WD2RE04GX836-667G-PFI

Wintec Industries – OEM Embedded Design Center Page 1 of 2 DRAM DDR2 RDIMM RDIMM UDIMM SODIMM mini DIMM DDR2 has been the standard memory solutions for applications in virtually all market segments from Servers, PCs and Notebooks to Printers, Networking and Storage systems and many more for several years providing superior cost and performance criteria. DDR2 has started to relinquish its role as the memory industry’s mainstream technology to DDR3 and is forecasted to become a legacy product by early 2011 Available in power supply voltages of 1.8V (and 1.55V for FBDIMMs) and with transfer data rates from 400Mb/s to 800Mb/s and beyond, DDR2 has been designed in a wide range of applications providing designers with numerous module options to choose from. Wintec offers a wide range of DDR2 Module solutions. Please click on the link to find out more about our solutions. DDR2 - 240-Pin DIMM - Registered ECC Standard Profile (1.181”) with Nominal Voltage (1.8V) Density Part Number Rank DIMM Config Component Config Voltage WD2RE01GX809-xxxx-yyz 1 rank 128x72 128Mx8 1.8V WD2RE01GX418-xxxx-yyz 1 rank 128x72 128Mx4 1.8V WD2RE02GX818-xxxx-yyz 2 rank 256x72 128Mx8 1.8V WD2RE04GX418-xxxx-yyz 1 rank 512x72 512Mx4 1.8V WD2RE04GX436-xxxx-yyz 2 rank 512x72 256Mx4 1.8V WD2RE04GX836-xxxx-yyz 4 rank 512x72 128Mx8 1.8V WD2RE08GX436-xxxx-yyz 2 rank 1024x72 512Mx4 1.8V WD2RE08GX836-xxxx-yyz 4 rank 1024x72 256Mx8 1.8V 1GB 2GB 4GB 8GB Very Low Profile (0.72”) with Nominal Voltage (1.8V) Density Part Number Rank DIMM Config Component Config Voltage WD2RE01GX809V-xxxx-yyz 1 rank 128x72 128Mx8 1.8V WD2RE01GX418V-xxxx-yyz 1 rank 128x72 128Mx4 1.8V WD2RE02GX818V-xxxx-yyz 2 rank 256x72 128Mx8 1.8V WD2RE04GX418V-xxxx-yyz 1 rank 512x72 512Mx4 1.8V WD2RE04GX818V-xxxx-yyz 2 rank 512x72 256Mx8 1.8V WD2RE08GX818V-xxxxx-yyz 2 rank 1024x72 512Mx8 1.8V 1GB 2GB 4GB 8GB (xxxxx) Modules Speed (MHz) and CAS Latency 800I: 800MHz CL6 = 800G : 800MHz CL5 667G : 667MHz CL5 533E : 533MHz CL4 (yy) = (z) = DRAM Manufacturer and Die Revision A: A-Die P: Samsung B: B-Die H: Micron C: C-Die C: Hynix Buffer / Register set (Only applies to Registered/Buffered modules) I: Inphi 5/31/2012 Page 2 of 2 D: IDT L: Intel http://www.wintecind.com/oem/DRAM/DDR2/RDIMM.html 5/31/2012