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DOC No: WS2118-00A-DTS-R01
Index
1. OVERVIEW ....................................................................................................................................... 3
1.1. GENERAL FEATURES ........................................................................................................................ 3
2. FUNCTIONAL FEATURES .................................................................................................................. 4
2.1. MODULE BLOCK DIAGRAM ............................................................................................................... 4
2.2. BLOCK FUNCTIONAL FEATURE ........................................................................................................... 5
BlueNRG-1 : Bluetooth low energy wireless SOC ....................................................................... 5
S2-LP Sub-1Ghz transceiver ......................................................................................................... 5
3. MODULE OUTLINE ........................................................................................................................... 7
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3.1. SIGNAL LAYOUT (TOP VIEW) ............................................................................................................. 7
3.2. PIN DESCRIPTION ........................................................................................................................... 8
4. MODULE SPECIFICATIONS ............................................................................................................. 10
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4.1. ABSOLUTE MAXIMUM RATINGS ...................................................................................................... 10
4.2. ESD RATINGS .............................................................................................................................. 10
4.3. RECOMMENDED OPERATING CONDITIONS ......................................................................................... 10
4.4. POWER CONSUMPTION SUMMARY .................................................................................................. 11
4.5. 2.4GHZ GFSK (BLUETOOTH LOW ENERGY) RF CHARACTERISTICS ......................................................... 12
4.6. SUB-1GHZ RF CHARACTERISTICS .................................................................................................... 12
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4.7. INTERNAL 16-MHZ CRYSTAL OSCILLATOR ( FOR BLUENRG-1 ) ............................................................. 13
4.8. INTERNAL 32.768-KHZ CRYSTAL OSCILLATOR ( FOR BLUENRG-1 ) ........................................................ 14
4.9. INTERNAL 50MHZ CRYSTAL OSCILLATOR ( FOR S2-LP ) ....................................................................... 14
4.10. BLUENRG-1 DIGITAL I/O SPECIFICATIONS ....................................................................................... 14
4.11. S2-LP DIGITAL INTERFACE SPECIFICATION ........................................................................................ 15
4.12. MORE CHARACTERISTICS.............................................................................................................. 16
5. DESIGN RECOMMENDATIONS ....................................................................................................... 17
5.1. GPIO USAGE OF BLUENRG-1 ........................................................................................................ 17
5.2. DEBUG PORT ............................................................................................................................... 17
5.3. DEBUGGING TIPS.......................................................................................................................... 18
5.4. PRE-PROGRAMMED BOOTLOADER ............................................................................................ 18
5.5. SPI MULTIPLE USE................................................................................................................... 18
5.6. ANTENNA SELECTION GUIDE ........................................................................................................... 19
5.7. REFERENCE SCHEMATIC ................................................................................................................. 19
5.8. MODULE LAYOUT RECOMMENDATIONS ............................................................................................ 20
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6. PACKAGE INFORMATION ............................................................................................................... 21
6.1. MODULE MECHANICAL OUTLINE ..................................................................................................... 21
6.2. PACKAGE MARKING ...................................................................................................................... 23
7. SMT AND BAKING RECOMMENDATION ....................................................................................... 24
7.1. BAKING RECOMMENDATION ........................................................................................................... 24
7.2. SMT RECOMMENDATION .............................................................................................................. 24
8. SMT AND BAKING RECOMMENDATION ....................................................................................... 26
8.1. EUROPE ...................................................................................................................................... 26
8.2. JAPAN ........................................................................................................................................ 27
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9. HISTORY CHANGE .......................................................................................................................... 28
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DOC No: WS2118-00A-DTS-R01
1. OVERVIEW
The WS2118-00 series is a sub-1GHz and Bluetooth® low energy ultralow power wireless MCU
module. This module is built-in ST S2-LP and BlueNRG-1 chip.
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The module is a cost-effective, high performance, ultra-low power, sub-1GHz and Bluetooth® low
energy RF devices. Very low active RF and MCU current and low-power mode current consumption
provide excellent battery lifetime and allow for operation on small coin cell batteries and in
energy-harvesting applications.
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Up to +8dBm BLE RF output power, up to +16dBm sub-1GHz RF output power (1)
Excellent performance of receiver sensitivity. Up to -88dBm (BLE) and -130dBm (Sub-1GHz).
Low Power and Wide I/O Voltage Range: 1.8 to 3.6V
- Internal DC-DC converter built-in
Operating temperature range: -40 °C to +85 °C
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ST BlueNRG-1, S2-LP, 16MHz, 50MHz & 32.768KHz crystals, DC2DC, and U.FL connector on a
single module.
Stamp-hole 38pins package.
Dimension 22mm(L) x 24mm(W) x 2.8mm(H)
High performance, ultra-low power Cortex-M0 32-bit Microcontroller
Programmable 160 KB Flash
24 KB RAM with retention (two 12 KB banks)
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1.1. General Features
(1) In order to comply with ETSI EN 300 328, EN 300 220-1, ARIB STD-T108, Sigfox limits, the maximum RF
output power must be reduced. See the 4. MODULE SPECIFICATIONS for details.
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2. FUNCTIONAL FEATURES
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DIO
pins
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2.1. Module Block Diagram
WS2118-00
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2.2. Block Functional Feature
BlueNRG-1 : Bluetooth low energy wireless SOC
24 KB RAM with retention (two 12 KB banks)
1 x UART interface
1 x SPI interface
1 x I2C interface
15 GPIO
2 x multifunction timer
10-bit ADC
Watchdog & RTC
DMA controller
PDM stream processor
16 MHz crystal oscillator built-in.
32 kHz crystal oscillator built-in.
Battery voltage monitor and temperature sensor
Up to +8 dBm available output power (at antenna connector)
Excellent RF link budget (up to 96 dB)
BALF-NRG-01D3 BALUN built-in.
Accurate RSSI to allow power control
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Bluetooth specification compliant master, slave and multiple roles simultaneously,
single-mode Bluetooth low energy SOC
Integrated linear regulator and DC-DC step-down converter
High performance, ultra-low power Cortex-M0 32-bit based architecture core
Programmable 160 KB Flash
S2-LP Sub-1Ghz transceiver
Narrow band ultra-low power Sub-1GHz transceiver tuned for 860-943 MHz frequency
bands.
Suitable for SigFox applications
Modulation schemes: 2-FSK, 2-GFSK, 4-FSK, 4-GFSK, OOK, and ASK
Air data rate from 0.3 to 500 kbps
Programmable RF output power up to +16 dBm
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Excellent performance of receiver sensitivity: down to -130 dBm
Programmable RX digital filter
Programmable channel spacing
Low duty cycle RX/TX operation mode
Integrated linear regulator and DC-DC step-down converter
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3. MODULE OUTLINE
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3.1. Signal Layout (Top View)
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3.2. Pin Description
Table 3-1. Pin Description
Type
1
GND
2
RESETN
Digital Input
3
DIO13
Digital I/O
4
DIO12
Digital I/O
5
TEST
6
DIO11
Digital I/O
7
DIO10
Digital I/O
8
DIO9
Digital I/O
9
DIO8
Digital I/O
10
GND
GND
11
VBAT
POWER
12
GND
GND
Digital Input
DIO7/BOOT
(1)
Digital I/O
DIO6
System reset
General purpose digital I/O of BlueNRG-1
Connected internally to GPIO3 of S2-LP for interrupt.
General purpose digital I/O of BlueNRG-1
Test pin put to GND
General purpose digital I/O of BlueNRG-1
General purpose digital I/O of BlueNRG-1
General purpose digital I/O of BlueNRG-1
General purpose digital I/O of BlueNRG-1
GND
Power for BlueNRG-1
GND
15
DIO5
16
DIO4
17
DIO3
Digital I/O
18
DIO2
Digital I/O
Bootloader pin/
General purpose digital I/O of BlueNRG-1
Digital I/O
General purpose digital I/O of BlueNRG-1
Digital I/O
General purpose digital I/O of BlueNRG-1
Digital I/O
General purpose digital I/O of BlueNRG-1
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14
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13
GND
Description
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Pin Name
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General purpose digital I/O of BlueNRG-1 / SPI master
input pin connected internally to SDO pin of S2-LP
General purpose digital I/O of BlueNRG-1 / SPI master
output pin connected internally to SDI pin of S2-LP
General purpose digital I/O of BlueNRG-1 / SPI master
19
DIO1
Digital I/O
CS pin connected internally to CS pin of S2-LP
Built-in pull-up 10K ohm resistor.
20
DIO0
Digital I/O
General purpose digital I/O of BlueNRG-1 / SPI master
CLK pin connected internally to SCLK pin of S2-LP
General purpose digital I/O of BlueNRG-1 /
21
DIO14
Digital I/O
Connected internally to SDN pin of S2-LP
Built-in pull-down 10K ohm resistor.
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22
ANATEST1
23
ADC1
Analog Input
24
GND
GND
25
ADC2
Analog Input
26
GND
GND
27
VCC_S2LP
28
GND
29
GPIO3
Digital I/O
30
GPIO2
Digital I/O
General purpose I/O of S2-LP.
31
GPIO1
Digital I/O
General purpose I/O of S2-LP.
32
GPIO0
Digital I/O
33
NC
-
34
NC
-
35
NC
-
36
GND
GND
ANT1
ANT1
RF I/O
ANT2
ANT2
GND
ADC input2
GND
Power for S2-LP
GND
General purpose I/O of S2-LP. Connected internally to
DIO13 pin of BlueNRG-1 for interrupt.
General purpose I/O of S2-LP.
No connection
No connection
No connection
GND
2.4 GHz BLE antenna connector
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GND
ADC input1
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POWER
Analog output
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Analog Output
RF I/O
Sub-1GHz antenna connector
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(1) The pin DIO7/BOOT is monitored by bootloader after power up or hardware Reset and it should be low to prevent
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unwanted bootloader activation.
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4. MODULE SPECIFICATIONS
4.1. Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Pin
Parameter
MIN
MAX
Unit
Power for BlueNRG-1 and S2-LP
-0.3
+3.9
V
3, 4, 5, 6, 7, 8, 9, 13, 14, 15, 16, 17,
DC voltage on digital input/output
-0.3
+3.9
V
18, 19, 20, 21, 29,
pins
22, 23, 25,
DC voltage on analog pins
-0.3
+3.9
V
30, 31, 32
DC voltage on digital control pins of
+3.6
V
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11, 27
0
ANT1
Input RF level
+11
dBm
ANT2
Input RF level
+5
dBm
+85
°C
-40
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Storage temperature range
4.2. ESD Ratings
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Parameter
Value
Unit
VESD+HBM
BlueNRG-1 pins
±2000
V
discharge
VESD+HBM
S2-LP pins
±500
V
RF pins
±500
V
performance
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Electrostatic
VESD+HBM
4.3. Recommended Operating Conditions
Parameter
Conditions
Ambient temperature range
MIN
MAX
Unit
-40
85
°C
VBAT
For BlueNRG-1
+1.7
+3.6 (1)
V
VCC_S2LP
For S2-LP
+1.8
+3.6 (1)
V
(1) The maximum voltage is limited to 3.3V in Sigfox application
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4.4. Power Consumption Summary
Ta = 25°C, VBAT=3.0 V, VCC_S2LP=3.0 V with internal DC-DC converter, unless otherwise noted.
Test Conditions
Parameter
Min
Units
nA
Standby
500
nA
Sleep mode: 32 kHz XO ON (24 KB retention RAM)
0.9
μA
Sleep mode: 32 kHZ RO ON (24 KB retention RAM)
2.1
μA
Active mode: CPU, Flash and RAM on
1.9
mA
RX
7.7
mA
BLE TX +8 dBm
15.1
mA
10.9
mA
9
mA
8.3
mA
7.7
mA
7.1
mA
6.8
mA
6.6
mA
BlueNRG-1
BLE TX +4 dBm
Supply current
BLE TX +2 dBm
BLE TX -2 dBm
BLE TX -5 dBm
BLE TX -8 dBm
BLE TX -11 dBm
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BLE TX -14 dBm
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IBAT
Max
5
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Reset
Typ
Peripheral Current Consumption (Adds to core current for each peripheral unit activated)
11.6
μA
6.3
μA
Flash controller
Peripheral
System controller
0.2
μA
current
UART
82.3
μA
SPI
46.5
μA
Watchdog
3.6
μA
ADC
6.3
μA
I2C1
95.9
μA
MFT1
5.4
μA
MFT2
6.2
μA
RTC
7.5
μA
DMA
16.3
μA
RNG
21.7
μA
PKA
23.7
μA
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GPIO
IVCC_
S2_LP
Shutdown
2.5
nA
S2LP
Supply current
Standby
30.5
μA
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Sleep
30.7
μA
Sleep (FIFOs retained)
31.0
μA
Ready
450
μA
8
mA
TX CW @ 14 dBm
20.6
mA
TX CW @ 10 dBm
11.7
mA
27
mA
RX @ sensitivity level
TX CW @ 16 dBm in Boost (1)
(1)
SMPS output voltage 1.8 V
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4.5. 2.4GHz GFSK (Bluetooth Low Energy) RF Characteristics
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RF performance is specified in a single ended 50 ohm reference plane at the U.FL connector with Ta = 25°C, VBAT = 3.0 V,
fRF = 2440 MHz, unless otherwise noted. Please see the more detail data in the STM’s BlueNRG-1 datasheet.
Test Conditions
Parameter
Frequency range
Channel spacing
Channel center frequency
Min
Typ
Max
Units
2400
-
2483.5
MHz
-
2
-
MHz
2480
MHz
2402
Receiver sensitivity
BER = 10–3
Receiver saturation
BER = 10
–3
Maximum Output Power
Minimum Output Power
dBm
11
dBm
At U.FL connector
+8
dBm
At U.FL connector
-15
dBm
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-87
(1) The maximum output power must be reduced to 4dBm to meet ETSI EN 300 328 emission limits.
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4.6. Sub-1GHz RF Characteristics
RF performance is specified in a single ended 50 ohm reference plane at the U.FL connector with Ta = 25°C, VCC_S2LP =
3.3 V, unless otherwise noted. Please see the more detail data in the STM’s S2_LP datasheet.
Min
Typ
Max
Units
Frequency range(1)
860
-
940
MHz
Data rate – 2-(G)FSK
0.3
-
250
kbps
Data rate – 4-(G)FSK
0.6
-
500
kbps
Data rate – OOK/ASK
0.3
-
125
kbps
Frequency deviation FDEV
0.15
-
500
kHz
Parameter
Test Conditions
Sensitivity @ 868MHz,
DR = 0.3 kbps, FDEV = 0.25 kHz, CHF = 1 kHz
-129
dBm
1% BER @ 2-GFSK BT = 0.5
DR = 1.2 kbps, FDEV = 1.2 kHz, CHF = 4 kHz
-123
dBm
DR = 38.4 kbps, FDEV = 20 kHz, CHF = 100 kHz
-110
dBm
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-107
dBm
Sensitivity @ 868MHz,
DR = 4.8 kbps, DEV = 2.4 kHz, CHF = 10 kHz
-115
dBm
1% BER @ 4-GFSK BT = 0.5
DR = 9.6 kbps, DEV = 4.8 kHz, CHF = 20 kHz
-112
dBm
DR = 19.2 kbps, DEV = 9.6 kHz, CHF = 40 kHz
-110
dBm
Sensitivity @ 868MHz,
DR = 0.3 kbps, CHF = 1 kHz
-121
dBm
1% BER @ OOK
DR = 1.2 kbps, CHF = 4 kHz
-120
dBm
DR = 38.4 kbps, CHF = 100 kHz
-106
dBm
DR = 125 kbps, CHF = 250 kHz
-101
dBm
Sensitivity @ 920MHz,
DR = 0.3 kbps, FDEV = 0.25 kHz, CHF = 1 kHz
-128
dBm
1% BER @ 2-GFSK BT = 0.5
DR = 1.2 kbps, FDEV = 1.2 kHz, CHF = 4 kHz
-122
dBm
DR = 38.4 kbps, FDEV = 20 kHz, CHF = 100 kHz
-109
dBm
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DR = 100 kbps, FDEV = 50 kHz, CHF = 200 kHz
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DR = 100 kbps, FDEV = 50 kHz, CHF = 200 kHz
-105
dBm
DR = 4.8 kbps, DEV = 2.4 kHz, CHF = 10 kHz
-114
dBm
1% BER @ 4-GFSK BT = 0.5
DR = 9.6 kbps, DEV = 4.8 kHz, CHF = 20 kHz
-112
dBm
DR = 19.2 kbps, DEV = 9.6 kHz, CHF = 40 kHz
-108
dBm
Sensitivity @ 920MHz,
DR = 0.3 kbps, CHF = 1 kHz
-121
dBm
1% BER @ OOK
DR = 1.2 kbps, CHF = 4 kHz
-118
dBm
DR = 38.4 kbps, CHF = 100 kHz
-105
dBm
-100
dBm
CO
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Sensitivity @ 920MHz,
DR = 125 kbps, CHF = 250 kHz
At U.FL connector
+16 (1)
dBm
Minimum Output Power
At U.FL connector
-30
dBm
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Maximum Output Power(2)
(1) The frequency range of Sigfox RC-1 and ETSI EN 300 220-1 is 868.055MHz to 868.205MHz
The frequency range of Sigfox RC-3.C and ARIB STD-T108 is 923.125MHz to 923.275MHz.
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(2) The maximum output power must be reduced to +10dBm to meet EN 300-220-1, Sigfox RC-1 emission limits.
The maximum output power must be reduced to +12dBm to meet ARIB STD-T108, Sigfox RC-3.C emission limits
4.7. Internal 16-MHz Crystal Oscillator ( for BlueNRG-1 )
over operating free-air temperature range (unless otherwise noted)
Test Conditions
Parameter
Min
Crystal frequency
Crystal frequency tolerance
Typ
Max
16
(1)
-40
Units
MHz
+40
ppm
(1) Includes initial tolerance of the crystal, drift over temperature, aging ( 5 years ).
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4.8. Internal 32.768-kHz Crystal Oscillator ( for BlueNRG-1 )
over operating free-air temperature range (unless otherwise noted)
Test Conditions
Parameter
Min
Crystal frequency
Max
32.768
Crystal frequency tolerance
(1)
Typ
(1)
Units
KHz
-40
40
ppm
Includes initial tolerance of the crystal, drift over temperature, aging ( 5 years ).
4.9. Internal 50MHz Crystal Oscillator ( for S2-LP )
Test Conditions
Crystal frequency
Crystal frequency tolerance(1)
Crystal frequency tolerance(2)
Min
FI
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Parameter
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over operating free-air temperature range (unless otherwise noted)
Initial frequency is calibrated by software
Typ
Max
Units
50
MHz
-40
40
ppm
-20
20
ppm
Includes initial tolerance of the crystal, drift over temperature, aging ( 5 years ).
(2)
Includes only drift over temperature, aging ( 5 years ).
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(1)
Ta = 25°C
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4.10. BlueNRG-1 Digital I/O specifications
Min
Typ
Max
Units
1.4(TC)
-
19(TC2)
ns
1.5(TC)
-
22(TC2)
ns
-
1.5
-
ms
TC
3
3.3
3.6
V
TC1
2.25
2.5
2.75
V
TC2
1.72
1.8
1.98
V
TC
-0.3
-
0.9
V
TC1
-0.3
-
0.67
V
TC2
-0.3
-
0.54
V
TC
1.95
-
3.6
V
TC1
1.46
-
2.75
V
TC2
1.1
-
1.98
V
Trise
Tfall
T(RST)L
VIL
VIH
Test Conditions
0.1*VDD to 0.9*VDD, CL=50pF
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Parameter
0.9*VDD to 0.1*VDD, CL=50pF
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-
-
0.4
V
TC1
-
-
0.42
V
TC2
-
-
0.45
V
TC
2.4
-
-
V
TC1
1.72
-
-
V
TC2
1.35
-
-
V
IOL
TC (VOL = 0.4V)
3.4
5.6
7.9
mA
(Low drive strength)
TC1 (VOL= 0.42V)
3.8
6.6
10.1
mA
TC2 (VOL =0.45V)
1.6
3
5
mA
IOL
TC (VOL = 0.4V)
6.8
11.2
15.8
mA
(High drive strength)
TC1 (VOL= 0.42V)
7.6
13.2
20.1
mA
TC2 (VOL =0.45V)
3.3
6
9.9
mA
5.5
10.6
17.6
mA
3.7
7.2
12
mA
1.4
3
5.6
mA
9.9
19.2
31.7
mA
6.7
12.9
21.6
mA
2.4
5.5
10.1
mA
VOH
IOH
TC (VOH = 2.4V)
(Low drive strength)
TC1 (VOH= 1.72V)
TC2 (VOH =1.35V)
IOH
TC (VOH = 2.4V)
(High drive strength)
TC1 (VOH= 1.72V)
CO
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TC2 (VOH =1.35V)
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TC
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VOL
Test Conditions
Parameter
VIL
VOH
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SPI clock frequency
VIH
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4.11. S2-LP Digital interface specification
IOH = -2.4 mA (-4.2 mA into high
Min
Typ
Max
Units
8
10
MHz
VCC_S2LP/2+0.3
-
-
V
-
-
VCC_S2LP/8 +0.3
V
0.625*VCC_S2LP+0.1
-
-
V
0.5
V
output current mode).
VOL
IOL = +2.0 mA (+4.0 mA into high
output current mode).
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4.12. More Characteristics
If you need more detail characteristics, please visit STM and Skyworks web site.
BlueNRG-1:
http://www.st.com/content/st_com/en/products/wireless-connectivity/bluetooth-bluetooth-low-e
nergy/bluenrg-1.html
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S2-LP:
http://www.st.com/content/st_com/en/products/wireless-connectivity/sub-1ghz-rf/s2-lp.html
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5. DESIGN RECOMMENDATIONS
5.1. GPIO Usage of BlueNRG-1
Because the function of some pins has been used in the module internally, the other functions of
these pins can not be defined. Please refer the below table.
Pin
Mode “000”
Mode “001”
Type
Signal
Type
Signal
Type
Signal
DIO0
I/O
GPIO 0
I
UART_CTS
I/O
SPI_CLK
-
-
DIO1
I/O
GPIO 1
O
UART_RTS
I/O
SPI_CS1
I
PDM_DAT
DIO2
I/O
GPIO 2
O
PWM0
O
SPI_OUT
O
PDM_CLK
DIO3
I/O
GPIO 3
O
PWM1
I
DIO4
I/O
GPIO 4
I
UART_RXD
DIO5
I/O
GPIO 5
O
DIO6
I/O
GPIO 6
DIO7
I/O
DIO8
Name
O
-
I/O
I2C2_CLK
O
PWM0
UART_TXD
I/O
I2C2_DAT
O
PWM1
O
UART_RTS
I/O
I2C2_CLK
I
PDM_DAT
GPIO 7
I
UART_CTS
I/O
I2C2_DAT
O
PDM_CLK
I/O
GPIO 8
O
UART_TXD
I/O
SPI_CLK
I
PDM_DAT
DIO9
I/O
GPIO 9
I
SWCLK
I
SPI_IN
-
-
DIO10
I/O
GPIO 10
I
SWDIO
O
SPI_OUT
-
-
DIO11
I/O
GPIO 11
I
UART_RXD
I/O
SPI_CS1
-
-
DIO12
OD
GPIO 12
DIO13
OD
GPIO 13
DIO14
I/O
GPIO 14
CO
N
SPI_IN
RJ
IN
Note
To SCLK pin of S2-LP
To CS pin of S2-LP
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Signal
Mode “101”
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Type
Mode “100”
To SDI pin of S2-LP
To SDO pin of S2-LP
-
I/O
I2C1_CLK
-
-
I
UART_CTS
I/O
I2C1_DAT
-
-
To GPIO3 pin of S2-LP
I/O
I2C1_CLK
I/O
SPI_CLK
O
-
To SDN pin of S2-LP
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5.2. Debug Port
The BlueNRG-1 embeds the ARM serial wire debug (SWD) port. It is two pins (clock and single
bi-directional data) debug interface, providing all the debug functionality plus realtime access to
system memory without halting the processor or requiring any target resident code.
Pin functionality
Pin Name
Pin description
SWCLK
DIO9
SWD clock signal
SWDIO
DIO10
SWD data signal
The Cortex-M0 subsystem of the BlueNRG-1 embeds two breakpoints and one watchpoint.
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5.3. Debugging Tips
There are certain situations where debug access is disabled and the chip cannot be accessed,
including:
application that disables debug pins
application that set the device in sleep or standby state, in which the debug port is not
powered.
These cases are common during application development and device can end up in a state where
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debug access is no longer possible. To recover this situation, it is recommended to force DIO7 pin
high and hardware reset the device in order to force execution of the updater code. The user can
then connect with SWD interface and erase the device Flash memory.
5.4. Pre-programmed bootloader
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BlueNRG-1 device has a pre-programmed bootloader supporting UART protocol with automatic
baudrate detection. Main features of the embedded bootloader are:
Auto baudrate detection up to 460 kbps
Flash mass erase, section erase
Flash programming
Flash readout protection enable/disable
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IN
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The pre-programmed bootloader is an application which is stored on the BlueNRG-1 internal ROM
at manufacturing time by STMicroelectronics. This application allows upgrading the device Flash
with a user application using a serial communication channel (UART).
Bootloader is activated by hardware by forcing IO7 high during power-up or hardware Reset,
otherwise, application residing in Flash will be launched.
The customer application must ensure that IO7 is forced low during power up.
5.5. SPI Multiple Use
The SDO pin of S2-LP is always forced to output with an internal low impedance and the pin is not
tri-stated when the CSn pin of S2-LP is high. This prevents the BlueNRG-1 to use the same SPI bus
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for driving other SPI slaves.
Two actions can be taken:
do not use multiple slaves on the SPI bus.
each time an application needs to access another SPI slave, turn the S2-LP off via the SDN pin
(DIO14 of BlueNRG-1) .
5.6. Antenna Selection Guide
There are two U.FL connectors to connect one 2.4GHz antenna and one Sub-1GHz antenna. There is
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an antenna selection guide from STM. You can download it from the below link.
A1
U1
JTMS-SWTDIO
JTCK-SWTCK
DIO12
DIO11
DIO10
DIO9
DIO8
SWD Interface
VBAT
1
2
3
4
5
6
7
8
9
10
11
12
GND1
RESETN
DIO13
DIO12
TEST
DIO11
DIO10
DIO9
DIO8
GND2
VBAT
GND3
WS2118-00
SUB-1G RF
GND7
NC3
NC2
NC1
GPIO0
GPIO1
GPIO2
GPIO3
GND6
VCC_S2LP
GND5
ADC2
36
35
34
33
32
31
30
29
28
27
26
25
VCC_S2LP
ADC2
ADC2_Input
DIO7
DIO6
DIO5
DIO4
DIO3
DIO2
DIO1
DIO0
DIO14
TEST1
ADC1
GND4
DIO12
RESETN
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BLE RF
A2
A1
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5.7. Reference Schematic
A2
http://www.st.com/content/ccc/resource/technical/document/application_note/82/38/3f/9f/fd/4d/4f
/ab/DM00068254.pdf/files/DM00068254.pdf/jcr:content/translations/en.DM00068254.pdf
13
14
15
16
17
18
19
20
21
22
23
24
100K
RXD
TXD
ADC1
UART Interface
DIO7
I2C_SDA
I2C_SCL
I2C Interface
TEST1
ADC1_Input
1
TEST POINT
DIO7
DIO5
DIO4
DIO0
DIO2
DIO3
SPI_CLK
SPI_SDO
SPI_SDI
SPI Interface
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5.8. Module Layout Recommendations
Power Trace - Power trace for VCC_S2LP should be 25mil wide. VBAT traces should be 15mil
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wide, at least.
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6. PACKAGE INFORMATION
Top View
Side View
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6.1. Module Mechanical Outline
Note:
A: Typical: 2.8mm, Maximum: 3.0mm
Unit: mm
Tolerance: +/- 0.2mm
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DOC No: WS2118-00A-DTS-R01
Note:
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1> Pad tolerance as ±30um
2> Unit: mm
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Bottom View
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Marking
Description
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6.2. Package Marking
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Brand name: JORJIN
Model name
YYWWSSFX
Lot Trace Code: YYWWSSFX
YY= Digit of the year, ex: 2017=17
WW= Week (01~52)
SS= Serial number from 01~98 match to MFG’s lot number, or 99
to repair control code
F= Reverse for internal use
X = A for Module version
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WS2118-00
CE compliance mark
Sigfox P1 certified mark
JRF compliance mark, and ID
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7. SMT AND BAKING RECOMMENDATION
7.1. Baking Recommendation
Baking condition：
-
Follow MSL Level 4 to do baking process.
After bag is opened, devices that will be subjected to reflow solder or other high
temperature process must be
a) Mounted within 72 hours of factory conditions
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