32EP16-M4FTC32-GA67

k i n g s t o n . c o m /e p o p ePoP Embedded Package-on-Package Memory for Wearables Kingston’s ePoP provides a highly integrated JEDEC standard component that combines Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Package-on-Package (PoP) solution. ePoP is mounted directly on top of a compatible host System-on-a-Chip (SoC), which reduces Printed Circuit Board (PCB) space, and ensures optimum performance. ePoP is an ideal solution for space constrained applications such as wearables. #KingstonIsWithYou more >> ePoP KEY BENEFITS • By mounting directly on top of a host SoC, ePoP provides an ideal solution for small form factor applications such as wearables. • Simplifies system design, reduces time to market, and shortens the qualification cycle. • Low-Power DRAM and optimized storage firmware reduces power consumption while delivering the high performance needed for battery powered wearable applications. • Multiple firmware configurations available to best fit your application requirements for performance, power, and life span. MARKET SEGMENTS EPOP PART NUMBERS AND SPECIFICATIONS LPDDR3 based ePoP Capacity Part Number IoT NAND (GB) DRAM (Gb) Description eMMC DRAM Package (mm) FBGA Operating Temperature 04EP04-N3GM627 4 4 5.0 LPDDR3 10x10x0.8 136 -25°C ~ +85°C 04EP08-N3GM627 4 8 5.0 LPDDR3 10x10x0.85 136 -25°C ~ +85°C 08EP08-N3GTC32* 8 8 5.1 LPDDR3 10x10x0.85 136 -25°C ~ +85°C 32EP08-N3GTC32 32 8 5.1 LPDDR3 10x10x0.85 136 -25°C ~ +85°C LPDDR4x based ePoP Capacity Wearables Augmented Reality (AR) / Virtual Reality (VR) devices Description Part Number NAND (GB) DRAM (Gb) eMMC DRAM Package (mm) Operating FBGA Temperature 08EP08-M4ETC32* 8 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 08CP08-M4ETC32* 8 8 5.1 LPDDR4x 8x9.5x0.85 144 -25°C ~ +85°C 16EP08-M4ETC32 16 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 32EP08-M4ETC32 32 8 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 16EP16-M4FTC32 16 16 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 32EP16-M4FTC32 32 16 5.1 LPDDR4x 8x9.5x0.8 144 -25°C ~ +85°C 32CP16-M4FTC32 32 16 5.1 LPDDR4x 8x9.5x0.85 144 -25°C ~ +85°C *pSLC mode for higher endurance THIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE. ©2022 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. MKF-960US All trademarks and registered trademarks are the property of their respective owners.