a module solution provider
WG3221-00
WLAN Dual-Band 1x1 802.11ac + Bluetooth 5.0
M.2 Type 1216, Wireless Module
Qualcomm QCA9377-3 Solution
Datasheet
Revision 0.1
Prepared By
Reviewed By
Approved By
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DOC No: WG3221-00-DTS-R01
Index
1. OVERVIEW ....................................................................................................................................... 3
1.1. GENERAL FEATURES ........................................................................................................................ 3
2. FUNCTIONAL FEATURES .................................................................................................................. 4
2.1. MODULE BLOCK DIAGRAM ............................................................................................................... 4
3. MODULE OUTLINE ........................................................................................................................... 5
3.1. SIGNAL L AYOUT (TOP VIEW) ............................................................................................................. 5
3.2. PIN DESCRIPTION ........................................................................................................................... 6
4. MODULE SPECIFICATIONS ............................................................................................................... 9
4.1. ABSOLUTE MAXIMUM RATINGS......................................................................................................... 9
4.2. RECOMMENDED OPERATING CONDITIONS ........................................................................................... 9
4.3. POWER SEQUENCING: ................................................................................................................... 10
4.4. DIGITAL LOGIC CHARACTERISTICS ..................................................................................................... 13
4.5. EXTERNAL 32.768KHZ CLOCK ........................................................................................................ 14
4.6. WLAN RF CHARACTERISTICS ......................................................................................................... 15
4.7. BT RF CHARACTERISTICS................................................................................................................ 19
4.8. TYPICAL POWER CONSUMPTION ...................................................................................................... 20
5. DESIGN RECOMMENDATIONS ....................................................................................................... 22
5.1. REFERENCE SCHEMATIC ................................................................................................................. 22
5.2. L AYOUT RECOMMENDATION ........................................................................................................... 23
5.3. ANTENNA RECOMMENDATION ........................................................................................................ 24
6. PACKAGE INFORMATION ............................................................................................................... 25
6.1. MODULE MECHANICAL OUTLINE ..................................................................................................... 25
6.2. RECOMMENDED L AND PATTERN ...................................................................................................... 26
6.3. RF CONNECTOR ........................................................................................................................... 27
6.4. ORDERING INFORMATION............................................................................................................... 27
6.5. PACKAGE MARKING ...................................................................................................................... 28
6.6. TAPE REEL INFORMATION ............................................................................................................... 29
7. SMT AND BAKING RECOMMENDATION ....................................................................................... 30
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7.1. BAKING RECOMMENDATION ........................................................................................................... 30
7.2. SMT RECOMMENDATION .............................................................................................................. 30
8. REGULATORY INFORMATION ........................................................................................................ 31
9. HISTORY CHANGE .......................................................................................................................... 40
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1. OVERVIEW
The WG3221-00 is a wireless local area network (WLAN) and Bluetooth (BT) combination
module to support 1×1 IEEE 802.11a/b/g/n/ac WLAN standards and BT5.0, enabling seamless
integration of WLAN/BT and low-energy technology. This module is based on Qualcomm QCA9377-3
single-die chip that WLAN function is connected to the host processor via a SDIO interface, and the
Bluetooth is connected via a UART interface.
1.1. General Features
Integrated Crystal, power inductor, filter and diplexer on a single module.
Supports a low-power SDIO 3.0 interface for WLAN and a UART/PCM interface for BT.
Supports 20 MHz/40 MHz at 2.4 GHz and supports 20 MHz, 40 MHz, or 80 MHz at 5 GHz.
Supports BT 5.0, BLE and backward compatibility with BT 1.x and BT 2.x + Enhanced Data Rate.
Supports a single-ended RF port I-PEX MHF4 connector.
Supports BT-WLAN coexistence and ISM-LTE coexistence
Operates on one 3.3V power supply and an I/O supply of 3.3V or 1.8V. Both WLAN and BT
power management use advanced power-saving techniques such as:
- Gating clocks to idle or inactive blocks
- Voltage scaling to specific blocks in certain states
- Fast start and settling circuits to reduce Tx
- Active duty cycles
- Processor frequency scaling
- Other techniques to optimize power consumption across all operating states
Includes additional features such as:
- Low-density parity check (LDPC).
- 1.5 KB of on-chip one-time programmable (OTP) memory to eliminate the need for an
external flash and to further reduce the external component count and BOM cost.
- Available in a M.2 type 1216 package.
- Uses an internal PA and internal LNA to support the datasheet specifications.
Dimension 16mm(L) x 12mm(W) x 2.1mm(H)
RoHS Compliance
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2. FUNCTIONAL FEATURES
2.1. Module Block Diagram
IPEX MHF4
Connector
VDD
VIO_AO
QCA9377-3
VIO
Diplexer
SUSCLK
WLAN 5G
SDIO
HCI_UART
WLAN 2.4G, BT
PCM, I2S
BPF
GPIOs, Debug
Inductor
48MHz
Crystal
WG3221-00 module
Figure 2-1. WG3221-00 Block Diagram
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3. MODULE OUTLINE
105
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
108
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
3.1. Signal Layout (Top View)
GND
1
N.C.
GND
76
2
N.C.
GND
75
3
N.C.
GND
74
4
VDD
VDD
73
5
VIO_AO
VDD
72
6
GND
GND
71
7
N.C.
N.C.
70
8
N.C.
N.C.
69
9
N.C.
GND
68
10
N.C.
N.C.
67
11
COEX1
N.C.
66
12
COEX2
LED1#
65
13
N.C.
LED2#
64
14
N.C.
BT_EN
63
15
N.C.
GND
62
16
3D_SYNC
PCMCLK
61
17
GND
PCMOUT
60
18
N.C.
PCMIN
59
19
N.C.
PCMRF1
58
20
GND
UART RTS
57
21
N.C.
UART RX
56
22
N.C.
UART TX
55
23
GND
UART CTS
54
24
N.C.
UART WAKE
53
25
N.C.
SDIO CLK
52
26
GND
SDIO CMD
51
27
SUSCLK
SDIO DATA0
50
28
W_DISABLE1#
SDIO DATA1
49
GND
97
GND
GND
98
GND
GND
99
103
GND
GND
100
104
102
GND
101
GND
PEWAKE#
CLKREW#
N.C.
GND
N.C.
N.C.
GND
N.C.
N.C.
GND
N.C.
N.C.
GND
VIO
GPIO11
GPIO35
SDIO RESET#
SDIO WAKE#
SDIO DATA3
SDIO DATA2
WG3221-00 Module Pin Out
Top View
GND
106
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
107
Figure 3-1. Module Pin Ofut (Top View)
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3.2. Pin Description
Table 3-1. Pin Description
Pin No.
Pin Name
Type(1)
Description
1
NC
NC
No connection.
2
NC
NC
No connection.
3
NC
NC
No connection.
4
VDD
Power
5
VIO_AO
Power
6
GND
7
NC
NC
No connection.
8
NC
NC
No connection.
9
NC
NC
No connection.
10
NC
NC
No connection.
11
COEX1
PU
LTE coexistence signal. LTE_UART_RXD or LTE_FS.
12
COEX2
DO
LTE coexistence signal. LTE_UART_TXD or LTE_PRI.
13
NC
NC
No connection.
14
NC
NC
No connection.
15
NC
NC
No connection.
16
3D_SYNC
PD
17
GND
18
NC
NC
No connection.
19
NC
NC
No connection.
20
GND
21
NC
NC
No connection.
22
NC
NC
No connection.
23
GND
24
NC
NC
No connection.
25
NC
NC
No connection.
26
GND
27
SUSCLK
GND
GND
GND
GND
GND
PD
3.3V main power supply
Always–on I/O supply for power management and
real–time clock. 1.8V or 3.3V supply.
Ground
Frame sync signal from TV to sync with 3D glass via
Bluetooth.
Ground
Ground
Ground
Ground
External low–power 32.768 kHz clock input
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28
W_DISABLE1#
PU
29
PEWAKE#
OD
30
CLKREW#
OD
PCI Express clock request signal. Not used, leave N.C.
31
NC
NC
No connection.
32
GND
33
NC
NC
No connection.
34
NC
NC
No connection.
35
GND
36
NC
NC
No connection.
37
NC
NC
No connection.
38
GND
39
NC
NC
No connection.
40
NC
NC
No connection.
41
GND
GND
42
VIO
Power
43
GPIO11
DO
44
GPIO35
OD
45
SDIO RESET#
PD
WLAN enable. Active high
46
SDIO WAKE#
DO
WLAN SDIO interrupt signal.
47
SDIO DATA3
B
GND
GND
GND
Turn off WLAN RF analog and front–end. Active low.
PCI Express host wakeup function to wake up the host on
WLAN activity. Not used, leave N.C.
Ground
Ground
Ground
Ground
I/O voltage supply. 1.8V or 3.3V supply.
Clock request output. Not used, leave N.C.
This signal can be used to enable for external Wireless
charging UART circuit. Not used, leave N.C.
WLAN SDIO data bus D3
This pin is a boot strap signal. It must keep high for
48
SDIO DATA2
B
normal operation during power on reset. WLAN SDIO
data bus D2
49
SDIO DATA1
B
WLAN SDIO data bus D1
50
SDIO DATA0
B
WLAN SDIO data bus D0
51
SDIO CMD
DI
WLAN SDIO CMD line signal
52
SDIO CLK
OD
WLAN SDIO clock signal.
53
UART WAKE
OD
54
UART CTS
DI
Bluetooth HCI UART CTS signal
55
UART TX
DO
Bluetooth HCI UART TXD signal
Bluetooth wakeup host. Active high.
Shared for BT LED.
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56
UART RX
DI
Bluetooth HCI UART RXD signal
57
UART RTS
DO
Bluetooth HCI UART RTS signal
58
PCMRF1
B
59
PCMIN
OD
Bluetooth PCM_IN signal
60
PCMOUT
DO
Bluetooth PCM_OUT signal
61
PCMCLK
PD
Bluetooth PCM_CLK signal
62
GND
63
BT_EN
PD
Bluetooth enable. Active high
64
LED2#
OD
Connected internally to pin 53 (UART WAKE )
65
LED1#
OD
Connected internally to pin 30 ( CLKREW# )
66
NC
NC
No connection.
67
NC
NC
No connection.
68
GND
69
NC
NC
No connection.
70
NC
NC
No connection.
71
GND
GND
72
VDD
Power
3.3V main power supply
73
VDD
Power
3.3V main power supply
74~108
GND
GND
GND
GND
Bluetooth PCM_SYNC signal
Ground
Ground
Ground
Ground
(1) Type:
Power: Voltage supply
GND: Ground
NC: No connection
PU: Input signals with weak internal pull-up, to prevent signals from floating when left open
PD: Input signals with weak internal pull-down, to prevent signals from floating when left open
B: Bidirectional digital with CMOS input
DI: Digital input (CMOS)
DO: Digital output signal
OD: A digital output signal with open drain
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4. MODULE SPECIFICATIONS
We reserve the right to amend the design and/or specifications of our products without notice.
4.1. Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
Table 4-1. Absolute Maximum Ratings
Parameter
Conditions
MIN
MAX
Supply voltage, VDD
-0.3
3.65
Supply voltage, VIO
-0.3
4.0
Units
3.3V I/O VIH MAX
Maximum digital I/O input voltage for 3.3V I/O supply
VIO + 0.3
1.8V I/O VIH MAX
Maximum digital I/O input voltage for 1.8V I/O supply
VIO + 0.2
Minimum digital I/O input voltage for 3.3V or 1.8V I/O
VIH MIN
supply
Input RF level
Maximum RF input
ESD
Electrostatic discharge tolerance
V
-0.3
+10
dBm
2000
Storage temperature range
V
-40
+85
°C
4.2. Recommended Operating Conditions
Table 4-2. Recommended Operating Conditions
Parameter
Conditions
Ambient temperature range
Operating supply voltage (VDD)
3.3V supply
Operating supply voltage (VIO)
1.8V or 3.3V supply
MIN
Typ.
MAX
Units
-30
-
85
°C
3.135
3.3
3.465
1.71
1.8
3.14
3.3
V
3.46
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4.3. Power Sequencing:
Case-1: 3.3V power down after 1.8V
If the battery source can be removed from the end user device (battery removed, AC/DC plugged
in), this is the recommended power sequence. It will avoid violating the power off sequence by
allowing the 3.3V rail to shut down after the 1.8V rail.
Notes:
1. The module VIO voltage should match VIO voltage from the host.
2. In this case, both WLAN_EN and BT_EN of WG3221 are at 3.3V due to using the VIO_AO power
rail. If the host VIO voltage is 1.8V, it must have level shifters to interface with host.
3. All host interface signals must stay floating or low before valid power on sequence (WLAN_EN
and BT_EN goes high).
VIO_AO (3.3V)
VDD (3.3V)
ta1
ta7
ta2
ta3
ta8
ta6
VIO (1.8V)
WLAN_EN
BT_EN
ta4
ta5
32KHz_CLK
Symbol
Parameter
Min
Max
ta1
No requirement if VIO_AO connected to 3.3V
0
-
ta2
90% of 3.3V to 10% of 1.8V
0
0
ta3
90% of VIO to 0.7 V of both WLAN_EN and BT_EN
10
-
ta4
WLAN_EN valid to SUSCLK input
0
-
ta5
WLAN_EN de-assert (“low”) to SUSCLK de-assert (tristate or low)
0
-
ta6
Both WLAN_EN = low and BT_EN = low to 90% of 1.8V
10
-
ta7
ta8
3.3V always higher than 1.8V during operation, with power off by
removing battery or unplugging AC/DC
VIO_AO should be connected to 3.3V power rail
Units
μs
0
0
Figure 4-1. Power Sequence (3.3V power down after 1.8V)
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Case-2: 1.8V power down after 3.3V
If the battery source cannot be removed from the end user device, this is the recommended
power sequence for this application. This sequence allows the software to control the power on/off
sequence.
Notes:
1. The module VIO voltage should match VIO voltage from the host.
2. Both WLAN_EN and BT_EN of WG3221 are 1.8V. If host VIO voltage is 1.8V, it does not need
level shifter to interface with host.
3. All host interface signals must stay floating or low before WLAN_EN/BT_EN =high, and after
WLAN_EN/BT_EN = Low.
VIO_AO (1.8V)
tb1
tb7
tb2
VIO (1.8V)
tb3
tb8
tb6
VDD (3.3V)
WLAN_EN
BT_EN
tb4
tb5
32KHz_CLK
Symbol
Parameter
Min
Max
tb1
No requirement if VIO_AO connected to 1.8V
0
-
tb2
90% of 1.8V to 10% of 3.3V
0
-
tb3
90% of 3.3V to 0.7 V of both WLAN_EN and BT_EN
10
-
tb4
WLAN_EN valid to SUSCLK input
0
-
tb5
WLAN_EN de-assert (“low”) to SUSCLK de-assert (tristate or low)
0
-
tb6
Both WLAN_EN = low and BT_EN = low to 90% of 3.3V
10
-
tb7
10% of 3.3V to 90% of 1.8V
0
-
tb8
VIO_AO should be connected to 1.8V power rail
0
Units
μs
Figure 4-2. Power Sequence (1.8V power down after 3.3V)
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Case-3: All power rails supplied 3.3V
All power pins are connected to 3.3V only include VDD、VIO_AO and VIO.
Notes: All host signals are either GND or floating before WLAN_EN/BT_EN =high, and after
WLAN_EN/BT_EN = Low.
VDD (3.3V)
VIO_AO (3.3V)
VIO (3.3V)
WLAN_EN
BT_EN
tc1
tc4
tc2
tc3
32KHz_CLK
Symbol
Parameter
Min
Max
tc1
90% of 3.3V to 0.7 V of both WLAN_EN and BT_EN
0
-
tc2
WLAN_EN valid to SUSCLK input
0
-
tc3
WLAN_EN de-assert (“low”) to SUSCLK de-assert (tristate or low)
0
-
tc4
Both WLAN_EN = low and BT_EN = low to 90% of 3.3V
10
-
Units
μs
Figure 4-3. Power Sequence (All power rails supplied 3.3V)
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4.4. Digital Logic Characteristics
General DC electrical characteristics (for VDD=3.3V, I/O operation). Tc = 25°C
Table 4-3. Digital Logic Characteristics
Symbol
Parameter
Comments
Min
Typ.
Max
Units
-
VIO + 0.3
V
0.3 x VIO
V
μA
VIH
High-level input voltage
0.7 x VIO
VIL
Low-level input voltage
-0.3
IIL
Input low leakage current
VIN = 0 V, Supply = VIO max
RPULL
Input pull resistor
Up or down
VOH
-5.0
-
5.0
1.8V VIO
-
120
-
3.3V VIO
-
70
-
High-level output voltage
0.9 x VIO
-
VIO
V
VOL
Low-level output voltage
0
-
0.1 x VIO
V
IOH
High-level output current
3
-
-
mA
IOL
Low-level output current
-
-
-11
mA
CIN
Input capacitance
-
-
3
pF
kΩ
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4.5. External 32.768KHz clock
The 32.768kHz clock is used in low-power modes such as IEEE power-save and sleep. It serves as a timer to
determine when to wake up to receive beacons in various power-save schemes and to maintain basic logic operations
when in sleep.
The WG3221 module does not require an external 32 kHz clock. By default, the module utilizes its internal 200 kHz
clock shared with the WLAN and BT subsystem.
If the end application has a more accurate 32 kHz clock, then it can be supplied externally via the SUSCLK pin. The
SUSCLK pin must be grounded when using the default internal clock mode. If an external 32 kHz clock is used, the
requirements are:
Symbol
Parameter
Min
Typ.
Max
Units
CK1
Clock rate
-
32.768
-
KHz
CK2
Fail time
1
-
100
Ns
CK3
Rise time
1
-
100
Ns
CK4
Duty cycle (high to los ratio)
15
-
85
%
CK5
Frequency stability
-200
-
200
Ppm
CK6
Input high voltage
0.8xVIO
-
VIO+0.2
V
CK7
Input low voltage
-0.3
-
V
1/CK1
CK6
CK7
CK2
CK3
Figure 4-4. External 32.768KHz clock information
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4.6. WLAN RF Characteristics
Transmit power at 2.4 GHz:
Transmit power with IEEE 802.11 EVM and spectral mask compliance.
Standard
Modulation
Data rates
MIN
Typ.
MAX
BPSK
1 Mbps
15
18
-
802.11b
QPSK
2 Mbps
15
18
-
(1)
CCK
5.5 Mbps
15
18
-
CCK
11 Mbps
15
18
-
BPSK
6 Mbps
14
17
-
BPSK
9 Mbps
14
17
-
QPSK
12 Mbps
14
17
-
802.11g
QPSK
18 Mbps
14
17
-
(1)
16 QAM
24 Mbps
13
16
-
16 QAM
36 Mbps
13
16
-
64 QAM
48 Mbps
12
15
-
64 QAM
54 Mbps
12
15
-
Units
dBm
20 MHz
Standard
Modulation
40MHz
Data rates
Units
MIN
Typ.
MAX
MIN
Typ.
MAX
BPSK
MCS0
13.5
16.5
-
12.5
15.5
-
QPSK
MCS1
13.5
16.5
-
12.5
15.5
-
QPSK
MCS2
13.5
16.5
-
12.5
15.5
-
802.11n
16 QAM
MCS3
13
16
-
12.5
15.5
-
(1)
16 QAM
MCS4
13
16
-
12.5
15.5
-
64 QAM
MCS5
12
15
-
11.5
14.5
-
64 QAM
MCS6
12
15
-
11.5
14.5
-
64 QAM
MCS7
11
14
-
10.5
13.5
-
dBm
(1) Regulatory constraints limit the module output power to the following:
- Channel 1, 11 @ 11B and 11G data rates is 15dBm typical to comply with the FCC/IC/NCC.
- Channel 3, 9 @ MCS0 to MCS4 of 11N 40MHz is 14.5dBm typical to comply with the FCC/IC/NCC.
- Channel 1, 13, 14 @ 11B and 11G data rates is 15dBm typical to comply with the TELEC.
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Channel 3, 11 @ MCS0 to MCS4 of 11N 40MHz is 14.5dBm typical to comply with the TELEC.
Channel 1-13 @ 1Mbps to 36Mbps data rates is 15dBm typical to comply with the ETSI EIRP.
Channel 1-13 @ MCS0 to MCS4 of 11N 20MHz is 15dBm typical to comply with the ETSI EIRP.
Channel 3-11 @ MCS0 to MCS4 of 11N 40MHz is 14.5dBm typical to comply with the ETSI EIRP.
-
Transmit power at 5 GHz:
Transmit power with IEEE 802.11 EVM and spectral mask compliance.
Standard
Modulation
Data rates
MIN
Typ.
MAX
BPSK
6 Mbps
12
15
-
BPSK
9 Mbps
12
15
-
QPSK
12 Mbps
12
15
-
802.11a
QPSK
18 Mbps
12
15
-
(1)
16 QAM
24 Mbps
11.5
14.5
-
16 QAM
36 Mbps
10
13
-
64 QAM
48 Mbps
9
12
-
64 QAM
54 Mbps
7.5
10.5
-
Modulation
Data rates
Units
dBm
20 MHz
Standard
40MHz
Units
MIN
Typ.
MAX
MIN
Typ.
MAX
BPSK
MCS0
12
15
-
10.5
13.5
-
QPSK
MCS1
12
15
-
10.5
13.5
-
QPSK
MCS2
12
15
-
10.5
13.5
-
802.11n
16 QAM
MCS3
10.5
13.5
-
9.5
12.5
-
(1)
16 QAM
MCS4
10.5
13.5
-
9.5
12.5
-
64 QAM
MCS5
9.5
12.5
-
8.5
11.5
-
64 QAM
MCS6
8.5
11.5
-
7.5
10.5
-
64 QAM
MCS7
7.5
10.5
-
6.5
9.5
-
dBm
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Standard
Modulation
20 MHz
Data
40MHz
80MHz
Units
Rates
Min
Typ.
Max
Min
Typ.
Max
Min
Typ.
Max
BPSK
MCS0
11.5
14.5
-
10
13
-
10
13
-
QPSK
MCS1
11.5
14.5
-
10
13
-
10
13
-
QPSK
MCS2
11.5
14.5
-
10
13
-
10
13
-
16 QAM
MCS3
10
13
-
9
12
-
8.5
11.5
-
802.11ac
16 QAM
MCS4
10
13
-
9
12
-
8.5
11.5
-
(1)
64 QAM
MCS5
9
12
-
8
11
-
7.5
10.5
-
64 QAM
MCS6
8
11
-
7
10
-
6.5
9.5
-
64 QAM
MCS7
7
10
-
6
9
-
5.5
8.5
-
256 QAM
MCS8
6.5
9.5
-
6
9
-
5.5
8.5
-
256 QAM
MCS9
-
-
-
5
8
-
4
7
-
dBm
(1) Regulatory constraints limit the module output power to the following:
- Channel 149-165 @ 11A and 11N data rate is 8.5dBm typical to comply with the ETSI EIRP.
- Channel 149-165 @ MCS0 to MCS8 of 11AC is 8.5dBm typical to comply with the ETSI EIRP.
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Receive minimum input level sensitivity at 2.4 GHz:
Standard
Modulation
Data rates
Typ.
Max
BPSK
1 Mbps
-94
-90
CCK
11 Mbps
-87
-83
BPSK
6 Mbps
-89
-85
64 QAM
54 Mbps
-72
-68
Modulation
Data rates
Units
802.11b
dBm
802.11g
20 MHz
Standard
40MHz
Units
Typ.
Max
Typ.
Max
BPSK
MCS0
-88.5
-84
-86.5
-82
64 QAM
MCS7
-69
-65
-67.5
-63
802.11n
dBm
Receive minimum input level sensitivity at 5 GHz:
Standard
Modulation
Data rates
Typ.
Max
BPSK
6 Mbps
-88.5
-84
64 QAM
54 Mbps
-72
-68
802.11a
Units
dBm
20 MHz
Standard
Modulation
40MHz
Data rates
Units
Typ.
Max
Typ.
Max
BPSK
MCS0
-88.5
-84
-85.5
-81
64 QAM
MCS7
-69
-65
-67
-63
802.11n
dBm
20 MHz
Standard
802.11ac
Modulation
40MHz
80MHz
Data rates
Units
Typ.
Max
Typ.
Max
Typ.
Max
BPSK
MCS0
-88
-84
-85.5
-81
-83
-79
256 QAM
MCS8
-65
-61
-62.5
-58
-60
-56
256 QAM
MCS9
-
-
-60.5
-56
-57.5
-53
dBm
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DOC No: WG3221-00-DTS-R01
4.7. BT RF Characteristics
Bluetooth and Low-Energy Transmit power:
Parameter
Min
Typ.
Max
8
10.5
-
EDR output power
5
7.5
-
BLE output power
3.5
6
-
BR output power
(1)
Units
dBm
(1) Regulatory constraints limit the module output power to the following:
- The Bluetooth BR is 5dBm typical to comply with the ETSI 10-dBm EIRP.
- The Bluetooth EDR is 5dBm typical to comply with the ETSI 10-dBm EIRP.
Bluetooth and Low-Energy Receive sensitivity:
Parameter
Condition
Typ.
Max
BT BR, EDR sensitivity
BR, BER = 0.1%
-92
-72
Dirty TX on
EDR2, BER = 0.1%
-92
-72
EDR3, BER = 0.1%
-86
-72
1M bps, PER = 30.8%
-95
-72
Units
dBm
BLE sensitivity
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4.8. Typical Power Consumption
All measurements are performed with VDD、VIO_AO and VIO=3.3V. Temperature at 25°C.
Power consumption for continuous Rx 2.4 GHz.
Data rates
Typ
11b, 1 Mbps
57
11b, 11 Mbps
58
11g, 6 Mbps
58
11g, 54 Mbps
59
MCS0, HT20
58
MCS7, HT20
60
MCS0, HT40
63
MCS7, HT40
67
Units
mA
Power consumption for continuous Tx 2.4 GHz
Data rates
Typ
11b, 1 Mbps at 18 dBm
348
11b, 11 Mbps at 18 dBm
326
11g, 6 Mbps at 17 dBm
314
11g, 54 Mbps at 15 dBm
228
MCS0, HT20 at 16.5 dBm
308
MCS7, HT20 at 14 dBm
214
MCS0, HT40 at 15.5 dBm
279
MCS7, HT40 at 13.5 dBm
179
Units
mA
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Power consumption for continuous Rx 5 GHz.
Data rates
Typ
MCS0, HT20
80
MCS7, HT20
82
MCS0, VHT20
81
MCS8, VHT20
83
MCS0, VHT40
86
MCS9, VHT40
90
MCS0, VHT80
94
MCS9, VHT80
97
Units
mA
Power consumption for continuous Tx 5 GHz
Data rates
Typ
MCS0, HT20 at 15 dBm
388
MCS7, HT20 at 10.5 dBm
265
MCS0, VHT20 at 14.5 dBm
393
MCS8, VHT20 at 9.5 dBm
258
MCS0, VHT40 at 13 dBm
366
MCS9, VHT40 at 8 dBm
216
MCS0, VHT80 at 13 dBm
332
MCS9, VHT80 at 7 dBm
193
Units
mA
Power consumption for Bluetooth.
Mode
Typ
Continuous Rx DH5
26
Continuous Tx DH5 at 10.5 dBm
59
Units
mA
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DOC No: WG3221-00-DTS-R01
5. DESIGN RECOMMENDATIONS
27R
R0402
T1
TP
1
28
VIO_AO
NC
UART_WAKE#
NC
SDIO_CLK
GND
SDIO_CMD
32KHz_CLK_IN
WLAN_RF_KILL
VIO
VIO
R21
R20
10K R0402
10K R0402
SDIO_DATA0
SDIO_DATA1
72
BT Enable Control.
71
70
R19
69
0R R0402
BT_EN
68
67
VIO
66
R23
10K
R0402
65
64
To Host BT PCM Bus.
PCM_CLK
63
PCM_OUT
62
PCM_IN
61
PCM_SY NC
60
VIO
59
To HOST HCI Interface.
R11
0R R0402
R0402
52
R25
10K
R0402
R0402
HCI_UART_WAKE
R0402
0R R0402
NC
R10
NC
HCI_UART_CTS
53
NC
HCI_UART_TXD
0R R0402
R4
HCI_UART_RXD
0R R0402
R5
R8
0R R0402
R3
54
R9
R2
55
R0402
56
VIO
R0402
HCI_UART_RTS
R0402
0R R0402
NC
R1
NC
57
NC
58
R6
UART CTS
GND
73
R7
GND
29
EXT_32K
UART_TXD
GND
SDIO_DATA2
R13
27
UART_RXD
NC
WL_EN
R0402
NC
SDIO_INT_L
27R
UART RTS
SDIO_DATA3
R12
PCM_SY NC
GND
74
To HOST SDIO Interface.
SDIO_CLK
51
SDIO_CMD
50
SDIO_DATA0
49
SDIO_DATA1
SDIO_DATA2
SDIO_DATA3
R14
SDIO_INTERRUPT
0R R0402
48
SG-3030LC
CRY -SMT-12-3.6X2.4-0.5-A
NC
45
26
PCM_IN
46
25
32KHz_CLK_IN
NC
47
24
PCM_OUT
GND
23
GND
VDDIO_AO_PM_ext
21
GND
GND
GPIO11
12
11
10
9
8
7
PCM_CLK
GPIO35
0.1uF
C0603
22
VCC
NC8
NC7
NC6
NC5
OUT
3D_SY NC
44
VIO
NC1
NC2
NC3
NC4
GND
GND
41
C3
Y1
1
2
3
4
5
6
BT_ EN
NC
42
20
NC
43
19
BT_LED
75
WLAN Enable Control.
1
VIO
WLAN_LED
LTE_ATIVE
76
TP
VIO
EXT_4.2V
LTE_UART_TXD
PCIE_RXN
18
LTE_UART_RXD
PCIE_RXP
17
EXT_4.2V
GND
40
16
GND
PCIE_TXN
1
GND
NC
PCIE_TXP
TP
NC
GND
T6
32.768KHz Source Optional:
Select one source for clock.
BT_USB_DN
36
15
NC
37
14
BT_USB_DP
38
13
NC
39
12
GND
PCIE_REFCLKN
11
LTE_UART_TXD
GND
PCIE_REFCLKP
LTE_UART_RXD
3.3V
GND
10
3.3V
GND
VIO_AO
33
9
LTE coexistence
GND
34
8
3.3V
35
7
GND
GND
6
GND
NC
32
5
GND
NC
PCIE_WAKE_L
4
WG3221-00 PIN OUT
LPGA-96-16.0X12.0-0.5-TOP-A
NC
PCIE_CLKREQ_L
3
PCIE_RST_L
2
C2
0.1uF
C0603
30
C1
10uF
C0805
31
1
C5
0.1uF
C0603
Module Supply Voltage :
1. VDD: 3.3V typical.
2. VIO_AO: 1.8V or 3.3V for WL_EN/BT_EN.
3. VIO: 1.8V or 3.3V for I/O.
VDD
R17
VDD
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
U1
VIO_AO
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
108
107
106
105
104
103
102
101
100
99
98
97
5.1. Reference Schematic
T4
C4
0.1uF
C0603
R24
R18
0R R0402
WLAN_EN
10K R0402
Figure 5-1. WG3221-00 module reference circuit
____________________________________________________________________________________
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DOC No: WG3221-00-DTS-R01
5.2. Layout Recommendation
1.
The proximity of ground vias must be close to the pad.
2.
The signal traces must not be run underneath the module on the layer where the module is mounted.
3.
Have a complete ground pour in layer-2 for thermal dissipation.
4.
The signal traces can be run on layer-3 under the ground layer.
5.
The power trace for VDD must be at least 40-mil wide.
6.
The SDIO signals traces must be routed in parallel to each other and as short as possible (less than 20cm).
7.
The SDIO and digital clock signals (especially for the SDIO_CLK) are a source of noise. Keep the traces of these
signals as short as possible and away from the other digital or analog signal traces.
Layer-1
Layer-2
Figure 5-2. Recommend Layout of WG3221-00 module
____________________________________________________________________________________
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DOC No: WG3221-00-DTS-R01
5.3. Antenna Recommendation
The recommend Antenna of the WG3221-00 module list as below:
Trade Name
Model
Type
Drawing
Band
Number
Unictron
AA222
Peak Gain
(dBi)
2.4G
3.73
Technologies
UNII-1
3.46
Corp.
UNII-2A
3.3
UNII-2C
3.79
UNII-3
3.91
2.4G
2.45
UNII-1
2.71
Manufacturing
UNII-2A
2.57
CO., LTD.
UNII-2C
2.02
UNII-3
2.3
2.4G
1.4
Technologies
UNII-1
2.3
Corp.
UNII-2A
2.3
UNII-2C
2.3
UNII-3
2.3
Joinsoon
WiFi3dB
Electronics
Antenna
Unictron
AA077
PCB
Dipole
Chip
____________________________________________________________________________________
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DOC No: WG3221-00-DTS-R01
6. PACKAGE INFORMATION
6.1. Module Mechanical Outline
Bottom View
Units: mm
Top View
Side View
Figure 6-1 WG3221-00 Mechanical Outline Drawing
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DOC No: WG3221-00-DTS-R01
6.2. Recommended Land Pattern
Units: mm
Figure 6-2 Recommended Land Pattern for Module Type 1216
____________________________________________________________________________________
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DOC No: WG3221-00-DTS-R01
6.3. RF Connector
※ P/N : 20449-001E (MHF4 series) from I-PEX
Figure 6-3 RF Connect drawing
6.4. Ordering Information
Order Number
Package
WG3221-00
M.2 type 1216
____________________________________________________________________________________
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DOC No: WG3221-00-DTS-R01
6.5. Package Marking
Marking
Description
JORJIN
Brand name
WG3221-00
Model name
YYWWSSFBX
YY = Digit of the year, ex: 2019=19
WW = Week (01~52)
SS = Serial number from 01 ~99 match to manufacture’s lot number
F = Reverse for internal use.
B = Module version.
X = Chip version
WS2-WG3221B
FCC grant ID
10462A-WG3221B
IC grant ID
201-200204
MIC grant ID
CCAM20LP0370T2
NCC grant ID
____________________________________________________________________________________
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DOC No: WG3221-00-DTS-R01
6.6. Tape Reel information
Reel : 1500 pcs per reel
Pizza Box : 1 reel per pizza box
____________________________________________________________________________________
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DOC No: WG3221-00-DTS-R01
7. SMT AND BAKING RECOMMENDATION
7.1. Baking Recommendation
Baking condition：
-
-
Follow MSL Level 4 to do baking process.
After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
a. Mounted within 72 hours of factory conditions 20cm/low power)
Radiation Exposure Statement:
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with greater than 20cm between the radiator & your
body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé à plus de 20 cm entre le
radiateur et votre corps.
This device is intended only for OEM integrators under the following conditions: (For module device
use)
1) The antenna must be installed and operated with greater than 20cm between the antenna and users,
and
2) The transmitter module may not be co-located with any other transmitter or antenna.
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DOC No: WG3221-00-DTS-R01
Trade Name
Antenna Type
Band
Peak Gain (dBi)
PCB
2.4G
3.73
Technologies
UNII-1
3.46
Corp.
UNII-2A
3.3
UNII-2C
3.79
UNII-3
3.91
2.4G
2.45
UNII-1
2.71
Manufacturing
UNII-2A
2.57
CO., LTD.
UNII-2C
2.02
UNII-3
2.3
2.4G
1.4
Technologies
UNII-1
2.3
Corp.
UNII-2A
2.3
UNII-2C
2.3
UNII-3
2.3
Unictron
Model Number
AA222
Joinsoon
WiFi3dB
Electronics
Antenna
Unictron
AA077
Dipole
Chip
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour
utilisation de dispositif module)
1) L'antenne doit être installé et exploité avec plus de 20 cm entre l'antenne et les utilisateurs, et
2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires.Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour
toutes exigences de conformité supplémentaires requis pour ce module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or
co-location with another transmitter), then the Canada authorization is no longer considered valid and
the IC ID can not be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
Canada authorization.
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DOC No: WG3221-00-DTS-R01
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada
n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces
circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et
l'obtention d'une autorisation distincte au Canada.
End Product Labeling FOR MOBILE DEVICE USAGE (>20cm/low power)
This transmitter module is authorized only for use in device where the antenna may be installed and
operated with greater than 20cm between the antenna and users. The final end product must be
labeled in a visible area with the following: “Contains IC: 10462A-WG3221B”.
Plaque signalétique du produit final
Ce module émetteur est autorisé uniquement pour une utilisation dans un appareil où l’antenne peut
être installée et utilisée à plus de 20 cm entre l’antenne et les utilisateurs. Le produit final doit être
étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 10462A-WG3221B".
End Product Labeling FOR PORTABLE DEVICE USAGE (
工商网监
湘ICP备2023018690号
