BL-HG836G-TRB

BRIGHT LED ELECTRONICS CORP. Specification for Approval SAMPLES ATTACHED AREA ● DEVICE NUMBER: BL-HG836G-TRB PAGE DATE 1 2 3 4 5 6 7 CONTENTS 2015.11.13 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Initial Released 2022.07.08 1.1 1.1 1.1 1.1 1.1 1.1 1.1 Modify Mark FOR CUSTOMER’S APPROVAL STAMP OR SIGNATURE APPROVED PURCHASE MANUFACTURE 佰鴻工業股份有限公司 QUALITY ENGINEERING Approved By Confirmed By Prepared By BRIGHT LED ELECTRONICS CORP. 新北市板橋區和平路 新北市板橋區和平路 19 號 3 樓 3F., No.19, He Ping Road, Ban Qiao Dist., New Taipei City, Taiwan Tel: +886-2-29591090 曾 占 周 2022.07.08 2022.07.08 2022.07.08 慶 霖 旭 穎 BRIGHT LED ELECTRONICS CORP. BL-HG836G -TRB ● Features: ●Package Dimensions: 1. Emitted Color : Green 2. Lens Appearance : Water Clear 3. Mono-color type. 4. 1.6x0.8x0.4mm(0603) standard package 5. Suitable for all SMT assembly methods. 6. Compatible with infrared and vapor phase reflow solder process. 7. Compatible with automatic placement equipment. 8. This product doesn’t contain restriction Substance, comply ROHS standard. ● Applications: 1. Backlighting: LCDs, Key pads advertising. 2. Status indicators: Comsumer & industrial NOTES: 1. All dimensions are in millimeters . 2. Tolerance is ±0.10mm unless otherwise specified. 3. Specifications are subject to change without notice. electronics. 3. General use. ● Absolute Maximum Ratings(Ta=25℃ ℃) Parameter Symbol Rating Unit Power Dissipation Pd 70 mW Forward Current IF 20 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol See Page 6 - ＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.1.1 Page 1 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG836G -TRB ● Electrical and optical characteristics(Ta=25℃ ℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=20mA - 3.2 3.6 V Luminous Intensity Iv IF=20mA 140 317 - mcd Reverse Current IR VR=5V - - 1 µA Peak Wave Length λp IF=20mA - 520 - nm Dominant Wave Length λd IF=20mA 520 - 535 nm Viewing Angle 2θ1/2 IF=20mA - 120 - deg ● Typical Electro-Optical Characteristics Curves Fig.2 Forw ard c urrent derating curve v s . am bient tem perature Fig.1 R elativ e intens ity vs. wavelength 1.0 50 Forward current (mA) Relative radiant intensity 40 0.5 30 20 10 0 470 520 0 570 20 40 60 80 100 W av elength (nm) A mbient temperature Ta( C) Fig.4 R elativ e lum inous intensity vs. am bient tem perature F ig.3 Forw ard c urrent v s . forward voltage 50 3.0 2.5 30 20 10 (Normalized @20mA) Relative Luminous intensity Forward current (mA) 40 2.0 1.5 1.0 0.5 0 1 2 3 4 0 -40 5 -20 Forw ard v oltage(V) 0 20 40 60 A mbient temperature Ta( C) Fig.5 R elativ e lum inous intensity v s . forw ard current Fig.6 R adiation diagram 0 10 20 2.0 1.5 Relative radiant intensity Relative luminous intensity (@20mA) 30 1.0 0.5 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 Forw ard c urrent (mA) Ver.1.1 Page 2 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG836G -TRB ● Tapping and packaging specifications(Units: mm) Quantity:5000PCS USER DIRECTION OF FEED 0.2±0.1 START END CATHODE 1.8±0.1 8.0±0.3 ANODE 0.95±0.1 4.0±0.1 4.0±0.1 ● Package Method:(unit:mm)Vacuum 12 bag/box 5000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 Ver.1.1 Page 3 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG836G -TRB ● Bin Limits I n t e n s i t y B i n L im its ( A t 2 0 m A ) BIN CODE Min. (mcd) Max. (mcd) R 140 210 S 210 317 T 317 475 U 475 715 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % C o l o r B i n L im it s (A t 2 0 m A ) BIN CODE Min. (nm) Max. (nm) 6 520 525 7 525 530 8 530 535 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 n m V F B in L im it s ( A t 2 0 m A ) BIN CODE M i n . ( v) M a x . ( v) G 2.8 3.0 H 3.0 3.2 J 3.2 3.4 K 3.4 3.6 To l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 V. ● BIN： x x x VF BIN CODE Color BIN CODE Intensity BIN CODE Ver.1.1 Page 4 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG836G -TRB ● Reliability Test Classification Endurance Test Environmental Test Test Item Reference Standard MIL-STD-750D:1026 Operation Life MIL-STD-883D:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202F:103B High Humidity JIS-C-7021 :B-11 Storage High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-11 Storage MIL-STD-202F:107D Temperature MIL-STD-750D:1051 Cycling MIL-STD-883D:1010 JIS-C-7021 :A-2 MIL-STD-202F:107D(1980) Thermal Shock MIL-STD-750D:1051(1995) MIL-STD-883D:1011(1991) Test Conditions Result Ta: Under room temperature Test time:1,000hrs IF=Product Recommended IF 0/32 Ta:85±5℃ RH:90%-95% Test time:240hrs Ta:100±5℃ Test time:1,000hrs 0/32 Ta: -45±5℃ Test time=1,000hrs 0/32 0/32 Ta:-35±5℃~25±5℃~85±5℃~25±5℃ 30min 5min 30min 5min Time:5cycles Ta:-45±5℃ ~+85±5℃ 20min 20 min Time:10cycles 0/32 0/32 Wetting balance MIL-STD-883:2003 MIL-STD-202F:208D MIL-STD-883D:2003 Ta:230±5℃ Time:5±0.5s 0/32 Solder Resistance MIL-STD-202F:210A MIL-STD-883D:1011 JIS-C-7021 :A-1 Ta:260±10℃ Time:10±1s 0/32 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA Judgement criteria for failure Initial Level*1.1 Over U*2 Initial Level*0.7 1.U means the upper limit of specified characteristics. 2. Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.1 Page 5 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG836G -TRB ● IR-Reflow Soldering 1. Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering. 2. Avoid rapid cooling or any excess vibration during temperature ramp-down process. 3. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs. ● IRON Soldering 350℃ ℃ Within 3 sec.,One time only. Ver.1.1 Page 6 of 7 BRIGHT LED ELECTRONICS CORP. BL-HG836G -TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 5000 pcs (one taping reel) and a label is attached on each bag. (2) Label: B Part No Quantity BIN. Sealing Date x xx xx xx x xx xx Year Month Year Cycle Manufacture Location Ver.1.1 Page 7 of 7