Confidential Degree : Confidential
Specification of MEMS
Microphone
(RoHS Compliance & Halogen Free)
Customer Name :
Customer Model :
Goermicro Model: SD33OT261-003
Goermicro
CUSTOMER APPROVAL
DESIGN
Aaron.Xie
2021.06.30
CHKD
Samual.Wang
2021.06.30
STANDARD
Angela.Kong
2021.06.30
APVD
Roy.Wang
2021.06.30
Tel : + 86 536 3051234
E- Mail : goermicro@goermicro.com
Website: http://www.goermicro.com
Address: No.268 Dongfang Road, High-Tech Industry
Development District, Weifang, Shandong, P.R.C.
Version：3.0
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Restricted
1 Security Warning
The information contained in this document is the exclusive property of Goermicro
Inc. and should not be disclosed to any third party without the written consent of
Goermicro Inc.
2 Publication History
Version
Description
Date
Author
Approved
1.0
New Design
2021.01.29
Ford
Roy
2.0
Change package method
2021.04.11
Aaron
Roy
3.0
Change General Microphone
Specifications
2021.06.30
Aaron
Roy
Version：3.0
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Contents
1 Introduction
2 Test Condition
3 Acoustical and Electrical Characteristics
4
4
4
3.1
Standard Performance Mode
4
3.2
Frequency Response Curve and Limits
4
3.3
Low Power Mode
5
3.4
General Microphone Specification
5
3.5
Micronphone Interface Specifications
6
4 Measurement Circuit
5 Test Setup Drawing
6 Mechanical Characteristics
7
7
8
6.1 Appearance Drawing
8
6.2 Weight
8
7 Reliability Test
9
7.1
Vibration Test
9
7.2
Drop Test
9
7.3
Temperature Test
9
7.4
Humidity Test
9
7.5
Mechanical Shock Test
9
7.6
Thermal Shock Test
9
7.7
Reflow Test
9
7.8 ESD Shock Test
9
8 Package
10
8.1 Tape Specification
10
8.2 Reel Dimension
11
8.3 The Content of Box
11
8.4 Packing Explain
12
9 Storage and Transportation
10 Land Pattern Recommendation
12
13
10.1 The Pattern of MIC Pad
13
10.2 Recommended Soldering Surface Land Pattern
13
11 Soldering Recommendation
14
11.1 Soldering Machine Condition
14
11.2 The Drawing and Dimension of Nozzle
14
11.3 Reflow Profile
15
16
12 Cautions When Using MEMS MIC
12.1 Board Wash Restrictions
16
12.2 Sound Hole Productions
16
12.3 Wire Width Adaption
16
12.4 Ultrasonic Restrictions
16
13 Output Inspection Standard
16
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1 Introduction:
MEMS MIC which is able to endure reflow temperature up to 260℃ for 50 seconds can be
used in SMT process. It is widely used in telecommunication and electronics device such as
mobile phone, laptop computers, and other portable electronic devices etc.
2 Test Condition (L=50 cm)
StandardConditions
(As IEC 60268-4)
Air pressure
Humidity
Temperature
Environment Conditions
+15℃～+35℃
25％RH～75%RH
86kPa～106kPa
Basic Test Conditions
+20℃±2℃
60％RH～70%RH
86kPa～106kPa
3 Acoustical and Electrical Characteristics
3.1 Standard Performance Mode (Test Condition: VDD=1.8V, fCLK =2.4MHz)
Symbol
Test Conditions
Min
Typ
Max
Unit
Sensitivity
S
f=1kHz, Pin=1Pa
-27
-26
-25
dBFS
(Note 1)
Current Consumption
(Note 2)
I
fclk=2.4MHz
-
750
-
μA
S/N Ratio
SNR
f=1kHz, Pin=1Pa
A-Weighted Curve
-
64
-
dB
Distortion
THD
94dB SPL@ 1kHz
-
0.2
0.5
Acoustic Overload Point
AOP
10% THD @1 kHz
-
118
-
dB SPL
Power Supply Rejection
PSR
100mVpp
squarewave@217Hz
-
-80
-
dBFS
Power Supply Rejection
Ratio
PSRR
-
60
-
dBFS
Item
100mVpp
squarewave@217Hz
%
Relative Response (dB)
3.2 Frequency Response Curve and Limits
+10
+5
+7
+3
+3
+3
+3
+3
+3
+1
0
-5
-10
-3
50
-3
100
200
-3
500
-3
-3
-3
1K
3K
5K
8K
10K
Frequency (Hz)
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3.3 Low Power Mode (Test Condition: VDD=1.8V, fCLK =768kHz)
Item
Sensitivity
Current Consumption
(Note 2)
Symbol
Test Conditions
Min
Typ
Max
Unit
S
f=1kHz, Pin=1Pa
-27
-26
-25
dBFS
(Note 1)
I
fclk=768kHz
-
300
-
μA
S/N Ratio
SNR
f=1kHz, Pin=1Pa
A-Weighted Curve
-
64
-
dB
Distortion
THD
94dB SPL@ 1kHz
-
0.2
0.5
%
Acoustic Overload Point
AOP
10% THD @1 kHz
-
118
-
dB SPL
Power Supply Rejection
PSR
100mVpp
squarewave@217Hz
-
-85
-
dBFS
Power Supply Rejection
Ratio
PSRR
-
60
-
dBFS
200mVpp
sinewave@1KHz
long term percent
of full scale
DC offset
%
0
3.4 General Microphone Specifications
Test Condition: VDD=1.8V,fCLK =2.4MHz, select pin grounded,no load.
Symbol
Item
Test Conditions
VDD
Supply Voltage
1.62
Standby Mode
Clock
Frequency Lower Power
Mode
Range
Normal Mode
Typ
Max
Unit
1.8
3.6
V
250
kHz
0
Isleep
Sleep Current
Min
350
-
800
kHz
1.0
-
4.8
MHz
Fclk=0Hz，VDD=1.8V
-
3
-
μA
Fclk=0Hz，VDD=3.6V
-
6
-
μA
Directivity
Omnidirectional
Increasing density of 1's
Increasing sound pressure
Polarity
Data Format
1/2 cycle PDM
Short Output Current
ISC
Output Load
Cload
Data Pin short to GND
Fclk ＜250KHz
1
-
20
mA
-
-
140
pF
-
5
-
us
Fall Asleep Time
Tslp
Wake-up Time
Twk
±0.5dB sensitivity accuracy
-
-
20
ms
Power-up Time
Tup
±0.5dB sensitivity accuracy
-
-
20
ms
Mode-Change Time
Tmc
±0.5dB sensitivity accuracy
-
-
20
ms
-
0
-
%FS
DC Output
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3.5 Microphone Interface Specifications
Typ
Max
Unit
0.65 VDD
-
VDD+0.3
V
V IL
-0.3
-
0.35 VDD
V
Logic Output High
VOH
VDD-0.45
-
-
V
Logic Output Low
VOL
-
-
0.45
V
40
-
60
%
Item
Symbol
Logic Input High
V IH
Logic Input Low
Min
Test Conditions
Clock Duty Cycle
Note 1. dBFS = 20xlog (A/B) where A is the level of the signal, B is the level that corrsponds
to Full-scale level.
Note 2. The current consumption depends on the applied Clock Frequency and the load on
the DATA output.
1/F
CLK
Note 3. Timing
VIH
TR
TF
CLOCK
VIL
TDZ
TDV
DATA1
SEL=GND
VOH
High Z
VOL
TDZ
TDV
DATA2
SEL=VDD
Symbol
Item
High Z
VOH
VOL
Test Conditions
Min
Typ
Max
Unit
Clock Rising Time
TR
RL=1MΩ，CL=12pF
-
-
15
ns
Clock Falling Time
TF
RL=1MΩ，CL=12pF
-
-
15
ns
Data into Hi Z time
TDZ
RL=1MΩ，CL=12pF
0
-
20
ns
DataValid time
TDV
RL=1MΩ，CL=12pF
24
36
48
ns
0.5
ns
Clock Jitter
Period jitter in RMS
Clock Duty Cycle
40
-
60
%
Clock Frequency
350
2400
4800
KHz
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4 Measurement Circuit
Term.1
Vdd +
Term.6
L/R
Vreg
Amp
ΣΔ
Modulator
Term.3
Data
Select
Term.4
CLK
Charge
Pump
Term.2，5
GND
ASIC
MEMS MIC
5 Test Setup Drawing
Power Amplifier
Free-field 1/2"
Microphone
Audio Analyzer
50cm
Speaker
MIC
Input
Output
Remote Control
PDM Line
Driver
Turn Table
Anechoic Room
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6 Mechanical Characteristics
6.1 Appearance Drawing (Unit: mm)
H
0.792
1.8
0.6 0.57
1
5-0.638*0.57
GWWD
YLLL
L
AP
3
4
2
5
1
6
0.638
0.3
0.3
R0.319
0.57
W
Top View
Pin#
Bottom View
Side View
Function
ITEM
DIMENSION
TOLERANCE
UNITS
Length(L)
4.00
±0.10
mm
Width(W)
2.00
±0.10
mm
1
VDD
2/5
GND
Height(H)
1.10
±0.10
mm
3
Data
ACOUSTIC
PORT(AP)
Ø0.65
±0.05
mm
4
CLK
6
L/R
Note: 1. Tolerance ±0.10mm unless otherwise specified.
2. Identification Number Convention: Job Identification Number.
Identification G W W D
Number
Y LLL
G : Goermicro W W :Week
Y
:Year
L L L
D
:Day
2D Code
: Lot Number
6.2 Weight
The weight of the MIC is Less than 0.05g.
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7 Reliability Test
7.1
Vibration
Test
7.2
Drop
Test
To be no interference in operation after vibrations, 4 cycles, from 20 to 2,000Hz in each
direction(X,Y,Z), 48 minutes, using peak acceleration of 20g, sensitivity should vary
within ±3dBFS from initial sensitivity(IEC 60068-2-6:2007).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
To be no interference in operation after dropped to 1.0cm steel plate 12 times from 1.5
meter height in state of JIG,JIG weight of 100g, sensitivity should vary within ±3dBFS from
initial sensitivity(IEC60068-2-31:2008).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
a) After exposure at +125℃ for 200 hours, sensitivity should vary within ±3dBFS from initial
sensitivity(IEC 60068-2-1:2007).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
7.3
Temperature
b) After exposure at -40℃ for 200 hours, sensitivity should vary within ±3dBFS from initial
Test
sensitivity(IEC 60068-2-1:2007).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
7.4
Humidity
Test
After exposure at +85℃ and 85% relative humidity for 200 hours, sensitivity should vary
within ±3dBFS from initial sensitivity(IEC 60068-2-67:2019).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
Then subject samples to three one-half sine shock pulses (3000 g for 0.3 milliseconds) in
7.5
each direction (for six axes in total) along each of the three mutually perpendicular axes
Mechanical for a total of 18 shocks, sensitivity should vary within ±3dBFS from initial sensitivity
Shock Test (IEC60068-2-27:2008).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
After exposure at -40℃ for 30 minutes, at +125℃ for 30 minutes (change time 20 seconds)
7.6
32 cycles, sensitivity should vary within ±3dBFS from initial sensitivity(IEC 60068-2-14:2009).
Thermal
Shock Test (The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
7.7
Reflow
Test
Adopt the reflow curve of item 12.3, after three reflows, sensitivity should vary within ±2dBFS
from initial sensitivity(Refer to customer's request).
(The measurement to be done after 2 hours of condition at 15℃-35℃, R.H. 25%～75%)
7.8
Under C=150pF, R=330ohm.
Electrostatic Air discharge to case with±8kV and contact discharge to I/O terminals with±2kV , 10 times,
Discharge Grounding. Sensitivity should vary within ±3dBFS from initial sensitivity (IEC61000-4-2:2008).
Test
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8 Package
8.1 Tape Specification
P2
D0
E
P0
B
A
GWWD
YLLL
GWWD
YLLL
F
W
A
GWWD
YLLL
B
C
P1
Pin 1#
(Vdd)
A-A
B-B
T
10°
B0
10°
A0
K0
The Dimensions as Follows:
W
E
F
∅D0
P2
P0
10P0
P1
A0
B0
ITEM
K0
T
DIM(mm)
1.35±0.10
ITEM
DIM(mm)
ITEM
DIM(mm)
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8.2 Reel Dimension
7'' reel for sample stage
13'' reel will be provided for the mass production stage
The following is 13'' reel dimensions (unit:mm)
DETAIL "A"
12.4±0.2
inner side
A
1.9±0.4
Ø21±0.4
11 12 1
10
2
7 65
3
4
Ø13±0.2
Ø330(max)
9
8
Ø100±0.5
120°
8.3 The Content of Box(13'' reel)
11121
10
2
9
87
3
6 54
Packing Bag
Packing (10,000PCS)
Two Inner Box(100,000PCS)
Version：3.0
Inner Box(50000PCS)
(340mm 135mm 355mm)
(50,000PCS)
Outer Box(100,000PCS)
(370mm 300mm 390mm)
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8.4 Packing Explain
8.4.1 The Label Content of the Reel
11121
10
2
9
87
3
6 54
xx
xx x
xx
xx xxxx x
xx
x
x
xx xxx xxx
x
x
xx xxx
x
xx
The Content Includes:
Product type, Lot, Customer P/N;
and other essential information such as
Quantity, Date etc.
8.4.2 The RoHS Label
11121
10
2
9
87
3
6 54
RoHS
RoHS Compliance&
Halogen Free Mark
9 Storage and Transportation
9.1 Keep MEMS MIC in warehouse with less than 75% humidity and without sudden
temperature change, acid air, any other harmful air or strong magnetic field.
Recommend storage period no more than 1 year and floor life(out of bag) at factory no
more than 4 weeks.
9.2 The MEMS MIC with normal pack can be transported by ordinary conveyances. Please
protect products against moist, shock, sunburn and pressure during transportation.
9.3 Storage Temperature Range：-40℃～+70℃
9.4 Operating Temperature Range：-40℃～+100℃
Note1: MSL(moisture sensitivity level) Class 1(IPC/JEDEC-J-STD-020 Revision C)
Note2: Static sensitive device
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10 Land Pattern Recommendation
10.1 The Pattern of MIC Pad(Unit:mm)
0.6 0.57
5-0.638*0.57
3
4
2
5
1
6
0.638
0.3
0.3
R0.319
0.57
10.2 Recommended Soldering Surface Land Pattern(Unit:mm)
0.57 0.6
0.3
0.3
4
1
5
2
6
3
0.638
5-0.638*0.57
R0.319
0.57
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11 Soldering Recommendation
11.1 Soldering Machine Condition
8 zones
Temperature Control
Heater Type
Hot Air
Solder Type
Lead-free
11.2 The Drawing and Dimension of Nozzle
Inside Diameter: 1.0mm;
Ø1 Forbidden area for
vacuum application
1.93
0.3
Recommendation
area for pick up
1.4
Please don't vacuum over the acoustic port directly.
Please don't blow the acoustic port directly.
Ø1.0
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11.3 Reflow Profile
Temp. °C
Tp
Max. Ramp-up rate = 3℃/s
Max. Ramp-down rate = 6℃/s
TL
tp
tL
Tsmax
Preheat area
Tsmin
ts
25
time 25℃ to peak
Time. sec
Key Features of The Profile:
Average Ramp-up rate(Tsmax to Tp)
3℃/s max.
Preheat :
Temperature Min(Tsmin)
Temperature Max(Tsmax)
Time(Tsmin to Tsmax)(ts)
150℃
200℃
60~180s
Time maintained above :
Tempreature(TL)
Time(tL)
217℃
60~150s
Peak Temperature(Tp)
260℃
Time within 5℃ of actual Peak Temperature(tp) :
30~40s
Ramp-down rate(Tp to Tsmax)
6℃/s max
Time 25℃ to Peak Temperature
8min max
When MEMS MIC is soldered on PCB, the reflow profile is set according to solder paste
and the thickness of PCB etc.
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12 Cautions When Using MEMS MIC
12.1 Board Wash Restrictions
It is very important not to wash this silicon microphone, otherwise this could
damage the microphone.
12.2 Sound Hole Protection
It is very important not to operate vacuum and air blow into sound hole(without any
covering over sound holes), otherwise this could damage the microphone.
And it is necessary to be careful about foreign substances into sound hole inside silicon
microphone.
12.3 Wire width Adaption
It is needed to adjust the dumping resistance according to the wire length and wire
tod,etc. when using.
It is also necessary to insert dumping resistance in the Data line located adjacent to the
microphone according to circumstances.
12.4 Ultrasonic Restrictions
It is very important not to use ultrasonic process. otherwise this could damage the
microphone.
13 Output Inspection Standard
Output inspection standard is executed according to .
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