-C-C-Q25S128F32 (eCM-BF561) ................................................................ 22
10.1.2
eCM-BF561-C-I-Q25S128F32 ........................................................................................ 22
10.2
Anomalies ............................................................................................................................ 22
11
Document Revision History ........................................................................................................ 23
12
List of Abbreviations ................................................................................................................... 24
A
List of Figures and Tables .............................................................................................................. 25
Template No.: 900-306 / A
© Bluetechnix GmbH 2013
All Rights Reserved.
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights of technical change reserved.
We hereby disclaim any warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or in any
communication with you. Bluetechnix specifically disclaims any implied warranty of merchantability or fitness
for a particular purpose.
Bluetechnix takes no liability for any damages and errors causing of the usage of this board. The user of this
board is responsible by himself for the functionality of his application. He is allowed to use the board only if he
has the qualification. More information is found in the General Terms and Conditions (AGB).
Information
For further information on technology, delivery terms and conditions and prices please contact Bluetechnix
(http://www.bluetechnix.com).
Warning
Due to technical requirements components may contain dangerous substances.
Template No.: 900-306 / A
Hardware User Manual - eCM-BF561
1
Last change: 18 June 2013
Version 1.4
Introduction
The Core Module eCM-BF561 is optimized for performance and parallel data processing. The module
integrates processor, RAM, flash and power supply at a size of 44x33mm! It is based on the high
performance ADSP-BF561 from Analog Devices. The eCM-BF561 is designed for industrial and commercial
applications. It addresses 128MByte SDRAM via its 32bit wide SDRAM bus and has an onboard NOR-flash
of 32MByte.
1.1
Overview
Figure 1-1 shows the main components of Core Module eCM-BF561.
100 Pin Expansion Connector
PPI’s
SPI
UART
JTAG
SPORT’s
ADSP-BF561
Low Voltage
Reset
128MByte
SDRAM
32MByte
NOR Flash
100 Pin Expansion Connector
eCM-BF561
Data/Address Bus
GPIO’s
POWER
Ctrl
Figure 1-1: Main components of the eCM-BF561 module
•
Analog Devices Blackfin Processor BF561
o Industrial version (see chapter Error! Reference source not found.)
ADSP-BF561SBBCZ-5A (Rev 0.5;-40° - 85°C)
o
•
Commercial version (see chapter Error! Reference source not found.)
ADSP-BF561SKBCZ-6A (Rev 0.5; 0° - 70°C)
U
128 MB SDRAM
o Industrial version (see chapter Error! Reference source not found.)
IS42S16320B-7BL
SDRAM Clock up to 133MHz
2x (32Mx16, 512Mbit at 3.3V)
o
Commercial version (see chapter Error! Reference source not found.)
IS42S16320B-7BL
SDRAM Clock up to 133MHz
2x (32Mx16, 512Mbit at 3.3V)
•
32 MB of Flash
o PF48F4000P0ZBQE (16Mx16, 128Mbit at 3.3V; all 32MByte addressable)
o Additional flash memory can be connected through the expansion board as parallel Flash
using asynchronous chip select lines or as a SPI flash.
•
Core Voltage Regulator
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Hardware User Manual - eCM-BF561
o
1.35V
•
Low Voltage Reset Circuit
o Module resets if power supply goes below 2.93V for at least 140ms
•
Connectors
o SPORT 0
o SPORT 1
o UART
o SPI
o PPI-0 (Parallel Port Interface 0)
o PPI-1 (Parallel Port Interface 1)
o GPIO’s
o Data Bus
o Address Bus, Control Signals
o nRESET
o Boot-Mode
o JTAG
o Power Supply
1.2
Last change: 18 June 2013
Version 1.4
Applications
•
Parallel digital signal processing
•
Imaging and consumer multimedia
•
Set top boxes
•
Automotive vision systems
•
Portable media players
•
Digital video camera systems
•
Video conference applications
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Hardware User Manual - eCM-BF561
2
Last change: 18 June 2013
Version 1.4
General Description
2.1
Functional Description
Figure 2-1: Functional Overview
2.2
Boot Mode
By default the Boot Mode is set to 00 (BMODE0 pin = LOW, BMODE1 pin = LOW). The boot mode pins are
available on the connectors.
BMODE1–0
00
01
10
11
Description
Execute from 16-bit external memory (Bypass Boot ROM) (uBoot, uClinux)
01 Boot from 8-bit/16-bit flash (BLACKSheep® OS)
Boot from SPI host slave mode
Boot from SPI serial EEPROM (16-, 24-bit address range)
Table 2-1 Boot Mode
2.3
2.3.1
Memory Map
Core Module Memory
Memory Type
FLASH *)
SDRAM
Start Address
0x20000000
0x00000000
End Address
0x21FFFFFF
0x07FFFFFF
Size
32MB
128MB
Comment
Intel PF48F4000P0ZBQE
32Bit Bus, 2x ISSI IS42S16320-7BL
Table 2-2: Memory Map
*) Please be aware that you have to unlock the flash before starting an erase process!
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Hardware User Manual - eCM-BF561
2.3.2
Last change: 18 June 2013
Version 1.4
Externally Addressable Memory (on connector)
The Blackfins External Bus Interface (EBI) allows connecting devices via an asynchronous memory interface.
AMS Line
nAMS1
nAMS2
nAMS3
Start Address
0x24000000
0x28000000
0x2C000000
End Address
0x27FFFFFF
0x2BFFFFFF
0x2FFFFFFF
Max. Size
128MB
128MB
128MB
Table 2-3: External Addressable Memory
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Page | 8
Hardware User Manual - eCM-BF561
3
Last change: 18 June 2013
Version 1.4
Specifications
3.1
3.1.1
Electrical Specifications
Operating Conditions
Symbol
VIN
I3V3 @ 25°C
VOH
VOL
IIH
IOZ
fCCLK
Parameter
Input supply voltage
3.3V current
High level output voltage
Low level output voltage
IO input current
Three state leakage current
Core clock frequency
Min
3.0
2.4
100
Typical
3.3
700
-
Max
3.6
0.4
10
10
600
Unit
V
mA
V
V
µA
µA
MHz
Table 3-1: Electrical characteristics
3.1.2
Maximum Ratings
Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent
damage to the device. These are stress ratings only. Operation of the device at these or any other conditions
greater than those indicated in the operating sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Symbol
VIN
VIO
IOH /IOL
TAMB
TSTO
φAMB
Parameter
Input supply voltage
Input or output voltage
Current per pin
Ambient temperature
Storage temperature
Relative ambient humidity
Min
-0.3
-0.5
0
-40
-55
-
Max
4.1
3.6
10
85
150
90
Unit
V
V
mA
°C
°C
%
Table 3-2: Absolute Maximum Ratings
3.1.3
ESD Sensitivity
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards
can discharge without detection. Although this product features patented or
proprietary protection circuitry, damage may occur on devices subjected to high
energy ESD. Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.
Template No.: 900-306 / A
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Hardware User Manual - eCM-BF561
4
4.1
Last change: 18 June 2013
Version 1.4
Connector Description
Connector X1
Please mind the mounted pull up, pull down and serial resistors on the Core Module (see column “Type”).
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Signal Name
PPI0D0
PPI0D1
PPI0D2
PPI0D3
PPI0D4
PPI0D5
PPI0D6
PPI0D7
PPI0SYNC3
PPI0SYNC2/TMR9
PPI0SYNC1/TMR8
PPI0CLK
GND
PPI1D0
PPI1D1
PPI1D2
PPI1D3
PPI1D4
PPI1D5
PPI1D6
PPI1D7
PPI1D8/PF32
PPI1D9/PF33
PPI1D10/PF34
PPI1D11/PF35
PPI1D12/PF36
PPI1D13/PF37
PPI1D14/PF38
PPI1D15/PF39
PPI1SYNC3
PPI1SYNC2/TMR11
PPI1SYNC1/TMR10
PPI1CLK
3V3
3V3
3V3
GND
GND
GND
NMI0
NMI1
RX/PF27
TX/PF26
GND
Template No.: 900-306 / A
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
Power
Power
Power
Power
Power
Power
I – 10k pull down
I – 10k pull down
I/O
I/O
Power
Function
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Sync
PPI Sync
PPI Sync
PPI Clock
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
PPI Sync
PPI Sync
PPI Sync
PPI Clock
Nonmaskable Interrupt Core A
Nonmaskable Interrupt Core A
UART Receive/GPIO
UART Transmit/GPIO
Page | 10
Hardware User Manual - eCM-BF561
Pin No.
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
Signal Name
TCK
TDO
TDI
TMS
NTRST
NEMU
PF10
PF11
PF12
PF13
PF14
DT0SEC/PF17
DT0PRI/PF18
TFS0/PF16
TSCLK0/PF29
DR0SEC/PF20
DR0PRI
RFS0/PF19
RSCLK0/PF28
GND
CLKBUF
GND
SCK
MISO
MOSI
nc
nc
DT1SEC/PF22
DT1PRI/PF23
TFS1/PF21
TSCLK1/PF31
DR1SEC/PF25
DR1PRI
RFS1/PF24
RSCLK1/PF30
GND
PF8
PF9
nc
nc
nc
nc
nc
nc
nc
nc
nc
nc
PPI0D15/PF47
PPI0D14/PF46
PPI0D13/PF45
Template No.: 900-306 / A
Last change: 18 June 2013
Version 1.4
Type
I – 10k pull up
O
I – 10k pull up
I – 10k pull up
I – 4k7 pull down
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
Power
O – 47R serial
Power
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I/O
I/O
Power
I/O
I/O
I/O
I/O
I/O
Function
JTAG Clock
JTAG Data Out
JTAG Data In
JTAG Mode Select
JTAG Reset
Emulation Out
GPIO
GPIO
GPIO
GPIO
GPIO
Sport0 Transmit Data Secondary
Sport0 Transmit Data Primary
Sport0 Transmit Frame Sync
Sport0 Transmit Serial Clock
Sport0 Receive Data Secondary
Sport0 Receive Data Primary
Sport0 Receive Frame Sync
Sport0 Receive Serial Clock
Clock Out (25Mhz permanent)
SPI Clock
Master In Slave Out
Master Out Slave In
Sport1 Transmit Data Secondary
Sport1 Transmit Data Primary
Sport1 Transmit Frame Sync
Sport1 Transmit Serial Clock
Sport1 Receive Data Secondary
Sport1 Receive Data Primary
Sport1 Receive Frame Sync
Sport1 Receive Serial Clock
GPIO
GPIO
PPI Data
PPI Data
PPI Data
Page | 11
Hardware User Manual - eCM-BF561
Pin No.
96
97
98
99
100
201
202
203
204
205
206
207
208
209
210
Signal Name
PPI0D12/PF44
PPI0D11/PF43
PPI0D10/PF42
PPI0D9/PF41
PPI0D8/PF40
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Last change: 18 June 2013
Version 1.4
Type
I/O
I/O
I/O
I/O
I/O
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Function
PPI Data
PPI Data
PPI Data
PPI Data
PPI Data
Table 4-1 - Connector Description X1
4.2
Connector X2
Please mind the mounted pull up, pull down and serial resistors on the Core Module (see column “Type”).
Pin No.
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
Signal Name
NABE0
NABE1
NABE2
NABE3
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
GND
3V3
3V3
3V3
GND
GND
GND
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
Template No.: 900-306 / A
Type
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
Power
Power
Power
Power
Power
Power
Power
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
Function
Byte Enable
Byte Enable
Byte Enable
Byte Enable
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Page | 12
Hardware User Manual - eCM-BF561
Pin No.
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
Signal Name
D10
D11
D12
D13
D14
D15
nc
NRESET
nc
NAMS1
NAMS2
NAMS3
NAOE
NARE
NAWE
ARDY
GND
SCLK
GND
nc
nc
nc
BMODE1
155
BMODE0
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
NFLASH_WP
NBGH
NBR
NBG
GND
PF15/EXT CLK
PF0/SPISS/TMR0
PF1/SPISEL1/TMR1
PF2/SPISEL2/TMR2
PF3/SPISEL3/TMR3
PF4/SPISEL4/TMR4
PF5/SPISEL5/TMR5
PF6/SPISEL6/TMR6
PF7/SPISEL7/TMR7
D31
D30
D29
D28
D27
D26
D25
D24
D23
D22
D21
D20
D19
D18
D17
Template No.: 900-306 / A
Last change: 18 June 2013
Version 1.4
Type
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I – 470R pull up
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
I – 10k pull up
Power
O – 47R serial
Power
I – 10k pull
down
I – 10k pull
down
I – 10k pull up
O – 47R serial
I – 10k pull up
O – 47R serial
PWR
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
I/O – 47R serial
Function
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Reset
Bank Select
Bank Select
Bank Select
Output Enable
Read Enable
Write Enable
Hardware Ready Control
Clock Output
Bode Mode
Bode Mode
Flash Write Protect
Bus Grant Hang
Bus Request
Bus Grant
GPIO/ External Timer Clock Input
GPIO/Slave SPI Select/Timer
GPIO/SPI Select/Timer
GPIO/SPI Select/Timer
GPIO/SPI Select/Timer
GPIO/SPI Select/Timer
GPIO/SPI Select/Timer
GPIO/SPI Select/Timer
GPIO/SPI Select/Timer
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Data Bus
Page | 13
Hardware User Manual - eCM-BF561
Pin No.
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
211
212
213
214
215
216
217
218
219
220
Signal Name
D16
nc
A25
A24
A23
A22
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
Last change: 18 June 2013
Version 1.4
Type
I/O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
O – 47R serial
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Shield
Function
Data Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Address Bus
Table 4-2 - Connector Description X2
Template No.: 900-306 / A
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Hardware User Manual - eCM-BF561
5
5.1
Last change: 18 June 2013
Version 1.4
Application Information
Supply Voltage Decoupling
For better stability we recommend to add a 100nF capacitor to each power supply pin and an additional
47µF tantalum capacitor to the VIN voltage rail next to the module.
5.2
Reset circuit
The integrated Reset circuit monitors the 3.3V power rail. If this voltage drops below 2.93V, the RESET signal
will be asserted. If the 3.3V voltage domain rises above this threshold, RESET will be kept low for 140 to
280ms and will be released afterwards.
The RESET signal is an open collector output with an internal pull-up resistor of 470Ω. This signal can be used
as external manual reset by connecting an external push-button that ties the signal to ground.
RESET of Flash
3V3
RESET of ADSP-BF5xx
3V3
2
3
VDD
GND
470R
RESET
1
nRESET
STM1001SWX6F
Core Module
External
Figure 5-1: Reset circuit
5.3
Application Example Schematics
Have a look at our eDEV-BF5xx schematics, which can be found at http://www.bluetechnix.com/goto/edevbf5xx to get application examples.
Template No.: 900-306 / A
Page | 15
Hardware User Manual - eCM-BF561
6
6.1
Last change: 18 June 2013
Version 1.4
Mechanical Outline
Top View
Figure 6-1 shows the top view of the mechanical outline of the eCM-BF561 Core Module. All dimensions are
given in millimeters! Outline dimensions +/- 0,5mm.
Figure 6-1: Mechanical outline (top view)
6.2
Bottom View
Figure 6-2 shows the bottom of the mechanical outline of the eCM-BF561 Core Module. All dimensions are
given in millimeters!
Template No.: 900-306 / A
Page | 16
Hardware User Manual - eCM-BF561
Last change: 18 June 2013
Version 1.4
Figure 6-2: Mechanical outline and Bottom Connectors (bottom view)
6.3
Side View
Figure 6-3 shows the mechanical outline from side of the eCM-BF561 Core Module. All dimensions are given
in millimeters!
33.0
44.0
2.0
1.2
3.5
37.0
7.3
7.3
Figure 6-3: Mechanical outline (side view)
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6.4
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Version 1.4
Footprint
309
205
301
204
202
201
302
303
206
216
308
203
207
217
208
218
209
219
210
220
307
306
215
214
213
212
304
211
305
310
Figure 6-4: Footprint (top view)
The footprint for Altium Designer is available on request. The used connectors can be found in Table 6-1. For
detailed dimensions of the connectors please see the datasheet from the manufacturer’s homepage.
6.5
Connectors
Connector Core Module
X1
X2
Matching Connector
X2
X1
Manufacturer
Hirose
Hirose
Manufacturer Part No.
FX-10A-100S/10SV
FX-10A-100P/10SV
Table 6-1: Core Module connector types
The Core Module features 2 connectors, one male and one female. The base board uses the same
connectors but oriented in the opposite way.
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7
Support
7.1
Last change: 18 June 2013
Version 1.4
General Support
General support for products can be found at Bluetechnix’ support site https://support.bluetechnix.at/wiki
7.2
Board Support Packages
Board support packages and software downloads are for registered customers only
https://support.bluetechnix.at/software/
7.3
7.3.1
Blackfin® Software Support
BLACKSheep® OS
BLACKSheep® OS stands for a powerfully and multithreaded real-time operating system (RTOS) originally
designed for digital signal processing application development on Analog Devices Blackfin® embedded
processors. This high-performance OS is based on the reliable and stable real-time VDK kernel from Analog
Devices that comes with VDSP++ IDE. Of course BLACKSheep® OS is fully supported by all Bluetechnix
Core-Modules and development hardware.
7.3.2
LabVIEW
You can get LabVIEW embedded support for Bluetechnix Core Modules by Schmid-Engineering AG
http://www.schmid-engineering.ch.
7.3.3
uClinux
You can get uClinux support (boot loader and uClinux) for Bluetechnix Core Modules at
http://blackfin.uClinux.org.
7.4
Blackfin® Design Services
Based on more than seven years of experience with Blackfin, Bluetechnix offers development assistance as
well as custom design services and software development.
7.4.1
Upcoming Products and Software Releases
Keep up to date with all product changes, releases and software updates of Bluetechnix at
http://www.bluetechnix.com.
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8
Last change: 18 June 2013
Version 1.4
Ordering Information
eCM - BF561 - C - C/I - Q25
S128 F32 -
-
(eCM-BF561)
Product Family
Former name
CM = Core Module
Special
SBC = Single Board Computer
Custom Core Modules or specials
CPU-Type
uC = uclinux
Equals the name of CPU
Extra controllers mounted
Connection-Type
E = Ethernet
A = BGA
U = USB
B = Border pad
Flash [MB]
C = Connector
F = NOR Flash [MB]
S = Special
N = NAND Flash [MB]
Operating Temperature Range
RAM
A = Automotive
S = SDRAM [MB]
C = Commercial
I = Industry
Crystal Frequency
Notation: QXX[MHz]
8.1
Predefined mounting options for CORE MODULE NICKNAME
Article Number
100-1214-1
100-1214-1-TR
100-1215-1
100-1215-1-TR
Name
eCM-BF561-C-C-Q25S128F32 (eCM-BF561)
eCM-BF561-C-C-Q25S128F32 (eCM-BF561)
Tape Reel (50 pcs per reel)
eCM-BF561-C-I-Q25S128F32
eCM-BF561-C-I-Q25S128F32
Temperature Range
Commercial
Commercial
Industrial
Industrial
Table 8-1 - Mounting options
Development boards for the eCM-BF561 are listed in the following table.
Article Number
100-2342-2
100-2350-1
100-3106
Name
eDEV-BF5xx
CDEV-BF5xx
CDK – Camera Development Kit
100-3400
Blackfin Evaluation Starter
Package
Description
Blackfin Evaluation Board
Camera Development Board
CDK Camera Development Kit with eCMBF561 and ISM-MT9M024
eDEV-BF5xx and eCM-BF561
Table 8-2 - Development boards for eCM-BF561
NOTE:
Custom Core Modules are available on request! Please contact Bluetechnix
(office@bluetechnix.com) if you are interested in custom Core Modules.
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9
9.1
Dependability
Last change: 18 June 2013
Version 1.4
MTBF
Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results,
because MTBF numbers just represent a statistical approximation of how long a set of devices should last
before failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take
all the components into account. The PCB and solder connections are excluded from this estimation. For
test conditions we assume an ambient temperature of 30°C of all Core Module components except the
Blackfin® processor (80°C) and the memories (70°C). We use the MTBF Calculator from ALD
(http://www.aldservice.com/) and use the reliability prediction MIL-217F2 Part Stress standard. Please get in
touch with Bluetechnix (office@bluetechnix.com) if you are interested in the MTBF result.
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Version 1.4
10 Product History
10.1 Version Information
10.1.1 eCM-BF561-C-C-Q25S128F32 (eCM-BF561)
Version
1.1.1
Component
Processor
RAM
Flash
Type
ADSP-BF561SKBCZ-6A (Rev 0.5)
IS42S16320B-7BL
PF48F4000P0ZBQE (32MB)
Table 10-1: Overview eCM-BF561-C-C-Q25S128F32 product changes
10.1.2 eCM-BF561-C-I-Q25S128F32
Version
1.1.1
Component
Processor
RAM
Flash
Type
ADSP-BF561SBBCZ-5A (Rev 0.5)
IS42S16320B-7BLI
PF48F4000P0ZBQE (32MB)
Table 10-2: Overview eCM-BF561-C-I-Q25S128F32 product changes
10.2 Anomalies
Version
V1.0
V1.1
Date
2011 02 11
2011 07 18
Description
No anomalies reported yet.
No anomalies reported yet.
Table 10-3: Overview product anomalies
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Version 1.4
11 Document Revision History
Version
1
2
3
4
Date
2009 12 03
2011 07 18
2011 10 18
2013 06 17
Document Revision
First release V1.0 of the Document
Updated document with industrial version.
Typical I3V3 set to 700mA
ARDY pin set to input, FLASH_WP renamed to nFLASH_WP (active low)
Update to new CI
Table 11-1: Revision history
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Version 1.4
12 List of Abbreviations
Abbreviation
ADI
AI
AMS
AO
CM
DC
DSP
eCM
EBI
ESD
GPIO
I
I²C
I/O
ISM
LDO
MTBF
NC
NFC
O
OS
PPI
PWR
RTOS
SADA
SD
SoC
SPI
SPM
SPORT
TFT
TISM
TSC
UART
USB
USBOTG
ZIF
Description
Analog Devices Inc.
Analog Input
Asynchronous Memory Select
Analog Output
Core Module
Direct Current
Digital Signal Processor
Enhanced Core Module
External Bus Interface
Electrostatic Discharge
General Purpose Input Output
Input
Inter-Integrated Circuit
Input/Output
Image Sensor Module
Low Drop-Out regulator
Mean Time Between Failure
Not Connected
NAND Flash Controller
Output
Operating System
Parallel Peripheral Interface
Power
Real-Time Operating System
Stand Alone Debug Agent
Secure Digital
System on Chip
Serial Peripheral Interface
Speech Processing Module
Serial Port
Thin-Film Transistor
Tiny Image Sensor Module
Touch Screen Controller
Universal Asynchronous Receiver Transmitter
Universal Serial Bus
USB On The Go
Zero Insertion Force
Table 12-1: List of abbreviations
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List of Figures and Tables
Last change: 18 June 2013
Version 1.4
Figures
Figure 1-1: Main components of the eCM-BF561 module ................................................................................. 5
Figure 2-1: Functional Overview ......................................................................................................................... 7
Figure 5-1: Reset circuit .................................................................................................................................... 15
Figure 6-1: Mechanical outline (top view) ............................................................................................................ 16
Figure 6-2: Mechanical outline and Bottom Connectors (bottom view) ........................................................... 17
Figure 6-3: Mechanical outline (side view) ........................................................................................................... 17
Figure 6-4: Footprint (top view) ........................................................................................................................... 18
Tables
Table 2-1 Boot Mode .......................................................................................................................................... 7
Table 2-2: Memory Map ...................................................................................................................................... 7
Table 2-3: External Addressable Memory ........................................................................................................... 8
Table 3-1: Electrical characteristics .................................................................................................................... 9
Table 3-2: Absolute Maximum Ratings ............................................................................................................... 9
Table 4-1 - Connector Description X1 .............................................................................................................. 12
Table 4-2 - Connector Description X2 .............................................................................................................. 14
Table 6-1: Core Module connector types ......................................................................................................... 18
Table 8-1 - Mounting options ............................................................................................................................ 20
Table 8-2 - Development boards for eCM-BF561 ............................................................................................ 20
Table 10-1: Overview eCM-BF561-C-C-Q25S128F32 product changes ......................................................... 22
Table 10-2: Overview eCM-BF561-C-I-Q25S128F32 product changes .......................................................... 22
Table 10-3: Overview product anomalies ......................................................................................................... 22
Table 11-1: Revision history .............................................................................................................................. 23
Table 12-1: List of abbreviations ....................................................................................................................... 24
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