ATG36CA

SPSEMI ATG36CA     Axial Auto Surge Suppressor Features Glass passivated junction Plastic package P-600 Bi-directional Excellent clamping capability Fast response time High temperature soldering guaranteed: 265°C/10 seconds/.375", (9.5mm) lead length, 5lbs., (2.3kg) tension Continued current transient suppressor AEC-Q101 IEC Compatibility ISO 16750-2 Test A 24V System (174V 4Ω 350ms 10c) Applications Auto powers system Can-bus ABS powers Car audio and video Automotive instrument Bluetooth Car GPS Maximum Ratings (T A =25 ℃ unless otherwise noted ) RATING SYMBOL VALUE UNITS P PP 12000 Watts Peak power dissipation with a 10/1000μs waveform(Note 1) Operating junction and storage temperature range - 55 to +175 T J , T STG ℃ Electrical Characteristics Part Number ATG36CA Stand-Off Voltage Reverse Leakage @V RWM V RWM (V) I R (μA) V BR (V)Min. V BR (V)Max. I T (mA) Vc(V) Ipp(A) 36 2 40.0 44.2 5 58.1 206.5 Marking ATG36CA REV . 2019 . 01 . 10 Breakdown Voltage @I T www.spsemi.cn Test Current Max. Clamping Voltage @Ipp 10/1000μs Page 1 of 3 SPSEMI ATG36CA     Dimensions (P600) Case Style P600 0.052 ( 1 . 32 ) 0.048 ( 1 . 22 ) DIA. 0.360 ( 9 . 1 ) 0.340 ( 8 . 6 ) DIA. 1.0 ( 25.4 ) MIN. 1.0 ( 25.4 ) MIN. 0.360 ( 9 . 1 ) 0.340 ( 8 . 6 ) Dimensions in inches and(millimeters) Ratings and Characteristic Curves (TA=25 ℃ unless otherwise noted) Fig.1 Peak Pulse Power Rating Cure Fig.2 Pulse Waveform 150 I PPM -Peak Pulse Current(%) P PPM -Peak Pulse Power (kW) 1000 100 10 1 0.1 0.000001 0.00001 0.0001 t d-Pulse Width (Sec.) 0.001 tr=10uS Peak Value I PPM T J =25℃ Pulse width(td) is defined ad the Point where the Peak Current Decays to 50% of I PPM 100 Half Value 50 I PPM 2 10/1000uS Waveform td 00 1.0 2.0 t-Time(mS) 3.0 4.0 Fig.3 Power Derating Cure Percent of Rated Value 120 100 80 60 40 20 0 0 50 75 100 125 AMBIENT TEMPERATURE(℃) 25 REV . 2019 . 01 . 10 150 www.spsemi.cn Page 2 of 3 SPSEMI ATG36CA     Recommended Soldering Conditions Recommended Conditions Pb-Free assembly (see Fig.1) TP -Temperature Min(T s(min) ) +150℃ TL -Temperature Max(T s(max) ) +200℃ -Time(Min to Max)(t s ) 60-180secs Pre Heat Critical Zone T L to T P tL Average ramp up rate (Liquidus Temp(T L ) to peak) 3℃/sec.Max. T s(max) to T L -Ramp-up Rate 3℃/sec.Max. Re”ow tP Ramp-up -Temperature(T L )(Liquidus) +217℃ -Temperature(t L ) 60-150secs Peak Temp(T P ) +260(+0/-5)℃ Time within 5℃ of actual Peak Temp(t P ) Ramp-down Rate 30 secs.Max. Time 25℃ to Peak Temp(T P ) 8 min.Max. Do not exceed +260℃ Temperature Re”ow Condition T s (max) Ramp-down Preheat T s (min) ts 25 time to peak temperature (t 25℃ to peak) Time 6℃/sec.Max. Flow/Wave Soldering(Solder Dipping) Peak Temperature : 265OC Dipping Time : 10 seconds Soldering : 1 time Packaging Z A ±5 º E L1 H B L W L2 T E A Dimensions in millimeters B Z 10.0±0.5 52.0±0.5 1.2Max REV . 2019 . 01 . 10 T E L1-L2 6.0±0.4 1.0Max 1.0Max www.spsemi.cn L W H Quantity 250.0±5.0 78.0±5.0 114.0±5.0 300PCS Page 3 of 3